3d sensor processing - ibl g. darbo – infn / genova venezia, 4 june 2009 o ibl per marzio g. darbo...
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3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 2009o
IBL per MarzioIBL per Marzio
G. Darbo - INFN / Genova
Agenda page:
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 20092
IBL OrganizationIBL OrganizationThe IBL (Insertable B-Layer) is an ATLAS Upgrade project:
• It will deliver a fourth pixel layer, including a new beam-pipe, to the Inner Detector
• When delivered, it will become a part of the Pixel Detector and of the Inner Detector and the organization will be “absorbed” into the Pixel & ID
Module WG
Module WG
IBL MB(Management Board)
IBL MB(Management Board)
StaveWG
StaveWG
I&IWGI&IWG
Off-detWG
Off-detWG
IBL IB(Institute Board)
IBL IB(Institute Board)
Pixel Institutesin IBL
Pixel Institutesin IBL
New Institute
sin IBL
New Institute
sin IBL
ATLASUPO ATLASUPO
ATLAS UPGRADE
IBL
IBL PLIBL TC
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 20093
Management Board (MB)Management Board (MB)
Module WG(2
coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation
Module WG(2
coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation
Stave WG(1 Phys + 1
Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC
Stave WG(1 Phys + 1
Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC
IBL Integr.-Install.(2 Eng.)
•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC
IBL Integr.-Install.(2 Eng.)
•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC
Off-detector(1 Phys + 1 E.Eng.)
•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test
Off-detector(1 Phys + 1 E.Eng.)
•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test
IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members
IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members
Ad-interim membershipIBL Project Leader: G. DarboIBL Technical Coordinator: H. Pernegger“Module” WG (2 Physicists): F. Hügging & M. Garcia-Sciveres“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni“IBL Assembly & Installation” WG (2 M.E. initially, a Phy. Later): N. Hartman + R. Vuillermet“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux“Extra” members:Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling)Offline “liaison” Pixel Off-line coordinator: A. AndreazzaTDR editor (temporary): K. Einsweiler
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 20094
Ref: N. Hartman:•http://indico.cern.ch/conferenceDisplay.py?confId=43496
Single Stave LayoutsSingle Stave Layouts
Several layouts under study: 14 staves at Rmin=~3.2 cm
Turbine Inverted
Rail Space
Sensor
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 20095
Ref: N. Hartman:•http://indico.cern.ch/conferenceDisplay.py?confId=43496
BiStave LayoutsBiStave LayoutsBiStave LayoutsBiStave Layouts
Biturbine Castellated
Sensor
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 20096
Frontend Chip - FE-I4Frontend Chip - FE-I4FE-I4 Status
• Prototype blocks in MPW (MOSIS) submitted 3/2008, measurements, irradiation
• Design review (3/2009): “Design Technical Issues” on full scale design• FE-I4 Collaboration meeting 1/7/2009• Foreseen complete design review after Summer and submission later
this year.
7.6mm
8mm active
2.8mm
FE-I374%
active 16.8mm
20.2mm
~2mm
~200μm
FE-I4~89%
Chartered reticule (24 x 32)
IBM reticule
~19 mm
New FE-I4
Pixel size = 250 x 50 µm2
Pixels = 80 x 336Technology = 0.13µmPower = 0.5 W/cm2
FE-I3
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 20097
FE-I4 Review & CollaborationFE-I4 Review & Collaboration
FE-I4 – “Design Technical Issue” Review March 2nd , 2009 - Review agenda page:http://indico.cern.ch/conferenceDisplay.py?confId=52403
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 20098
Modules & Stave ArrangementModules & Stave ArrangementTwo module options:
• Single chip modules abut one against the next
• Small sensor type: like 3D, active edge
• Multi chip modules: chip look the same if using multi-chip modules
• As present sensor size (~2xFE-I4) : like planar n-on-n
• assuming no Z-shingling, no space.
W-bond pads
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 20099
Requirements - FluenceRequirements - FluenceRequirements discussed in previous meetings
• New simulation of n fluences as input for the IBL design (see box)
• Other requirements are:• IBL design Peak Luminosity = 3x1034,
• Integrated Luminosity seen by IBL = 550 fb-1
€
Φ(r) =493
r2+
25
r
⎛
⎝ ⎜
⎞
⎠ ⎟×1014
• Fit made for 2 < r < 20 cm for L=1000fb-1
• Gives for IBL @ 3.7 cm (550 fb-1):
Φ1MeV=2.4x1015 (1.2 MGy)
• Safety factors not included in the computation (pp event generator: 30%, damage factor for 1 MeV fluences: 50%)Ref. Ian Dawson - AUW
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 200910
Sensors - Time lineSensors - Time lineIBL project started now:
• TDR March 2010 – sensor option not decided before
FE-I4.v1 prototyping• FE-I4.v1 submitted (earliest) 15/10/2009 – Wafer back 31/4/2010
• FE-I4.v1 prototype modules and testing – second half 2010
Sensor decision on FE-I3 and FE-I4.v1 prototypes• End of 2010
Sensor production and testing• 8 months production assumed. Testing could last 4 months after end
production.
• Production starts beginning 2011.
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 200911
How Many 3D Sensor WafersHow Many 3D Sensor WafersFor IBL we need:
• 14 staves (+6 spares)
• 32 FE-I4 (3D sensors)
• Total need = 640 single FE-I4 tiles = 54 Wafer
• If we consider yields:
• Sensor (0.5)
• Bump Bonding
• Module
• ~ 150÷200 wafer for whole IBL
4” Wafer – Fits 12 FE-I4
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 200912
Beam-pipe - LayoutBeam-pipe - LayoutBeam-pipe radius can be reduced by at least 4mm
• On-site survey has shown that cavern floor is stable (~1mm respect 9.8mm foreseen)
• See LEB (LHC Experimental Beam-pipes) WG – 5/3/2009:http://indico.cern.ch/conferenceDisplay.py?confId=53606
Smaller beam-pipe Layout options• Better physics performance obtained with “reverse turbine” layout -
sensor facing beam-pipe – cooling redundancy (two cooling pipes) for beam-pipe bake-out
1 mm
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 200913
Material BudgetMaterial BudgetPhysics performance low material budget
• Strategy for reducing X0: carbon foam, carbon fiber (CF) cooling pipe, CO2 cooling,…
Omega 0.00165Carbon foam 0.00179Epoxy 0.00030Sensor 0.00434R/O chips 0.00382Flex 0.00144Cooling pipe (Al) 0.00266Cooling fluid (C3F8) 0.00133
General total 0.01730
Total structure 0.00640Structure+cool. Fluid0.00773
Omega 0.00165Carbon foam 0.00179Epoxy 0.00030Sensor 0.00434R/O chips 0.00382Flex 0.00144Cooling pipe (CF) 0.00083Cooling fluid 0.00133
General total 0.01550
Total structure 0.00457Structure + cool. Fluid0.00590
X0 - Ti cooling pipe option
X0 - CF cooling pipe option
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 200914
Inner Tracker R&DInner Tracker R&DStatus – November 2008
Approved by Executive Board
EoI, Proposal presented to USG
Pixel
Strips
Inner Detector
3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 200915
Calorimeter, Muon & Other R&D
Calorimeter, Muon & Other R&D
Status – November 2008
Approved by Executive Board
EoI, Proposal presented to USG
Calorimeter
Muon
Trigger, Elec,
…