development of advanced collaborative engineering environments (cees) phase 1 overview version 3a -...

Development of AdvancedCollaborative Engineering Environments (CEEs)

Phase 1 Overview

Version 3a - October 23, 2001

Contact:

[email protected]

Georgia Tech

This general audience presentation contains selected content from the Phase 1 review held August 29-31, 2001 at JPL in Pasadena CA. Contact us for further information if needed.

Copyright © 1993-2001 by Georgia Tech Research Corporation, Atlanta, Georgia 30332-0415 USA. All Rights Reserved.Developed by eislab.gatech.edu. Permission to use for non-commercial purposes is hereby granted provided this notice is included.

2Engineering Information Systems Lab eislab.gatech.edu© 1993-2001 GTRC

Development of AdvancedCollaborative Engineering Environments (CEEs)

Phase 1: CEE-based Stackup Design Tool

Period: December 2000 - September 2001

ContactsMichael L. Dickerson

[email protected] - NASA

Pasadena, California USAhttp://www.jpl.nasa.gov/

Russell S. [email protected] Institute of Technology

Atlanta, Georgia USAhttp://eislab.gatech.edu/

SynopsisCurrent engineering computing environments can be characterized as largely disjoint setsof tools that exchange information via labor-intensive processes. While some progresshas been made, a good deal of engineering knowledge is not available in effectiveelectronic forms, and interoperability among engineering processes is less than optimum.

For example, today engineers still often manually add numerous notes and sketches toCAD drawings. In spite of being in an electronic form, these notes and sketches are in arelatively low-level representation that is not easily processed by downstream tools.They are primarily intended for human consumption. These items typically requiremanual intervention and re-creation downstream, resulting in increased labor efforts andtranscriptions errors.

Thus, there is a great need to capture the higher level concepts behind these items (e.g.,PWB stackup design intent) in semantically rich knowledge containers. Associativitywith other types of information is also needed (e.g., other rich objects that exist in somecurrent CAD tools). This Phase 1 effort is aimed at a) developing a general methodologyand computing framework for capturing this ancillary information, and b) implementing aprototype PWB stackup tool in this framework to demonstrate this approach.

Phase 1 helps JPL/NASA move along the roadmap defined in Phase 0 to achieve a next-generation collaborative engineering environment. The target environment will leverageadvances in engineering information technology, including standards like STEP, toachieve fine-grain, modular interoperability among design objects and related tools.Techniques based on efforts including Georgia Tech CAD-CAE integration research willbe applied and enhanced, and new approaches will be developed as needed. The targetoutcome is a virtual collaborative engineering environment which increases product lifecycle effectiveness by an order of magnitude or greater.

Phase 2: October 2001 - September 2002


Nomenclature ABB-SMM transformation idealization relation between design and analysis attributes APM-ABB associativity linkage indicating usage of one or more i

ABB analysis building blockAMCOM U. S. Army Aviation and Missile CommandAPM analyzable product modelCAD computer aided designCAE computer aided engineeringCBAM context-based analysis modelCOB constrained objectCOI constrained object instanceCOS constrained object structureCORBA common ORB architectureDAI design-analysis integrationEIS engineering information systemsESB engineering service bureauFEA finite element analysisFTT fixed topology templateGUI graphical user interfaceIIOP Internet inter-ORB protocolMRA multi-representation architectureORB object request brokerOMG Object Management Group, www.omg.comPWA printed wiring assembly (a PWB populated with components)PWB printed wiring boardSBD simulation-based designSBE simulation-based engineeringSME small-to-medium sized enterprise (small business)SMM solution method modelProAM Product Data-Driven Analysis in a Missile Supply Chain (ProAM) project (AMCOM)PSI Product Simulation Integration project (Boeing)STEP Standard for the Exchange of Product Model Data (ISO 10303).VTMB variable topology multi-bodyXAI X-analysis integration (X= design, mfg., etc.)XCP XaiTools ChipPackage™

XFW XaiTools FrameWork™

XPWAB XaiTools PWA-B™


Primary Technical Team Georgia Tech

– Mfg. Research Center (MARC)

» Robbie Ludlow - PDM

» Russell Peak - Project mgt., STEP, analysis templates

» Nsikan Udoyen - Software development

» Miyako Wilson - Software development, STEP, objects

– Georgia Tech Research Institute (GTRI) Admin. Info Systems Team (AIST)

» Tonette Melvin - next-gen. human factors & user interfaces

» Allen Servedio - next-gen. software architecture

– ECS / ECRC / EIS Lab

» Tord Dennis - Metaphase PDM administration

» Chien Hsiung, M. Saadat, … - System admin. & computing support External collaborators

– Sponsor: NASA-JPL

– LKSoft, SDRC (Metaphase)

– PDES Inc. Electromechanical Team: Boeing, NASA-Goddard, Rockwell Collins, …


Phase 1 Demonstration & Overview(Highlights from Aug. 2001 Meetings at JPL)

Motivation, Multi-Phase Context, and Phase 1 Scope Phase 1 Accomplishments Overview of Phase 2 Plans


Example PWA Ancillary Information

Component AssemblyInstructions

Maximum HeightRestrictions

Stackup Notes

Conformal CoatingRestrictions

PWA = printed wiring assemblyPWB = printed wiring board


Example PWB Ancillary Information

Outline DetailStackup Specs

Stackup Notes


Current Situation (typical) CAx tools of diverse disciplines Each focuses on information subset

(some overlap) Much ancillary information

– Some captured as “dumb” notes & sketches in CAD » Human-oriented, not computer-sensible

– Much not captured at all – Lack of fine-grain explicit associativity

Problems – Manually intensive transformations– Error-prone transcription / re-creation downstream – Little knowledge capture


Domain is Configuration Controlled Design of Electronic Assemblies, their Interconnection and Packaging

Product Enclosure

ExternallyVisible Connectors

Printed Circuit Assemblies

Die

Package

Packaged Part

InterconnectAssembly

Printed Circuit Substrate

Die

Copyright Rockwell Collins Inc.All Rights Reserved

STEP AP 210 (ISO 10303-210) Domain: Electronics DesignR


STEP AP210 Scope

Scope is “As-Required” & “As-Designed” Product Information – Design “In Process” & “Release”

Sharing Partners:– Engineering Domains– Design / Analysis– Manufacturing / Analysis

Sharing Across Several Levels of Supply Base

R

STEP AP210 Models

Assembly Models

• User View• Design View• Component Placement• Material product• Complex Assemblies with Multiple Interconnect

Component / Part Models

• Analysis Support • Package• Material Product• Properties• “White Box”/ “Black Box”• Pin Mapping

Requirements Models• Design• Constraints• Interface• Allocation

Functional Models

• Functional Unit• Interface Declaration• Network Listing• Simulation Models• Signals

Interconnect Models

• User View• Design View• Bare Board Design• Layout templates• Layers

planarnon-planar

conductive non-conductive

Configuration Mgmt• Identification• Authority • Effectivity • Control• Net Change

GD & T Model

• Datum Reference Frame• Tolerances

R


AncillaryInformation

Needed Tools

Tool B1 Tool C1... Tool Bn

Typical end-user tools (for novices experts)

Instance population tools(for experts)

AddressingInformation Capture Gaps

Existing Tools

Tool A1 Tool An

Product Model(e.g., AP210 + AP2xx + ...)

...

“dumb” information capture(only human-sensible,I.e., not computer-sensible)

Legend


Target Situation (longer term)

Collaborative Engineering Environment with Advanced Interoperability

Domain Specific Analysis

Cross Domain Analysis

CAx Applications and PDMs

PDMSchema

AnalysisSchema(AP209)

Repository Schema Generator

Requirements Design & Analysis

Data Viewer

SystemEngineeringSchema

Catalog &ViewSchemas

Application Access/Translation Layer

ElectricalSchema(AP210)

MechanicalSchema(AP203)

Documentation Facility

(UML)

Mfg.Capabilities(AP220)

(Text, XML,

SGML, etc.)

(STEP)

(STEP)

(STEP)

(STEP, XML)

(STEP)

Model Development and Interactive Environment

RequestBrokerOrRemoteAccessMech.

ObjectsEntities,Relations &AttributesObject Oriented or Object Relational DBMS

Data Views and PDM

AnalysisAgents

Negotiation/CommunicationsAgents

Data Dictionary Facility

(Express)

Potential Standards-based Architecture (after G. Smith, Boeing)


Phase 1 ScopeWork-in-Progress

Initial step towards vision Capture of representative ancillary information

– Focus: PWB stackup information – Extend Georgia Tech stackup tool (from ProAM) – STEP AP210 as information container structure– Develop & demonstrate methodology

Initial steps (Phases 1, 2): file-oriented– Use Metaphase as PDM capability– Manage files: ECAD file, MCAD file, Gerber file,

stackup tool file (AP210 subset), ... Next steps (Phases 2+):

Fine-grained interactive sharing (Accelis-type tools)


LKSoftLKSoft

Collaborative Engineering Environment Initial Steps - Phases 1, 2

Design Tools

Laminates Library

Product KnowledgeManagement System

Metaphase

ECAD Tools Mentor Graphics,

Cadence

Materials Library

PWB Stackup ToolXaiTools PWA-B

Nativefiles

AP210 file CC24

LKSoftSTEP s/w

JSD

AI

LKSoft, ...

Instance Browser/EditorSTEP-Book AP210,

SDAI-Edit,STI AP210 Viewer, ...

Work-In-Progress

AP210 file CCx1-xn


Collaborative Engineering Environment Next Steps - Phases 2+

MetaphaseAccelis

Standards-BasedCoarse/Fine-Grained

Interoperability

Notes:Accelis & Metaphase are SDRC products.


EngineeringMiddleware

LKSoftLKSoft

Design Tools

Laminates Library

ECAD Tools Mentor Graphics, Cadence

Materials Library


LKSoftSTEP s/w

JSD

AI

LKSoft, ...



J2EE-compliantWeb Application Server

Other Tools

AP210 content


MentorGraphics

LKSoft, …

AncillaryInformation

Added Tools

XaiToolsPWA-B LKSoft, …

Typical end-user tools (for novices experts)

Instance population tools(for experts)

Phases 1, 2 View

Existing ToolsMentor

Graphics

Product Model(AP210)

“dumb” information capture(only human-sensible,I.e., not computer-sensible)

Legend

STEP-Book AP210,SDAI-Edit,

STI AP210 Viewer, ...

Instance Browser/EditorPWB Stackup Tool

ECAD Tools


Phase 1 Demonstration & Overview



Phase 1 Accomplishments Conceptual architecture and roadmaps Repository/PDM methodology in Metaphase

– Gained familiarity via initial test cases: PWA/Bs & mechanical assy. PWB stackup design tool

– Exemplifies ancillary info capture– In XaiTools PWA-B v1.1 (current-generation framework)

» Upgraded from v1.0 to support IS AP210 subset (prototype)– Supports laminates selection & post-lamination thickness calcs. (beta)– Added new graphical OEM/spec view (alpha)– Includes example analysis modules: warpage (beta)

Next-generation XaiTools PWA-B vM.1.a2 (alpha)– Web-based mockup illustrating target extended capabilities

AP210/STEP-based tool methodology Analysis module methodology & general-purpose tools

– XaiTools FrameWork v0.5 (beta/production)


PDM Contents

• Metaphase Introduction (adapted from SDRC)• Metaphase Familiarization and Support

Georgia Tech Support Team Georgia Tech Metaphase Training Timeline

• E-Widget v1.1 – Test Case 1 Test Case Introduction Product Structure Model Metaphase Model

• E-Widget v2.1 – Test Case 2 Test Case Introduction Product Structure Model Metaphase Model


PDM Contents (cont.)

• Warning Module PWA – Test Case 3 Test Case Introduction Product Structure Model Metaphase Model Detail – Path 1 Detail Path 2

• Metaphase Features Experienced• Metaphase Work Observations• Next Steps

Selected slides are included here from a larger PDM-oriented presentation.

Contact us for further information if interested.


Benchmark ExampleExtended wing in-deck galley end tie (ewidget) - case 1

• Made up of three components• Entire assembly is welded together

Case 1 – E-Widget v1.1

End Block 1

End Block 2

Sheet Tie 2 Welds

Welds


usesXYZ-430

E-Widget v1.1

Described byManufacturing

DocumentMfg. Notes

MS PowerPoint Document

Described byDesign

Document

Described byDesign

DocumentXYZ-440_FEA

ANSYS File

XYZ-440CATIA v5 File

XYZ-440Back plate Type 3

End Block 1

XYZ-450

Corner Sheet 2 Described byDesign

DocumentXYZ-450

CATIA v5 File

Sheet Tie 2

XYZ-455Backplate Type 6

Described byDesign

DocumentXYZ-455

CATIA V5 File

End Block 2

Described byDesign

DocumentE-Widget Assembly

CATIA v5 File

E-Widget Version 1.1 – Product Structure Model


E-Widget v1.1 – Metaphase Model(In OMF Tool)


Benchmark ExampleExtended wing in-deck galley end tie (ewidget) - case 2

• Made up of five components• End Block 1 is welded to Sheet Tie 2• End Block 2 is bolted to Sheet Tie 2

Case 1 – E-Widget v2.1

End Block 1

End Block 2

Sheet Tie 2 Bolts

Welds


usesXYZ-431

E-Widget v2.1

Described byManufacturing

DocumentMfg. Notes


Described byDesign

Document

Described byDesign

DocumentXYZ-440_FEA

ANSYS File

XYZ-440CATIA v5 File

XYZ-500Bolt

Bolt1, Bolt2

Described byDesign

DocumentXYZ-500

CATIA v5 File

XYZ-455Backplate Type 6

Described byDesign

DocumentXYZ-455

CATIA V5 File

XYZ-455

Corner Sheet 2 Described byDesign

DocumentXYZ-455

CATIA v5 File

XYZ-440Back plate Type 3

End Block 1

Sheet Tie 2

End Block 2

Described byDesign

DocumentE-Widget Assembly

CATIA v5 File

E-Widget Version 2.1 – Product Structure Model


E-Widget v2.1 – Metaphase Model


Benchmark ExampleWarning Module PWA – Case 3


Warning Module PWA

PWA = printed wiring assemblyPWB = printed wiring board

U5

PWA

K1

PWB

R10; R46


Warning Module PWA – Product Structure Model

usesABC-9010

Warning Module PWA

Described byDesign

Document

Described byDesign

Document

24052-4993Resistor RC1206

R10, R11, R12, R13, R14

Described byDesign

Document

24052-2003Resistor RC1206

R46, R47, R48

Described byDesign

Document

20135-5512 Digital Oscillator K_M28776_7

K1

Described byDesign

Document

22471-338

Relay TO_220_5_LF

U5

Described byDesign

Document

ABC-9230Warning Module PWB

Board 1

Mfg. NotesMS PowerPoint Document

PWA DesignSTEP File

Described byDesign

DocumentPWB Stack up Design

STEP File

Described byDesign

DocumentPWB Mfg. Notes


Resistor Mfg. NotesMS PowerPoint Document

Resistor Mfg. NotesMS PowerPoint Document

K1 Mfg. NotesMS PowerPoint Document

U5 Mfg. NotesMS PowerPoint Document


Warning Module PWA – Metaphase Model


Item Info – ABC_9010 Assembly


Metaphase Features Experienced in Examples

• OMF (Object Management Framework) Meta-document creation (design documents, etc.) Data file uploading and registering General user features Web-based access (e!Vista and Meta Web)

• APC (Advanced Part Configurator) Product structure creation

Part and component creation Relationship creation and management

• Customization and Advanced Tasks New data file type creation Direct Oracle data manipulation


ProAM Design-Analysis IntegrationElectronic Packaging Examples: PWA/B

Analysis Modules (CBAMs) of Diverse Mode & Fidelity

Design Tools

Laminates DB

FEA Ansys

General MathMathematica

Analyzable Product Model

XaiToolsPWA-B

XaiToolsPWA-B

Solder JointDeformation*

PTHDeformation & Fatigue**

1D,2D

1D,2D,3D

Modular, ReusableTemplate Libraries


Accel*

temperature change,T

material model

temperature, T

reference temperature, To

cte,

youngs modulus, E

force, F

area, A stress,

undeformed length, Lo

strain,

total elongation,L

length, L

start, x1

end, x2

mv6

mv5

smv1

mv1mv4

E

One D LinearElastic Model(no shear)

T

e

t

thermal strain, t

elastic strain, e

mv3

mv2

x

FF

E, A,

LLo

T, ,

yL

r1

12 xxL

r2

oLLL

r4

A

F

sr1

oTTT

r3L

L

m a t e r i a l

e f f e c t i v e l e n g t h , L e f f

d e f o r m a t i o n m o d e l

l i n e a r e l a s t i c m o d e l

L o

T o r s i o n a l R o d

G

J

r

2

1

s h e a r m o d u l u s , G

c r o s s s e c t i o n :e f f e c t i v e r i n g p o l a r m o m e n t o f i n e r t i a , J

a l 1

a l 3

a l 2 a

l i n k a g e

m o d e : s h a f t t o r s i o n

c o n d i t i o n r e a c t i o n

t s 1

A

S l e e v e 1

A t s 2

d s 2

d s 1

S l e e v e 2

L

S h a f t

L e f f

s

T

o u t e r r a d i u s , r o a l 2 b

s t r e s s m o s m o d e l

a l l o w a b l e s t r e s s

t w i s t m o s m o d e l

M a r g i n o f S a f e t y( > c a s e )

a l l o w a b l e

a c t u a l

M S

M a r g i n o f S a f e t y( > c a s e )

a l l o w a b l e

a c t u a l

M S

a l l o w a b l et w i s t Analysis Tools

PWBWarpage

1D,2D

Materials DB


STEP AP210‡ GenCAM**,

PDIF*

‡ AP210 DIS WD1.7 * = Item not yet available in toolkit (all others have working examples) ** = Item available via U-Engineer.com


Overview of PWB Stackup Design

Fabrication engineer designs PWB stackup details

Stackup Specs - PWA/B Designer

Layer 1: 1 Oz. Cu Foil






component

plane

signal

signal

plane

solder

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

.065

.055overbase

material

OR

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

2 Oz. Cu

2 Oz. CuM150P2P11184

M150P1P21184

3 x 1080

3 x 1080

2 x 2116

Design Alternative 1

Stackup Design - PWB Fabricator

3 X 106

3 X 106

M150P1P21184

M150P2P11184

M150P1P11184

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

2 Oz. Cu

2 Oz. Cu

…Design Alternative n

1 Oz. Cu


Post-Lamination Thickness CalculationExample Design Requirement Check

Before: Typical Manual Worksheet(as much as 1 hour engr. time)

After: Tool-Aided Design (ProAM)

321

221

1 2/2/C

t

ytC

t

ytC

n

iii

n

iii

B

n

ithickessnestedthicknessationlapost1

__min_

filltoretkthicknessnestedp

isfnsetprepreg _sin__1

_


Stackup DesignEnd User Scenarios

ap210.exp (IS CC24)

xxx.step(or other format)

MentorGraphics

mg-ap210

MG file(s)

XaiTools PWA-B

Translator

Board Station v8

(2), (4)

(1)

pwb_stackup.step

XaiTools PWA-B

COBServer

StackupTool

AnalysisModules

MathSolver

Mathematica v4.1

FEASolver

Ansys v5.6

files

v1 - OEM specv2 - OEM spec plus

stackup details

LaminatesDatabase

• OEM spec viewing & editing • Detailed stackup design• Post lamination thickness calc.• <other calcs.>

XaiTools FrameWork

• Warpage analysis• <PTH reliability analysis>• <other analysis>

(3)

(1), (5)

XaiTools PWA-B v1.2 Scope (in JPL Phase 1 Project)


Stackup “OEM Spec”Editor/Viewer








component

plane

signal

signal

plane

solder

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

.065

.055overbase

material







component

plane

signal

signal

plane

solder

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

.065

.055overbase

material

OR

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

2 Oz. Cu

2 Oz. CuM150P2P11184

M150P1P21184

M150P2P11184

M150P1P21184

3 x 1080

3 x 1080

2 x 2116



3 X 106

3 X 106

M150P1P21184

M150P2P11184

M150P1P11184

M150P1P21184

M150P2P11184

M150P1P11184

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

2 Oz. Cu

2 Oz. Cu


1 Oz. Cu


Stackup “OEM Spec” ViewerExample Instances from 210-Based Designs

2 layer design

4 layer design 6 layer design


Detailed Stackup Design








component

plane

signal

signal

plane

solder

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

.065

.055overbase

material







component

plane

signal

signal

plane

solder

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

Epoxy Glass GF/ PGF

.065

.055overbase

material

OR

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

2 Oz. Cu

2 Oz. CuM150P2P11184

M150P1P21184

M150P2P11184

M150P1P21184

3 x 1080

3 x 1080

2 x 2116



3 X 106

3 X 106

M150P1P21184

M150P2P11184

M150P1P11184

M150P1P21184

M150P2P11184

M150P1P11184

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

2 Oz. Cu

2 Oz. Cu


1 Oz. Cu


Iterative Design & Analysis PWB Stackup Design & Warpage Analysis

AnalyzableProduct Model

PWB Stackup Design Tool

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

2 Oz. Cu

2 Oz. CuTetra GF

Tetra GF

3 x 1080

3 x 1080

2 x 2116

2D Plane Strain Model

b L T

t

2

Detailed FEA Check

bi i i

i

w y

t w

/ 2

1D Thermal Bending Model

StackupRe-design

PWB Warpage Modules

Quick Formula-based Check


Warpage Analysis ModulesCheck Warpage Requirement - Two Fidelity Levels

Detailed FEA Check

Quick Formula-based Check

b L T

t

2

bi i i

i

w y

t w

/ 2


total_thicknesspwa

layup layers[0]

layers[1]

layers[2]

TOTAL

CU1T

CU2T

POLYT

PREPREGT

TETRA1T

EXCU

ALPXCU

EXEPGL

ALPXEGL

TO

deformation model

ParameterizedFEA Model

ux mos model

Margin of Safety(> case)

allowable

actual

MS

UX

condition

UY

SX

associated_pwb

nominal_thickness

prepregs[0] nominal_thickness

top_copper_layer nominal_thickness

related_core nominal_thickness

prepregs[0] nominal_thicknesslayers[3]

primary_structure_material linear_elastic_model E

cte

primary_structure_material linear_elastic_model E

cte

reference temperature

temperatureDELTAT

APM ABB

SMM

PWB Warpage Modulesa.k.a. CBAMs: COB-based analysis templates

deformation model

Thermal Bending Beam

L

b

T

Treference

t

T

total diagonalassociated_pwb

total thickness

coefficient of thermal bending

al1

al2

al6

al3

t

TLb

2

warpage

wrapage mos model

allowable

MSactual

Marginof Safety

associated condition

al5

al4

temperature

reference temperature

pwa

APM

ABBPWB Thermal Bending Model

(1D formula-based CBAM)

PWB Plane Strain Model (2D FEA-based CBAM)

APM



– Gained familiarity via initial test cases: PWA/Bs & mechanical assy.

PWB stackup design tool (in XaiTools PWA-B v1.1) Next-generation XaiTools PWA-B vM.1.a2 (alpha)

– Web-based mockup illustrating target extended capabilities AP210/STEP-based tool methodology Analysis module methodology & general-purpose

tools – XaiTools FrameWork v0.5 (beta/production)


Next-Generation XaiTools PWA-B Mockup Demonstration Overview

Initial mockup illustrating key envisioned extensions– Helps identify and refine end user scenarios– Status: Needs end user feedback and several more iterations– Provides basis for next steps:

» Software architecture refinement» Working prototype and production tools

Assumptions– Use PDM system and other information stores underneath– Re-use existing tools where feasible

(provide smart glue and gap fillers) Mockup demo

– Starts with an in-progress PWA/B design (some Mentor design has been done and loaded into the PDM)

– Shows main usage scenario, plus a few side paths Starting Points: http://eislab.gatech.edu/tools/XaiTools/PWA-B/vM.1.a2/readme.txt

http://eislab.gatech.edu/tools/XaiTools/PWA-B/vM.1.a2/mockup/

Selected screen shots are included here. See links below for further information.


Design Requirements & ObjectivesProvide Context, Purpose, & Status Checks


Stackup Detailed Design: Build-Up Type


Stackup Detailed Design: Laminate Selection & Thickness Check


Stackup Detailed Design: Warpage Checks


Stackup Detailed Design: Warpage FEA Model Details


Stackup Design: Updated Requirements Status

Other scenarios:(done as ppt animation in the following slides; not implemented in web mockup yet):

Interacting with underlying fine-grained multi-directional constrained objects (COBs )

See also Short Course slides for other COB views/tools:

Ex. COB Tree Browser (an object-oriented spreadsheet)

Shows ABC_9010 PWA - instance with PWB attributes and relations


Using COBs for Multi-Directional Design K1 Digital Oscillator - State 0: Unspecified Standoff Height

D e f i n i t i o n s ( n o t t o s c a l e ) S c a l e d

z

h s o

h ch a h s r

t p w b

P W A C o m p o n e n t L o c a t i o n : K 1 D i g i t a l O s c i l l a t o r

A t t r i b u t e s

F i g u r e s U p d a t e

o r i g i n . x : 0 . 7 1 2 5 i n c h e si

o r i g i n . y : 2 . 4 8 7 5 i n c h e si

o r i g i n . z : i n c h e so

r o t a t i o n : 0 . 7 1 2 5 i n c h e si

s u r f a c e : T o p i

m a x . h e i g h t ( a b s o l u t e ) , h a : i n c h e s

s t a n d o f f h e i g h t , h s o : i n c h e si

o

m a x . h e i g h t ( s u r f a c e r e l a t i v e ) , h s r : i n c h e so

c o m p o n e n t b o d y h e i g h t , h c : i n c h e s0 . 5 0 0i

z

h s o

h ch a h s r

t p w bu n k n o w n

C o n s t r a i n t S c h e m a t i c - I

0 . 5 0 0 i n .0 . 0 6 0 i n .

2 0 1 3 5 - 5 5 1 2 d i g i t a l o s c i l l a t o rA B C _ 9 2 3 0 W a r n i n g M o d u l e P W B

c o m p o n e n t

l w

h

c o m p o n e n t , c

r 2

socsr hhh

s t a n d o f f h e i g h t , h s o :

m a x . h e i g h t ( s u r f a c e r e la t i v e ) , h s rr 1

pwbsra thh m a x . h e i g h t ( a b s o l u t e ) , h a

p w b

l w

p w b

t

r 3

pwbso thz zo r i g i n

0 . 5 0 0 i n .0 . 0 6 0 i n .


0 . 5 0 0 i n .0 . 0 6 0 i n .


c o m p o n e n t

l w

h


r 2

socsr hhh




p w b

l w

p w b

t

r 3


c o m p o n e n t

l w

hc o m p o n e n t

l w

h


r 2

socsr hhh




p w b

l w

p w b

t

r 3



Using COBs for Multi-Directional Design K1 Digital Oscillator - State 1: Input Standoff Height

D e fin it io n s (n o t to s c a le ) S c a le d

z

h s o

h ch a h s r

tp w b

P W A C o m p o n e n t L o c a t io n : K 1 D ig ita l O s c il la to r

A ttr ib u te s

F ig u re s

z

h s o

h ch a h s r

tp w b0 .0 5 0 - 0 .1 0 0 in .

0 .5 5 0 - 0 .6 0 0 in .

U p d a te

o r ig in .x : 0 .7 1 2 5 in c h e si

o r ig in .y : 2 .4 8 7 5 in c h e si

o r ig in .z : 0 .1 1 0 -0 .1 6 0 in c h e so

ro ta t io n : 0 .7 1 2 5 in c h e si

s u r fa c e : T o p i

m a x . h e ig h t (a b s o lu te ) , h a : in c h e s

s ta n d o ff h e ig h t, h s o : in c h e s0 .0 5 0 - 0 .1 0 0i

0 .6 1 0 - 0 .6 6 0o

m a x . h e ig h t (s u r fa c e re la t iv e ) , h s r : in c h e s0 .5 5 0 - 0 .6 0 0o

c o m p o n e n t b o d y h e ig h t, h c : in c h e s0 .5 0 0i


c o m p o n e n t

l w

hc o m p o n e n t

l w

h


r 2

socsr hhh




p w b

l w

p w b

t

r 3


0 . 6 1 0 - 0 . 6 6 0 i n . 0 . 5 5 0 - 0 . 6 0 0 i n .

0 . 5 0 0 i n .

0 . 0 5 0 - 0 . 1 0 0 i n .

0 . 0 6 0 i n .

0 . 1 1 0 - 0 . 1 6 0 i n .



Using COBs for Multi-Directional Design K1 Digital Oscillator - State 2: Output Standoff Height

D e fin it io n s (n o t to s c a le ) S c a le d

z

h s o

h ch a h s r

tp w b

P W A C o m p o n e n t L o c a t io n : K 1 D ig ita l O s c il la to r

A ttr ib u te s

F ig u re s U p d a te

z

h s o

h ch a h s r

tp w b0 .1 5 0 - 0 .2 0 0 in .

0 .6 5 0 - 0 .7 0 0 in .

o r ig in .x : 0 .7 1 2 5 in c h e si

o r ig in .y : 2 .4 8 7 5 in c h e si

o r ig in .z : 0 .1 1 0 -0 .1 6 0 in c h e so

ro ta t io n : 0 .7 1 2 5 in c h e si

s u r fa c e : T o p i

m a x . h e ig h t (a b s o lu te ) , h a : in c h e s

s ta n d o ff h e ig h t, h s o : in c h e s

0 .6 1 0 - 0 .6 6 0o

m a x . h e ig h t (s u r fa c e re la t iv e ) , h s r : in c h e s0 .5 5 0 - 0 .6 0 0o

c o m p o n e n t b o d y h e ig h t, h c : in c h e s0 .5 0 0i

0 .0 5 0 - 0 .1 0 0o


c o m p o n e n t

l w

hc o m p o n e n t

l w

h


r 2

socsr hhh




p w b

l w

p w b

t

r 3


0 . 5 0 0 i n .0 . 0 6 0 i n .

0 . 2 1 0 - 0 . 2 6 0 i n .

0 . 7 1 0 - 0 . 7 6 0 i n . 0 . 6 5 0 - 0 . 7 0 0 i n .

0 . 1 5 0 - 0 . 2 0 0 i n .


0.550 - 0.600i

z

hso

hcha hsr

tpwb0.050 - 0.100 in.

0.550 - 0.600 in.

0.210-0.260o

0.710 - 0.760o

0.150 - 0.200o

0.650 - 0.700i

z

hso

hcha hsr

tpwb0.150 - 0.200 in.

0.650 - 0.700 in.


Next-Generation XaiTools PWA-B Extensions Illustrated in Mockup

Extensions

Other envisioned extensions (not included yet) – Design alternative comparisons, multi-sequence stackups, …

1) Depicts Design Req. and Objectives (DR&Os) in hierarchy context, with analysis modules associated to them. a) Gives linkage to ap233 type of systems engineering information b) Could have various hierarchy views (by assembly-part relationships, by requirements breakdown,

by discipline, …) 2) Shows stackup in context of other design parts and features, including others that are “ancillary” (i.e.,

not captured in tools like Mentor - e.g., K1 stand-off height) 3) Shows linkage with PDM/repository 4) Shows underlying constrained (COBs) and various views for advanced associativity

a) I/O changes, constraint schematics, … 5) Puts product-specific GUIs (definition figures, …) in context with generic COBs

a) Product-specific GUIs generated by late-bound information structure 6) Envisions COTS plugins and/or interfaces (knowledge-based “glue” and gap fillers to minimize re-

invention)


Development method for AP210 instances (e.g., stackup OEM view)

Define end user-oriented information requirements Create an ARM instance Mapping from ARM to AIM Create an AIM instance Load and test instance

– In STEP processing tools (e.g, Expresso)– In applications - see 210-based tool development slides

(e.g., LKSoft STEP Book, XaiTools PWA-B, …) Repeat process for more instances and expanded

information requirements

A summary is given here.Contact us for further information.


2 layer example – Information requirementStackup Specs - PWA/B Designer



Primary

plane

Epoxy Glass IPC4101/24 (GF/ PGF)

.045

.055overbase

material

Secondary

other signal


STEP Information ModelARM Instance - OEM view Example - Layer Sequence requirement

Design_layer_stratum_9

Stratum_surface_156 (Primary)

Stratum_surface_201 (Secondary)

Documentation_layer_stratum_13


Stratum_surface_147 (Secondary)

adjacent_stratum_surface_definition_202

Design_layer_stratum_23


Stratum_surface_161(Secondary)

adjacent_stratum_surface_definition_215

……..…………………

interconnect_module_secondary_surface_165

interconnect_module_primary_surface_164

interconnect_module_surface_feature_163

stratum_concept_to_physical_usage_view_relationship_157

stratum_concept_to_physical_usage_view_relationship_166


AP210 instance file (p21) – 2 layer example/* conductive layer 1 */

#100=STRATUM('zz conductive layer 1', 'zz description', #101,#4);

#101=PRODUCT_DEFINITION_FORMATION( 'zz conductive layer 1', 'primary design layer stratum', #102);

#102=PRODUCT('zz conductive layer 1', 'zzname', 'zzdesc', (#3));

#103=PRODUCT_RELATED_PRODUCT_CATEGORY( 'design layer', $, (#102));

/* conductive layer 2 */

#200=STRATUM('zz conductive layer 2', 'zz description', #201, #4);

#201=PRODUCT_DEFINITION_FORMATION( 'zz conductive layer 2', 'non primary design layer stratum', #202);

#202=PRODUCT( 'zz conductive layer 2', 'zzname', 'zzdesc', (#3) );

#203=PRODUCT_RELATED_PRODUCT_CATEGORY( 'design layer', $, (#202));

/* */

/* Stratum to Stratum Technology */

/* */

/* conductive layer 1 */

#110=PROPERTY_DEFINITION_RELATIONSHIP('technology usage', 'zz desc = conductive layer1 to stratum technology', #111, #112 );

#111=PROPERTY_DEFINITION('zz conductive layer 1', 'zzlabel', #100 );

#112=PROPERTY_DEFINITION('zzname = stratum technology', 'zzlabel',#113);

…………………….


Development method for AP210-based tools(e.g., OEM Stackup Spec Viewer)

Create Java objects to hold info. about the view desired view (e.g., OEMViewLayer)

Create a graphical viewer for the OEMViewLayer. Define mapping from AP210 instance to the

OEMViewLayer. Using JSDAI, develop a code to map JSDAI-

AP210 into OEMViewLayer.– read in AP210 instance file and create JSDAI ap210

model into memory– Extract info from JSDAI ap210 model and create

OEMViewLayers Etc.

A summary is given here.Contact us for further information.








– XaiTools FrameWork v0.5 (beta/production) See XAI Central (last slide)


An Introduction to X-Analysis Integration (XAI) Short Course Outline

Part 1: Constrained Objects (COBs) Primer– Nomenclature

Part 2: Multi-Representation Architecture (MRA) Primer – Analysis Integration Challenges – Overview of COB-based XAI

Part 3: Example Applications» Airframe Structural Analysis (Boeing)» Circuit Board Thermomechanical Analysis

(DoD: ProAM; JPL/NASA)» Chip Package Thermal Analysis (Shinko)

– Summary

Part 4: Advanced Topics & Current Research

Analysis TemplateMethodology


X-Analysis Integration Techniquesa. Multi-Representation Architecture (MRA)

1 Solution Method Model

ABB SMM

2 Analysis Building Block

4 Context-Based Analysis Model3

SMMABB

APM ABB

CBAM

APM

Design Tools Solution Tools

Printed Wiring Assembly (PWA)

Solder Joint

Component

PWB

body3body2

body1

body4

T0

Printed Wiring Board (PWB)

SolderJoint

Component

AnalyzableProduct Model

b. Explicit Design-Analysis Associativity

c. Analysis Module Creation Methodology

I n f o r m a l A s s o c i a t i v i t y D i a g r a m

C o n s t r a i n e d O b j e c t - b a s e d A n a l y s i s M o d u l eC o n s t r a i n t S c h e m a t i c V i e w

P l a n e S t r a i n B o d i e s S y s t e m

P W A C o m p o n e n t O c c u r r e n c e

CL

1

m a t e r i a l ,E( , )g e o m e t r y

b o d y

p l a n e s t r a i n b o d y , i = 1 . . . 4P W B

S o l d e rJ o i n t

E p o x y

C o m p o n e n tb a s e : A l u m i n a

c o r e : F R 4

S o l d e r J o i n t P l a n e S t r a i n M o d e l

t o t a l h e i g h t , h

l i n e a r - e l a s t i c m o d e l

A P M A B B

3 A P M 4 C B A M

2 A B Bc

4b o d y 3b o d y

2b o d y

1h oT

p r i m a r y s t r u c t u r a l m a t e r i a l

ii

i

1 S M M

D e s i g n M o d e l A n a l y s i s M o d e l

A B B S M M

s o l d e rs o l d e r j o i n t

p w b

c o m p o n e n t

1 . 2 5

d e f o r m a t i o n m o d e l

t o t a l h e i g h t

d e t a i l e d s h a p e

r e c t a n g l e

[ 1 . 2 ]

[ 1 . 1 ]

a v e r a g e

[ 2 . 2 ]

[ 2 . 1 ]

cT c

T s

i n t e r - s o l d e r j o i n t d i s t a n c ea p p r o x i m a t e m a x i m u m

s j

L s

p r i m a r y s t r u c t u r a l m a t e r i a l

t o t a l t h i c k n e s s


P l a n e S t r a i n

g e o m e t r y m o d e l 3

a

s t r e s s - s t r a i nm o d e l 1



B o d i e s S y s t e m

x y , e x t r e m e , 3

T 2

L 1

T 1

T 0

L 2

h 1

h 2

T 3

T s j

h s

h c

L c

x y , e x t r e m e , s jb i l i n e a r - e l a s t o p l a s t i c m o d e l


p r i m a r y s t r u c t u r a l m a t e r i a l l i n e a r - e l a s t i c m o d e l

c o m p o n e n to c c u r r e n c e

s o l d e r j o i n ts h e a r s t r a i nr a n g e

[ 1 . 2 ]

[ 1 . 1 ]l e n g t h 2 +

3 A P M 2 A B B 4 C B A M

F i n e - G r a i n e d A s s o c i a t i v i t y

ProductModel Selected Module

Analysis Module Catalogs

MCAD

ECAD

Analysis Procedures

CommercialAnalysis Tools

Ansys

Abaqus

Solder Joint Deformation Model

Idealization/Defeaturization

CommercialDesign Tools

PWB

Solder Joint

Component

APM CBAM ABB SMM

Ubiquitous Analysis(Module Usage)

Ubiquitization(Module Creation)

CAE

Physical Behavior Research,Know-How, Design Handbooks, ...


COB-Enhanced XAI Interoperability FrameworkCompany/Product-Independent View

v0.5.0 Capabilities - June, 2001

Libraries

MCAD: CATIA v5

ECAD: Mentor Graphics (STEP AP210 WD)PWB Layup ADT, ChipPackage ADT

FEA: AnsysMath: Mathematica

ConstraintSolver

COB Schemas

x.cos, x.exp

Analysis Module Tools(product-specific)

Mathematica

Template Libraries: CBAMs, ABBs, APMsInstances: Usage/adaptation of templates

SolutionTools

COB Instances

x.coi, x.step

Tool Forms(parameterized

tool models / SMMs)

Design Tools

COB/Object Manager COB Mgt. ToolsNavigators

Editors (text)

API / WrapperCORBA

CAD Tools

MaterialProperties Mgr.

MATDB-like files

Std. PartsManager

FASTDB-like files

XaiTools


Using Internet/Intranet-based Analysis SolversThick Client Architecture

Client PCs

XaiTools

Thick Client

Users

Internet

June’99-Present:EIS Lab - Regular internal use

U-Engineer.com - Demo usage: - US - Japan

Nov.’00-Present:Electronics Co. - Began production usage (dept. Intranet)

Future:Company Intranet and/or

U-Engineer.com(commercial) - Other solvers

Iona orbixdj

Mathematica

Ansys

Internet/Intranet

XaiTools AnsysSolver Server


XaiTools Math.Solver Server

CORBA Daemon


FEA Solvers

Math Solvers

CORBA Servers

CO

RB

A IIO

P..

.

Engineering Service BureauHost Machines


Web Services (J2EE, .NET, …) Apache, IIS

Tomcat, WebSphere, WebLogic + Accelis …

Idealization Tools*

Libraries

Synthesis Tools*

ICAD, ...

SA, MCAD, ...

COB-Enhanced XAI Interoperability FrameworkCompany/Product-Independent View

XaiTools with Envisioned Extensions - June 2001

PKM/PLM/PDM*:pgpdm, Enovia, Metaphase ...

DBMS*MySQL, Oracle, SQL Server, ...

MCAD: CATIAI-DEAS*, Pro/E*, UG *, AutoCAD*, ...

ECAD: Mentor Graphics (STEP AP210)PWB Layup ADT, ChipPackage ADT

Accel (PDIF, GenCAM)*, ...

FEA: Ansys, Elfini*, Abaqus*, ...Math: Mathematica, MathCAD*, Matlab*, ...

Optimizers: ConMin, iSIGHT*, ModelCenter*, ... In-House Codes

ConstraintSolver

Schemas

objects, x.xml*x.cos, x.exp

Analysis Module Tools(product-specific)

Mathematica

Template Libraries: Analysis Packages*, CBAMs, ABBs, APMs, Conditions*Instances: Usage/adaptation of templates

SolutionTools

Instances

objects, x.xml*x.coi, x.step

Tool Forms(parameterized

tool models/full* SMMs)

Object Managers

Design Tools

Object / COB Middleware

asterisk (*) =In-progress/envisioned extensions

Simulation Mgt. Tools

COB User ToolsNavigators

Editors (text & graphical*)

Pullable Views*,Condition Mgr*, ...

API / WrappersCORBA,

SOAP*, Jini*

CAD Tools

MaterialProperties Mgr.

MATDB*,Mvision*, ...

Std. PartsManager

FASTDB*, ...

*

*

*

t e m p e r a t u r e c h a n g e , T

c t e ,

y o u n g s m o d u lu s , E

s t r e s s ,

s h e a r m o d u lu s , G

p o is s o n s r a t io ,

s h e a r s t r e s s , s h e a r s t r a in ,

t h e r m a l s t r a in , t

e la s t ic s t r a in , e

s t r a in ,

r 2

r 1)1(2

EG

r 3

r 4Tt

Ee

r 5

G

te

Constraint Manager XaiTools

Neutral APIsOMG CAD Services,

CADScript, …


Potential Web Application Server (WAS) Framework(replaces all but a few distinct pieces of XaiTools FrameWork)

Ex: Accelis Framework (SDRC)• Uses J2EE-based WAS:

• WebLogic - BEA• WebSphere - IBM

• Web-based user interfaces

Supported Standard Wrappers • Product knowledge mgt. tools (PKM/PLM/PDM)• CAD tools• CAE tools (solvers)• Documentation tools

New Tools (WIP)* • Constrained object tools - Constraint managers & algorithms - User tools (viewers, editors) - Toolkits

* = R&D underway at GIT


Phase 1 Demonstration & Overview


– Refine architecture and tool roadmaps» Investigate Mentor Graphics ICX, DMS, …

– Enable pilot trials of stackup design scenarios» Establish near-term capabilities for each subsystem» Demonstrate roadmap progress

– Extend capabilities for AP210-based stackup design


LKSoftLKSoft

Collaborative Engineering Environment Initial Steps - Phases 1, 2

Design Tools

Laminates Library


Metaphase


Cadence

Materials Library


Nativefiles

AP210 file CC24

LKSoftSTEP s/w

JSD

AI

LKSoft, ...



AP210 file CCx1-xn

Phase 2 Approach• Increase maturity of each subsystem and path• Pilot full end user scenarios


Stackup DesignEnd User Scenarios

ap210.exp (IS CC24)

xxx.step(or other format)

MentorGraphics

mg-ap210

MG file(s)

XaiTools PWA-B

Translator

Board Station v8

(2), (4)

(1)

pwb_stackup.step

XaiTools PWA-B

COBServer

StackupTool

AnalysisModules

MathSolver

Mathematica v4.1

FEASolver

Ansys v5.6

files

v1 - OEM specv2 - OEM spec plus

stackup details

LaminatesDatabase

• OEM spec viewing & editing • Detailed stackup design• Post lamination thickness calc.• <other calcs.>

XaiTools FrameWork

• Warpage analysis• <PTH reliability analysis>• <other analysis>

(3)

(1), (5)

Phase 2 Considerations• MGC ICX tool - stackup specs, impedance calcs.• Multi-PDM federation: MP, MGC DMS, NASA pgpdm• AP210 translator link• Next-gen XaiTools (web-based)• SOAP-based CAE tool links


Expected Benefits STEP AP 210-based method

» Depth, extendibility Capture of ancillary information

– Representative tool: PWB stackup design» Graphics, automation» Tangible end user benefits» Technique illustration

– “Better, faster, cheaper”» Increased product model completeness» Reduced downstream errors» Increased automation» Increased knowledge retention


For Further Information ...

EIS Lab web site: http://eislab.gatech.edu/– Publications, project overviews, tools, etc.– See: X-Analysis Integration (XAI) Central

http://eislab.gatech.edu/research/XAI_Central.doc

XaiTools™ home page: http://eislab.gatech.edu/tools/XaiTools/

Pilot commercial ESB: http://www.u-engineer.com/– Internet-based self-serve analysis– Analysis module catalog for electronic packaging– Highly automated front-ends to general FEA & math tools

development of advanced collaborative engineering environments (cees) phase 1 overview version 3a -...

Documents

engineering processes

ancillary information

types of information

design objects

georgia usahttp

gtrc phase

downstream tools

current cad tools