de la plastronique à la « mecatronic integrated devices

1 181009_Mecaplastroconnection_S2P.pdfConfidentiel

De la Plastronique à la « Mecatronic Integrated Devices » Actualités et tendances

Mecatronic & Plastronic Connection - 09 Octobre 2018

2 181009_Mecaplastroconnection_S2P.pdf

Introduction

General S2P Presentation

The actual situation of 3D-MID

Short term innovations

Middle term innovations

Long term innovations

Conclusion

Annexe 6 DEV P 001 - Confidentiel

3 181009_Mecaplastroconnection_S2P.pdf

S2P : Smart Plastic Products

A new way to develop and manufacture integrated devices

Annexe 6 DEV P 001 160317 - Confidentiel

4 181009_Mecaplastroconnection_S2P.pdf

Company skills and values

SME expert in 3D-MID, with an innovative multidisciplinary team of mechanics/plastics, chemistry and electronics

Unique know-how in France, independent and major actorof an international network

A single desk from the idea to the manufacturing of high added value products, focused on customer qualityrequirement through design and prototyping steps.

Sharing, Customer satisfaction, Innovation

5 181009_Mecaplastroconnection_S2P.pdf

Skills needed to develop 3D-MID

Product Design

Part Manufacturing

Selective activation

Selective plating

Components assembly

Quality

6 181009_Mecaplastroconnection_S2P.pdf

How to work with us

You have an idea : S2P can make the co-development with you !

You already have your concept : S2P can prototype it !

You have finished the product development : S2P can produceit !

Expertise, Development, Prototyping, Production

7 181009_Mecaplastroconnection_S2P.pdf

They trusted us

8 181009_Mecaplastroconnection_S2P.pdf

3D- MID : Molded Interconnect Devices

An already 30 years discipline

Annexe 6 DEV P 001 160317 - Confidentiel

9 181009_Mecaplastroconnection_S2P.pdf

3D-MID : a bit of History

First integrated Molded part by IBM in 1987

Several applications by selective plating early on the

Annexe 6 DEV P 001 160317 - Confidentiel

Source : Molex, IBM

10 181009_Mecaplastroconnection_S2P.pdf

3D-MID : New kind of products

Miniaturization

Function integration

Weight reduction

Free design

Etc.

Annexe 6 DEV P 001 160317 - Confidentiel

Source : Thalès, Airbus, S2P, Huawei

11 181009_Mecaplastroconnection_S2P.pdf

3D-MID : Mixing known and new technologies

Insert molding

Selective Plating

Laser activation

2-Shot Molding

Etc.

Annexe 6 DEV P 001 160317 - Confidentiel

IR-Laser

structuring

Cleaning

Electroless Cu

Electroless Ni

Immersion Au

Injection moulding

Source : LPKF, 3D-MID E.V, BOSCH

12 181009_Mecaplastroconnection_S2P.pdf

3D- MID : Molded InterconnectMecatronic Integrated Devices

Short term Innovations

Annexe 6 DEV P 001 160317 - Confidentiel

13 181009_Mecaplastroconnection_S2P.pdf

Short term innovations : New materials

From PC to PEEK

Colorable grades

Epoxy Resin thermoset

PowderCoating on metallicsubstrates

Ceramics (including CIM substrates)

Chemical plating improvement(quicker, ductile)

Annexe 6 DEV P 001 160317 - Confidentiel

Source : LPKF, MacDermid

14 181009_Mecaplastroconnection_S2P.pdf

Short term innovations : Rapid prototyping

Protopaint

FDM with LDS material

Milling of LDS Material

Annexe 6 DEV P 001 160317 - Confidentiel

Source : MEPEU, Franhaufer IZM, S2P

15 181009_Mecaplastroconnection_S2P.pdf

Short term innovations : Design Rules / Software

NEXXTRA MID

Target 3001!

3D Expérience DASSAULT

Design Rules from Design Of experiment ( MID Plan)

Annexe 6 DEV P 001 160317 - Confidentiel

Source : Huawei, BetaLayout

16 181009_Mecaplastroconnection_S2P.pdf

Short term innovations : Serial production improvement

Prototyping available in France, Europe, World

Small serial production

Big serial production Europe and Asia

Automatisation

Annexe 6 DEV P 001 160317 - Confidentiel

17 181009_Mecaplastroconnection_S2P.pdf

3D- MID : needs

Middle term Innovations

Annexe 6 DEV P 001 160317 - Confidentiel

18 181009_Mecaplastroconnection_S2P.pdf

Middle term innovations : Technology Improvements

Multilayers technologies

Chemical process :

Copper acceleration

Formaldehyde Free

New finishing

Annexe 6 DEV P 001 160317 - Confidentiel

Source : ITRI

19 181009_Mecaplastroconnection_S2P.pdf

Middle term innovations : Printed Electronics

Overmoulding

Large surfaces

OPV / OLED OPVIUS

Annexe 6 DEV P 001 160317 - Confidentiel

Source : ifm, OPVIUS

20 181009_Mecaplastroconnection_S2P.pdf

Middle term innovations : 3D Printed Electronics

Standard surface

Multimaterial (Ceramics)

Inkjet / Dispense

Annexe 6 DEV P 001 160317 - Confidentiel

Source : Hitachi

21 181009_Mecaplastroconnection_S2P.pdf

3D- MID : Will become the normal way to design a product

Long term innovations

Annexe 6 DEV P 001 160317 - Confidentiel

22 181009_Mecaplastroconnection_S2P.pdf

Long term innovations : Digital manufacturing

Combination of Additive manufacturing and interconnection in 3D

Annexe 6 DEV P 001 160317 - Confidentiel

23 181009_Mecaplastroconnection_S2P.pdf

Long term innovations : Digital manufacturing

Process improvementneeded :

Geometrical accuracy

Surface topology

Conductivity of inks

Annexe 6 DEV P 001 160317 - Confidentiel

Source : Voxel8, Nano dimensions

24 181009_Mecaplastroconnection_S2P.pdf

Long term innovations : Digital manufacturing

Process improvementneeded :

Material development (high temperature)

Speed improvement (smallserial production)

Annexe 6 DEV P 001 160317 - Confidentiel

Source : HP

25 181009_Mecaplastroconnection_S2P.pdf

Conclusion

New technologies? New way to use and combine existing and reliabletechnologies.

Not applicable for some markets? Development and improvement fromprototyping to large serial production

No future? Software development to accelerate and integrate design rules for everyday use.

Annexe 6 DEV P 001 160317 - Confidentiel

26 181009_Mecaplastroconnection_S2P.pdf

CONTACT

5 rue Pierre et Marie Curie 01100 Bellignat

04 81 92 06 30

info@s-2p.com

www.s-2p.com

Annexe 6 DEV P 001 - Confidentiel