advisory board - electronics

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Advisory Board - Electronics 26. September 2019 The Faculty of Engineering

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Page 1: Advisory Board - Electronics

Advisory Board - Electronics26. September 2019

The Faculty of Engineering

Page 2: Advisory Board - Electronics

Agenda:

Welcome (Ib Christensen) Presentation of members

Information about the programmes (Ib Christensen) Uptake 2019 Drop-out rate - first year students Job guarantee (Christina Skytte Møller)

The MSc programme (with start in 2020)

AoB

Next Meeting:ThemesCompany Visit:

A look at the new CIE building

Page 3: Advisory Board - Electronics

Uptake 2019 vs. 2018Applications – first priority

Page 4: Advisory Board - Electronics

Uptake 2019 vs. 2018Accepted

Page 5: Advisory Board - Electronics

Job Guarantee

Drop – out rate

Page 6: Advisory Board - Electronics

Bachelor Programmes, up and running

3 years B.Sc.

+2 years M.Sc.Eng.or M.Sc.

Ph.D.3 years

3½ years B.Eng. incl.

½ year internship

First graduates expectedin January 2021

First graduates expectedin June 2022

Page 7: Advisory Board - Electronics

Semester Electronics B.Eng (and BSc) STRUCTURE Autumn 2018

7. Final Project (External, oral)

6.Spring 21

Internship for B.Eng studentsBachelor project (External) EE-SAA (EXAM: Internal), MC-AEM (EXAM: Internal, P/F) and elective course for BSc

5.Autumn

21

MC-EXSExperts in Teams(EXAM: External)

EE-POE Power Electronics(EXAM: External)

ELECTIVE ELECTIVE

4.Spring 20

EE-DEADesign of Embedded Architectures

SPRO4E (EXAM: External)

MC-DSP Digital Signal

Processing (EXAM: Internal)

MC-DDS Digital Design and Signal

Processing (EXAM: External)

MC-COE2 Control Engineering 2

(EXAM: Internal) ELECTIVE

3.Autumn

20

EE-DIEDevelop Intelligent Dynamic Electronic Systems

(SPRO3E, ELTR3, CON1 EXAM: External)

MC-EDMElectrodynamics and Mathematics

(EDY External,3 hour written,MSS EXAM: External,3 hour written)

2.Spring 19

EE-BIEBuild Industrial Electronics

(SPRO2E, ELTR2, EMB2 EXAM: Internal)

EE-EMATSignals, Filters and Mathematics

(ASF, MATH2 EXAM: Internal)

1.Autumn

18

EE-DEDPDiscover the Electronic Development Process

(SPRO1E, ELTR1, EMB1 EXAM: Internal)

EE-PHYMPhysics and Mathematics

(ENPHYS*, MATH1 EXAM: Internal)

ECTS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

1st year-exam

EE-DEDP + EE-BIE + EE-PHYM

MUST PASS

Page 8: Advisory Board - Electronics

MSc in Electronics

The Faculty of Engineering

Page 9: Advisory Board - Electronics

Teoretisk ingeniørfaglig metode, avanceret matematik og fysik, projektledelse samt forsk-ningsbaseret viden inden for kompetenceområderne i en praksisnær kontekst og med inddragelse

af opgaver og problemstillinger fra erhvervslivet

Grundlag for tilegnelse a f kompetencer

½ års specialepraktik med udgangspunkt i forskning og erhvervssamarbejde

Distr ibuted Systems

Materials, Packaging and

Reliability

Data Communication

and IoT

Signal Processing

and Sensors

AdvancedEmbeddedSystems

Intelligent Control

EngineeringPower

Elect ronics

Modeling and Simulation

EMC and EMIAnalog and Digital Elect ronics

Civilingeniøruddannelsen i elektronikBacheloruddannelse (3 år) + kandidatuddannelse (2 år)

(SDU – Center for industriel Elektronik, Camp u s Sønderborg)

The Faculty of Engineering

Page 10: Advisory Board - Electronics

The Faculty of Engineering

Materials, Packaging and reliabilityPower ElectronicsModelling and Control EngineeringControl of Grid Connected ConvertersModelling and Control of Electrical Machines

Software for Embedded systemsSignal- and Image ProcessingDistributed systems and IoTReal Time systemsHardware-Software Co-Design

Electronic Design and Build (project work)Scientific Methods used in PractiseIn Company PeriodMaster Thesis (30 or 40 ECTS)Electives

Academic Fields – MSc in Electronics

Page 11: Advisory Board - Electronics

SemesterMaster of Science in Engineering – Electronics

Sønderborg

4.

Choose between:THS-U2 (30 ECTS) Master Thesis or

THS-U1 (40 ECTS) Master Thesis continued.

3.

MC-RTSReal Time Systems

EE-DITDistributed

Systems and IoT

EE-SIPSignal and Image

Processing

Choose between:VF-U1 (15 ECTS) In Company Period or

THS-U1 (40 ECTS) Master Thesis upstart andElective (5 ECTS) or

Electives (15 ECTS)

2.

MC-HSCODHW/SW Co-Design of

Embedded Systems

EE-MAT2Material Science,

Packagingand reliability of

Electronics

EE-CGCCControl of (grid connected)

converters

EE-POE2Advanced Power

Electronics

EE-EDB1Electronics Design and Build Project

1.

MC-SESSoftware for Embedded

Systems

EE-MAT1Material Science,

Packagingand reliability of

Electronics

EE-MCEMModelling and Control of Electrical

Machines

EE-POE1Power Electronics

EE-EDBElectronics Design and Build Project

ECTS POINT5 5 5 5 5 5

Page 12: Advisory Board - Electronics

EE-MAT1, Material Science- Physics of Solids (Wave Function, Conduction Band, Valence Band, Effective

Mass, Free Electron)- Aspects of Materials Science (Phase Diagram, Lattice Site, Reciprocal Lattice, Binary

Phase Diagram, Ternary Phase Diagram- Engineering Electronic Structure (Valence Band, Band Structure, Interatomic

Distance, Atomic Orbital, Hybrid Orbital)- Crystal orientation, Charge carrier mobility and conductivity of Semiconductors- Defects in Semiconductors (Dislocation and critical thickness)- Amorphous Semiconductors (Solar Cell Dangling Bond)- Organic Semiconductors- Pn-junction- Electronic Devices (Band Edge, Minority Carrier, Depletion Region, Bipolar Junction

Transistor, Majority Carrier)- bi-polar and uni-polar Transistors- Power transistors- Introduction to Advanced Power electronics (silicon carbide, gallium nitride)- Material characteristics of WBG devices

Page 13: Advisory Board - Electronics

EE-MAT2, Material Science- Semiconductors with wide bandgap (WBG)- SiC diodes and pin diodes- SiC-MOSFETS, IGBT- GaN devices: HEMTs and MOSFETs- Process technologies for WBG devices and Application examples- Introduction to thermal radiation, convection, thermal capacity and

thermal spreading- Thermal interface materials- Materials for packaging and housing- Electrical-thermal modelling- Effects on life time and reliability- Coatings, over-molds and protective materials, material properties- Failure mechanisms and Failure analysis:

- failure mechanisms caused by different environmental stresses- Basics of corrosion processes- Analysis and characterization methods

- One variable topic based on the current research (<10% of course content)

Page 14: Advisory Board - Electronics

EE-MCEM, Modelling and Control of Electrical Machines- Rotating Machines

- DC- Synchronous type AC- Asynchronous AC

- Interfacing and control of the different machines- Stability and linear state-feedback control for DC Machines- State Space representations for continuous and discrete-time systems- Observability and state estimators/observers- Parameter estimation- Modelling and simulating linear and non-linear systems in Matlab/Simulink- Clarke and Park transform and Field Oriented Control of Synchronous Machines

(simulation)

EE-CGCC, Control of Grid Connected Converters- Advanced grid connected converter topologies for renewable energy conversion,

their control and synchronization to power grid, requirements and regulations.- The course contains theory, seminars and laboratory activities that cover the

design and control of grid connected power converters.

Page 15: Advisory Board - Electronics

EE-POE1, Power Electronics 1- DC/DC converters (Topologies)- AC/DC Rectifier- DC/AC converter (Topologies)- Modulation strategies as single phase, three

phase, Space Vector 3- Design of power electronic converter

- Power devices and packages- Gate Driver1- Cooling1- Busbar and Capacitors, Stray inductance- Inductor- Current sensing- Voltage sensing- Isolation

EE-POE2, Power Electronics 2- DC/DC converters (Hard and soft switching, resonant

switching)- AC/DC converters (line commutated)- DC/AC converter (self-commutated)- Impact of converters to the grid- Power Electronic components- Silicon Carbide and Gallium Nitride Devices- Applications:

- Power factor correction (DC-DC converter)- Motor drives- Solar inverter (introduction to 3 Level Topologies)

- One variable topic based on the current research (<10% of course content)

Page 16: Advisory Board - Electronics

EE-SIP, Signal and Image ProcessingSignal Processing Algorithms (FFT, DFT, Correlation, Convolution etc.)FIR and IIR filtersCore Algorithms in image processing, exemplified in relevant use cases.

MC-SES, Software for Embedded SystemsObject-oriented programming in C++ClassesInheritancePolymorphismTemplatesExceptions

MC-HSCOD, Hardware Software Co-DesignComputer Systems OrganizationThe Microarchitecture Level.The Instruction Set Architecture Level.Parallel Computer Architectures.Techniques for pipelining and improving performance in an embedded microcontroller.Design, modelling and Implementation of a pipelined Computer Architecture in a FPGA.

EE-DIT, Distributed Systems and IoTDatacommunication in generalSecuring safe transfer of dataArchitecture of industrial networksPerformance of industrial networksInternet of Things.

MC-RTS, Real Time SystemsScheduling of independent and dependent tasks.Scheduling schemes for handling overloadMultiprocessor scheduling.Joint scheduling of tasks and messages in distributed systemsExamples of different real-time operating systems, real-time languages and real-time middle-ware systems.

Page 17: Advisory Board - Electronics

- Electives (max. 15 ECTS)- Project: State-of-the-art research in Power Electronics

and Embedded Control (10 ECTS)- In-Company Project (15 ECTS)- Thesis (30 or 40 ECTS)

Page 18: Advisory Board - Electronics

AoB

Next Meeting:ThemesCompany Visit:

A look at the new CIE building