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MANUFACTURING TECHNOLOGIES FOR FAN-OUT PANEL LEVEL PACKAGING CONTACT Fraunhofer Institute for Reliability and Microintegration IZM Gustav-Meyer-Allee 25 | 13355 Berlin | Germany www.izm.fraunhofer.de | [email protected] Dr. Tanja Braun Phone: + 49 30 464 03 -244 Fax: + 49 30 464 03 -254 Email: [email protected] For more information please go to: www.izm.fraunhofer.de/plp FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION Panel Level Packaging CONSORTIUM Develop a reference process ready for industrializa- tion! Work on the development of a low-cost reference process ready for industrialization! Make use of the consortium as networking platform! JOIN THE PRE-COMPETITIVE INITIATIVE TOWARDS FAN-OUT PANEL LEVEL PACKAGING! PROGRAM JUNE 28 – 29, 2016 Berlin, Germany CONTRIBUTE TO STANDARDIZATION ACTIVITIES! Work with partners along the entire value chain incl. end-users, material & equipment suppliers and manufacturing partners (OSATs)! © istockphoto BastianLinder, alengo / Bildmontage: mcc-events.de; © fotolia.de herby64

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Page 1: contact Manufacturing technologies for Fraunhofer Institute for ... · Panel level Packaging ConsortiuM Develop a reference process ready for industrializa-tion! Work on the development

Manufacturing technologies for fan-out Panel level Packaging

contact

Fraunhofer Institute for Reliability and

Microintegration IZM

Gustav-Meyer-Allee 25 | 13355 Berlin | Germany

www.izm.fraunhofer.de | [email protected]

Dr. tanja Braun

Phone: + 49 30 464 03 -244

Fax: + 49 30 464 03 -254

Email: [email protected]

For more information please go to:

www.izm.fraunhofer.de/plp

F R a u n h o F e R I n s t I t u t e F o R R e l I a B I l I t y a n D M I c R o I n t e g R at I o n

Panellevel Packaging C o n s o r t i u M

Develop a reference process ready for industrializa-tion!

Work on the development of a low-cost reference process ready for industrialization!

Make use of the consortium as networking platform!

Jo in the Pre -coMPet it ive in it iat ive towards fan-out Panel level Packaging!

PrograMJune 28 – 29, 2016 Berl in, germany

contr iBute to standardizat ion act iv it ies!

Work with partners along the entire value chain incl. end-users, material & equipment suppliers and manufacturing partners (osAts)!

© istockphoto BastianLinder, alengo / Bildmontage: mcc-events.de; © fotolia.de herby64

Page 2: contact Manufacturing technologies for Fraunhofer Institute for ... · Panel level Packaging ConsortiuM Develop a reference process ready for industrializa-tion! Work on the development

Day 1: June 28, 2016 (oPen FoR eveRyBoDy)

9:00 Introduction to Fraunhofer IZM

Klaus-Dieter Lang

9:30 Keynote Panel level Packaging

Islam A. Salama, Intel Corporation

10:00 Introduction Panel level Packaging

consortium

Tanja Braun

10:30 Coffee Break

11:00 assembly strategies for Fan-out Panel level

Packaging – Karl-Friedrich Becker

11:20 Molding / embedding for Fan-out Panel

level Packaging – Materials and

technologies – Tanja Braun

11:40 RDl for Fan-out Panel level Packaging –

Materials and technologies

Lars Böttcher / Markus Wöhrmann

12:00 Discussion – Host: Rolf Aschenbrenner

12:30 Lunch

13:30 labtour: Substrate Line • Cleanroom •

Assembly and Encapsulation • Advanced

Material Analytics

15:30 Coffee Break

16:00 standardization activities

Walter Huck, Murata Europe

16:30 closing remarks – Rolf Aschenbrenner

18:20 Pick-up for social event (see right)

Day 2: June 29, 2016 (only FoR coMPanIes who have sIgneD

the loI oR contRact)

9:00 - 15:00

topics: introduction Members (10 - 15 min per partner)

introduction statement of Work (soW)

Legal Aspects, iP rules

social event: Berlin by night

to get a taste of the city’s 200 km of waterways and 950

bridges, climb aboard a panoramic boat for a 3-hour cruise

along the river spree, and enjoy. the tour links historical

and modern Berlin and offers another perspective of the city.

Discover the inner city sights, such as the Hauptbahnhof,

Museum island and Berlin Cathedral. Admire the facades of

the Berlin City Palace, Berlin‘s red town Hall. Discover where

part of the Berlin Wall still stands at the East-side-Gallery, and

cruise past the Mercedes Benz Arena and oberbaum Bridge.

A buffet style dinner will be served on board.

Bus pick-up from Fraunhofer IZM: 18:20

ship boarding time: 18:45

ship departure time: 19:00

Address: Weidendamm / corner of Planckstraße

(Friedrichstraße)

ship arrival: 22:00 at oberbaumbrücke

on the way back there will be bus-drop-offs at Friedrichstraße

and at the Holiday inn at Hochstraße.

syMPosIuM PRogRaM