deploy more functions latency at the edge … · latency, high-bandwidth multi-access edge (mec)...
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ME2400MOBILE EDGE / MECPLATFORM
DEPLOY MORE FUNCTIONS
AT THE EDGE
RUN ULTRA-LOW
LATENCY APPLICATIONS
ME2400 — MOBILE EDGE/MEC CONVERGED PLATFORM SHORT-DEPTH, HIGH-PERFORMANCE COMPUTE AND IO ACCELERATION IDEAL FOR RADIO ACCESS NETWORK (RAN), LTE FUNCTIONS, AND ANY ULTRA-LOW LATENCY, HIGH-BANDWIDTH MULTI-ACCESS EDGE (MEC) APPLICATIONS
SCALE YOUR INFRASTRUCTURE WITH EASE WITH UP TO 4 HOT-SWAPPABLE MODULES FOR COMPUTE, NETWORK, STORAGE, AND PCIE IO ACCELERATION
SUPPORTS RACK SCALE DESIGN (RSD) FOR SMART MANAGEMENT SOLUTIONS
REDUCE BANDWIDTH
DEMANDS TO CORE
SUPERIOR SCALABLE MODULARITY:
MIX n‘ MATCH CPU, STORAGE, GPU, FPGA
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EUROPE, MIDDLE EAST & AFRICALise-Meitner-Str. 3-586156 AugsburgGermanyTel.: + 49 821 4086-0Fax: + 49 821 [email protected]
CORPORATE OFFICES
ASIA PACIFIC
1~2F, 10 Building, No. 8 Liangshuihe 2nd Street, Economical & Techonological Development Zone,Beijing, 100176, P.R. ChinaTel.: + 86 10 63751188Fax: + 86 10 [email protected]
NORTH AMERICA
9477 Waples Street San Diego, CA 92121USATel.: + 1 888 294 4558Fax: + 1 858 677 [email protected]
KONTRON CANADA
4555 Ambroise-LaFortuneBoisbriand, QCCanada J7H 0A4Tel.: + 1 450 437-5682Tel: + 1 800-387-4223
Service providers need to deploy virtualized services across VMs and/or cloud-native containers and, simultaneously, push more intelligence and processing across distributed edge points that have limited space availability and yet still require diverse types of compute and storage.
Kontron solves this with the hardware design of the new ME Series of 1U, 2U and 3U platforms. They represent the intersection of common open modular designs, special short-depth form factors, and, most importantly, an opened door for network architects to now freely choose how they mix and match consumable components (CPU, FPGA, DSP, GPU, NVMe) in a highly integrated and scalable edge deployment.
The ME Series are dedicated to support the full array of 4G LTE- and future 5G-based services that require ultra-compute and scalable accelerators deployed at mobile base stations and other telco-like multi-access edge computing (MEC) environments.
MULTI-ACCESS EDGE (MEC) PLATFORMS FOR HIGHLY
EFFICIENT EDGE SERVICES
Enclosure
Standard 19 in. rack mountable, with only 300 mm [11.8 in.] max depth, including front handles;
Designed for side to side cooling with hot-swappable fan and fi lter trays;
Up to 4 hot-swappable modules (compute, network, storage, accelerator);
Front access Dual DC input power feed of -57 VDC to -40 VDC
Modular Nodes MEC200 dual server compute module:
Network: Four 10 GbE (data plane)
Two Intel® 8 Cores Xeon® D-1548, 2.0 GHz, 45 W
Two Intel® 12 Cores Xeon® D-1559, 1.5 GHz, 45 W
Two Intel® 12 Cores Xeon® D-1567, 2.1 GHz, 65 W
Per CPU: Four DIMM slots for up to 128 GB DDR4 memory; supports RDIMM, UDIMM
1.2V ECC, up to 2400 MHz;
One M.2-2242 SSD SATA up to 512 GB;
One M.2-2242 SSD NVMe up to 1 TB
MEX100 acceleration module:
PCIe module supporting x8 Gen 3 full-height half-length (FHHL) (x16 mechanical);
Power: maximum consumption at 75 W;
Storage: Two M.2 SSD NVMe x4 storage module up to 1 TB;
Network: One 1 GB RJ45 port for the control plane; Six 10 GB SFP+ ports for the data plane
Front Access: 1x micro-B USB serial port; 1x RJ45 1GbE management port; 6x SFP+ ports
which can be connected with up to eight 10 GbE fabric interfaces from MEC200 module
Management Independent management network supporting Redfi sh API and IPMI v2.0;
Secure remote management capabilities (encrypted fi rmware, boot, storage);
Aggregation of remote sites in a single tool;
Ready for bare-metal provisioning using MAAS, Ironic, Puppet, Ansible, among others;
Remote access using KVM and VM; Power management and power caps
Environment Operating Temperature: -40ºC to +65ºC (-40ºF to 149ºF) at the air inlet
Operating Humidity: Telcordia GR-63, ETSI EN 300 019-2-4 class T4.1
Operating Vibration: ETSI EN 300 019-2-4 class T4.1 and IEC 60721-3-4 class 4M5
TECHNICAL INFORMATION