2004 multichannel integrated circuits for digital x-ray imaging with energy windowing krzysztof...
DESCRIPTION
2004 Introduction multichannel ASIC Input signals - small amplitude (Qin = 1400 el) - stochastic character (amplitude, time) SET OF SENSORS ( silicon strip detector) MULTICHANNEL INTEGRATED CIRCUITS (analogue & digital blocks) CROSSTALK digital analogue LIMITS: power & area LOW LEVEL OF NOISE UNIFORMITY OF PARAMETERS 6.5 mm RX64DTHTRANSCRIPT
2004
Multichannel integrated circuits
for digital X-ray imaging
with energy windowing
Krzysztof Świentek
Department of Nuclear Electronics FPNT, AGH Kraków
2004
• Introduction – multichannel ASICs • Noise in MOS transistors• Crosstalk in mixed–mode integrated circuits • Random matching• RX64DTH – digital imaging using silicon detectors• Measurements results – chip tutorial• Summary
Content
2004
Introduction multichannel ASIC
Input signals - small amplitude (Qin = 1400 el) - stochastic character (amplitude, time)
SET OF SENSORS ( silicon strip detector)
MULTICHANNEL INTEGRATED CIRCUITS (analogue & digital blocks)
CROSSTALKdigital analogue
LIMITS: power & area
LOW LEVELOF NOISE
UNIFORMITY OFPARAMETERS
6.5
mm
RX64DTH
2004
Noise in MOS transistors
mth kTg
dfdi
382
saturation
dsth kTg
dfdi 4
2
linear
Simulations (HSPICE) NLEV=3 GDSNIO
aaaVV
LWCkT
dfdi
TGSoxth
1
13
8 22
BSIM3v3 (NIMOD=2) inveff
effth QL
kTdfdi
2
2 4
1. Thermal noise of channel
Measurments – short channel effects (2-10x):( velocity saturation, hot electrons)
2. Flicker noise
Simulations (HSPICE)
NLEV=2, 3 AFeffeff
m
ox
f
fLWg
CKF
dfdi 122
/1
Measurments – short channel effects( hot electrons, RST noise)
BSIM3v3 (NIMOD=2)
2004
CROSSTALK
Transfer:– common supply lines: parasitic inductance and resistance (Vind=LdI/dt)– common substrate: (substrateepi, VT=f(VSB), gmb)
Effects for analogue blocks: switching noise, oscillation etc.
Minimisation:– reducing the noise generation,– increasing the immunity of analogue part,– isolation techniques.
GENERATIONTRANSFER EFFECT
DIGITALBLOCKS
ANALOGBLOCKS
SILICON SUBSTRATE
2004
RANDOM MATCHINGMATCHING - identically design devices have different parameters
P=P1-P2 (P/P)
222
2 DSWLAP P
P
For MOS transistors: VT0 , ,
ox
BFs
ox
oxFMST0 C
NqCQV
42
LWCox
ox
Bs
CNq
2
CMOS 0.7m - (VT0) NMOS PMOS
W/L=2m/0.7m 9.72 mV 19.43 mV
W/L=1500m/1.5m 0.31 mV 0.63 mV
L
W
L
W
D
Num
ber o
f cas
es
P/P [%]
2004
1. Matching bias condition differences: VT, , R VDD VDD
IBIAS
IREF
M1 M2
R1 R2
IN1 IN2
OUT1 OUT2
M0 M1 M2
IDS1 IDS2
a) b)
RRVVVV TGS
Tosr 2
4. Symmetry in layout– bias, temperature, orientation,
– common centroid geometry, unit cells,
– surrounding, metal coverage
TTGSDS
DS VVVI
I 2
2. Reduce sensitivity - proper configuration (Kv Ci/Cj)
3. Monte-Carlo analysis using HSPICE (matching data for given technology)
a)
b)
2004
data, control
Silicon strip detector Integrated circuit
PC computer
100 m
current pulses
X-rays
Signal 10x smaller
Stochastic
High Energy Physics
Key system issues:– fully parallel signal processing for all channels.– only binary information (yes/no) is extracted from each strip.– data from each channel must be stored in the local buffer for
the whole measurement period.
X-ray imaging using silicon strip detectors
2004
RX64DTH - fully integrated 64-channel chip (CMOS 0.8 m process)
RX64DTH consists of:– 64 front-end channels (preamplifier, shaper, two discriminators)– 128 pseudo-random counters (20-bit)– internal DACs: two 8-bit threshold setting and and three 5-bit for
bias– internal calibration circuit (square wave 1mV-30 mV)– control logic– I/O circuit (interface to external bus)
37006500 m2
2004
Single analogue channel
Key design issues:– low noise (ENC 200 el. rms, sensor )– low power (3-5 mW/channel)– relatively fast shaping (Tp = 0.5 1s) – uniformity from channel to channel (gain, offset, noise)– immunity to switching noise
0
1
t
V
t
V
PreamplifierShaper
Discriminators
C2 C5
C3t
V
Tp
VT-HIGH
VT-LOW
0
2004
Preamplifier & shaper
piinvfp
inv TcFCbFTCFaENC 2
2
fLWCK
gkT
dfdv
ox
f
m
n 11138
112
1
2
fedbiasDET
n
RkT
RkTqI
dfdi 442
2
1. POWER
2. PEAKING TIME
3. SENSOR
4. PSRR, stability, matching.
LIMITATIONS
SENSOR:Cdet
Idet
Rbias
t
V
Tp
Minimum of noise (transistor dimensions, bias)
cdfdi
fba
dfdv
n
n
2
2
Hand calculation SimulationHSPICE
Other transistors
Measurements(bias, temp., Tp)
M1: 500/1 M5: 2/120 M4: 100/10 Id = 500 A
t
V
DAC currents – IFED– IFEDSH – ICAS
2004
ENC versus Peaking Time
ENC – total noise
ENCW – white voltage noise
ENCf – 1/f voltage noise
ENCi – white current noise
t
V
TpNoise types
TP [s]
Peaking time TP
• Optimal the lowest noise
• Fast Front-end increasing noise
2004
Discriminator – offsets, crosstalk
• AC coupling
• differential stage (CMRR)
• hysteresis
• power supply lines, guard rings
0
1
t
V
Tp
VT-HIGH
VT-LOW
0
1
2004
Pseudo-random counters
– 20 bit counters (large dynamic range of the image)
– small layout area (only 8 transistor per bit)
– 128 counters are grouped in the 8 blocks of 16 counters each (8 bit I/O bus to minimize the dead time)
2004
I/O circuits:• LVDS standard (command, clock)
• 8-bit data bus (tristate),
• 3-bit address (up to 8 chips)
Functionality & testability
Calibration circuits: Qinj=CtVcal (500 el - 13000 el)
Internal DACs: threshold setting, gain, peaking time
2 x threshold 8-bit 3 x bias 5-bit1 x calibration 4-bit
6 dacs
Command code Action000 SetGateStatus
001 ReadoutDestructive
010 ReadoutNonDestructive
011 CalibrationPulseLong
100 CalibrationPulseShort
101 CounterPulse
110 LoadDac
111 Unused code
2004
LAYOUT - floor plan, bias lines, pads
Isolation techniques – reduce inductance (separate bias line,pads),– floor plan, bias lines – keep “clean” substrate – LVDS– RC filters– guard rings, shielding
109
Floor plan– preamplifier & shaper– discriminators– counters & IOs– digital outputs– control logic– calibration– bias DACs
2
3
4
5
6
7
Digitalguard ring
Digitalground
Analogguard ring
Analogground
Middlering
11 14
1312
8
2004
0 50 100 150 200 250
0
5
10
15
20
Diff
eren
ce [L
SB
]
Diff
eren
ce [m
V]
Dac value [LSB]
0
1
2
3
4
5
6
Diff
eren
ce [m
V]
Diff
eren
ce [L
SB]
Dac value [LSB]Silicon:
3,67eV/el
Window – threshold DAC’s
0 50 100 150 200 250
0
100
200
300
400
500
600
700
800
Vol
tage
[mV
]
Dac value [LSB]
-0,5
-0,4
-0,3
-0,2
-0,1
0,0
0,1
0,2
0,3
0,4
0,5
Err
or [L
SB
]
Dac value [LSB]
– two independent DACs
– common centroid matrix
– mixed matrices
– matching problem
– need software correction
Difference betweenDAC HIGH and LOW
7 LSB
2004
IFED[LSB]
IFEDSH
[LSB]
ICAS[LSB]
Temp. Gain[V/el]
()
Offset[mV]()
ENC[el. rms]8 keV
ENC[el. rms]20 keV
ENC[el. rms]Cal 10
32 32 32 room 57.63(0.34)
-9.23(1.91)
248(6.1)
232(7.7)
232(24)
32 32 32 room 56.79(0.34)
-11.84(1.91)
251(6.1)
234(8.5)
32 32 40 room 219(24)
32 32 48 room 56.30(0.37)
-11.50(1.96)
233(7.5)
217(7.3)
213(15)
32 32 56 room 203(13)
32 32 56 25° 191
32 32 63 25° 185
32 32 63 20° 175
32 32 63 18° 163
Noise versus ICAS & Temp
Source Pu238 + Cu
Vdet = 130 V
Vdd = 4.0 V
Vddd = 4.0 V
Peltier element for temp.
ControledTemp.
VTH = 255VTL = scan
VTH = scanVTL = 255
2004
IFED[LSB]
IFEDSH[LSB]
ICAS[LSB]
Temp. Gain[V/el]
()
Offset[mV]()
ENC[el. rms]8 keV
ENC[el. rms]20 keV
24 32 63 20° 54.86(0.39)
-17.62(1.33)
198.9(5.1)
205.9(16.7)
32 32 63 20° 54.85(0.44)
-17.85(1.09)
203.1(6.6)
201.5(8.22)
40 32 63 20° 54.86(0.45)
-17.55(1.26)
220.7(8.5)
213.7(9.47)
48 32 63 20° 54.84(0.49)
-16.96(1.30)
238.2(9.2)
228.6(9.46)
Noise versus IFED
– gain & offset const
– window is 5 LSB
– Peltier element
pin-holes in detector leakeage current
fastnoiseincreasing }
dead channels becauseout of operating point
rescueincrease IFED but ...
2004
Simulation: TP & Gain as a function of IFEDSH
shaper output
TP
Impu
lse
heig
ht
• TP = 0.7 – 1 s• Impulse fall ends 4 s 200 kHz
2004
IFED[LSB]
IFEDSH[LSB]
ICAS[LSB]
Temp. Gain[V/el]
()
Offset[mV]()
ENC[el. rms]20 keV
32 16 63 20° 80.54(0.57)
-0.8(0.9)
177.5(4.91)
32 24 63 20° 63.74(0.52)
-11.68(1.11)
197.6(8.69)
32 32 63 20° 54.85(0.44)
-17.85(1.09)
201.5(8.22)
32 40 63 20° 50.2(0.36)
-20.59(1.24)
206.5(9.42)
32 48 63 20° 47.64(0.35)
-21.67(1.39)
209.9(8.92)
32 63 63 20° 45.52(0.32)
-22.82(1.22)
210.7(9.36)
Gain, Offset & Noise versus IFEDSH
– window is 5 LSB
– Peltier element
min (fast)
max (slow)
TP
peakingtime
2004
1. Multichannel mix-mode ASIC :— critical parameters connected together— looking for a golden solution
2. Software corrections : — DACs problem — differences between the chips
3. Noise controling :IFED – better detector lower noiseICAS – the highier the beter (cooling ?) IFEDSH – high gain gives low noise and speed
4. To do – measurements— speed— uniformity in 6-chip module
Summary