cam-i scalable flexible manufacturing initiative ngms task 6.1
TRANSCRIPT
CAM-I Scalable Flexible Manufacturing Initiative
NGMS Task 6.1
2
Vision
Our vision is E-manufacturing where we haveSeamless, scalable and robust evolution of
products from design to manufacturing (and possibly to delivery and service)
Computer tools (such as simulators, rule-bases, visualizing environments) to rapidly plan, validate and deploy manufacturing instructions
Flexible manufacturing systems for simultaneous production of multiple products and minimum system change over
3
Broad Goals
Manufacturing evaluation and deployment of emerging standards (STEP 203 and 210, possibly 220)
Development of environments for manufacturability analysis of designs
Manufacturing process planning and simulation environments
Simulation and control for flexible manufacturing of board assemblies
4
Immediate Goals
Implementation of visualization and translation tools for STEP AP210 (Generate 3-D models of assembly from AP210 descriptions)
Computer implementation of Rockwell’s DFM rule base to function with AP210 description of boards
Simulators for placement processes and machines (HSP and GSM simulators)
Development of capabilities to ‘virtually’ produce a board (AP210 ‘as produced’ view of board assembly)
Generation of (HSP) machine input files from AP210 model
Present flow
Physical Constraintsand Functions
Design andDrafting
MFG. Review(DFM Checks)
Design Release
Trial&ErrorProduction
Proposed Flow
Production
Design Release
VirtualEnvironment
Physical Constraintsand Functions
EngineeringDesign
Design For Manufacturing
Computer Integrated Manufacturing
Optel - Manufacturing Execution System
Enterprise Resource Planning
Virtual Environment
Process Planners
Simulator
Manufacturing Execution Systems
DesignsRules Resources
ProcessPlans Virtual
ProductsMachinePrograms
ManufacturingAnalysis
Visualizers
RuleInferenceEngines
8
Product Enclosure
ExternallyVisible Connectors
Printed Circuit Assemblies
Die
Package
Packaged Part
InterconnectAssembly
Printed Circuit Substrate
Die
9
Typical 2-D design of a PCB
10
PCB Manufacturing Process
11
Why STEP?
Emerging standardMillion seats of AP-203 presently
deployed Simulation tool to be used across
manufacturing facilities and vendors e-manufacturing
E-Business applications of STEP are being enabled by the STEP and W3C committees working together.
12
What is STEP?
ISO standard (ISO 10303): to share and exchange digital
technical information Set of common data structures Application Protocols - Domain
specific usage of data structuresAP 203 (3D solid Models)
AP210: Electronic Assembly,Interconnect and Packaging Design
Technology
Physical• Component Placement• Bare Board Design• Layout templates• Layers non-planar, conductive & non-conductive• Material product
• Geometrically Bounded 2-D• Wireframe with Topology • Surfaces• Advanced BREP Solids • Constructive Solid Geometry
Part• Functionality• Analysis Support • Shape 2D, 3D • Package• Material Product• Properties
Configuration Mgmt• Identification• Authority • Effectivity • Control• Requirement Traceability• Analytical Model• Document References
Product Structure/Connectivity
• Functional• Packaged
• Fabrication Design Rules• Product Design Rules
Requirements• Design• Allocation• Constraints• Interface• Rules
• Geometric Dimensioning and Tolerancing
Geometry
Design Control
14
AP 210
Several product models in electromechanical domain.
Supports Multidisciplinary library data. Scope is “as required” & “as designed”
product information. Sharing across several levels of supply
base. Ability to Integrate with other
engineering domains. Ability to integrate external services
coherently.
Flow Diagram
DFM Rule Checker
DFM Rule files
AP 210 file (3D)
AP 210 file (2D)
Assembly configuration
file
Placement Sequence (OPTEL)
Visualizer(STEP OIV)
Machine library
Simulator
Design Facts
16
2D to 3D converter
ECAD translators generate AP 210 files containing 2D Geometry
Simulate 3D view of the assembly board Converter
Input : AP 210 file (2D geometry)Extrudes them into solids (Advanced
BREP)Output:
AP 210 file (2D + 3D geometry)AP 203 files
17
2D to 3D converter
Ap203 files Individual
packages Board
These files then converted into Open Inventor formatInventor:
Graphics package used for rendering
18
Typical 2-D design of a PCB
19
AP-210 Viewer
20
DFM We are adapting a system
originally developed by Boeing for use at Rockwell Developed on PreAMP and
TIGER project. RDF syntax Inputs
AP-210 Design File Rule Files
Configuration ManagementSchema User
Interface
Rule DefinitionSoftware
Rule Execution Software
21
DFM Rule Facility
Subset of Rockwell Collins DFM rules were chosen for implementation.
Relevant facts extracted from the AP-210 file during preprocessing.Rule Inference engine insulated from intricacies
of STEPDifferent facilities can easily plug in their DFM
modules.
Interface to the simulatorDFM rules which were violatedComponents which violated these rules.
22
Assembly Data
Establish an assembly usage viewComponents
Organization by package / part family
Part numbers, versionConfiguration management data Location, orientation Reference Designators
Integrated with OPTELMagazine SetupOptimized placement sequence
210 / 203 translator
Electrical Domain Mechanical Domain
Simulator
Feeder information
Component information
Placement Sequence
Geometric Models
Placement Simulator
Virtual Board
DFM RuleCheck
Components violating
DFM rules
25
Simulator
ConfigurableKinematics – accepts
a mechanism graphGraphics –
Geometric Models of machine components
Next stepsMachine LibraryAdding functionality
Nozzle compatibility
Placement timing
26
Project timeline
Year 1
Year 3
Year 2
Process Planning
Production & Setup Planning
Shop Floor Controller
• STEP Basics• Machine Simulator• DFM Checking
• Process Planning Modules• Development of SFM Controller• Capacity Planning & Simulation
• Standardization• Deployment• Process Simulation
27
Work done
Accepting an AP210 2D design file Manufacturability analysis Extracting component information Generating 3D models of components and
assemblies Simulation using Universal HSP and GSM Generating
“as designed” view “as simulated” view
28
Work done (cont.)
Simulation Double sided boards Multi Panel Boards GSM Multiple stage simulation
Testing Update of DFM Rules Development of ‘Fact Extraction’ software
AP210 Viewer Full 3-D assembly model of board Association between Graphical entities and AP210 entities Ability to display properties
29
Future Work
DFT Bare Board testing In-circuit test: fixtures for the test
Manufacturing systems planning Generating stencils for printed circuit substrates Explore transition from Line concept to Cell concept
Capacity planning and simulation Describing production facilities (AP-220)
Deployment