Development of Cryogenic X-ray DetectorsDevelopment of Cryogenic X-ray Detectors

Interests, Resources and Capabilities in

SpainL.Fàbrega

Spanish groups with interest/capability:

ICMAB- Institut de Ciència de Materials de Barcelona (CSIC)

ICMA- Instituto de Ciencia de Materiales de Aragón (CSIC)

IMM- Instituto de Microelectrónica de Madrid-CNM (CSIC)

IMB- Instituto de Microelectrónica de Barcelona-CNM (CSIC)

Development of Cryogenic X-ray Detectors

IFCA - Instituto de Física de Cantabria (CSIC-UC)

X-ray Astronomy link:

ICMAB: Dpt. of Magnetic and Superconducting Materials Epitaxial growth of oxide thin films and heterostructures Correlation structure/properties Superconductors: basic aspects and applications Devices with functional complex oxides:

Electro-optic modulators, tunable filtersMagnetic tunnel junctions

Main recent projectsFacilities

• AFM, SEM, TEM• XPS• Lithography

• THIOX (Thin films for novel oxide devices, ESF, 2002-06)

• SPINOX (New oxides and devices for telecommunications and magnetoelectronics, ESP, 2003-05)

• AMORE (Advanced Magnetic Oxides, UE, 2000-02)

• Oxide thin film technologies for superconducting and spintronic devices (ESP, 1999-2002)

•FAME (Functionalized advanced materials engineering, UE, 2004-)

Groups Expertise

Epitaxy: Characterization and control

1.0µm

0.0 0.20 0.40 0.60 0.80 1.0 1.2 1.4

0.0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

X[µm]

Z[Å

]

SrRuO3 on SrTiO3

AFM

d = 6 nmLCMO

STO

HRTEM

ICMAB

0.25 0.50 0.75 1.00 1.25 1.50

10-4

10-3

10-2

10-1

100

(º)

R (

arb. unit

s)

Experimental data Fit

LCMO, 23.4nmLCMO, 23.4nm

DRX: Grazing Incidence Reflectometry

STO=18 m 28 m 43 m

325 m

1270 m1000 m

50 m

Magnetic tunnel junctions for spintronics: (La,Sr)MnO3/SrTiO3/ (La,Sr)MnO3

Project HEMAGE: ICMAB-IMM-ICMA

-20 -10 0 10 20

202

203

204

TMR 0.5 %?

R(

)

H(kOe)

10 K

RR RR

ICMAB

Wave guide

VRF

LiNbO3

• Lower losses• Higher speed

YBCO

Interface

YSZ

YBa2Cu3O7/YSZ/LiNbO3Projects COSMOS, MAT, SPINOX:

ICMAB-UPC-UB

Electrooptic modulators with superconductors: YBa2Cu3O7 on LiNbO3

ICMAB

Institute of Microelectronics of Madrid- IMM-CNM (CSIC) Dept. Fabrication and Characterization of Nanostructures

Electronic and optoelectronic devices, radiation detectors Magnetic tunnel junctions, Micro-SQUIDS, magneto-optics

Facilities:• UHV sputtering• EBL• MBE • RIBE

•AFM lithography

•Structural, magnetic and optical characterization of nanostructures

Recent main projects:

• NANOMAT (Growth 2001-2004)Self-assembled Nanostructured Materials for Electronic and Optoelectronic Applications

• MONA_LISA (BIO 2000-2003)Development of Novel Conjugated Molecular Nanostructures by lithography and their transport scaling aspects

• NANOMAGIQC (IST 2001-2004)Development of Superconducting circuits and microSQUIDS for the implementation of magnetic clusters based Qbits for Quantum Computing

• HIDEMAR (Growth 2002-2005)High Density nanopatterned Magnetic Recording Media

• NANOCIR (MCYT 2002-2005)Implantable Micro-and nanosystems for medical applications

Groups Expertise

InP

InP

SubstrateInP(001) (doped n+)

InP (doped n++)

InP (doped n+)

InP (doped p+)

InP(doped p++)

Waveguide:

Waveguide

QWR-1.55m

Waveguide SPS lattice match GaInAs/InP SPS GaInP/GaInAs

SubstrateGaAs

(doped n+)

GaInP (doped n++)

GaInP (doped n+)

GaInP (doped p+)

GaInP(doped p++)

Waveguide: GaAs

Waveguide: GaAs

QR-980nm

Project NANOMAT (IST 2001-2004)

Incorporation of self-organized quantum-wires and quantum rings in the active zone of laser diodes

IMM-CNM

sample

Vth

sample

Vox

adsorbed water

sample

x

MOx

dry N2

H2O vapor

Local Oxidation Nanolithography by AFM

250 nm 1 nm

20 nm 5 m

W = 45 nmSiO2

Au

Si

Au/Si

IMM-CNM

Detail of nanoconstrictions : 160 nm length, 35 nm wide.

Micro-SQUIDs fabricated by e-beam lithography at IMM-CSIC

- Dilution refrigerator measurements (spin tunnel and quantum coherence) UB

Project NANOMAGIQC (IST 2001-2004)

IMM-CNM

ICMA: Low Temperature Solid State Physics Department

Applications of SQUIDs and Josephson Junction devices Basic electronic aspects Magnetic and electric measurementsQuantum electrical metrology

Advanced scientific and technical instrumentation Cryogenics, very low temperatures (mK).

Facilities• Josephson Voltage Standard• Quantum Hall resistance Standard• SQUID based CCC for Quantum current standard• EUROMET (EC), CICYT, MIDAS• U. Twente, NMi, NPL, NIST

• VTI ( 9 T, 1.5 K-400 K)•3He (12T, 300 mK-10K)• Dilution ( 9 T, 20 mK-1 K)• Dilution ( 5 T, 10 mK-1 K)

Recent projects

Groups Expertise

10mK – 1K10mK – 1K5T5T

20mK – 1K20mK – 1K10T10T

300mK – 10K300mK – 10K12T12T

The Low Temperature labs The Low Temperature labs have been recently have been recently refurbrishedrefurbrished

ICMA

5 mm

ICMA

Voltage standard based on the Josephson effect

ICMA

1991:

JJ Voltage Standard is transfered from ICMA to

TPYCEA, Madrid

Uncertainty: 1 part in 108

1995:

QHE Resistance Standard to

TPYCEA

Uncertainty: 1 part in 109

2002: CCC-SQUID to Nmi, Holland

Uncertainty: 1 part in 1010

ICMA

I

V

4.2K4.2K

ICMA

• Dpt. of Nanotechnology Nanolithography, Nanomechanics, Micro/nano systems for sensors

Processes available at the clean room

• Dpt. of Electronic circuits and systems design

Design, modeling and development of microsystems interfaces

• Clean Room 1.000 m2, CMOS Technology, Silicon technology, Micromechanics

• Wet and dry oxidations

• Ion implantation of B, P, As, N and Ar

• Diffusion (several ambients)

• CVD (nitride, polysilicon, oxide, BPSG)

• Metallization (Al-Si, Al-Cu, Al-Cu-Si, TaSi, Ti, Ni, Au*)

• Polyimide

•Wet and dry etching

• Surface and bulk silicon micromechanization

• Anodic bonding

• Packaging (die bonding, wire bonding, smd)

• Photolithography (proximity, step and repeat, double side)

•Nanolithography (e-beam, AFM, nanoimprint)

Institute of Microelectronics of Barcelona IMB-CNM (CSIC)

Groups Expertise

Combination of Microelectronics and Nanotechnology

Oscillation

Thickness

CMOS circuitry

Nanocantilever

Width, 100 nm

Length

Nanoresonator with integrated circuitry for high spatial resolution and high sensitivity mass detection

Fabrication• Nanolithography: AFM, laser, e-beam, NIL

• Structure layer: Polysilicion, SOI

• Combination with CMOS circuit fabrication

Detection• Capacitive current

• Reduction of parasitic capacitances: Integrated circuit

NANOMASS: IST-2001-33068

Partners: UAB (Es), CNM (Es)

MIC (Dk), U. Lund (S)

: IST-2001-33068

cantilever

buffer amplifier

voltage follower

IMB-CNM

Final implementation

ASICs, FPGAs, SoCs developmentASICs, FPGAs, SoCs development• Goals:

– SoC design for extreme environment applications.

– HDL based design methodologies.

– FPGA-ASIC retargeting/co-design.

• Techniques:– IP development with HDL languages

– Synthesis with EDA tools applicable to qualified technologies.

Projects:

SOCCER: SoC from Civilian to Armament Re-use. EUCLID-CEPA2, WEU/WEAO. MBDA (F), THALES Comunications (F), Galileo Avionica S.p.A. (I), CESVIT Microelecttronica SRL (I), SAAB Avionics (S), ASTRIUM - Crisa (E) & CNM-IMB (E). 2002-2005. NANOSAT: VLSI digital modem for LEO satellite communications, PNIE (CICYT), 1995-1997 (INTA (leader), ICM, UPM y CNM/UAB, y 1997-2000 INTA (leader), CNM-IMB & UPM).PEC-31750: Microcontroller for embedded space applications, ESTEC-ESA, 1994-96 (INDRA-Espacio (leader), TGI & CNM-IMB).PRENDA: Project for specification and normalisation on the design of ASICs, GAME (ESPRIT-CE), 1994-95 (Telefónica I+D (leader), Tecnológica, TGI, INDRA-Espacio, SIDSA, UPM-ETSII, UPM-ETSIT & CNM-IMB).

IMB-CNM

Microsystems integrationMicrosystems integration• Goals:

– MOEMS integration to build-up new -instruments for satellite applications.

– Study the use optical wireless links in order to reduce the size, weight and power consumption.

• Techniques:– Flexible MEMS architecture

– Integrated design methodology for MEMS

– IR diffused communication protocols & Optoelectronic devices qualification

Projects:• IDEA: Implementation of a Design Methodology for the Integration of microsystems in a distributed architecture (ESP).• OWLS: Study on Optical Wireless Systems for intra-satellite communications, ESTEC/ESA, 1999-2000 (INTA (leader), UPM & CNM-IMB)• Study of Interfacing Microdevices: Micro and Nanotechnologies considerations , ESTEC/ESA, 1998.

IMB-CNM

Dear Mama: New X-ray Imaging SystemDear Mama: New X-ray Imaging System

• Aim:– To develop a new mammography system based on

advanced photon solid state detectors and read-out circuits (ROIC)

– Advantages: Resolution&Contrast Dose (50 times less than film x-ray)

• Techniques:– Sensor BumpBonding to ROIC

– System based on an array (7*9) of {Sensor+ROIC}

– FPLD flexible control design

• Project: QLRT-2000-01318 (QoL-UE)

IMB-CNM

ICMAB SuperconductorsStructure/properties

ICMA CryogenicsInstrumentationSQUIDs

IMM Epitaxial growthSensors

IMB Clean RoomRT circuit design

Expertise

Structural characterizationCorrel. materials/properties

Fabrication

RT readout electronics

Low T characterizationTest of detection

Development of Cryogenic X-ray Detectors:

Interests, Resources and Capabilities in Spain

IMBIMB

New materialsNew materials

IMMIMM

IMBIMB

ICMABICMAB

ReadoutReadout

FabricationFabrication

Struct. charact.Struct. charact.ICMAICMA

TestTest

Development of Cryogenic X-ray Detectors:

Resources and Capabilities in Spain

Cryogenic detectors in Spain:

• Materials can be Fabricated

• Detectors could be Tested

• Detectors could be Developed

NOW

SOON

in the Future