NASDAQ: KLIC

A World of

Opportunity

Corporate

OverviewFebruary 2021

In addition to historical statements, this presentation contains statements relating to future

events and our future results based on management’s expectations as of February 3, 2021.

These statements are “forward-looking” statements within the meaning of the Private Securities

Litigation Reform Act of 1995.

While these forward-looking statements represent our judgments and future expectations

concerning our business, a number of risks, uncertainties and other important factors could

cause actual developments and results to differ materially from our expectations. These factors

include, but are not limited to the factors listed or discussed in our 2020 Annual Report on Form

10-K and our other filings with the Securities and Exchange Commission. Kulicke and Soffa

Industries, Inc. is under no obligation to (and expressly disclaims any obligation to) update or

alter its forward-looking statements whether as a result of new information, future events or

otherwise.

2

Safe Harbor

Company &

Industry

Positioning

Market Landscape

Benchmark

• Founding NASDAQ

Company

• History of Core-Market

Leadership

• Diversified & Growing

Served Markets

• Core Market Recovery

• Advanced Packaging

• Aftermarket Products &

Services

• Mini & MicroLED

• Balance Sheet

• Prudent M&A

• Increased Dividend

• Opportunistic Repurchase

Program

ESTABLISHED & DOMINANT CORE POSITIONS

MEANINGFUL GROWTH OPPORTUNITIES

FUNDAMENTAL STRENGTH & VALUEDELIVERY

Who We AreNASDAQ: KLIC

4

• Incumbent Positions, R&D Commitment & New Market Exposure Provides Several

Adjacent Growth Opportunities

• Semiconductor Unit Growth + Increasing Assembly Complexity Increasing Capital

Intensity of Served Markets

SEMICONDUCTOR

FABRICATION

$52B

2019 TAM

Served Market

Adjacent Opportunity

SEMICONDUCTOR

ASSEMBLY & TEST

Chip assembly & test

ELECTRONICS

ASSEMBLY

Back-End Assembly

Back-End

Lithography

Lithography

Wafer Inspection

Die Inspection

Package

Inspection

Back-End

Metrology

Metrology &

Inspection

Blade Dicing

Laser Dicing

Plasma Dicing

Backside Grinding

Mounting

Package

Singulation

Dicing

Die Attach

Wire Bond

Flip Chip /

Mass Reflow

Advanced

Packaging

Bonding

Molding & Sealing

Finishing & Marking

Package Inspection

Packaging

Advanced LED

Passive & Active

Placement

Screen Printing

Reflow &

Inspection

E.A.

Electronic device assembly

$9.4B $1.6B

$3.7B

Chip design & wafer fabrication

5

Core StrengthCore Products Support Semi Unit Growth

Personal &

Corporate Computing

Internet

Data Center

Mobility

5G, IoT, AI, Elec Vehicles,

Wearables

Source: VLSI Research, K&S Estimates

20221998

CONSISTENT CORE MARKET GROWTH (EXCLUDES ADVANCED LED)

4X EQUIPMENT PORTFOLIO GROWTH SINCE 2008

IC BONDING EQUIP REVENUE $0.9B $1.3B $2.7BIC ASSEMBLY EQUIP REVENUE $2.2B $2.9B $5.2B

2008 20181981

IC PACKAGES PRODUCED 260B 560B 1T

6

R&D/Revenue FCF Yield Dividend YieldGross Margin Repurchases /

Revenue

0.0%

12.0%

24.0%

36.0%

48.0%

60.0%

0.0%

5.0%

10.0%

15.0%

20.0%

25.0%

-2.0%

0.8%

3.6%

6.4%

9.2%

12.0%

0.0%

0.5%

1.0%

1.5%

2.0%

2.5%

0.0%

5.0%

10.0%

15.0%

20.0%

25.0%

Peer BenchmarkComparison to Semi Capital Equipment Peers with $1B-$5.5B Market Cap

KLIC

Average

Peers

7

15% CAGR

Core

Equipment

Advanced

Packaging

LED

Electronics

Assembly

APS

2015 Served

Market

$1.3B

Core Equipment

LED

Advanced

Packaging

Electronics

Assembly

APS

>$2.9B2021 Served

Market

Expanding OpportunitiesThrough Organic Development & Prudent Acquisitions

8

Auto & Industrial

13%

General

Semiconductor

63%

Memory

8%

LED

16%

Annual FY20 Total Sales of $623M

• FY20 sales up >15% Y/Y

• 74% Capital Equipment

• New traction in LED

Adding New Layers of Growth

• Complexity increasing capital intensity of core market

• Meaningful contribution of new Advanced LED opportunity

• Targeting $1.1B of FY21 sales

Capital Equipment

Revenue TTM by

End Market

Broad End-MarketsExpanding Markets, Technology Inflections & New Solutions

9

POSITIONED FOR GROWTH

Core Tech is Ubiquitous to Global Electronics

• Wire bonding is the interconnect process used in over 80% of Semiconductors

• Historic & dominant leader in this key served market

• Cash-cow business with ongoing growth potential

Established History

• Market leading positions for decades

• Direct sales & service of over 300 employees

• Equipment installed base of >140,000 systems supporting >500 customers

Key Underlying Growth Drivers

• Smartphone Recovery

• IoT & low-cost connected devices

• 5G rollouts

• Solid-state flash memory

• LED Lighting

• Cloud, data center

Core Semiconductor MarketExpanding Market with Long-term Growth Track Record

11

Core BusinessExpanding Market with Long-term Growth Track Record

-6%

-4%

-2%

0%

2%

4%

6%

8%

10%

12%

14%

16%

FY17 FY18 FY19 FY20 FY21*

$-

$250

$500

$750

$1,000

Sem

icon

du

ctor U

nit G

row

th

Reven

ue in

Millio

ns

Revenue Annual Unit Growth LT Avg Unit Growth

Historically Relevant

• Since FY19, cyclical slowdown, trade tensions and COVID-19 drove under investments in capital equipment

• Significant capacity shortfalls and complex assembly are now increasing demand

• 6.5% unit growth expected to support >$800M** of core revenue

Market Expectations

• Unit growth of >10% has delivered $890M of revenue in FY18

• Above average unit growth anticipated over the coming years

*Source: Revenue Represents Analyst Consensus as of 1/29/21;

Semi Unit Growth Estimates based on Gartner & Internal Forecasts

**Updated target as of Feb 4, 2020 12

AdvancedPackaging

Technology Change Provides Market Access

• Evolution in the Display Market

• New Semiconductor Assembly Techniques

Executing on APS Segment Strategy

Targeting >$200M of Incremental Annual Revenue

• Products in development or already developed

• Margins & fall-through above corporate average

• Significant operating leverage anticipated

Advanced Display

AftermarketProducts &

Services (APS)

New Growth OpportunitiesNew High-Growth Prospects & Tactical Strategy to Deliver New Profitability Levels

13

Moore’s Law is alive and well, but it is no longer the only approach. And depending on the market or slice of a market, it may no longer be the best approach.

– Ed Sperling, Editor in Chief, Semiconductor Engineering

Advanced and competitive K&S solutions support thermo-

compression, high-accuracy flip-chip, Cu-Cu bonding, dedicated

lithography & advanced looping are enabling package-level density

Increasing value proposition is increasing capital intensity of K&S served markets

5G, IoT and next-generation logic are demanding new assembly techniques that enable cost benefits and package-level, transistor density

Scaling has historically enabled the industry’s progress on:

• Performance & capability

• Form factor reductions

• Power efficiency enhancements

Over the past few years, scaling has failed to deliver its historic benefits causing the industry to examine alternatives…

Advanced PackagingEvolving Value Proposition for New Assembly Challenges

14

Advanced DisplayUltra-High-Speed Placement Solutions Enabling New Display Features

Leading this Significant Transition

• 700% sales growth in Advanced LED Systems Y/Y 2020

• K&S solutions in commercial, high-volume production for new feature-rich displays

• On track to achieve annual sales goal of >$100M

Mini & MicroLED wafer production expected to grow by >200% through 2025

• Evolution in display technology supporting advanced backlighting & direct view

• Potential for cost, performance & power efficiency improvements across many end applications

• End Applications: TVs, monitors, wearables, automotive, consumer electronics

15

K&S Extends Advanced LED TechnologyAnnounced Enabling Technology Acquisition February 2021

Strategic Significance

• Expedites next-generation mini and microLED solutions supporting fast-growing advanced display market

• No meaningful impact on long-term operating expense model

• Accretive within one year

Acquires

• Technology acquisition, headquartered in Cambridge, Massachusetts

• Developers of high-precision, ultrafast, laser-based placement technology - LEAPTM

• Ongoing development effort to commercialize LEAPTM with K&S

16

Opportunistic Repurchases

• 19.7M shares repurchased, since FY15

• Equivalent to 30% of FY20 ending shares balance

• Meaningfully extending value created through

organic growth execution

Competitive Dividend

• Introduced fixed quarterly dividend June 2018

• Maintaining stated goal of providing competitive

dividend yields, relative to peers

• Increased fixed divided by 16.7% December 2020

Track-Record of Delivering Direct ValueExtending Fundamental Growth Execution Through Direct-Value Delivery

Over $430M of Direct Shareholder Returns

Since FY15

17

Opportunistic

Repurchases

82%

Dividends

18%

Organizationally

Prepared to

Execute

Strategically

Dominant

Core-Market

Positions

Participating In

High-Growth

Market

Opportunities

Significant

Operational

Leverage

Potential

Track Record of

Delivering Value

Summary

18

Q&A For additional information…

investor.kns.com

investor@kns.com