cmos: fabrication principles and design rules · cmos: fabrication principles and design rules...
TRANSCRIPT
CMOS: Fabrication principles and design rules
João Canas Ferreira
University of PortoFaculty of Engineering
2016-02-29
Topics
1 Overview of the CMOS fabrication process
2 Geometric design rules
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 2 / 35
CMOS technology evolution
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 3 / 35
Ingots of doped silicone
Fonte: [May04]
à Diameters: 300 mm and 400 mm
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 4 / 35
Czochralski method
Fonte: [May04]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 5 / 35
Ingot production
Fonte: [http://www.tf.uni-kiel.de/matwis/amat/elmat_en/kap_6/illustr/i6_1_2.html]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 6 / 35
Photolithography
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 7 / 35
Masks
Fonte: [May04]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 8 / 35
Mask projection
Fonte: [May04]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 9 / 35
Transfer
Fonte: [May04]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 10 / 35
Optical correction (pre-distortion)
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 11 / 35
Inverter: cut view
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 12 / 35
Inverter: masks
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 13 / 35
Triple-well process
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 14 / 35
Well isolation (trenches)
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 15 / 35
Gate oxide
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 16 / 35
Source and drain formation
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 17 / 35
Improvements
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 18 / 35
Metal connections
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 19 / 35
Example: 11 levels of metal
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 20 / 35
If things go wrong . . .
Fonte: R. Rodríguez-Montañés et al., “Bridging Defects Resistance in the Metal Layer of a CMOS
Process”, J. Electronic Testing: Theory and Applications 8, 35–46 (1996)
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 21 / 35
Topics
1 Overview of the CMOS fabrication process
2 Geometric design rules
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 22 / 35
Design rules
I The geometric design rules are a “contract” between the foundry and thedesigner.
I These rules are the designer’s interface to the fabrication process.
I They guarantee that the transfers onto the wafer preserve the topologyand geometry of the patterns.
I Rules specify: minimum separations, minimum and maximum widths,overlap rules
I Scalable rules: distances are specified as multiples of λ
I Minimum gate width: 2λ
I Industrial processes generally state their rules in microns (non-scalable).
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 23 / 35
Masks for an inverter (n-well)
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 24 / 35
Substrate contacts
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 25 / 35
Classes of rules
Well Definition of: p-well, n-well, deep-n-well. For twin-tubprocesses only one well may be specified (n-well).
Transistors Four masks:I active (diffusion), n-select (n-implant), p-select, polyI active + n-select + p-well + poly : NMOS transistorI active + p-select + n-well + poly : PMOS transistorI active + n-select + n-well + contact : contact to wellI active + p-select + p-well + contact : contact to well/substrate
Some systems create the active masks from the select masks.
Contacts One maskI metal1/p-active, metal/n-active, metal-poly, metal/substratoI fixed size; use more than one contact in parallel
Metal Rule values depend on the level (increasingly larger and moreseparated)Rules for connection between metal levels (vias): modernprocesses allow stacked vias.
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 26 / 35
FreePDK45: POLY rules
à http://www.eda.ncsu.edu/wiki/FreePDK45:Contents
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 27 / 35
FreePDK45: WELL rules
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 28 / 35
FreePDK45: ACTIVE rules (DIFFUSION)
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 29 / 35
FreePDK45: regras IMPLANT (SELECT)
(Figure is confusing: active, n-well and n-implant layers have the same color!)João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 30 / 35
FreePDK45: CONTACT rules
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 31 / 35
FreePDK45: METAL1 rules (1/2)
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 32 / 35
FreePDK45: METAL1 rules (2/2)
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 33 / 35
Once upon a time . . .
Fonte: [Weste11]
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 34 / 35
References
à Sources of the figures:
May04 G.S. May, S. M. Sze, Fundamentals of Semiconductor Fabrication,Wiley, 2004.
Rabaey03 J. M. Rabaey et al, Digital Integrated Circuits, 2ndedition,Prentice Hall, 2003.http://bwrc.eecs.berkeley.edu/icbook/
Weste11 N. Weste, D. Harris, CMOS VLSI Design, 4th ed., PearsonEducation, 2011.http://www3.hmc.edu/~harris/cmosvlsi/4e/index.html
à The FreePDK45 Wiki specifies the FreePDK45 design rules:
http://www.eda.ncsu.edu/wiki/FreePDK45:Contents
João Canas Ferreira (FEUP) CMOS: Fabrication principles and design rules 2016-02-29 35 / 35