de la plastronique à la « mecatronic integrated devices

1 181009_Mecaplastroconnection_S2P.pdfConfidentiel

De la Plastronique à la « Mecatronic Integrated Devices » Actualités et tendances

Mecatronic & Plastronic Connection - 09 Octobre 2018

2 181009_Mecaplastroconnection_S2P.pdf

Introduction

General S2P Presentation

The actual situation of 3D-MID

Short term innovations

Middle term innovations

Long term innovations

Conclusion

Annexe 6 DEV P 001 - Confidentiel


S2P : Smart Plastic Products

A new way to develop and manufacture integrated devices

Annexe 6 DEV P 001 160317 - Confidentiel


Company skills and values

SME expert in 3D-MID, with an innovative multidisciplinary team of mechanics/plastics, chemistry and electronics

Unique know-how in France, independent and major actorof an international network

A single desk from the idea to the manufacturing of high added value products, focused on customer qualityrequirement through design and prototyping steps.

Sharing, Customer satisfaction, Innovation


Skills needed to develop 3D-MID

Product Design

Part Manufacturing

Selective activation

Selective plating

Components assembly

Quality


How to work with us

You have an idea : S2P can make the co-development with you !

You already have your concept : S2P can prototype it !

You have finished the product development : S2P can produceit !

Expertise, Development, Prototyping, Production


They trusted us


3D- MID : Molded Interconnect Devices

An already 30 years discipline



3D-MID : a bit of History

First integrated Molded part by IBM in 1987

Several applications by selective plating early on the


Source : Molex, IBM


3D-MID : New kind of products

Miniaturization

Function integration

Weight reduction

Free design

Etc.


Source : Thalès, Airbus, S2P, Huawei


3D-MID : Mixing known and new technologies

Insert molding

Selective Plating

Laser activation

2-Shot Molding

Etc.


IR-Laser

structuring

Cleaning

Electroless Cu

Electroless Ni

Immersion Au

Injection moulding

Source : LPKF, 3D-MID E.V, BOSCH


3D- MID : Molded InterconnectMecatronic Integrated Devices

Short term Innovations



Short term innovations : New materials

From PC to PEEK

Colorable grades

Epoxy Resin thermoset

PowderCoating on metallicsubstrates

Ceramics (including CIM substrates)

Chemical plating improvement(quicker, ductile)


Source : LPKF, MacDermid


Short term innovations : Rapid prototyping

Protopaint

FDM with LDS material

Milling of LDS Material


Source : MEPEU, Franhaufer IZM, S2P


Short term innovations : Design Rules / Software

NEXXTRA MID

Target 3001!

3D Expérience DASSAULT

Design Rules from Design Of experiment ( MID Plan)


Source : Huawei, BetaLayout


Short term innovations : Serial production improvement

Prototyping available in France, Europe, World

Small serial production

Big serial production Europe and Asia

Automatisation



3D- MID : needs

Middle term Innovations



Middle term innovations : Technology Improvements

Multilayers technologies

Chemical process :

Copper acceleration

Formaldehyde Free

New finishing


Source : ITRI


Middle term innovations : Printed Electronics

Overmoulding

Large surfaces

OPV / OLED OPVIUS


Source : ifm, OPVIUS


Middle term innovations : 3D Printed Electronics

Standard surface

Multimaterial (Ceramics)

Inkjet / Dispense


Source : Hitachi


3D- MID : Will become the normal way to design a product

Long term innovations



Long term innovations : Digital manufacturing

Combination of Additive manufacturing and interconnection in 3D




Process improvementneeded :

Geometrical accuracy

Surface topology

Conductivity of inks


Source : Voxel8, Nano dimensions



Process improvementneeded :

Material development (high temperature)

Speed improvement (smallserial production)


Source : HP


Conclusion

New technologies? New way to use and combine existing and reliabletechnologies.

Not applicable for some markets? Development and improvement fromprototyping to large serial production

No future? Software development to accelerate and integrate design rules for everyday use.



CONTACT

5 rue Pierre et Marie Curie 01100 Bellignat

04 81 92 06 30

[email protected]

www.s-2p.com

Annexe 6 DEV P 001 - Confidentiel

de la plastronique à la « mecatronic integrated devices

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