cmc laboratories client presentation 2009

CMC Laboratories, Inc.Client Presenta4on March 2009

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Friday, September 11, 2009

• CMC Laboratories was founded in 2003 by a group of packaging industry veterans.• Today, CMC has over 200 clients ranging from start-‐ups to Fortune 100 companies.• CMC supports clients across North America, Europe, and throughout Asia including China, Taiwan, Singapore, and Malaysia.

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CMC Laboratories provides a high level of technical service focussed on advanced materials within the electronic industry.

Innova&ve Materials Solu&ons for Electronics

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Technical Exper4se

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• Advanced electronic packaging materials

• Micro-‐structural Characteriza:on

• Failure Analysis and Destruc:ve Physical Analysis

• Electrical, Thermal and Mechanical Test and Proper:es of Packaging Materials

• Custom Reliability Tes:ng: Test Development and Implementa:on

• Thin and Thick FIlm Metalliza:on

• Electro and Electro-‐less pla:ng for electronic applica:ons

Technical Exper4se

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CMC Business Focus

•Materials Analysis

•Electrical and Thermal Tes:ng

• Technology Development and Prototype/ Low Volume Fabrica:on

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Business Sectors

CMC Client Industries

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Military and Aerospace

Medical Device

Telecommunications

Photovoltaic

Advanced Materials

Semiconductor

Business Sectors

CMC Client Industries

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Technical Support to Medical Device Manufacturers


• Reliability evalua:on and failure mode analysis.• Device and component construc:on analysis for supplier

qualifica:on.• Microstructural analysis in support of process op:miza:on

and verifica:on.• Design, development and FA support to assist clients with

FDA submissions.

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Technical Support to Medical Device Manufacturers


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Medical Device Manufacturers: Recent Projects


1. Electronic reliability and failure mode evalua:on of a PCB assembly used in a hand held medical device.

2. Evalua:on of Pb and Pb-‐free solder processing parameters and rework limita:ons for high reliability implantable devices.

3. Assisted in the development of an improved herme:c feed-‐thru for an implantable device.

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Medical Device Manufacturers: Recent Projects


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Experience Base in Op4cal Applica4ons for Semiconductors


•Solar cells, high brightness LEDs, Laser Diodes•Thin film, thick film and direct bond copper metalliza:on

•Material structure, composi:on and defect characteriza:on in Opto-‐electronic assemblies

• Ceramic packages including alumina and AlN• Cu pla:ng

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Experience Base in Op4cal Applica4ons for Semiconductors


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Optoelectronics and Photovoltaics: Recent Projects


1. Characteriza:on and op:miza:on of high thermal demand packaging for cuUng edge solar concentrator technology.

2. Thick Cu pla:ng process development for an HBLED package

3. New material selec:on and assembly process development for a high frequency MEMs op:cal transmiWer.

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Optoelectronics and Photovoltaics: Recent Projects


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Experience in RF and Microwave Device Packaging


TELECOMUNICATIONSTELECOMUNICATIONS

• Cellular base-‐sta:on power amplifier packages including GaAs and Silicon LDMOS

• Microwave communica:on devices • Packaging materials and processing for high frequency applica:ons

• Alumina, LTCC and LCP

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Experience in RF and Microwave Device Packaging


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RF and Microwave Device Packaging: Recent Projects


TELECOMUNICATIONSTELECOMUNICATIONS

1. Working with a leading edge advanced packaging material supplier to introduce a new genera:on of RF packages for cellular base-‐sta:on applica:ons.

2. Supported the introduc:on to market of a new high frequency passive component technology with enhanced performance from 20-‐100 GHz.

3. Assisted in the development of a novel, low stress die aWach technology for RF devices which enhances thermal managment. Supported client patent submissions.

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RF and Microwave Device Packaging: Recent Projects


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CMC Supports The Worlds Most Innova4ve Advanced Materials Suppliers Worldwide


• CMC provides clients cri4cal exper4se for advanced materials development

• CMC assists in market introduc4on for advanced materials in electronic applica4ons

• High thermal performance materials

• Expansion matched systems

• Advanced solder systems

• Specialized thick film and thin film metalliza4on

• Polymer composites

• High frequency materials

• LTCC, HTCC, and AlN

• Pla4ng layers

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CMC Supports The Worlds Most Innova4ve Advanced Materials Suppliers Worldwide


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Advanced Materials: Recent Projects


1. Process development to reclaim/rework high-‐end specialty components preven:ng mul:-‐million dollar yield loss.

2.Valida:on of material proper:es and market opportuni:es for advanced polymer composites used in high thermal demand packaging applica:ons.

3.Licensing of CMC developed AlN mul:layer ceramic technology for military, space, medical, wafer tes:ng, and telecommunica:ons.

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Advanced Materials: Recent Projects


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Core Exper4se in Specialized Technology for Military and Aerospace Applica4ons


• Ceramic packaging technologies including LTCC, AlN and HTCC

• Thin film metalliza4on

• High performance organic packaging solu4ons

• High thermal demand packaging materials including AlSiC and other composite metal solu4ons

• Herme4c package sealing technologies

• Custom, aerospace focussed reliability test development

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Core Exper4se in Specialized Technology for Military and Aerospace Applica4ons


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Military and Aerospace Applica4ons: Recent Projects


1. Developed and implemented custom electrical test program for power components for space under environmental stress condi:ons.

2. LTCC component op:miza:on and failure analysis for next genera:on short wave military communica:ons.

3. Root cause analysis of wirebond failures in guidance system control module.

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Military and Aerospace Applica4ons: Recent Projects


Technology Services

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Failure Analysis Reliability and Test

Materials Characterization Process Development

AlN Licensing Market Analysis

Technology Services

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Failure Analysis and Material Characteriza4on Capabili4es


• Package deconstruc4on• Interfacial structure• Elemental analysis and

mapping• Microstructure and phase

analysis• Grain structure and size

distribu4on• Failure interface

iden4fica4on

• Electrical resis4vity• Dielectric constant and loss• Surface roughness• Adhesion Tes4ng• Mechanical Tes4ng• Thermal conduc4vity• Interfacial thermal

resistance• Micro-‐hardness

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Failure Analysis and Material Characteriza4on Capabili4es


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Failure Analysis and Material Characteriza4on Capabili4es-‐ Con4nued


• IC Level Analysis• Metal Fractography

• Acous4c Microscopy (CSAM)

• Secondary Ion Mass Spectroscopy (SIMS)

• SEM with SE and BSE imaging

• Energy Dispersive Spectrometry

• Metallographic Evalua4on

• X-‐Ray Radiography• XRF Thickness Measurement

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Failure Analysis and Material Characteriza4on Capabili4es-‐ Con4nued


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Failure Analysis and Material Characteriza4on: Recent Projects


1. Failure determina:on of a herme:c feed-‐thru in an implantable medical device.

2. Construc:on evalua:on of a discrete device for patent infringement li:ga:on.

3. Compe::ve analysis of advanced graphics processor including the device, package/substrate and graphics board.

4. Advanced solder process evalua:on and op:miza:on for major medical device manufacturer.

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Failure Analysis and Material Characteriza4on: Recent Projects


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Metal Fractography


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IC Level Cross Sec4on Analysis


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X-‐ray Radiography and Acous4c Microscopy


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Custom Design for Specialized Tes4ng Requirements


• Micro-‐Controllers

• High-‐Speed Data Acquisi:on

• Lab View Programming

• Environmental Test Chambers

• Mechanical Tes:ng

• Air to air thermal stress

• HAST Chamber

• Wide range of electrical test equipment from DC to GHz

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Custom Design for Specialized Tes4ng Requirements


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Custom Design for Specialized Tes4ng Requirements: Recent Projects


1. System design and development to test and capture extremely short :me scale events in an advanced satellite component while undergoing environmental stress.

2.Burn-‐in and precision electrical monitoring of military components under rigid temperature condi:ons.

3.Design and development of a custom op:cal reflectometer to set laser weld condi:ons for high reliability.

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Custom Design for Specialized Tes4ng Requirements: Recent Projects


Technology Development and Fabrica4on

• Pla:ng metalliza:on development

• Low volume electro-‐pla:ng, electro-‐less pla:ng and barrel pla:ng

• Fabrica:on and assembly process development– Solder profiles

– Braze profiles

– Die aWach processes

• Low volume fabrica:on and assembly capability

• Thick film metalliza:on produc:on facility

• Module re-‐work for military and medical applica:ons

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Pla4ng Process Development


• Development of custom pla4ng processes– Evaluate pla4ng chemistry op4ons– Create prototypes for func4onal and reliability tes4ng

– Detailed documenta4on of pla4ng procedures– Transfer to high volume processors

• Small volume, fully func4onal pla4ng facility– Rack and barrel pla4ng– DC and pulsed rec4fica4on

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• CMC’s Pla4ng Development Customers:– Semiconductor manufacturers– Electronic Package fabricators– Specialty materials manufacturers

• Cu, Ni, Au, Sn and co-‐deposited alloys• Cleaning and etching chemistry

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Technology Development and Fabrica4on-‐ Recent Projects

• Fabricate specialized direct bond copper substrates

• Plate Al-‐SiC flanges over wide composi:on range

• Re-‐work and re-‐assemble module used for medical imaging

• Produce range of high temperature thick film metalliza:on pastes for AlN ceramics

• Assemble MEMs diode laser switching module for telecommunica:ons applica:ons

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CMC Wireless Packaging Experience

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Mul4layer, Co-‐Fire AlN Technology Licenses


ALUMINUM NITRIDE TECHNOLOGY LICENSINGALUMINUM NITRIDE TECHNOLOGY LICENSING

• Non-‐exclusive Licensing of CMC’s proprietary co-‐fired, mul4layer AlN process– Thermal conduc:vity as high as 190 W/m-‐K– Up to 20 metalliza:on layers – Required materials, processes and equipment details transferred to licensees

• Process has been u4lized for high volume produc4on• Applica4ons in telecommunica4ons infrastructure, power electronics, op4cal communica4ons, HBLED and industrial equipment.

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Mul4layer, Co-‐Fire AlN Technology Licenses


Technology Market Analysis

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Technology Market Analysis• Technical Market Studies focused on Electronic

Interconnect, Packaging, New Materials, Assembly Technology, or Passive Components

• Compe44ve Analysis including Compe4tor’s Technical Performance, Target Markets, Key Strengths/Weaknesses and Product Roadmaps

• Iden4fica4on of Acquisi4on Candidates to fit Client’s Growth Objec4ves.

• Industry Wide Surveys and Survey Data Analysis

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Technology Market Analysis-‐ Recent Projects


1. Developed a customized market analysis for a large advanced materials company, evalua:ng the market poten:al of a new polymer-‐based product line used in high thermal demand electronic applica:ons. Developed a market strategy and iden:fied poten:al customers throughout the US and Asia (2008).

2. Introduced a small advanced materials company specializing in new polymer formula:ons for packaging applica:ons to poten:al strategic partners to assist in scale-‐up and marke:ng of this technology (2008).

3. Performed a detailed market analysis for an advanced electronic materials company in China, delinea:ng commercial market opportuni:es for ceramic products. Created a technology roadmap for this client based on the study. Provided technical support to implement the roadmap (2007, 2008).

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Technology Market Analysis-‐ Recent Projects


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CMC Laboratories, Inc.7755 South Research Drive

Tempe, AZ 85284(480) 496-‐5000

Contact Us:

[email protected]

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mailto:[email protected]

mailto:[email protected]

cmc laboratories client presentation 2009

Technology

ons alumina

ltccandlcp telecomunications

vephysicalanalysis electrical

laserdiodes thinlm

andaln pla4nglayers

clientpresenta4on march2009