8-channelvariable gain amplifier sheets/texas instruments pdfs... · ... and use in critical...
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FEATURES DESCRIPTION
APPLICATIONS
OUT1IN1 LNA
VLNA
VLNA
VCA
AnalogControl
PGA2−PoleFilter
CW(0−9)DOUT CW Processor(8 x 10)
5x8FIFO
OUT8IN8 LNA VCA PGA
2−PoleFilter
•••
•••
DIN
CLK
CS
SerialInterface
PG
ATNVCNTRL
VCA8613
10
OUT1OUT1
OUT8
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
8-Channel VARIABLE GAIN AMPLIFIER
• LOW INPUT NOISE: The VCA8613 is an 8-channel variable gain amplifierideally suited to portable ultrasound applications.– 1.2nV/√Hz at fIN = 5MHzExcellent dynamic performance enables use in• EXTREMELY LOW POWER OPERATION:low-power, high-performance portable applications.
– 75mW/CHANNEL at 3V Each channel consists of a Low-Noise pre-Amplifier• INTEGRATED LOW-PASS, 2-POLE FILTER (LNA) and a Variable Gain Amplifier (VGA). The
differential outputs of the LNA can be switched– 14MHz BANDWIDTHthrough the 8x10 cross-point switch, which is
• INTEGRATED INPUT LNA programmable through the serial interface port.• INTEGRATED INPUT CLAMP DIODES
The output of the LNA is fed directly into the VGA• DIFFERENTIAL OUTPUT stage. The VGA consists of two parts, a Voltage• READABLE CONTROL REGISTERS Controlled Attenuator (VCA) and a Programmable
Gain Amplifier (PGA). The gain and gain range of the• INTEGRATED CONTINUOUS WAVE (CW)PGA can be digitally configured separately. The gainPROCESSORof the PGA can be varied between two discretesettings of 21dB and 26dB. The VCA has fourprogrammable maximum attenuation settings: 29dB,
• Medical and Industrial Ultrasound Systems 33dB, 36.5dB, and 40dB. Also, the VCA can becontinuously varied by a control voltage from 0dB to amaximum of 29dB, 33dB, 36.5dB, and 40dB.
The output of the PGA feeds directly into anintegrated 2-pole, low-pass filter, allowing for directconnection to a differential input Analog-to-DigitalConverter (ADC), such as the ADS5121 or ADS5122from Texas Instruments. The VCA8613 is available ina TQFP-64 package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2003–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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ABSOLUTE MAXIMUM RATINGS (1)
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integratedcircuits be handled with appropriate precautions. Failure to observe proper handling and installationprocedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precisionintegrated circuits may be more susceptible to damage because very small parametric changes couldcause the device not to meet its published specifications.
ORDERING INFORMATION (1)
SPECIFIEDPACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
VCA8613YT Tape and Reel, 250VCA8613 TQFP-64 PAG –40°C to +85°C VCA8613Y
VCA8613YR Tape and Reel, 1500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com.
+AVDD +3.6V
Analog Input –0.3V to +AVDD + 0.3V
Logic Input –0.3V to +AVDD + 0.3V
Case Temperature +100°C
Junction Temperature +150°C
Storage Temperature +150°C
Thermal Resistance, Junction-to-Ambient (θJA) 66.6°C/W
Thermal Resistance, Junction-to-Case (θJC) 4.3°C/W
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods maydegrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyondthose specified is not implied.
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ELECTRICAL CHARACTERISTICS: AVDD = DVDD = 3V
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
At TA = +25°C, load resistance = 500Ω on each output to ground; the input to the preamp (LNA) is single-ended; fIN = 2MHz,ATN = 01, PG = 00, and the output from the VCA is differential, unless otherwise noted.
VCA8613
PARAMETER CONDITIONS MIN TYP MAX UNIT
PREAMPLIFIER (LNA)
Input Resistance 4.5 kΩ
Input Capacitance (1) 80 pF
Input Bias Current 1 nA
Maximum Input Voltage (2) 110 mVPP
Input Voltage Noise TGC-mode, fIN = 5MHz 1.2 nV/√Hz
Input Voltage Noise CW-mode, fIN = 5MHz 1.6 nV/√Hz
Output Swing (Differential) 2 VPP
Bandwidth 70 MHz
Gain TGC-Mode, SE-to-Differential 24.5 dB
Input Common-Mode Voltage 2.4 V
ACCURACY
Gain Slope VCNTRL = 0.2V to 1.7V 20 dB/V
Gain Error VCNTRL = 0.2V to 1.7V 2 dB
Output Offset Voltage Differential ±20 mV
GAIN CONTROL INTERFACE
Input Voltage (VCNTRL) Range 0 to 2.0 V
Input Resistance 1 MΩ
Response Time 40dB Gain Change, ATN = 00 0.2 µs
PROGRAMMABLE VGA AND LOW-PASS FILTER
–3dB Cutoff (low-pass) 14 MHz
–3dB Cutoff (high-pass) 800 kHz
Slew Rate 300 V/µs
Output Impedance 10 Ω
Crosstalk 49 dB
Output Common-Mode Voltage 1 V
Output Swing (Differential) (3) 2 VPP
2nd-Harmonic Distortion VOUT = 500mVPP –55 –45 dBc
3rd-Harmonic Distortion VOUT = 500mVPP –50 –40 dBc
Group Delay Variation ±3 ns
CONTINUOUS WAVE PROCESSOR
CW Output Compliance Voltage 3 3.3 V
V/I Converter Transconductance 10.35 11.5 12.65 mA/V
Maximum CW Output Swing 2.0 mAPP
LOGIC INPUTS
VIN LOW (input low voltage) 0 0.6 V
VIN HIGH (input high voltage) 2.1 VDD V
Input Current ±1 µA
Input Pin Capacitance 5 pF
Clock Input Frequency 10k 25M Hz
POWER SUPPLY
Supply Voltage 2.85 3.0 3.15 V
Power-Down Delay 5 µs
Power-Up Delay 20 µs
Power Dissipation (TGC Mode) Operating All Channels 600 700 mW
(1) Includes internal clamping diodes.(2) Under conditions that input signal is within linear range of LNA.(3) Under conditions that signal is within linear range of output amplifier.
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AG
ND
IN7
AG
ND
IN8
AV
DD
CW
0
CW
2
CW
4
CW
6
CW
8
AG
ND
AV
DD
VC
NTR
L
VLN
A
AG
ND
VR
EF
AG
ND
IN2
AG
ND
IN1
AV
DD
CW
1
CW
3
CW
5
CW
7
CW
9
AG
ND
AV
DD
VFI
L
VC
M
AG
ND
VR
EF
B
IN6
AGND
IN5
AGND
DVDD
DGND
DOUT
CLK
DIN
CS
DGND
DVDD
AGND
IN4
AGND
IN3
OUT8
OUT8
OUT7
OUT7
OUT6
OUT6
OUT5
OUT5
OUT4
OUT4
OUT3
OUT3
OUT2
OUT2
OUT1
OUT1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
64 63 62 61 60 59 58 57 56 55 54
17 18 19 20 21 22 23 24 25 26 27
53 52 51 50 49
28 29 30 31 32
VCA8613
Top View TQFP
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
PIN DESCRIPTIONSPIN DESIGNATOR DESCRIPTION
5, 12 DVDD Digital Supplies
2, 4, 13, 15, 17, 19, 27, 31, 50, 54, 62, 64 AGND Analog Ground
1, 3, 14, 16, 18, 20, 61, 63 IN(1–8) Single-Ended LNA Inputs
22–26, 55–59 CW(0–9) Continuous Wave Processor Outputs
51 VLNA Reference Voltage for LNA–internally generated; requires external bypass cap.
29 VFIL Reference Voltage for Output Filter–internally generated; requires external bypass cap.
30 VCM Common-Mode Voltage–internally generated; requires external bypass cap.
34, 36, 38, 40, 42, 44, 46, 48 OUT(1–8) Positive Polarity PGA Outputs
33, 35, 37, 39, 41, 43, 45, 47 OUT(1–8) Negative Polarity PGA Outputs
52 VCNTRL Attenuator Control Voltage Input
9 DIN Serial Data Input Pin
10 CS Serial Data Chip Select
8 CLK Serial Data Input Clock
7 DOUT Serial Data Output Pin
21, 28, 53, 60 AVDD Analog Supplies
6, 11 DGND Digital Ground
49 VREF Reference Voltage for Attenuator–internally generated; requires external bypass cap.
32 VREFB Bandgap Reference Voltage—internally generated; requires external bypass cap.
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INPUT REGISTER BIT MAPS
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
Table 1. Byte 1—Control Byte Register Map
BIT # NAME DESCRIPTION
LSB 1 Start bit; always a ‘1’—40-bit countdown starts upon first ‘1’ after chip select.
1 W/R 1 = Write, 0 = Read—Read prevents latching of DATA only—Control register still latched.
2 PWR Entire chip. Power Control—'1' = Off. Otherwise, chip is on.
3 A0 Attenuator control bit (LSB): ATN [ A1:A0 ].
4 A1 Attenuator control bit (MSB).
5 Mode '1' = TGC mode (CW powered down), '0' = Doppler mode (TGC powered down)
6 PG0 LSB of PGA Gain Control; PG [ PG1:PG0 ].
MSB PG1 MSB of PGA Gain Control
Table 2. Byte 2—First Data Byte
BIT # NAME DESCRIPTION
LSB Data 1:0 Channel 1, LSB of Matrix Control
1 Data 1:1 Channel 1, Matrix Control
2 Data 1:2 Channel 1, Matrix Control
3 Data 1:3 Channel 1, MSB of Matrix Control
4 Data 2:0 Channel 2, LSB of Matrix Control
5 Data 2:1 Channel 2, Matrix Control
6 Data 2:2 Channel 2, Matrix Control
MSB Data 2:3 Channel 2, MSB of Matrix Control
Table 3. Byte 3—Second Data Byte
BIT # NAME DESCRIPTION
LSB Data 3:0 Channel 3, LSB of Matrix Control
1 Data 3:1 Channel 3, Matrix Control
2 Data 3:2 Channel 3, Matrix Control
3 Data 3:3 Channel 3, MSB of Matrix Control
4 Data 4:0 Channel 4, LSB of Matrix Control
5 Data 4:1 Channel 4, Matrix Control
6 Data 4:2 Channel 4, Matrix Control
MSB Data 4:3 Channel 4, MSB of Matrix Control
Table 4. Byte 4—Third Data Byte
BIT # NAME DESCRIPTION
LSB Data 5:0 Channel 5, LSB of Matrix Control
1 Data 5:1 Channel 5, Matrix Control
2 Data 5:2 Channel 5, Matrix Control
3 Data 5:3 Channel 5, MSB of Matrix Control
4 Data 6:0 Channel 6, LSB of Matrix Control
5 Data 6:1 Channel 6, Matrix Control
6 Data 6:2 Channel 6, Matrix Control
MSB Data 6:3 Channel 6, MSB of Matrix Control
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DATA SHIFT SEQUENCE
MSB 6 5 4 3 2 1 LSB
MSB 6 5 4 3 2 1 LSB
MSB 6 5 4 3 2 1 LSB
MSB 6 5 4 3 2 1 LSB
MSB 6 5 4 3 2 1 LSB
DIN
Shift Direction
DOUT
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
Table 5. Byte 5—Fourth Data Byte
BIT # NAME DESCRIPTION
LSB Data 7:0 Channel 7, LSB of Matrix Control
1 Data 7:1 Channel 7, Matrix Control
2 Data 7:2 Channel 7, Matrix Control
3 Data 7:3 Channel 7, MSB of Matrix Control
4 Data 8:0 Channel 8, LSB of Matrix Control
5 Data 8:1 Channel 8, Matrix Control
6 Data 8:2 Channel 8, Matrix Control
MSB Data 8:3 Channel 8, MSB of Matrix Control
Table 6. Maximum Attenuation Table 7. PGA Gain Settings
A1, A0 MAXIMUM ATTENUATION PG1, PG0 PGA GAIN
0, 0 29dB 0, 0 21dB
0, 1 33dB 0, 1 26dB
1, 0 36.5dB 1, 0 Invalid
1, 1 40dB 1, 1 Invalid
Table 8. CW Coding for Each Channel
CW CODINGNUMBER (MSB, LSB) CHANNEL DIRECTED TO:
0 0000 Output CW0
1 0001 Output CW1
2 0010 Output CW2
3 0011 Output CW3
4 0100 Output CW4
5 0101 Output CW5
6 0110 Output CW6
7 0111 Output CW7
8 1000 Output CW8
9 1001 Output CW9
10 1010 Channel tied to +V (internal)
11 1011 Channel tied to +V (internal)
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VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
Table 8. CW Coding for Each Channel (continued)
CW CODINGNUMBER (MSB, LSB) CHANNEL DIRECTED TO:
12 1100 Channel tied to +V (internal)
13 1101 Channel tied to +V (internal)
14 1110 Channel tied to +V (internal)
15 1111 Channel tied to +V (internal)
Applies to bytes 2 through 5.
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WRITE/READ TIMING
CS
CLK
DIN LSB 1 2 3 4 5 6 MSB
t4 t7
t5 t6 t1
t2 t3
NOTE: It is highly recommended that the clock be turned off after the required data has been programmed into the VCA8613.
SERIAL PORT TIMING TABLE
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
Generally follows SPI Timing Specification:• All writes and reads will be 5 bytes at a time. Each byte consists of 8 bits;• Separate write and read data lines;• Reads will follow the same bit stream pattern seen in the write cycle;• Reads will extract data from the FIFO, not the latched register;• DOUT data is continuously available and need not be enabled with a read cycle. Selecting a read cycle in the
control register only prevents latching of data. The control register is still latched.
Chip Select (CS) must be held low (active LOW) during transfer. CS can be held permanently low.
PARAMETER DESCRIPTION MIN TYP MAX UNITS
t1 Serial CLK Period 40 ns
t2 Serial CLK HIGH Time 20 ns
t3 Serial CLK LOW Time 20 ns
t4 CS Falling Edge to Serial CLK Falling Edge 10 ns
t5 Data Setup Time 5 ns
t6 Data Hold Time 5 ns
t7 Serial CLK Falling Edge to CS Rising Edge 10 ns
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TYPICAL CHARACTERISTICS
60
55
50
45
40
35
30
25
20
15
10
5
0
VCNTRL (V)
Ga
in(d
B)
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7
ATN = 01
ATN = 00
ATN = 10
ATN = 11
55
50
45
40
35
30
25
20
15
10
5
0
VCNTRL (V)
Ga
in(d
B)
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7
ATN = 01
ATN = 00
ATN = 10
ATN = 11
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
VCNTRL (V)
Gai
nE
rror
(dB
)
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7
ATN = 01
ATN = 00
ATN = 10
ATN = 11
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
VCNTRL (V)
Gai
nE
rror
(dB
)
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7
ATN = 01
ATN = 00
ATN = 10
ATN = 11
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
VCNTRL (V)
Gai
nE
rro
r(d
B)
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7
10MHz
2MHz
5MHz
2.01.81.61.41.21.00.80.60.40.2
0−0.2−0.4−0.6−0.8−1.0−1.2−1.4−1.6−1.8−2.0
VCNTRL (V)
Gai
n(d
B)
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7
−40C
+85C
+25C
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
At TA = +25°C, fIN = 2MHz, ATN = 01, PG = 00, VCNTRL = 1.7V; differential output, 750mVPP, and AVDD = DVDD = 3.0V, unlessotherwise noted.
GAIN vs VCNTRL GAIN vs VCNTRL(PG = 00) (PG = 01)
GAIN ERROR vs VCNTRL GAIN ERROR vs VCNTRL(PG = 00) (PG = 01)
GAIN ERROR vs VCNTRL GAIN ERROR vs VCNTRLvs TEMPERATURE
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210
205
200
195
190
185
180
Temperature (C)
Su
pply
Cu
rre
nt(m
A)
−40 −20 0 20 40 60 80
100
90
80
70
60
50
40
30
20
10
0
Delta Gain (dB)
Un
its
− 1.1
9− 1
.09
− 0.9
9− 0
.88
− 0.7
8− 0
.68
− 0.5
8− 0
.47
− 0.3
7− 0
.27
− 0.1
6− 0
.06
0.0
40.
15
0.2
50.
35
0.4
60.
56
0.6
60.
77
0.8
70.
97
1.0
81.
18
1.2
8
1600
1400
1200
1000
800
600
400
200
0
Transconductance (mA/V)
Un
its
11.0
111
.08
11.1
611
.23
11.3
111
.38
11.4
611
.53
11.6
111
.68
11.7
611
.83
11.9
111
.98
12.0
612
.13
12.2
012
.28
12.3
512
.50
100
90
80
70
60
50
40
30
20
10
0
Delta Gain (dB)
Un
its
− 0.9
8− 0
.89
− 0.8
1− 0
.72
− 0.6
4− 0
.55
− 0.4
7− 0
.39
− 0.3
0− 0
.22
− 0.1
3− 0
.05
0.0
40.
12
0.2
00.
29
0.3
70.
46
0.5
40.
63
0.7
10.
79
0.8
80.
96
1.0
5
50454035302520151050
−5−10−15
Frequency (MHz)
0.1 1 10 100
Ga
in(d
B) PG = 01
PG = 00
55
50
45
40
35
30
25
20
Frequency (MHz)
0.1 1 10 100
Ga
in(d
B)
PG = 01
PG = 00
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, fIN = 2MHz, ATN = 01, PG = 00, VCNTRL = 1.7V; differential output, 750mVPP, and AVDD = DVDD = 3.0V, unlessotherwise noted.
SUPPLY CURRENT (TGC MODE) vs TEMPERATURE GAIN MATCH(VCNTRL = 0.2V)
GAIN MATCH CW ACCURACY(VCNTRL = 1.7V)
GAIN vs FREQUENCY GAIN vs FREQUENCY(ATN = 00, VCNTRL = 0.2V) (ATN = 00, VCNTRL = 1.7V)
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600
500
400
300
200
100
0
VCNTRL (V)
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Noi
se(n
V/√
Hz)
PG = 01
PG = 00
600
500
400
300
200
100
0
VCNTRL (V)
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Noi
se(n
V/√
Hz)
PG = 01
PG = 00
14
12
10
8
6
4
2
0
VCNTRL (V)
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Noi
se(n
V/√
Hz)
PG = 01
PG = 00
14
12
10
8
6
4
2
0
VCNTRL (V)
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Noi
se(n
V/√
Hz)
PG = 01
PG = 00
45
42
39
36
33
30
27
24
21
18
15
VCNTRL (V)
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Noi
seF
igur
e(d
B)
PG = 01
PG = 00
45
42
39
36
33
30
27
24
21
18
15
VCNTRL (V)
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Noi
seF
igur
e(d
B)
PG = 01
PG = 00
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, fIN = 2MHz, ATN = 01, PG = 00, VCNTRL = 1.7V; differential output, 750mVPP, and AVDD = DVDD = 3.0V, unlessotherwise noted.
OUTPUT-REFERRED NOISE vs VCNTRL OUTPUT-REFERRED NOISE vs VCNTRL(ATN = 00, fIN = 2MHz) (ATN = 00, fIN = 5MHz)
INPUT-REFERRED NOISE vs VCNTRL INPUT-REFERRED NOISE vs VCNTRL(ATN = 00, fIN = 2MHz) (ATN = 00, fIN = 5MHz)
NOISE FIGURE vs VCNTRL NOISE FIGURE vs VCNTRL(ATN = 00, fIN = 2MHz) (ATN = 00, fIN = 5MHz)
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3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
Frequency (MHz)
1 10
Noi
se(n
V/√
Hz)
−30
−35
−40
−45
−50
−55
−60
−65
−70
−75
−80
Frequency (MHz)
1 10
Dis
tort
ion
(dB
)
2nd−Harmonic
3rd−Harmonic
−30
−35
−40
−45
−50
−55
−60
−65
−70
−75
−80
Frequency (MHz)
1 10
Dis
tort
ion
(dB
)
2nd−Harmonic
3rd−Harmonic
−30
−35
−40
−45
−50
−55
−60
−65
−70
−75
VCNTRL (V)
0.2 0.5 0.8 1.1 1.4 1.7 2.0
Dis
tort
ion
(dB
)
2nd−Harmonic
3rd−Harmonic
−30
−35
−40
−45
−50
−55
−60
−65
−70
−75
−80
VCNTRL (V)
0.2 0.5 0.8 1.1 1.4 1.7 2.0
Dis
tort
ion
(dB
)
2nd−Harmonic
3rd−Harmonic
Under this test condition, at the lowestcontrol voltage, the LNA is overloaded.
−30
−35
−40
−45
−50
−55
−60
−65
−70
−75
−80
VCNTRL (V)
Dis
tort
ion
(dB
)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
5MHz
10MHz
1MHz
2MHz
Under this test condition, at the lowestcontrol voltage, the LNA is overloaded.
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, fIN = 2MHz, ATN = 01, PG = 00, VCNTRL = 1.7V; differential output, 750mVPP, and AVDD = DVDD = 3.0V, unlessotherwise noted.
INPUT-REFERRED NOISE DISTORTION vs FREQUENCY(CW Output) (ATN = 00, PG = 00, VCNTRL = 2.0V)
DISTORTION vs FREQUENCY DISTORTION vs VCNTRL(ATN = 00, PG = 01, VCNTL = 2.0V) (ATN = 00, PG = 01, fIN = 2MHz, 750mVPP)
DISTORTION vs VCNTRL DISTORTION vs VCNTRL(ATN = 01, PG = 01, fIN = 2MHz, 750mVPP) (ATN = 00, PG = 00, 500mVPP, 2nd-Harmonic)
12
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−30
−35
−40
−45
−50
−55
−60
−65
−70
−75
−80
VCNTRL (V)
Dis
tort
ion
(dB
)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
10MHz 5MHz
1MHz
2MHz
−30
−35
−40
−45
−50
−55
−60
−65
−70
−75
−80
VCNTRL (V)
Dis
tort
ion
(dB
)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
5MHz
10MHz
1MHz
2MHz
−30
−35
−40
−45
−50
−55
−60
−65
−70
−75
−80
VCNTRL (V)
Dis
tort
ion
(dB
)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
5MHz
10MHz
1MHz
2MHz
−30
−35
−40
−45
−50
−55
−60
−65
−70
VCNTRL (V)
Cro
ssta
lk(d
B)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
PG = 00
PG = 01
−30
−35
−40
−45
−50
−55
−60
−65
−70
VCNTRL (V)
Cro
ssta
lk(d
B)
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
PG = 00
PG = 01
−30
−35
−40
−45
−50
−55
−60
−65
−70
VCNTRL (V)
Cro
ssta
lk(d
B)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
PG = 00
PG = 01
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, fIN = 2MHz, ATN = 01, PG = 00, VCNTRL = 1.7V; differential output, 750mVPP, and AVDD = DVDD = 3.0V, unlessotherwise noted.
DISTORTION vs VCNTRL DISTORTION vs VCNTRL(ATN = 00, PG = 01, 500mVPP, 2nd-Harmonic) (ATN = 00, PG = 00, 500mVPP, 3rd-Harmonic)
DISTORTION vs VCNTRL CROSSTALK vs VCNTRL(ATN = 00, PG = 01, 500mVPP, 3rd-Harmonic) (ATN = 00, fIN = 2MHz, CH4 to CH5)
CROSSTALK vs VCNTRL CROSSTALK vs VCNTRL(ATN = 00, fIN = 5MHz, CH4 to CH5) (ATN = 00, fIN = 10MHz, CH4 to CH5)
13
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Time (400ns/div)
The signal is greater than 2VPP input, so the LNA isseverely overloaded. Overload recovery time is 192ns.
Channel 1(Output)(2V/div)
Channel 2(Input)
(1V/div)
Time (400ns/div)
The signal is greater than 40mVPP
input, so the LNA is in the linear region
and the output amplifier is overloaded. Overload recovery time is 584ns.
Channel 1(Output)(2V/div)
Channel 2(Input)
(20mV/div)
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, fIN = 2MHz, ATN = 01, PG = 00, VCNTRL = 1.7V; differential output, 750mVPP, and AVDD = DVDD = 3.0V, unlessotherwise noted.
OVERLOAD RECOVERY vs TIME OVERLOAD RECOVERY vs TIME(ATN = 00, PG = 00, VCNTRL = 1V) (ATN = 00, PG = 01, VCNTRL = 2V)
14
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APPLICATION INFORMATION
INPUT CIRCUIT CW DOPPLER PROCESSOR
LOW-NOISE PRE-AMPLIFIER (LNA)
LNAInput Buffer
VCM = +1.5VVLNACM = 2.4V
CW Output
+1.5VDC
700Ω
ControlLogic
Cross−PointSwitch
V/I Stage
I = 2mAto 2.5mA
VCA8613
4.5kΩ
(18.5dB Gain
in CW−mode)
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
The input of the VCA8613 integrates several The VCA8613 integrates many of the elementscommonly used elements. Prior to reaching the input necessary to allow for the implementation of a simpleof the VCA, the receive signal should be coupled with CW Doppler processing circuit. One circuit that wasa capacitor of at least 1nF, preferably more. When integrated was a V/I converter following the LNA (seethis AC coupling element is inserted, the LNA input Figure 1). The V/I converter converts the LNA voltagebias point is held to a common-mode value of 2.4V output to a current which is then passed through anby an integrated 4.5kΩ resistor. This common-mode 8x10 switch matrix (see Figure 2). Within this switchvalue will change with temperature and may also vary matrix, any of the eight LNA outputs can befrom chip to chip, but for each chip, it will be held connected to any of ten CW output pins. This is aconstant. In parallel with this resistor are two simple current-summing circuit such that each CWback-to-back clipping diodes. These diodes prevent output can represent the sum of any or all theexcessive input voltages from passing through to the channel currents. The output current for each LNA isLNA input, preventing deep saturation effects in the equal to the single-ended LNA output voltage swingLNA itself. divided by an internally integrated 700Ω resistor. This
resistor value may change ±5% from chip to chip.
The CW output pins need a compliance voltagebetween 3V to 3.3V. The 3V to 3.3V can be appliedThe VCA8613 integrates a low-noise pre-amplifier.through either an inductor (see Figure 3) tied to theBecause of the high level of integration in the system,3V to 3.3V source or from the inverting input of an opnoise performance was traded for poweramp circuit (see Figure 4). The architecture of the V/Iconsumption, resulting in an extremely low-powerconverter requires a 2mA to 2.5mA current that ispre-amplifier, with 1.2nV/√Hz noise performance atgenerated by the compliance voltage.5MHz. The LNA is configured as a fixed-gain 24.5dB
amplifier. Of this total gain, 6dB results from the The CW outputs are typically routed to a passivesingle-ended to differential conversion accomplished delay line, allowing coherent summing of the signals.within the LNA itself. The output of the LNA is limited After summing, IQ separation and down conversion toto approximately 2VPP differential swing. This implies base-band precedes a pair of high-resolution, lowa maximum input voltage swing of approximately sample rate ADCs.110mV to be operating in the linear range at 5MHz.Larger input signals can be accepted by the LNA, butdistortion performance will degrade with high-levelinput signals.
Figure 1. Basic CW Processing Block Diagram
15
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Channel 1Input
V/IConverter
SDI
CW0
CW1
CW2CW3
CW4
CW5CW6
CW7
CW8
CW9
+V
SDO
CLK
DecodeLogic
Channel 8Input
V/IConverter
SDI
SDO
DecodeLogic
CW Output
3V to 3.3V
I = 2mA to 2.5mA
To CW Circuitry
VCA8613
3V to 3.3V
3V to 3.3V
I = 2mAto 2.5mA
To CW CircuitryR
OPA
CW Output
VCA8613
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
Figure 2. Basic CW Cross-Point Switch Matrix for All Eight Channels
Figure 3. Inductor Figure 4. Operational Amplifier
16
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VOLTAGE-CONTROLLED ATTENUATOR
PGA POST-AMPLIFIER
RS
Q1A
A0
VCM
INPUTOUTPUT
A1
Q1B Q2A Q2B Q3A Q3B Q4A Q4B Q5A Q5B
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
sub-elements for each of the Q1 to Q10 FET shunt(VCA)—DETAIL elements (see Figure 6). In the simplified diagram of
Figure 5, each shunt FET is shown as twoThe VCA is designed to have a dB-linear attenuation sub-elements, QNA and QNB. Selector switches,characteristic; that is, the gain loss in dB is constant controlled through the attenuator control bits (ATNfor each equal increment of the VCNTRL control [A1:A0]), activate either or both of the sub-elementvoltage. Figure 5 shows a block diagram of the VCA. FETs to adjust the maximum RON and thus achieveThe attenuator is essentially a variable voltage divider the stepped attenuation options.consisting of one series input resistor, RS, and tenidentical shunt FETs, placed in parallel and controlled The input impedance of the VCA section will vary withby sequentially-activated clipping amplifiers. Each gain setting, due to the changing resistances of theclipping amplifier can be thought of as a specialized programmable voltage divider structure. At largevoltage comparator with a soft transfer characteristic attenuation factors (that is, low gain settings), theand well-controlled output limit voltages. The impedance will approach the series resistor value ofreference voltages V1 through V10 are equally approximately 120Ω.spaced over the 0V to 2.0V control voltage range. As
As with the LNA stage, the VCA output is AC-coupledthe control voltage rises through the input range ofinto the PGA. This means that theeach clipping amplifier, the amplifier output will riseattenuation-dependent DC common-mode voltage willfrom 0V (FET completely ON) to VCM– VT (FET nearlynot propagate into the PGA, and so the PGA DCOFF), where VCM is the common source voltage andoutput level will remain constant.VT is the threshold voltage of the FET. As each FET
approaches its OFF state and the control voltage Finally, note that the VCNTRL input consists of FETcontinues to rise, the next clipping amplifier/FET gate inputs. This provides very high impedance andcombination takes over for the next portion of the ensures that multiple VCA8613 devices may bepiecewise-linear attenuation characteristic. Thus, low connected in parallel with no significant loadingcontrol voltages have most of the FETs turned ON, effects. The nominal voltage range for the VCNTRLwhile high control voltages have most turned OFF. input spans from 0V to 2.0V. Overdriving this input (>Each FET acts to decrease the shunt resistance of 3V) does not affect the performance; however, thethe voltage divider formed by RS and the parallel FET Absolute Maximum ratings must be observed.network.
The attenuator is comprised of two sections, with fiveparallel clipping amplifier/FET combinations in each. Figure 7 shows a simplified circuit diagram of theSpecial reference circuitry is provided so that the PGA block. PGA gain is programmed through the(VCM– VT) limit voltage will track temperature and IC serial port, and can be configured to two differentprocess variations, minimizing the effects on the gain settings of 21dB and 26dB, as shown inattenuator control characteristic. Table 10. A patented circuit has been implemented in
the PGA that allows for fast overload signal recovery.In addition to the analog VCNTRL gain setting input, theattenuator architecture provides digitally-
Table 10. PGA Gain Settingsprogrammable adjustment in four steps, via the twoattenuation bits. These adjust the maximum PG1, PG0 GAINachievable gain (corresponding to minimum 0, 0 21attenuation in the VCA, with VCNTRL = 2.0V). This
0, 1 26function is accomplished by providing multiple FET
Figure 5. Programmable Attenuator Section
17
www.ti.com
RS
AttenuatorInput
AttenuatorOutput
A1−A10 Attenuator Stages
ControlInput
Q1VCM
0dB
− 4dB
Q2 Q3
C1
V1
Q4 Q5
QS
C1−C10 Clipping Amplifiers
Attenuation Characteristic of Individual FETs
Q6 Q7 Q8 Q9 Q10
C2
V2
VCM − VT
0
V1 V2 V3 V4 V5 V6 V7 V8 V9 V10
Characteristic of Attenuator Control Stage Output
Overall Control Characteristics of Attenuator
−40dB
0dB
0.2V 2.0VControl Signal (VCNTRL)
C3
V3
C4
V4
C5
V5
C6
V6
C7
V7
C8
V8
C9
V9
C10
V10
A1 A2 A3 A4 A5 A6 A7 A8 A9 A10
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
Figure 6. Piecewise Approximation to Logarithmic Control Characteristics
18
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1kΩ
1kΩ
2MΩ
2MΩ
80pF
80pF
OUT
VCM
VCM
Attenuator(VCA)
VCM
OUT
OUTPUT FILTER
LAYOUT CONSIDERATIONS
SERIAL INTERFACE
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
Figure 7. Simplified PGA and Output Filter Circuit
• Attenuation range• PGA gain• Power-down (this is the default state in which theThe VCA8613 integrates a 2-pole, low-pass
VCA8613 initializes)Butterworth filter in the output stage, as shown inFigure 7. The cutoff frequency is implemented with • CW output selection for each input channelpassive semiconductor elements and as such, the
The serial interface uses an SPI style of interfacecutoff frequency will not be precise. Table 11 showsformat. The Input Register Bit Maps (see page 5)the cutoff frequency for the different PGA settings.show the functionality of each control register.
The variation shown in Table 11 reflects deviations asmeasured from chip to chip and over the specifiedtemperature range.
The VCA8613 is a multi-channel amplifier capable ofhigh gains that has integrated digital controls. ByTable 11. Cutoff Frequency for PGA Settingsconnecting all of the grounds (including the digital
PG1, PG0 BANDWIDTH grounds) to the analog ground, noise performance0, 0 13MHz to 14MHz will help to be maintained. The analog ground should
be a solid plane.0, 1 11MHz to 12MHz
Power-supply decoupling and decoupling of thecontrol voltage (VCNTRL) pin are essential in order toensure that the noise performance be maintained. For
The serial interface of the VCA8613 allows flexibility further help in determining basic values, please referin the use of the part. The following parameters are to Figure 8.set from the serial control registers:• Mode
– TGC mode– CW mode
19
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DVDD
DVDD
DOUT
CLK
DIN
CS
DGND
DGND
IN8
IN7
IN6
IN5
IN4
IN3
IN2
IN1
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
VFIL
VLNA
CW0
CW2
CW4
CW6
CW8
CW9
CW7
CW5
CW3
CW1
OUT8
OUT8
OUT7
OUT7
OUT6
OUT6
OUT5
OUT5
OUT4
OUT4
OUT3
VCA8613
5
12
7
8
9
10
6
11
61
63
1
3
14
16
18
20
62
64
2
4
13
15
17
19
29
51
59
58
57
56
55
26
25
24
23
22
48
47
46
45
44
43
42
41
40
39
38
DOUT
+3V
CLK
DIN
CS
Input 8
Input 7
Input 6
Input 5
Input 4
Input 3
Input 2
Input 1
CW0
CW2
CW4
CW6
CW8
CW9
CW7
CW5
CW3
CW1
OUT8
OUT8
OUT7
OUT7
OUT6
OUT6
OUT5
OUT5
OUT4
OUT4
OUT3
2.2µF
0.1µF
2.2µF
0.1µF
+3V
0.1µF
2.2µF 0.1µF
VCNTRL
VC
NT
RL
52
VR
EF
49
AV
DD
28
AV
DD
21
AV
DD
60
AV
DD
53
VC
M30
VR
EF
B32
OU
T3
OU
T2
OU
T1
OU
T1
OU
T2
33 34 35 36 3727
31
50
54
AG
ND
AG
ND
AG
ND
AG
ND
(1) (1)
(1) (1) (1) (1) (1)(2) (2)
NOTES: (1) 0.1µF capacitors(2) 2.2µF capacitors
(1)
VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
Figure 8. Basic Connection Diagram
20
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VCA8613
SBOS200F–APRIL 2003–REVISED OCTOBER 2005
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from E Revision (May 2005) to F Revision ...................................................................................................... Page
• Changed to 14MHz from 12MHz ........................................................................................................................................... 3• Changed line position with 3rd-harmonic distortion. Added condition of VOUT = 500mVpp. Changed typ and max
values to -55dBc and -45dBc, respectively............................................................................................................................ 3• Changed line position with 2nd-harmonic distortion. Added condition of VOUT = 500mVpp. Changed typ and max
values to -50dBc and -40dBc, respectively............................................................................................................................ 3• Changed Specified Operating Range to Supply Voltage....................................................................................................... 3• Changed paragraph discussing attenuator architecture, digitally-programmable adjustments and maximum
achievable gain .................................................................................................................................................................... 17
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from D Revision (April 2005) to E Revision ..................................................................................................... Page
• Changed 8 to 5 bytes at a time. Added 'Each byte consists of 8 bits' at end of first bullet. .................................................. 8
21
PACKAGING INFORMATION
Orderable Device Status (1) PackageType
PackageDrawing
Pins PackageQty
Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
VCA8613YR ACTIVE TQFP PAG 64 1500 Green (RoHS &no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
VCA8613YT ACTIVE TQFP PAG 64 250 Green (RoHS &no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Apr-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device PackageType
PackageDrawing
Pins SPQ ReelDiameter
(mm)
ReelWidth
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1(mm)
W(mm)
Pin1Quadrant
VCA8613YR TQFP PAG 64 1500 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2
VCA8613YT TQFP PAG 64 250 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
VCA8613YR TQFP PAG 64 1500 346.0 346.0 41.0
VCA8613YT TQFP PAG 64 250 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PAG (S-PQFP-G64) PLASTIC QUAD FLATPACK
0,13 NOM
0,25
0,450,75
Seating Plane
0,05 MIN
4040282/C 11/96
Gage Plane
33
0,170,27
16
48
1
7,50 TYP
49
64
SQ
9,80
1,050,95
11,8012,20
1,20 MAX
10,20SQ
17
32
0,08
0,50 M0,08
0°–7°
NOTES: A. All linear dimensions are in millimeters.B. This drawing is subject to change without notice.C. Falls within JEDEC MS-026
IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. 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