ansoft - options brochures.pdf

Design Automation for EDA Layout and Mechanical CAD Import

AnsoftLinks™ streamlines the transfer of design data-bases from popular third-party EDA layout tools and Mechanical CAD (MCAD) packages into Ansoftelectromagnetic field simulation products. EDA links are available for a number of tools offered byCadence, Zuken, Mentor Graphics and Synopsys, while MCAD links support common file formats, such as IGES, STEP and Pro/E.

With AnsoftLinks, select components or complete IC, package, printed circuit board and connector designs can be automatically converted into ready-to-simulate Ansoft models, allowing engineers to useexisting design geometries in their electromagnetic analyses in order to meet aggressive development costs and schedule goals.

• ProvidesseamlessinteroperabilitybetweenAnsoft and the following third-party products and format. • Cadence • Virtuoso® Layout, APD, Allegro®

• Mentor Graphics • BoardStation®, Expedition™, PADS Layout™

• Synopsys Encore™

• Zuken CR-5000• GeometryFormats • Pro/E, STEP, IGES, ACIS• Generatesready-to-solveprojectsforHFSS™, SIwave™, Q3D Extractor®, Ansoft Designer®, and TPA™

• Unitestouchingmetalintosingleconductor (including traces on multiple layers)• Generates3Dsolidmodelsofselectedtraces, supply planes and vias• Editstack-upproperties,suchasindividuallayer thickness, dielectric constant and conductivity• Selectnetsfortranslationbynetname(s),orpoint and click on specific traces or region of the board• Automaticde-featuringofselectednetsto minimize model complexity and solution time

BGA created in Cadence APD and imported to SIwave™ for analysis.

FEATURED CAPABILITIESIC Layout Specific• Exportsspecific“cells”(andtheirsub-cells)• Mergeviaarraysintoasingleobjecttosimplify the solid model and speed analysis

Packaging Layout Specific• Generates3Dsolidmodelsforwirebonds,solder bumps, solder balls and irregularly shaped ground fill• Automaticallyaddsports(HFSS)orsinksand sources (Q3D Extractor) to wire bonds and solder balls

AnsoftLinks allows you to select traces, supply planes and vias and generate ready-to-solve, 3D solid models.

DESIGN FLOW

AnsoftLinks, HFSS, SIwave, Q3D Extractor, Ansoft Designer, Turbo Package Analyzer (TPA) and Maxwell are trademarks of Ansoft Corporation.All other trademarks are the property of their respective owners.

© 2006 Ansoft Corporation PH24-0806

AnsoftLinks™ is critical for applications where design automation is necessary to bring together electromagnetic analysis and the design entry and modeling tools required for capturing today’s intricate design complexity. With AnsoftLinks, selected components in your IC, package, or printed circuit board design can be automaticallytranslated and converted into ready-to-simulate Ansoft models, freeing the engineer from time-consuming anderror-prone design re-entry.

IC Packages• Leaded-type(QFP,PLCC,DiP,SO)• PGA• BGA(wire-bonded,flipchip)• MCM,SiP,LTCC

Printed Circuit Boards• High-speedcomputerboards• Networkinterfacecards• RFPCBs

ICs• Cellsandsub-cells• On-chippassives–vias,spiralinductors, interdigitated capacitors, interconnects

High-speed & RF/mW Components• Antennas,antennafeedstructures• Connectors• Waveguidecomponents(i.e.,filters,couplers, circulators)

Electromechanical • Motorsandgenerators• Linearorrotationalactuators• Relays• MEMS• Magneticrecordingheads

Power Electronics• Transformers• Converters• Busbars

APPLICATIONS

Layout DesignsCadence, Mentor Graphics,Synopsys, Zuken

ANSOFTLINKS™

ECAD

SIWAVE™

TPA™

HFSS™

Q3D EXTRACTOR®

MAXWELL®

ANSOFTLINKS™

MCAD

Mechanical CADPro/E, STEP, IGES

United Kingdom1st Floor, Unit 6Faraday Office ParkRankine RoadBasingstokeHampshire RG24 8QQUnited KingdomTel: +44 (0) 1256 347788Fax: +44 (0) 1256 363833Email: [email protected]://www.ansoft.co.uk

FranceLe Val St-Quentin, Bâtiment D2, rue René Caudron78960 VOISINS LE BRETONNEUXFranceTel: +33 1 61 38 31 30Fax: +33 1 61 38 06 75

GermanyMunich OfficeAidenbachstrasse 5281379 MunichGermanyTel: +49 89 68 086 240Fax: +49 89 68 086 226Email: [email protected]://www.ansoft.de

ItalyPiazzale Asia 2100144 RomaItalyTel: +39 06 591 6845Fax: +39 06 542 226 23Email: [email protected]://www.ansoft.it

Nordic RegionKista Science TowerFärögatan 33SE-164 51 Kista, StockholmSwedenTel: +46 8 58 83 70 60Fax: +46 8 58 83 70 69Email: [email protected]://www.ansoft.com

ANSOFT EUROPEAN OFFICES

ePhysics™ provides the ability to couple thermal and stress simulation to Ansoft’s industry-leading electromagnetic field simulation software, Maxwell® 3D and HFSS™. The combination of ePhysics with Maxwell 3D or HFSS delivers the multidisciplinary analysis frame-work needed to solve coupled physics problems and allows users to consider thermal, deformation and mechanical stress consequences of respective electromagnetic field simulations in applicable devices, such as RF components, electromechanical devices, MEMS and biomedical applications.

Key BenefitsThermal analysis• ePhysicsincludesnonlinearsteady-stateandtransientthermal analysis capabilities, including all heat transfer mechanisms: conduction, convection and radiation

• Powerlosswithvolumeorsurfacedensitiesandcore-loss distribution calculated by Maxwell or HFSS can be used as a heat source for thermal analysis to obtain a complete thermal profile of a device.

• ThermalsolverscanbecoupledwithMaxwellandHFSSandthe ePhysics stress solver to perform a comprehensive multi-physics evaluation of an electronic device.

Stress analysisePhysics includes linear stress analysis capability, allowing deforma-tion and stress due to electromagnetic force density distribution, thermal deformation, and structural stress due to temperaturedistribution to be accurately calculated.

ImportCAD files can be imported to ePhysics, streamlining the design process and the advanced model healing capabilities to auto-matically identify and resolve potential problems with geometry imported from popular CAD systems.

Multi-processing and distributed analysisePhysics can leverage available computing power with multi-processing and distributed analysis options for fast turnaround of your computationally large designs.

OptimizationOptimetrics™ adds parametric, optimization, sensitivity and statisti-cal analysis capabilities to ePhysics. Optimetrics automates the design process by quickly identifying optimal values for design parameters that satisfy user-specified constraints and provides design variable mapping between all coupled designs performed with ePhysics, Maxwell and HFSS.

ScriptingComprehensive scripting capabilities based on non-proprietary lan-guages, such as VBScript and Pearl, allow for customized design flows, integration with proprietary data and maximum flexibility.

APPLiCAtiOnsElectromechanical Component Design• Electricalmachines,solenoidsandsensors• Power-distributioncomponentsandapparatus,suchasbus-bar systems, power switching gear • Solid-statecomponentdesign,suchasIGBTs,diodes,bipolar transistors, etc.

RF & Microwave Passive Components• High-powerconnectors,terminations,couplers,filters, circulators• Antennas,feedstructures

ICThermalDistributionandDissipation• On-chippassivesandinterconnects• RFCMOSandRFdigitalICs• GaAsandSiGeMMICs• Advancedpackaging,BGAs,wirebonds

PCB Thermal Distribution and Dissipation• AdvancedRF/microwave• High-speeddigital,analogandmixedsignal• LTCC,SiP,multi-chipmodules,high-densityPCB

Temperature rise due to trace currents in an MMIC.

Coupled Thermal and Stress Analysis forElectromagnetic Applications

ePhysics, Maxwell, HFSS and Optimetrics are trademarks of Ansoft Corporation.All other trademarks are the property of their respective owners.

© 2008 Ansoft Corporation 0308

Key feAturesePhysics Features:• DynamicdatalinktoAnsoftproducts(Maxwell®, HFSS™, internal coupling between thermal and stress solution types)• Non-proprietaryscripting:VBScript,Pearl,etc.• Integratedoptimization• Thermalfeatures(seedetailsbelow)• Stressfeatures(seedetailsbelow)

Thermal Features • 3Dnonlinearsteady-stateandtransientsolvers• Heat-transfermechanisms o Conduction o Convection o Radiation • CoupleswithMaxwell3DandHFSSandePhysics™ stress solvers • Volumetricandsurfacesource/boundaryconditions• Functionalconvectioncoefficient(freeandforcedconvection modeling) • Automaticadaptivetimesteps• Automaticpower-lossmappingwithinadaptivemesh refinement solve loops • User-specifiedelectromagnetic/thermalvariableloadsequencing• Anisotropicmaterialproperties• Temperature-dependentsourcesandboundaryconditions• Temperature-dependentthermalconductivity• Executiveparameters o Average temperature o Maximum temperature o Temperatureandcoordinatesofhot/coldspots

(Thermal Features Continued)• Powerfulandflexiblefieldpost-processing o Animation of transient field distributions o Multi-functional field calculator o Post-processing macros

Stress Features • Staticlinearstress• CoupleswithMaxwell3D,HFSSandePhysicsthermalsolvers o Calculates deformation and stress o Complexsource/boundary-conditionsetup o Anisotropic stress solution o Automaticfieldmappingbetweenelectromechanical/thermal and stress problems • Executiveparameters o Maximum principal stresses o Maximum displacement o Orientation of principal planes o Maximum von Mises stresses o Coordinates of the respective maximum stresses • CalculatesdeformationandvonMisesstressdistributions• Powerfulandflexiblefieldpost-processing o Animation of transient field distributions o Multi-functional field calculator

Maxwell - ePhysics Links

HFSS - ePhysics Links Maxwell - HFSS - ePhysics Links






AnsOft eurOPeAn OffiCes

OVERVIEW

FEATURED CAPABILITIES

Optimetrics™ is an optional software module that adds parametric capabilities, optimization algorithms, sensitivity and statistical analyses to Ansoft’s best-in-class electromagnetic-field simulation products—HFSS™, Maxwell® 3D and Q3D Extractor®. Optimetrics automates the design-optimization process for high-performance electronics, such as microwave/RF devices, printed circuit boards, on-chip passives, IC packages and electromechanical components, by quickly identifying optimal values for design parameters that satisfy user-specified constraints and goals.

Optimetrics™ enables users to study the effects of geometry and materials on a design by creating parameters for the dimensions and material constants of the model to be analyzed. Optimetrics then varies these parameters and adjusts the geometry and materials to achieve the desired, user specified, performance goal.

Leveraging previously computed parametric simulation results within its optimizer, Optimetrics enables engineers to understand device

characteristics over a large design space and quickly identify the best performing design that is least sensitive to manufacturing tolerances. Optimetrics, when used in conjunction with HFSS™, Maxwell® 3D and Q3D Extractor®, delivers an innovative and robust design platform from which users gain a greater understanding of the design space and the ability to make insightful design choices.

• ParametricAnalysis • User-specified range and number of steps for parameters • Automatic analysis of parameter permutations • Distributed Analysis (cost option) o Automated parser management across multiple hardware platforms and reassembly of data for parametric tables and studies• SensitivityAnalysis • Design variations to determine sensitivities o Manufacturing tolerances o Material properties

This example is a connector designed with HFSS and Optimetrics. The control panel displays design variables (i.e., cost functions, parameters), launches design perturbations and converges to the optimal performance criterion.

PleaseconsultyourlocalsalesrepresentativeforpricingandinformationonthisandonotherAnsoftproducts.HFSS,Maxwell,OptimetricsandQ3DExtractoraretrademarksofAnsoftCorporation.All other trademarks are the property of their respective owners. © 2005 Ansoft Corporation PH15-1105

• Optimization • User-selectable cost functions and goal objective o Quasi-Newton method o SequentialNonlinearProgramming(SNLP) o Integer-onlySequentialNonlinearProgramming • Automatic analysis of parameter variants until optimum goal obtained• Tuning • User-controllable slide bar for real-time tuning display and results• StatisticalAnalysis • Design performance distribution versus parameter values

Current sensor optimization results using Maxwell 3D and Optimetrics






AnSOFT EUROPEAn OFFICES

OVERVIEW

FEATURED CAPABILITIES

Ansoft’s Distributed Analysis option for HFSS™, Q3D Extractor® and Maxwell® delivers the power of distributed computing to maximize the design engineer’s overall productivity. With Distributed Analysis, these industry-standard products can now distribute parametric studies across available hardware to expedite EM model extraction, characterization and optimization.

Distributed Analysis allows a single user to distribute parametric studies or frequency points across a number of machines to expedite total simulation time. This time-saving capability splits multiple pre-defined parametric design variations and/or frequency

points, solves each simulation instance on a separate machine and then reassembles the data. This dramatically accelerates parametric studies and design optimization.

• Distributed Analysis is a cost option to HFSS™, Q3D Extractor® and Maxwell® • The graphical user interface enables users to select computer addresses for analysis distribution • Automated parser management and reassembly of data • Parametric tables and studies • For HFSS, frequency sweeps for discrete, fast and interpolating

Distributed Computation of Parametric Electromagnetic Field Simulation

Distributed Analysis provides a single user with access to additional available hardware, including a heterogenous environment.

• Per license, Distributed Analysis allows up to 10 parallel simulations on remote machines, providing near-linear reduction of simulation run times• Distributed Analysis supports a heterogeneous environment of operating systems

SUPPORTED OPERATING SYSTEMS

DISTRIBUTEDANALYSIS

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