applied semvision g7 defect analysis system · 2018-03-19 · | applied materals external use....
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Applied Materials External Use
Applied SEMVision™ G7Defect Analysis System with Purity™ II Automatic Defect Classification
| Applied Materials External Use
20 Years of Leadership in Defect Review and Analysis
SEMVision Creates Defect Review Segment
Global Installed Base
SEMVision G6
SEMVision G5
SEMVision G4
SEMVision G3
SEMVision G2
SEMVision 300
SEMVision G7
2013
2011
2007
2005
2002
2001
1998
2018
>1,200 Tools
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| Applied Materials External Use
SEMVision G7 Defect Analysis System
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Advanced imaging for 3D devices
Unique imaging for wafer-edge bevel and apex
Next-generation optical technology for unpatterned wafer review See
Consistent Automatic Defect Classification (ADC) for accurate pareto
New algorithms enhance machine learning Stable pareto control with focus on critical defects
Classify
Automatic engineering analysis on tool
Location-based classification combines SEM image and design data
Faster root cause analysis from location-based classification
Analyze
Intelligent Defect Review and Classification System Speeds Time to Yield
| Applied Materials External Use
SEMVision G7 Defect Analysis System
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Automatic engineering analysis on tool
Location-based classification combines SEM image and design data
Faster root cause analysis from location-based classification
Consistent Automatic Defect Classification (ADC) for accurate pareto
New algorithms enhance machine learning
Stable pareto control with focus on critical defects
Classify
Analyze
Advanced imaging for 3D devices
Unique imaging for wafer-edge bevel and apex
Next-generation optical technology for unpatterned wafer review See
| Applied Materials External Use
SEMVision G7 Continues G6 Imaging Benchmark
SEMVisionResolution
Low Energy
HAR 360º Topography
eBeamTilt
See-Through
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Top Tilt
Source: Applied Materials, Inc.
| Applied Materials External Use
Apex
Bevel
WAFER PROFILE
Defects Migrate to Edge Dies
Edge
Unique Bevel and Apex Imaging
Proven correlation between bevel defectivity and wafer-edge yield
WHYDo we need it?
Unique telescopic SEM imaging using extreme depth of field and tilt
HOWDo we do that?
Yield increase due to defectivity control in edge, bevel, and apex
WHATIs the benefit?
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| Applied Materials External Use
High-Resolution Imaging of Bevel and Apex
Top View
Top BevelApex
eChuck
Tilt
Field of View 300µm
Both Bevel and Apex Visible in a Single Image7
| Applied Materials External Use8
Next-Generation Optical Technology for Unpatterned Wafer Review
Deep UV Camera
Improved Light Collection
Deep UV Laser Source
Wafer
15nm 27nm
Stronger signal with new laser source Enhanced detection with improved light collection Improved noise suppression with polarization control Faster review
Robust Review and Detection of 18nm Defects
| Applied Materials External Use
SEMVision G7 Defect Analysis System
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Consistent Automatic Defect Classification (ADC) for accurate pareto
New algorithms enhance machine learning Stable pareto control with focus on critical defects
Classify
Advanced imaging for 3D devices
Unique imaging for wafer-edge bevel and apex
Next-generation optical technology for unpatterned wafer review
Automatic engineering analysis on tool
Location-based classification combines SEM image and design data
Faster root cause analysis from location-based classification
See
Analyze
| Applied Materials External Use10
SEMVision G6 Benchmark Auto Classification - Purity ADC
Previous SEM Tool
SEMVision G6 With Purity ADC
100% Manual Classification
<20% Manual Classification
Manual
Automatic
More Accurate Results, Better SPC, Shorter Time to Decision
| Applied Materials External Use
SEMVision G7 Purity II ADC Enhances Machine LearningRetrain Flow
Sustained Accuracy in Dynamic Environment, Minimal Error Rate, Shorter Time to Decision
Trained Classification Engine Pareto Change Induced
by Process Change
Adaptation with Auto Machine
Learning
Adapted Classification
Engine
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Stable Performance for Dynamic Pareto
| Applied Materials External Use
SEMVision G7 Purity II ADC Enhances Machine Learning
Sustained Accuracy in Dynamic Environment, Minimal Error Rate, Shorter Time to Decision
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CDOI ExtractionCritical Defects Prioritized to Ensure Accurate Representation
SEMVision G6 With Purity ADC
<20% Manual Classification
Previous SEM Tool
100% Manual Classification
Manual
AutomaticCDOI
SEMVision G7With Purity II ADC
Critical Defects
Defect A
Defect B
Classification for Automatic Re-Analysis
Other Potential Critical Defects
| Applied Materials External Use
SEMVision G7 Defect Analysis System Advanced imaging for 3D devices
Unique imaging for wafer-edge bevel and apex
Next-generation optical technology for unpatterned wafer review
Consistent Automatic Defect Classification (ADC) for accurate pareto
New algorithms enhance machine learning
Stable pareto control with focus on critical defects
See
Classify
Automatic engineering analysis on tool
Location-based classification combines SEM image and design data
Faster root cause analysis from location-based classification
Analyze
13
| Applied Materials External Use
Design Based ADC – Beyond SEM Image Classification
Location Detail Distinguishes Defects, Speeds Root Cause Analysis, Aids Yield Prediction
SEM ImageDefect Classification
CAD Layer Mapping
SEM Image with CAD Location-Based
Defect Classification
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| Applied Materials External Use
SEMVision G7 with Purity II ADC
Standard Review Auto Classification
Manual Decision for Additional Analysis
Advanced Imaging and Analysis
Automated, All-in-One Defect Review, Analysis, and Classification15
Start to Finish – Hours to Complete
Auto Classification
| Applied Materials External Use
SEMVision G7 with Purity II ADC
Standard Review
Automated, All-in-One Defect Review, Analysis, and Classification16
Auto Classification
Start to Finish – Minutes to Complete
| Applied Materials External Use17
Applied SEMVision G7 Defect Analysis System
Unique imaging for wafer-edge bevel and apex
Next-generation optical technology for unpatterned wafers
Purity II enhanced machine learning ► Sustained accuracy and consistency with process changes► Reliability in production environment► Assured representation of fab-critical defects
Purity II location-based classification ► Accelerated root cause analysis► Improved yield prediction
Intelligent Defect Review and Classification System Speeds Time to Yield
