component selection the make- or-break milestone towards
TRANSCRIPT
Company Public – NXP, the NXP logo, and NXP secure connections for a smarter world are trademarks of NXP
B.V. All other product or service names are the property of their respective owners. © 2018 NXP B.V.
VP, Global Field Quality Engineering
Stephan Lehmann
Component Selection—The Make-or-Break Milestone Towards Autonomous Vehicles
June 2018 | AMF-AUT-T3193
COMPANY PUBLIC 1COMPANY PUBLIC 1
• Automotive Electronics Market – What is Changing?
• Consumer Components In Safe Automotive Applications – Industry Expert Work Group
• Fact Sheet – Your New Tool For Value Based Product Selection
• NXP Value Creation Towards Autonomous Driving - Examples
• Summary and Q&A
Agenda
COMPANY PUBLIC 2
Automotive Electronics Market –
What is Changing?
COMPANY PUBLIC 3
Ele
ctr
on
ic c
ost a
s %
of
tota
l ca
r co
st
1950 1960 1970 1980 1990 2000 2005 2010 2025?
Electronic
Fuel Injection
Airbag
ABS / ESP
Body Electronics
Multiplexing
Advanced Driver Assistance
Radar / Vision
Green Powertrain
Telematics
Infotainment/Graphics
Connected Vehicles
?
E.g
. A
udi A
8:
100 E
CU
s,
270M
B o
f S
/W
Semiconductors did penentrate the vehicle slowly over a period of 50 years.
Success model has been a vertical development chain:
1. CarOEM define vehicle requirements
2. Tier1 translate into ECU level requirements
3. Component suppliers create optimized product that meet all
requirements
This loop takes 4-5 years.
Autonomous
Vehicles
Growing Number of Automotive Electronics Applications
Gateways
COMPANY PUBLIC 4
Automotive Semiconductor Technologies Often Lagged Behind
State-of-the-Art
Advantages:
• "Older" and thus more robust technologies
• Extensive field data
• No teething troubles
• Available IP can be reused or customized
• Lower development costs
• Lower leakage currents and better high-
temperature behavior
• Better ESD and EMC performance
• Sufficient lead time for long automotive
development times
• Partially depreciated manufacturing
investment costs.
Disadvantages:
• Lower maximum speed / clock rates
• Advanced technology and factory life
• State-of-the-art IP not available / not
realizable
Specifically, the development cost advantage has made it
possible that many automotive devices were developed
specifically for the automotive industry despite relatively
low volume demands (relative to, for example, 1 billion
mobile phones / year).
COMPANY PUBLIC 5
Total Automotive Solutions for Next-Gen Automated Driving
More high-end computing, sensing, connectivity, security
ADVANCED MOBILITY APPLICATIONS
Front View
Camera SystemInterior Camera/
Driving Monitor
Smart Camera Rear—Remote Park Assist
Park Assist/Self Parking
Side Impact Assist
Blind Spot Detection/
Surround View
Radar Fusion Center
High Beam Control
Cross
Traffic Assist
Emergency Brake System and Adaptive Cruise Control
Night Vision/Surround View Camera
Required capabilities
may not (yet) be present
in a device specifically
designed for automotive
COMPANY PUBLIC 6
The Future of Components Used in Automotive• Automotive represents only 10% of the
global semiconductor market*
• The variety of products requestedcontinues to rise− Growing number of applications
− Fragmented application requirements
• R&D investment required for leading-edgecomponents is exploding **− Automotive requirements add substantial costs &
delays
• The number of products that theautomotive market can justify reducessubstantially− Specifically affecting the high-performance space
• The automotive industry needs to find ways to also integrate “standardcomponents”*** into vehicles whilemeeting quality, reliability, lifetime, safetyand security targets
* Source: WSTS 2014
** 2012 Baden-Baden - Freescale Lehmann - role of foundries for Auto MCUs
*** Any components not specifically developed for target market automotive
Automotive, 10%
Communications, 34%
Consumer, 13%
Industrial, 11%
Government, 1%
Data Processing,
31%
COMPANY PUBLIC 7
Consumer Components In Safe
Automotive Applications – Industry
Expert Work Group
COMPANY PUBLIC 8
Problem Statement Consumer Component Used in
Automotive – Example
• Differences in mission profile e.g. vibration, temperature cycles− Memory stacked-die BGA module
construction originally designed for consumer
− Bond wire cracks will create reliability issues in automotive
• This is not “poor quality” − Capability meets original design target
− Reliability frozen after product design
− AECQ100 qualification does not change product capability
− No compensation possible by “try harder” in production
Sources:
1. Springer 2010 ISBN 978-1-4419-6347-5 e-ISBN 978-1-4419-6348-2
2. IFAS GmbH, Dortmund, Germany
Bond Pads & Wires “Stacked die”
COMPANY PUBLIC 9
Consumer Components in Safe Automotive Applications
Targets of the ZVEI* work group (founded Jan ‘14):
• Create awareness: all potential differences — automotive vs.
consumer components
• Define a collaboration process with car OEM/Tier1 on vehicle/ECU
development to:
− Identify potential risks
− Conscious decisions on how to resolve or mitigate applicable risks
− Accept/refuse the consequences of remaining shortcomings including risks for
incidents and field failures
* German Industry Association of
Electric and Electronic Industry
COMPANY PUBLIC 10
Consumer Components in Safe Automotive Applications
Participating members:
• Workgroup competence combines leadingTier1 and component suppliers
• Most leading Automotive Semiconductorcontributed their knowledge
Milestones:
• Work group start in 2014
• July 2014: Release of position paper
• Nov 2015: Publication of fact sheet
Atmel, Leopold Kostal, Murata, Osram,Taiyo Yuden, Texas Instruments, Vishay, industry subject matter experts Mr. Keller and Mr. Gresch
✓✓
Source: Strategy Analytics
„Automotive Semiconductor
Vendor 2016 Market
Shares“; April 2017
Infineon incl. IR
ON Semi incl. Fairchild
Microchip incl. Atmel
✓
✓
✓
✓
COMPANY PUBLIC 11
Downloads via ZVEI-Homepage:
http://www.zvei.org/Verband/Fachverbaende/Automotive/Seiten/Consumer-Components-in-Safe-Automotive-Applications.aspx
Position Paper Available – English and German
COMPANY PUBLIC 12
Fact Sheet – Your New Tool For
Value Based Product Selection
COMPANY PUBLIC 13
Truly Different: Automotive Semiconductors and
Consumer Components
• 6 categories for potential differences:
− Technology Development – Semiconductor
− Technology Development – Packaging
− Component Development – Product Design
− Component Validation, Characterization, Qualification
− Component Manufacturing, Production, Test
− Component Supplier – Applicable Standards and Processes / Added value support
• 66 possible differences have been identified by the ZVEI work group
• Components and suppliers satisfy criteria to varying degree
Standards: ISO26262, AECQ100, IATF16949, AECQ200 , ….`
Support
(Logistics ,
FA, FQE)
**
Technology
Semiconductor
and Packaging
Automotive Requirements: Reliability, Zero Defects, Supply, Security, …
Design
(incl. DFT,
DFM)* …
Validation,
Character-
ization,
Qualification
Manu-
facturing
Production,
Test
Component capability is
frozen latest at the end
of product design
* DFT: Design for Test,
DFM: Design for Manufacturability
** FA: Failure analysis,
FQE: Field Quality Engineering
COMPANY PUBLIC 14
Fact Sheet Content
• Most comprehensive list of potential differences in the industry
• Beside semiconductors already identifying relevance for passive and/or opto components
• Still, knowing where gaps are does not tell you how to close them this is where collaboration starts
* VDA - OEM consumer component
risk assessment guideline
Potential differences
Auto vs. Consumer
Typical Automotive
Requirement Typical Consumer
RequirementPotential
Consequence on vehicle /
OEM
Auto-specific Investment by Component
SupplierDifference
captured by VDA*?
Describing the two extremes, there are
many “shades” between them –
both in requirements and capabilities
COMPANY PUBLIC 15
66 Potential Differences – Automotive vs. Consumer
Temperature
Range
Metal line
Electromigration
caused by
current density
TDDB (Time
dep. Dielectric
break down) —
Metallization
TDDB —
Transistor Gate
oxide Lifetime
Transistor Aging
margin for Auto
life-time degra-
dation
Radiation
Susceptibility
(SER/ SEL)
NVM Data
Retention
NVM write/
erase
NVM
Programming
Technology
Certification
Reliability
Requirements
Interaction Chip/
Package
Wire bond
integrity (Gold,
Cu, etc.)
Alternative
Package
connection
technology
Mold compound BOM flexibility Design Rules Package typesBoard level
reliability
Product
definition
Requirements
management
R&D
Partnership
R&D project
managementRobust Design DFMEA
Design-for-test
(DFT)ECC
Design-for-
manufac-
turability (DFM)
Design-for-
(Failure)-
Analysis (DFA)
Std Cell
libraries
Power
consumptionLatchup
Functional
Safety
Functions
APQP support
Qualification
acc. to
AECQ100
Drift AnalysisCharacterizatio
nPPAP
Test insertions
and test
coverage
Memory ECC
testing
Zero defect test
screen strategy
High voltage
stress and/or
burn-in
PFMEAProcess
Controls
Manufacturing
margin / Cpk
Sub-Supplier &
SubcontractorSupply security
Quality
Management
system / cert.
acc. TS16949
VDA audit
support
(VDA 6.3)
product maturityFA and 8D
support
Commitment to
confirmed ppm
target
TraceabilityRecord
retentionMAT Label
PCN handling
product life-
cycle
management
EOL handling &
stockFMEA
Supply Agree-
ments and CSR
Automotive
system design
support
EMC -ECU
design support
and component
certification
ISO26262
related support
Automotive
Software
Development
pro-active
quality alert
process
Material com-
pliance and
declaration
COMPANY PUBLIC 17
IP
DfX
FUNCTIONAL
SECURITY
FUNCTIONAL
SAFETY
DEVICE
RELIABILITY
ROAD
SAFETY
Total Automotive SolutionsSafe, Secure & Reliable Mobility is
Built Upon Deep Auto Experience
Full Automotive Solutions
COMPANY PUBLIC 18
Results
Full Automotive
Right slope is frozen after
technology, packaging and product
development and can only be
influenced by temperature profile
Reliability requirements may even
change with autonomous vehicle
business models
Accumulated Failures Over Time
Life Time
(Years)
Failu
res
(ppm
)
0 1510510 -1
10 3
10 2
10 1
10 0
Automotive
Total Automotive SolutionsSafe, Secure & Reliable Mobility is Built Upon Deep Auto Experience
COMPANY PUBLIC 19
Consumer
IP
DfX
COMPANY PUBLIC 20
Total Automotive SolutionsSafe, Secure & Reliable Mobility is
Built Upon Deep Auto Experience
RESULTS
Full Automotive
Accumulated Failures Over Time
Life Time
(Years)
Failu
res
(ppm
)
0 1510510 -1
10 3
10 2
10 1
10 0
Automotive Consumer
COMPANY PUBLIC 21
Enhanced Consumer
IP
DfX
COMPANY PUBLIC 22
Accumulated Failures Over Time
Life Time
(Years)
Failu
res
(ppm
)
0 1510510 -1
10 3
10 2
10 1
10 0
Automotive Consumer
Total Automotive SolutionsSafe, Secure & Reliable Mobility is
Built Upon Deep Auto Experience
Full Automotive
Optimal System Design and Time-to-Market
Lowest Risk and Cost of Non-quality
Best Customer Experience
Enhanced Consumer
Results
COMPANY PUBLIC 23
Consequences of the Differences on Automotive Use
• Zero defect quality and 15+ year reliability at ECU level in many cases cannot be accomplished with standard components ALONE
• Shortcomings can be mitigated by collaboration between Car OEMs, Tier1 and component suppliers− Modified vehicle and/or ECU mission profile
− System level solutions e.g.
▪ Redundancy
▪ External component protection
▪ Cooling
▪ Enhanced assembly technologies
• Remaining risks need to be understood, acknowledged and accepted by all participants
COMPANY PUBLIC 24
Concept Development Partnership
The component selection defines how long and risky the application development will be• Product: size of gap at sourcing decision
• Partner capabilities: potential risk reduction slope
• Collaboration: realized risk reduction
• Consequence: final remaining risks
Identify possible product differences
Relevance versus target application
and mission profile?
Mitigation strategy across OEM, Tier1,
..., Component Supplier
Vehicle level? Application level?
Product level?
Accept gap
ImplementationData
SupportSafe Launch
Reliable quality solution in production
for 10+ years
Risk depends on product & partner selection
Fact Sheet
COMPANY PUBLIC 25
NXP Value Creation Towards
Autonomous Driving - Examples
COMPANY PUBLIC 26
What Makes a Product Fully Automotive?
Product Design (incl. verification, DFx)
Packaging/Assembly technology
Validation, Characterization, Qualification
Semiconductor technology
Manufacturing Process and Test
6 Categories
Sta
ndard
s /
Pro
cesses /
Support
Continuous im
pro
vem
ent
Standards / Processes / Support
In blue: Additional items/granularity beyond ZVEI categories
SoC Design (incl. verification, validation)
Packaging/Assembly technology
Automotive specs (Cz, Qualification, PPAP)
Semiconductor technology
Manufacturing Process and Test
Design rules (DFx)
SoC Architecture/IP (ISO26262, DFT)
Services (CAS, logistics, FQE, Safe Launch…)
Automotive grade software
Example 32-bit general purpose MCU
COMPANY PUBLIC 27
Fact Sheet – What It Boils Down To – Example 32-bit
General Purpose MCU (GPIS)
Product originally designed for
Automotive / new supplier
Product originally designed for
Automotive / experienced Auto supplier
Product not specifically developed for Auto /
new supplier
Product not specifically developed for Auto /
experienced Auto supplier
Pro
duct
Capabili
ty
Supplier Capability
NXP
Automotive
unexperienced
supplier
Learning
curve
?
Kinetis
EA
S32K1 NXP product
strategies
optimized per
product /
application
scope
& over time
KEA
COMPANY PUBLIC 28
GPIS Example – Bringing Consumer/Industrial IP Into
Automotive
Grey is “Re-used as-is”; Yellow is “Specific measures applied for automotive”
KEA S32K1
Robust NPI process incl QMS and QRS
Automotive package certification
Datasheet updates for manufacturability and
ZD
TSMC10, auto certified 0.18u SST
Automotive ZD test flow, including outlier
screening, PAT, IDDQ…
Automotive DFM level 2 equivalent, eg. double
vias >=50%, no wire spreading
DFT level 3 maturity (eg. no Small Delay
Defect fault model). Not targeting ISO26262
Standard NXP automotive support
Same SDK provided as example code
State of the art automotive
State of the art automotive
State of the art automotive
GF7, auto certified 90nm TFS
State of the art automotive
Automotive DFM level 3 maturity (internal
metrics for continuous improvements)
Redesigned IP to achieve DFT level 4 (state of
the art). Targeting ASIL-B Applications
Standard NXP automotive support
SDK and Autosar MCAL/OS production grade
Re-used die from Kinetis EA
Consumer/Industrial
Re-used IP and technology from Kinetis E
portfolio
Sta
ndard
s /
Pro
cesses / S
upp
ort
Continuous im
pro
vem
ent
SoC Design (incl. verification, validation)
Packaging/Assembly technology
Automotive specs (Cz, Qualification, PPAP)
Semiconductor technology
Manufacturing Process and Test
Design rules (DFx)
SoC Architecture/IP (ISO26262, DFT)
Services (CAS, logistics, FQE, Safe Launch…)
Automotive grade software
Description
COMPANY PUBLIC 29
NXP Advanced Product Quality – Example S32V234Rel Look Ahead
& QualificationNTI
M2 Process Cert
M3 Technology Cert
M4 Extended Cert
Platform level Quals
IP Validation and
Characterization
FPGA Pre si validation
IP Design Bench Validation
ATE chip parametric
Validation/Characterisation
Design and DFx
Best Practices
DFM
DFT ( inc maturity Matrix)
DFMEA
Reliability stress look
aheads on TVs + Product
Manufacturing
Best Practices
SPC
SBL
PAT
GDBC
KLA inspections
Package/Assy CZ
Generic
Safe Launch
3 —Temp FT and Gate insertions
RQA Volume
Burn-in Content
& Failure Studies
Best In Class Test
Screens
> % coverage
ZD: HVST, JVT, VLV, IDDQ
Full Scan and Trans fault
Modular test Program
Robust G/bands
Design Tools for IR drop,
Crosstalk Delay and Noise
ZD look across
Bakes
Scan and Mem BIST
ESD, L-Up, EMC
Tightened BMY and SBL limits
BMY
Intrinsic Rel study
Advanced BI
Data review for all SL lots
Time to fail profile
Very high toggle
coverage on logic
CQI's lessons learned
Burn-in FA and CA
Advanced
Automotive Quality
IP Bench Characterisation
Analysis of Burn-In fails
SER / SEL
Design margin
• AECQ100 qualification only tells how bad – not how good – a part is
• NXP quality and reliability developed over 40 years of Automotive commitment
• Many of those capabilities fan-out to full NXP product portfolio
COMPANY PUBLIC 30
The New S32 Automotive Processor Platform • Standardized computing elements, standardized security architecture, a uniform security strategy, lowest
power consumption.
• Functionally safe Artificial Intelligence (AI)-capable products.
Customer benefits:
• The new NXP platform offers ten times more computing power than today's systems.
• High software reusability (90% within an application segment, 40% across all applications) enhances development efficiencies & enables continuous software quality improvement.
• Meets many automotive requirements, as outlined in the ZVEI fact sheet – e.g. technology certification to automotive standards for long-term reliability, product and production quality measures, robustness, functional safety, security, long-term availability, failure analysis on customer returns, change management, documentation such as PPAP.
• First time functional safety according to ISO26262 Level ASIL-D across all applications plus measures to support fault tolerance.
• Microcontrollers with up to 128 Mbyte integrated memory allow Over-the-Air (OTA) software updates, as OTA doubles the storage footprint of each node to be updated.
• Customers can flexibly expand their memory as the family provides a continuum between controllers and processors.
COMPANY PUBLIC 31
Summary and Q&A
COMPANY PUBLIC 32
Full Automotive
Optimal System Design and Time-to-Market
Lowest Risk and Cost of Non-quality
Best Customer Experience
Accumulated Failures Over Time
Life Time
(Years)
Failu
res
(ppm
)
0 1510510 -1
10 3
10 2
10 1
10 0
Automotive Consumer
Enhanced Consumer
Collaboration to achieve
Total Automotive SolutionsSafe, Secure & Reliable Mobility is
Built Upon Deep Auto Experience
COMPANY PUBLIC 33
NXP Differentiated Value Creation Towards Autonomous
Driving
Auto foundation: Conscious fan-out
across full product portfolio
• NXP leadership:
− Functional Safety
− Security
− Power-efficient, reliable high-performance computing
• NXP system development partnership:
− Conscious data driven decisions
− Extended technology certification
− Quality support
− FAE support
• Standard Processes across NXP:
− FMEA, DFMEA, PFMEA, subcon management, EOL,
IMDS, excursion elimination, reliable NPI flow,
IATF16949
• Customer value comes from product, but
even more from NXP capability
COMPANY PUBLIC 34
Autonomous Driving – Crossroad
• Autonomous driving creates substantial new hardware challenges requiring
attention by Tier1 and car OEMs
• Component selection risks impact companies and employees alike
NXP offers differentiated strategies across the complete solution space
Customer value builds on product, but even more on supplier capability
Success factor: data driven risk identification and understanding the implications
Which partner do you trust helping you towards solutions that will autonomously drive your children?
Your partner of choice – I hope NXP
NXP, the NXP logo, and NXP secure connections for a smarter world are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2018 NXP B.V.
www.nxp.com