atmel products - packing pre and post changes...6 combination rules packing media pre change...

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PCN # JAON-30NGKY659 CCB # 2733 Atmel Products Packing Pre and Post Changes Rev. A

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Page 1: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

PCN # JAON-30NGKY659

CCB # 2733 Atmel Products Packing Pre and Post Changes

Rev. A

Page 2: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

2

Summary of Changes

Items Changing Earliest

Implementation Date Slide No/s.

Part Aging November 1, 2016 3

Combination Rules November 1, 2016 4 - 6

Desiccant November 1, 2016 7

Humidity Indicator Card (HIC) November 1, 2016 8

MSL Caution Label November 1, 2016 9

Shipping Boxes November 1, 2016 10

Inner Label November 1, 2016 11

Outer Label November 1, 2016 12

MSL 1 packing procedure (tube

and tape and reel only) November 1, 2016 NA

Box dimensions for TUBE

MSL-1 Packing November 1, 2016 13

Box dimensions for REEL

MSL-1 Packing November 1, 2016 14

Page 3: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

3

Part Aging

PRE CHANGE POST CHANGE

Atmel may ship parts to customer as

following

• Commercial: 36 months (3 years) old.

• Automotive: 12 months (1 year) old.

Microchip may ship parts up to 48

months (4 years). Parts older than 24

months (2 years) old will be recertified

prior to shipment. The requirement will

be applied for both automotive and

commercial.

Reason: Material sets used to

manufacture integrated circuits have

shown no degradation in solderability,

moisture sensitivity or reliability of

products after 48 months.

For more information related to Microchip’s part aging strategy, please visit the

following link on our website: Component Age Policy

Page 4: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

4

Combination Rules

Packing

Media PRE CHANGE

(Memory)

PRE CHANGE (MCU)

PRE CHANGE (RFA)

POST

CHANGE

Tube

• 1 Device.

• 1 Date code.

• 1 Lot.

• 1 Assembly Site.

• 1 Test Site.

• 1 Fab Revision.

• Same

Material/BOM ID.

• Same Process

Flow.

• 1 Device.

• MSL1:

• 1 Date code.

• 1 Lot.

• MSL3:

• 2 Date code.

• 2 Lot.

• 1 Assembly site.

• No restriction on test

sites.

• 1 Fab Revision.

• 1 Die Revision.

• 1 Die ID.

• Same

Material/BOM ID.

• Same Process

Flow.

• Different D/C

combined within 52

weeks.

• 1 Device.

• Single Chip.

• 2 Date code.

• 5 Lots.

• Multi Chips.

• 2 Date code.

• No limit to number

of production lots

follow date code

combination rule.

• No restriction on

Assembly site.

• No restriction on test

sites.

• 1 Fab Revision.

• 1 Die ID.

• Different D/C combined

within 52 weeks.

• 1 Device.

• 1 Date code.

• No limit to

number of

production lots

follow date code

combination

rule.

• 1 Assembly Site.

• 1 Test Site.

• 1 Wire Material.

• No limit for Die

Revision, Die

ID, Fab

Revision, and

test flow.

Page 5: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

5

Combination Rules

Packing

Media PRE CHANGE

(Memory)

PRE CHANGE (MCU)

PRE CHANGE (RFA)

POST

CHANGE

Tray

• 1 Device.

• 1 Date code.

• 1 Lot.

• 1 Assembly Site.

• 1 Test Site.

• 1 Fab Revision.

• Same

Material/BOM ID.

• Same Process

Flow

• 1 Device.

• MSL1:

• 1 Date code.

• 1 Lot.

• MSL3:

• 2 Date code.

• 2 Lot.

• 1 Assembly site.

• No restriction on test

sites.

• 1 Fab Revision.

• 1 Die Revision.

• 1 Die ID.

• Same

Material/BOM ID.

• Same Process

Flow.

• Different D/C

combined within 52

weeks.

• 1 Device.

• Single Chip.

• 2 Date code.

• 5 Lots.

• Multi Chips.

• 2 Date code.

• No limit to number

of production lots

follow date code

combination rule.

• No restriction on

Assembly site.

• No restriction on test

sites.

• 1 Fab Revision.

• 1 Die ID.

• Different D/C combined

within 52 weeks.

• 1 Device.

• 3 Date codes.

• No limit to

number of

production lots

follow date code

combination

rule.

• 1 Assembly Site

• 1 Test Site.

• 1 Wire Material.

• No limit for Die

Revision, Die

ID, Fab

Revision,

Different D/C,

and test flow.

Page 6: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

6

Combination Rules

Packing

Media PRE CHANGE

(Memory)

PRE CHANGE (MCU)

PRE CHANGE (RFA)

POST

CHANGE

Tape and

Reel

• 1 Device.

• MSL1,2,3:

• 2 Date

code.

• 2 Lots.

• 1 Assembly site.

• No restriction on

test sites.

• 1 Fab Revision.

• 1 Die Revision.

• Same

Material/BOM ID.

• Same Process

Flow.

• Different D/C

combined within

52 weeks.

• 1 Device.

• MSL1,3:

• 2 Date code.

• 2 Lots.

• 1 Assembly site.

• No restriction on test

sites.

• 1 Fab Revision.

• 1 Die Revision.

• 1 Die ID.

• Same

Material/BOM ID.

• Same Process

Flow.

• Different D/C

combined within 52

weeks.

• 1 Device.

• Single Chip.

• 2 Date code.

• 5 Lots.

• Multi Chips.

• 2 Date code.

• No limit to number

of production lots

follow date code

combination rule.

• No restriction on

Assembly site.

• No restriction on test

sites.

• 1 Fab Revision.

• 1 Die ID.

• Different D/C combined

within 52 weeks.

• 1 Device.

• 3 Date codes.

• No limit to

number of

production lots

follow date code

combination

rule.

• 1 Assembly Site.

• 1 Test Site.

• 1 Wire Material.

• No limit for Die

Revision, Die

ID, Fab

Revision,

Different D/C,

and test flow.

Page 7: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

7

Desiccant

PRE CHANGE POST CHANGE

Clay desiccants only Clay or Silica Gel desiccants

Clay

Silica Gel

Page 8: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

8

Humidity Indicator Card (HIC)

PRE CHANGE POST CHANGE

HIC: 3 dots, and Free of

all Cobalt Compounds HIC: 3 dots, and Cobalt

Dichloride Free Only

Page 9: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

9

MSL Label

PRE CHANGE POST CHANGE

ATMEL MSL Label

Sample Only Atmel standard MSL caution label information.

Calculated shelf life in shield bag is 12 months.

MCHP MSL Label

Sample Only MCHP standard MSL caution label information.

Calculated shelf life in shield bag is 24 months.

Page 10: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

10

Shipping Boxes

PRE CHANGE POST CHANGE

MCHP Logo and ‘DO NOT

DROP’ print

ATMEL Logo

Sample Only

Sample Only

Page 11: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

11

Inner Label

PRE CHANGE POST CHANGE

ATMEL Label MCHP Label

Page 12: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

12

Outer Label

PRE CHANGE POST CHANGE

ATMEL Label MCHP Label

Page 13: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

13

POST change (Without inner box)

Box dimensions for TUBE MSL-1 Packing

Shipping Carton Dimension

W x L x H (cm)

Inner box Number of

BAG per carton Dimension

W x L x H (cm)

15.0 x 71.5 x 5.0

No Inner box

1 Full bag

17.0 x 65.0 x 8.0 1 Full bag

15.5 x 62.0 x 14.0 2 Full bags

22.5 x 63.0 x 16.5 3 Full bags

32.0 x 63.0 x 15.5 4 Full bags

36.0 x 63.0 x 16.5 5 Full bags

15.0 x 64.0 x 5.5 1 Full bag

15.0 x 64.0 x 10.0 2 Full bags

15.0 x 64.0 x 14.0 3 Full bags

28.0 x 63.0 x 11.0 4 Full bags

28.0 x 63.0 x 15.5 6 Full bags

28.0 x 63.0 x 20.0 8 Full bags

18.0 x 37.5 x 4.4 1 Partial bag

18.0 x 37.5 x 7.0 1 Full bag

18.0 x 37.0 x 16.0 3 Full bags

35.5 x 35.5 x 16.5 4 Full bags

8.0 x 65.0 x 5.0 1 Partial bag with

Small volume

Page 14: Atmel Products - Packing Pre and Post Changes...6 Combination Rules Packing Media PRE CHANGE (Memory) PRE CHANGE (MCU) PRE CHANGE (RFA) POST CHANGE Tape and Reel • •1 Device. •MSL1,2,3:

14

POST change (Without inner box)

Box dimensions for REEL MSL-1 Packing

Shipping Carton

Dimension

W x L x H (cm)

Inner box

Dimension

W x L x H

(cm)

Reel Dia.

Number of

BAG

per carton

21.0 x 21.0 x 5.5

No Inner

box

7” 3 bags

21.0 x 21.0 x 8.0 7” 5 bags

16.0 x 21.5 x 21.0 7” 10 bags

21.0 x 31.0 x 21.0 7” 20 bags

32.0 x 63.0 x 15.5 7” 52 bags

36.5 x 38.0 x 39.5 13” 6 – 18 bags

35.5 x 35.5 x 2.8 13” 1 bag

35.5 x 35.5 x 4.0 13” 1 – 3 bags

35.5 x 35.5 x 6.0 13” 1 – 4 bags

35.5 x 35.5 x 16.5 13” 2 – 10 bags