The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 1

the product:the product:

ALPHA®

SACX™Plus0807

Product Guide

Delivering the confidence you need to move to a lower silver alloy without sacrificing soldering performance or reliability

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 2

PAGE

Reliability 18-22Basic Properties 18Joint Strength 19Thermal Cycling 20-22

Joint Appearance 23Availability 24When to Consider SACX™ Plus 0307 25Summary of Properties 26Technical Data Sheet & MSDS 27

Contents PAGE

Introduction 3-5Features and Benefits 3Overview of SACX™ Alloys 4-5

Basic Alloy Properties 6Processing Parameters 7-9

Manufacturability 7Copper Erosion Data 8Dross Rates 9

Soldering Performance 10-17Wetting Balance 10-11Spread 12Skips 13Bridging 14Solderballing 15Hole-Fill 16-17

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 3

Introduction

ALPHA® SACX™ Plus 0807 is a newly designed and tested Pb-free electronics soldering alloy that uses the latest innovations to deliver best in class soldering performance and reliability. It’s also easy to use and can be dropped in to most current SAC 305 wave soldering processes. ALPHA® SACX™ Plus 0807 contains just the right amount of additives to be the perfect choice

for the most challenging assemblies while also helping Assemblers lower their material costs.

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 4

Overview of the SACX™ Plus Family of Pb-free Alloys

• Alloys are engineered for optimal performance in specific processes or on certain types of assemblies

• Alloys are fully cross compatible For example, a component can be readily soldered to a SACX™ Plus 0307 HASL finished pad using the SACX™ Plus 0807 wave solder alloy

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 5

High Performance Alloys for Every Assembly

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 6

Alloy Properties - Basic

Measured resistance of solid wire at 22°C0.1385 µΩm0.1399 µΩmResistivity

100 - 180°C at 1°C / minuteN/A20.2 x 10-6 / C

30 - 100°C at 1°C / minute21.9 x 10-6 / C19.5 x 10-6 / CCoefficient ofThermal Expansion

N/A

7.37 g / cm³

220ºC

216ºC

SAC 305

0.23 J/g/°C

7.4 g / cm³

225ºC

216ºC

SACX®0807

@100°C, Differential Scanning Colorimeter (DSC)

Calculated value

Differential Scanning Colorimeter (DSC)

Differential Scanning Colorimeter (DSC)

Test Method / Condition

Specific Heat

Density

Liquidus (peak)

Solidus

Material Property

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 7

Processing Parameters- “Manufacturability”

Assembly Types

Contact time (single and dual wave)

Conveyor speed

Operating Temperature

Material Property

From simple single side paper phenolic boards to thick (2.4mm+),complex 2-sided FR4 with OSP pad finishes that have hardened from prior reflow excursions

Seconds2 - 5

º C255 - 265

UnitsSACX®0807

m/min (ft/min)

0.8 - 1.5 (2.6 – 5.3)

• With SACX™ Plus 0807 , there is no need to change settings as it can be used in virtually any higher silver Pb-free alloy wave soldering process• Unlike Ag free alloys, SACX™ Plus 0807 requires no costly increase in pot temperature in order to provide acceptable wetting performance

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 8

Processing Parameters – Copper Erosion

Time taken for a .05mm copper wire to fail under a 1.5g load when

immersed in 260ºC static solder bath

Wire Break Times at 260C

0

5

10

15

20

25

30

35

SAC305 SACX®0807

seco

nds

Because of proprietary additives, SACX™ Plus 0807 exhibits much lower rates of copper erosion than SAC305

Cu erosion at barrel “knee”after 50 secs. exposure over

wave

SAC305

SACX®0807

No erosion

Actual Cu trace erosionTest 2Test 1

Cu plated through

hole

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 9

0

500

1000

1500

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36

Time (Hours)

Wei

ght (

g)

SACX0807 SAC305

Processing Parameters – Dross Rate

Proprietary additives

substantially decrease the

amount of dross produced by

SACX™ Plus 0807 versus traditional

SAC305

50% less dross can save >$5K / per line / per year!

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 10

Wetting Balance Test - Pot temp. 260C

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

0.90

1.00

SAC305 SACX0807Alloy

Wet

ting

Tim

e (s

econ

ds)

Soldering Performance – Wetting Speed

•SACX™ Plus 0807is engineered to have lower surface tension• Lower surface tension results in faster wetting• Faster wetting means better hole fill

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 11

Soldering Performance – Wetting Force

-4

-3

-2

-1

0

1

2

3

0 1 2 3 4 5

Time / sec

Wet

ting

Forc

e / m

N

SAC305 SACX®0807 Wetting Balance tests show the wetting force (Fmax) of SACX™ Plus 0807 is nearly identical to SAC305 under the same test conditions

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 12

Similar spread characteristics as SAC305

Soldering Performance – Spread

Similar wetting angles as SAC305

SAC305

SACX™Plus 0807

Spread Coefficient (JIS) 260C

70.0071.0072.0073.0074.0075.0076.0077.0078.0079.0080.00

SACX0807 SAC 305

Spre

ad v

alue

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 13

Transistors - Skips per Board

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

0.90

1.00

1

# of

Ski

ps

SACX0807

SAC305

Soldering Performance – Skips

Solder Skip resistance of SACX™Plus 0807 equivalent to SAC305 in our testing. No skips were seen with either alloy during testing.

Chip Capacitors - various sizes

0.000.100.200.300.400.500.600.700.800.901.00

1

# of

Ski

ps

SACX0807

SAC305

DualChip / Lambda

Wave .Configuration

1.3 m / minConveyor Speed

260ºCPot temp.Entek HTPad finish

ALPHA EF-8000FluxProcess set-up

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 14

Bridges per 0.8mm QFP

0.0010.0020.0030.0040.0050.0060.0070.00

1

Alloy

# of

Brid

ges

SACX®0807 SAC305

Soldering Performance – Bridging

DualChip / Lambda

Wave .Configuration

1.3 m / minConveyor Speed

260ºCPot temp.Entek HTPad finish

ALPHA EF-8000FluxProcess set-up

Bridges per Connector

0.0020.00

40.0060.00

80.00100.00

1A lloy

# of

Brid

ges

SACX®0807 SAC305

Designed to deliver excellent solder drainage

Good drainage = low bridging

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 15

Solder Ball Performance

0.00

20.00

40.00

60.00

80.00

SAC 405 SACX0807

Avg

. # p

er b

oard

Equivalent solder balling resistance compared to higher silver SAC

alloys

Soldering Performance – Solder Balls

DualChip / Lambda

Wave .Configuration

1.3 m / minConveyor Speed

260ºCPot temp.Entek HTPad finish

ALPHA EF-8000FluxProcess set-up

Average # of micro solder balls recorded from sampling of 24 processed assemblies

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 16

DualChip / Lambda

Wave .Configuration

1.3 m / minConveyor Speed

260ºCPot temp.Entek HTPad finish

ALPHA EF-8000FluxProcess set-up

Soldering Performance – Hole-Fill

High wetting force leads to improved hole-fill at standard

operating temperatures

SAC305

SACX™Plus 0807

0.00

20.00

40.00

60.00

80.00

100.00

Ave 10mil Hole-Fill Ave 20mil Hole-Fill Ave 40mil Hole f ill

AVer

age

Hol

e Fi

ll (%

)

SACX®0807 SAC305

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 17

In field trials, SACX™Plus 0807 achieved comparable hole-fill performance to higher silver SAC alloys

Soldering Performance – Hole-Fill

SACX™Plus 0807 SAC405

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 18

Reliability – Basic Properties

1.5 kg weight at 100ºC>1000 hrs>1000 hrsSolder Creep (time to failure)

33.5%32 MPa

14.7 Hv(after aging)

SAC 305

21.5%30.7 MPa

13.2 Hv(after aging)

SACX™ Plus 0807

Strain rate 10-3 per second Strain rate 10-3 per second

Vickers Hardness – cast samples “aged”for 24hrs @ 125ºC

Test Method

ElongationTensile Strength

Hardness

Material Property

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 19

Shear and Pull Testing Results

0

5

10

SACX0807 SAC305

Shea

r For

ce

200

250

300

350

400

450

500

550

Pulli

ng F

orce

Shear

Pull

Reliability – Joint Strength (shear and pull tests)

Additives contribute to joint strength

that is similar to SAC305

Mean data collected from over 20 separate tests

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 20

Joint inspections and cross sectional analysis performed on large power management devices in high heat capacity areas

• Large Equipment Board• 1.6mm FR4 multilayer PCB• Entek OSP HT• 1 prior glue cure• 4% solids ROL0 flux• Current alloy – SAC 405

Thermal Cycling – Test Vehicles usedBottom Side

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 21

Reliability – Thermal Cycling test conditions and results

Test Conditions – Shock profile - Twin chamber environmental cabinet used to cycle between -20°C to +100°C with 1 hour dwell (total cycle time = 2.5 hrs.)

After 1000+ cycles:• Equivalent results for SACX™ Plus 0807 and SAC405 alloys

SAC405

Cross sections of radial film capacitor

SACX®0807

SAC405

External view of the bottom side joint of a large pot capacitor

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 22

Joint Degradation from Thermal Shock Testing

SAC 405 SACX0807

Alloy

Am

t. of

Def

ects

Class E

Class D

Class C

Class B

Class A

SACX®0807 outperforms

current standard!

Current customer process

with acceptable reliability

High performing, low cost alternative

Results from inspection of large heat capacity components only

SAC405 SACX™ Plus 0807

Class A – No deformation

Class B – Slight deformation

Class C – Moderate deformation

Class D – Surface striations

Class E – Surface cracks

Class D

Class E

Reliability – Thermal Cycling

Test Profile-20°C to +100°C1 hour dwell (total cycle time = 2.5 hrs.)1000+ cycles

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 23

Joint Appearance

SACX™ Plus 0807

SAC405

SACX™ Plus 0807 SAC405

Unique additives help create

uniform grain structures

resulting in shiny joints

Pb-free finish is different from SnPb finish –helps avoid

contamination during rework

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 24

Availability

ItemNumber Description

152609 BAR SACX0807 Vaculoy Kilo152610 BAR SACX0807 Vaculoy Tri-Kilo152611 BAR SACX0807 Vaculoy 3.5KG152612 BAR SACX0807 Vaculoy Chunk

152614 BAR SACX0800 Vaculoy Kilo152615 BAR SACX0800 Vaculoy Tri-Kilo152616 BAR SACX0800 Vaculoy 3.5KG

152649 BAR SACX0807 Vaculoy Ultra Low Lead Kilo152650 BAR SACX0807 Vaculoy Ultra Low Lead Tri-Kilo152651 BAR SACX0807 Vaculoy Ultra Low Lead 3.5KG152652 BAR SACX0807 Vaculoy Ultra Low Lead Chunk

152653 BAR SACX0800 Vaculoy Ultra Low Lead Kilo152654 BAR SACX0800 Vaculoy Ultra Low Lead Tri-Kilo152655 BAR SACX0800 Vaculoy Ultra Low Lead 3.5KG

SACX™ Plus 0807 is made in each of our 3 global regions

VACProduct NameBRCProduct GroupBARProduct Type

Consult your local / regional manufacturing plant for special shape or size requests

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 25

When to consider SACX™ Plus 0807• Current SAC305/387/405 or SnPb users that are evaluating

low-Ag alternatives and have “difficult to solder” assemblies– Assembler should always consider their most difficult assembly when

selecting a single alloy• Users of lower Ag or Ag free alloys that:

– Are not getting the soldering performance they need – Are seeing an increase in mechanical reliability related field failures

Use the “SACX™Plus Family” map for guidance on which alloy to offer (based on the assembly type)

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 26

Summary of Properties• Low silver content lowers alloy cost• Wide processing temperature range saves energy and

allows drop in replacement of higher silver bearing Pb-free alloys

• Vaculoying process and unique additives minimize dross

• Fast wetting speeds and high wetting force results in excellent soldering across a wide variety of assemblies

• Silver and other additives result is strong, ductile solder joints for reliability similar or better than SAC305

ALPHA® SACX™ Plus 0807

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 27

Technical Bulletin and MSDS

Documents available from www.alpha.cooksonelectronics.com or contact your local Alpha® sales office

ALPHA® SACX™ Plus 0807