advanced manufacturing techniques r crockett

Dry-Film Developments for LDI - Technology

9/3/2009 DUPONT CONFIDENTIAL

Russell CrockettCircuit Packaging Materials.DuPont Electronic Technologies

Advanced Manufacturing Techniques.Rotherham 4 August. 2009

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Laser Direct Imaging forPrinted Circuit Manufacture.

Why Use LDI to expose a dry film resist?

Is it an Enabling Technology?• Improve production capabilities

9/3/2009 DUPONT CONFIDENTIAL9/3/2009 DUPONT CONFIDENTIAL

• Improve production capabilities

Does it Improve Yields?

• Reduce costs

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The 5 Steps to Create the Image.•Surface Preparation.•Resist Lamination.

•Resist Exposure.LDI step.


p p•Resist Development.

•Circuit Creation.• Etching.• Plating.

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The main Users of LDI Equipment.

•Prototype Market - Enabling Technology.• Speed to production. No phototool preparation.


• Flexability. Single board production.

•HDI Market – Yield Improvement.• Side to side, layer to layer registration.

• Large panel registration to micro vias.

• Reduced repeat fault ( dirt ) imaging for fine line.

• Better quality and lower total cost.

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LDI History

Nikon PentaxDI-2000

Dai-NihonScreen

OrbotechDP-100Polyscan

PDI-2000


UV Laser out put360nm * 350 - 365nm

405nm * 400 - 415nm

1990 1995 2000

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LDI Technology 355nm vs. 405nm

Laser

PolygonMirror

DMD

Laser

Wave Length：355nm Wave Length：405nm

Polygon Mirror System DMD (Digital Micro Mirror Devise) System


Mirror

Panel

Feed direction

Panel

Feed direction

Scandirection

Polygon Mirror 305nmOrbotech

DMD. Digital Micro-mirror Devise 405nm

Fuji Pentax (ORC) Hitachi

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Polygon Optical System source: ORBOTECH

UV LaserPolygonBeam

S litt

AOM


Lens SystemSplitter

Stage movement during imaging

Panel

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DMD 405nm LDI system

Exposure

CAD data

Optical system

Light Lens

ON

DMD


Panel feed direction

Direct imaging

Optical head

DMD （Digital Micro mirror Device）

消光板

OFF

Imaging

Focus Lens

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Laser technology and Resist evolution.•

Polygon Plotters ( DP 100 )• Low energy

• Productivity gated by photospeed, ~ 10mJ

Dry film resists( LDI 300, 500 Series )V hi h h t d


• Very high photospeed, • 8 - 10mJ 30micron resist• 15 – 18mJ 50micron resist

Trade off• Unstable to heat and yellow light.• Poor processing productivity, development, stripping.• Brittle, poor tenting.

Conventional resist 60 – 75mJ

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LDI History

Nikon PentaxDI-2000

Dai-NihonScreen


PDI-2000


1990 1995 2000

LDI 200

LDI 500

LDI 300

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LDI 500 series dry-film 405nm + 355nm

LDI540 @ 405nm LDI540 @ 355nm


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LDI 500 series dry-film 405nm + 355nm

LDI540 @ 405nm LDI540 @ 355nm25 – 28 mJ/cm2 14 – 16 mJ/cm2


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LDI Dry-Film Developments

Nikon PentaxDI-2000

Dai-NihonScreen LI-7000


PDI-2000


1990 1995 2000

LDI 200

LDI 500

LDI 300

LDI 800

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Laser technology and Resist evolution.

•

Digital Micro Mirror Device, LDI plotter

• High resolution• Smaller panel format

U d i l i A i


• Used mainly in Asia.• Needed specific photo-initiator at 405nm.

• Not compatible with other dry film photo-initiators.• Not compatible with other exposure equipment.

• Riston* LDI 800 developed specifically for 405nm wave length.

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Laser technology and Resist evolution.•

Polygon Plotters ( Paragon 8000 )• Higher energy

• Productivity gated by photospeed, ~ 18mJ

Dry film resists( LDI 7000 and 7200 Series )Hi h h t d


• High photospeed, Benifits

• More stable to heat and yellow light.• Improved resolution.• Improved resist flow and adhesion.• Improved processing productivity, development, stripping.• Higher yields.

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LDI Dry-Film continued developments

1990 199 2000

Nikon PentaxDI-2000

Dai-NihonScreen


PDI-2000


1990 1995 2000

LDI 200

LDI 500

LDI 300

LDI 7000

LDI 800

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Is it an Enabling Technology?• Improve production capabilities


• Improve production capabilities

Does it Improve Yields?

• Reduce costs

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Yield – Imaging Defects, none LDI exposure

708090

100without Repeatswith Repeats


010203040506070

Yield % opens/nicks

75 50

Feature size ym

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Yield – Imaging Defects, 50ym ( non-repeating )

708090

100


010203040506070

Yield % Imaging Defects

1 2

LDI Exposure

without Cleaningwith Cleaning

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Yield – Mis-registration Defects (610 x 510mm)

8090

100


01020304050607080

Yield % Misregistration

Feature size 50ym

Film exposureLDI exposure

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Riston* LDI 7040


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LDI Dry Film Resist RequirementsAll ApplicationsAdhesion to many surface finishesProductivity, all processes.Flow at lamination.Resolution ~ 50ym


Resolution, ~ 50ymEtching, Acid and AlkalinePlate Cu, Sn, PB,Ni, Au.Tenting, T&E and Plating.Stability, Transport, yellow light.Can be exposed on conventional printers.Highest possible yields.

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LDI Dry Film Resist Requirements

Best in class dry film, plus LDI exposureRiston* LDI 7000 and 7200 series.

Good Adhesion on all surfacesGood Flow - Characteristics


High ResolutionGood Tenting ( 8mm through 65µm Cu acid etch )High Productivity- fast development- fast and easy stripping

Acid and Alkaline etch.

Plating, Cu, Sn, Pb, Ni, Au.

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LDI 7000,7200, Dry Film Resists

Riston* LDI 7000 and 7200 series.Thicker resists 7250,7262,7275 and 7299

• Optimized for through polymerization.

Cover sheet clarity and quality.


High resolution capability, sub 50ym. ( resist thickness )

Compatibility with standard exposure equipment.

Production proven high yield performance.• Etching innerlayers.

• Tent and etch.

• Cu & Sn and Ni & Au plating.

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Riston* LDI 7000 / 7200 Series

LDI 7030 16 mJ/cm2

LDI 7040 20 mJ/cm2


LDI 7250 30 mJ/cm2

Paragon 8000, gate energy 18mJ.

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LDI 7040 - 37 micron L/S


14 mJ/cm2 20 mJ/cm2

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LDI 7030 LDI 7250


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Riston* LDI 7040


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Riston* LDI 7250


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Riston* LDI 7250


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LDI – Productivity?Paragon + DuPont WBR 2100


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