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©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr

STMicroelectronics ToF Proximity SensorTime-of-Flight Proximity Sensor in Apple iPhone 7 PlusIMAGING report by Stéphane ELISABETHMarch 2017

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 2

Table of Contents

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 7

o STMicroelectronics

o FlightSense TM Technology

o FlightSense TM Supply Chain

o STMicroelectronics Smartphone Market

o Apple iPhone 7 Plus Teardown

Physical Analysis 19

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o Package 22

Package Views & Dimensions

Package Opening

Wire Bonding Process

Package Cross-Section :

Adhesives, PCB, Filters, FOV

o VCSEL Die 36

View & Dimensions

Wire Bonding, Cavity

Cross-Section

Process Characteristics

o ASIC Die 51

View, Dimensions & Marking

Die Overview: Active Area, SPADs technology

Die Delayering, Main Blocks ID & Process

Cross-Section : Metal Layers, SPADs

Process Characteristics

Physical Comparison 76

o STMicroelectronics Portfolio

Package, Functions, FOV, Optical Blocking Package, ASIC & VCSEL, SPADs

Manufacturing Process Flow 83

o Global Overview

o ASIC Front-End Process

o ASIC Wafer Fabrication Unit

o VCSEL Process Flow

o VCSEL Wafer Fabrication Unit

o Packaging Process Flow

o Final Assembly Unit

Cost Analysis 91

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses

o ASIC Die 96

ASIC Front-End Cost

ASIC Back-End 0 : Probe Test & Dicing

ASIC Wafer & Die Cost

o VCSEL Die 99

VCSEL Front-End Cost

VCSEL Front-End Cost per process steps

VCSEL Back-End 0 : Probe Test & Dicing

VCSEL Wafer & Die Cost

o Component 103

Back-End : Packaging Cost

Back-End : Packaging Cost per Process Steps

Back-End : Final Test Cost

Component Cost

Estimated Price Analysis 108

Company services 112

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 3

Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• Located in the front above the main speaker, the proximity sensor is packaged using optical LGA. TheiPhone 7 Plus features the smallest Time of Flight sensor provided by STMicroelectronics.

• As always, Apple has ordered a custom version of the device. Compared to STMicroelectronics’s portfolio,the custom device is two time smaller (2.80 x 2.40 mm) than the actual proximity sensor proposes by thefirm. The sensor is based on FlighSenseTM technology that featured an illumination device which is aVertical-Cavity Surface-Emitting Laser (VCSEL) and a collector which is based on the Single PhotonAvalanche Diode (SPAD) developed by STMicroelectronics.

• To provide such device, STMicroelectronics has made some improvement on the SPADs and the VCSELfrom the actual devices that are studied and detailed in the report. The report featured also a function anda field-of-view comparison with the VL53L0X and VL6180X.

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 4

Overview / Introduction

Company Profile & Supply Chain o STMicroelectronicso Apple iPhone 7 Plus Teardown

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Apple iPhone 7 Plus Opened view

Apple iPhone 7 Plus Teardown

Apple iPhone 7 Plus Top Flex PCB – Top View

Apple iPhone 7 Plus Top Flex PCB – Bottom View

Front Camera

Microphone

ALS

Speaker

Proximity Sensor

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 5

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Synthesis of the Physical Analysis

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 6

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Package View & Dimensions

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 7

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Package Cross-Section

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 8

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

VCSEL Die View & Dimensions

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 9

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

VCSEL Die – Cross-Section

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 10

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

VCSEL Die – Cross-Section

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 11

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

ASIC Die View & Dimensions

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 12

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

ASIC Die – Active Area

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 13

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

ASIC Die – SPADs

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 14

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

ASIC Die – Die Cross-Section

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 15

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison o Packageo Functiono FOVo Optical Blocking Packageo ASIC & VCSELo SPADs

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Comparison with STMicroelectronics Portfolio – Package

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 16

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison o Packageo Functiono FOVo Optical Blocking Packageo ASIC & VCSELo SPADs

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Comparison with STMicroelectronics Portfolio – SPADs

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 17

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo VCSEL Front-End Processo Packaging Process

Cost Analysis

Selling Price Analysis

About System Plus

Global Overview

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 18

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo VCSEL Wafer & Die Costo Back-End Costo Component Cost

Selling Price Analysis

About System Plus

ASIC Front-End Cost

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 19

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo VCSEL Wafer & Die Costo Back-End Costo Component Cost

Selling Price Analysis

About System Plus

VCSEL Front-End Cost

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 20

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo VCSEL Wafer & Die Costo Back-End Costo Component Cost

Selling Price Analysis

About System Plus

Component Cost

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 21

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Pluso Company serviceso Feedbackso Contacto Legal

MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT

• Status of the CMOS Image Sensor Industry 2016

PATENT ANALYSIS - KNOWMADE

• Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

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Spectrometer Dongle

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 22

COMPANYSERVICES

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 23

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Pluso Company serviceso Feedbackso Contacto Legal

Business Models a Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings

©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 24

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Pluso Company serviceso Feedbackso Contacto Legal

Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 16sales@systemplus.fr

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