an experimental study on applying miniature loop heat ... · an experimental study on applying...
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![Page 1: An Experimental Study on Applying Miniature Loop Heat ... · An Experimental Study on Applying Miniature Loop Heat Pipes for Laptop PC Cooling L.Winston Zhang, Ph.D., P.E. Novark](https://reader033.vdocuments.mx/reader033/viewer/2022060323/5f0dc7a27e708231d43c0c2f/html5/thumbnails/1.jpg)
An Experimental Study on Applying Miniature Loop Heat Pipes for Laptop PC
Cooling
L.Winston Zhang, Ph.D., P.E.
Novark Technology Inc.www.novark.com.cn
Email: [email protected]
February 2016
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Outline
1. Introduction2. Experimental setup and parameters. 3. Application in PC cooling.4. Conclusions.5. Additional heat pipe applications.
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Introduction - Thermosyphon
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Introduction - Heat PipePassive Device that Moves Heat with low temperature difference
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Courtesy to Thermacore
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Introduction - Loop Heat Pipe
• Loop Heat Pipes for Electronics Cooling: Passive Orientation insensitive Flexible lines Potential alternative solution to remote cooling
1/4 inch DiameterEvaporator .060 OD x .010 inch
Transport Line
AluminumCondenser Plate
Compensation Chamber
EvaporatorTransport Line
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Flat LHP vs Conventional LHP
Condenser
Evaporator
Compensation chamber
Vapor line
Liquid line
Conventional loop heat pipe with cylinder shape evaporator, the
compensation chamber is separate from evaporator
Loop heat pipe with flat evaporator, its evaporator combined with the
compensation chamber
Compensation chamber
Advantages of Flat LHP: Evaporator in flat plate design reduces the contact resistance by applying directly to the chip surface; Evaporator combined with the compensation chamber simplifies the manufacturing process
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Research ObjectivesCompensation chamber
Liquid line
Wick structure
Vapor channel
Vapor line
Internal structure of miniature flat LHP with rectangular-shaped evaporator
Apply MFLHP to PC Cooling:(1) Operation of MFLHP : Analyzing the effect of diameter and length of connecting pipe to optimize the MFLHP heat sink design(2) Performance of MFLHP heat sink at different heat loads
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MFLHP Heat Sink inside a Laptop
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MFLHP for Laptop PC Cooling
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Experimental Parameters
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The thermocouple distribution schematic of the experiment setup for MFLHP
Experimental Parameters
liquid line
compensation chamber
the length of water cooling module is 100mm,circulating water temperature is 30°C
vapor line
sintered copper porouswick structure
Tci Tco
vapor channels
heating area(20×20mm)Th/Te
Trl
Experimental parameters of MFLHPs
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1、EFFECT OF THE LENGTH OF EVAPORATOR
0 10 20 30 40 50 60 70 80 900
1
2
3
4
5
6
7
Heat Load (W)
Ther
mal
Res
ista
nce
(℃/W
) MFLHP in 50mm evaporator (Lp=300mm/Di=1.6mm) MFLHP in 60mm evaporator (Lp=300mm/Di=1.6mm) MFLHP in 40mm evaporator (Lp=300mm/Di=1.6mm)
Thermal resistance versus heat load for different length of connecting pipelines
The thermal performance improved with the increase of the length of the evaporator. In particular, when the length of the evaporator increased from 40mm to 50mm, the thermal resistance significantly declined. It revealed that there was a critical length of the evaporator for MFLHP to start up.
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2、EFFECT OF THE LENGTH OF CONNECTING PIPELINE
0 10 20 30 40 50 60 70 80
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Ther
mal
Res
ista
nce
(℃/W
)
Heat Load (W)
MFLHP in 60mm evaporator (Lp=400mm/Di=1.6mm) MFLHP in 60mm evaporator (Lp=300mm/Di=1.6mm) MFLHP in 60mm evaporator (Lp=200mm/Di=1.6mm)
The lowest thermal resistance belonged to the MFLHP of 300mm length of connecting pipeline. The second one was the case of 400mm length with a little thermal resistance increase, while the worst one appeared in the case of 200mm length. It indicated there was an optimal length of the connecting pipeline for the MFLHP operation. It could be interpreted by the pressure drop due to friction losses in liquid and vapor flow through the pipeline, which calculated by Darcy–Weisbach equation.
2
2udlfP
m
dlP 4
128
Ref 64
udRe 24
dm
Amu
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Conclusion(1)By analyzing the temperature record of MFLHPs in different heat loads, it was concluded that the MFLHP can cope with the higher power dissipation rate and main stable heater temperature stable with the increase of heat loads, which met the laptop cooling requirements.
(2)The effect of lengths of the evaporator and the connecting pipe was investigated. The results showed that the lengths of the connecting pipe and the evaporator were the main factors affecting the MFLHP start-up. The thermal performance of MFLHP increased with the increase of the length of the evaporator. There is an optimal length of the connecting pipe for the MFLHP.
(3)A novel heat sink attached to a MFLHP was developed for cooling a CPU of laptop, the thermal design power (TDP) of which was 45W. The results showed the CPU heat sink with MFLHP maintained the average temperature of cooper block (dummy heater of CPU) at about 63.1°C in 45W. Compared to the conventional heat pipe solutions, MFLHP had better performance and offered the potential to make a lighter heat sink.
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Loop Heat Pipe GPU Heat Sink Design
graphics card
graphics processingunit (GPU)
an aluminum platefor mounting clips
fan
aluminum platewith a semicircularchannel
fin group 1
fin group 2
fin group 3
fin group 4
fin group 5
MFLHP
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Loop Heat Pipe GPU Heat Sink Design
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Test Results in Actual System
TDP=185wFan = 100%Room temp = 27.4℃ASIC Temp = 59 ℃
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Ultra-Thin Heat Pipe Technology
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Interior Structure of Ultra-thin Heat Pipe
Sinter
Fiber
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Novark’s Ultra-Thin Heat Pipe Patent
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Mass Production Cases Of Ultra-Thin HP-1
Spec. Structure CustomerD5*L139*T1.0 mm Sinter SD6*L199*T1.5 mm Sinter SD6*L165*T1.5 mm Sinter TD6*L145*T1.5 mm Sinter LD6*L198*T1.5 mm Sinter LD6*L272*T1.2 mm Sinter CD6*L192*T1.5 mm Sinter SD6*L253*T1.5 mm Sinter SD6*L236*T1.5 mm Sinter SD6*L189*T1.2 mm Sinter S
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Mass Production Cases Of Ultra-Thin HP-2
Spec. Structure CustomerD6*L157*T1.5 mm Sinter DD6*L181*T1.5 mm Sinter DD4*L97*T1.5 mm Sinter TD6*L154*T1.0 mm Sinter DD6*L110*T1.0 mm Sinter DD3*L109*T1.6 mm Fiber CD5*L85*T0.8 mm Fiber CD6*L195*T1.2 mm Fiber KD2*L113*T0.5 mm Fiber A
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Photos Of Mass Production Ultra-thin HP-1
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Photos Of Mass Production Ultra-thin HP-2
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Maximum Heat Transfer Rate Matrix
Type Diameter Thickness Heat pipe length (mm)
100 150 200 250Fiber 2 0.5 3W NA NA NA
Fiber 30.6 5W NA NA NA 1.6 7W 5W NA NA
Sinter 40.8 6W 3W NA NA 1.2 10W 5W NA NA
Sinter 51.0 12W 8W 5W NA 1.2 15W 10W 7W 4W
Sinter 6
1.2 15 W 13 W 7 W 5W 1.5 25 W 20W 15 W 10W 1.8 28W 25W 17 W 12W 2.0 32W 28W 22W 15W