11022 transcutaneous signal transmission for lvad october 8, 2010 yevgeniy popovskiy, vince...
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11022 Transcutaneous Signal Transmission for LVAD
October 8 , 2010Yevgeniy Popovskiy, Vince Antonicelli, Craig
LaMendola , Chrystal Andreozzi
Project Background Project Scope and Objective Project Schedule Customer Requirements Engineering specifications Work Breakdown System Concept Generation, Scoring and Selection
Case Insulation/ wire Electrical System
Risks Assessment Project Budget Next Steps Questions and discussion
System Level Design Review Agenda
The primary objective of this project is to design a transmission system to safely and affectively transfer power and control signal from the external power supply and control to the Left Ventricular Assist Device(LVAD).
Project Background
MSD I Objectives
Concept Generation and Selection
Detailed Design Ready for
Construction Deliverables
Finalizes design Order parts Finalize Test
specification
Project Objectives
MSD II Objectives
Assumable system Troubleshoot design Testing equipment
Deliverables Working System Test data to support
design
Senior Design I Schedule
System
Signal Transmission
Vince Antonicelli
Design Electrical Hardware
Debug
Yevgeniy Popovskiy
Program Chip
Debug
Case, Packaging,
Material
Craig LaMendola
Case
Material
Dimensions and Design
Wire Port Seal
Material
Products
Chrystal Andreozzi
Insulation
Heat sink
Material
Wire
Flexibility
Material
Work Breakdown
The device must be reliable (Must produce a continuous power and control signs)
The number of wires needs to be reduced The cable diameter needs to be reduced The cable needs to be more flexible Meet FDA standards or be able to be
modified to meet FDA standards
Customer Needs
THE SYSTEM NEEDS TO WORK!!!!
Reliable Operation 6 hours Cable Size ~3mm Improve Cable Flexibility 200% Internal/ External Volume 450 cm3
Eternal Weight 0.9 kg Cost below $3500
Engineering Specification
System Overview
Outer ProtectionProtective outer layers
Wire port sealingMaterial/product Benefits Possible Risks
Sealcon Cord GripsWith/without strain relief
RemovableAdjustable
Proven to workBulky size
Heat shrink bootPermanent InstallationLong lead time
On failed 10022
Adhesive heat shrink Proven to work Less robust
Material/product Benefits Possible Risks
Locktite 5248 Biocompatible On failed 10022
Master Bond JacketBiocompatible
Encapsulates componentsMore Robust
1st Line of
Defense
Sealing MethodsTypes of O-rings
O-ring grooves
Material/product Benefits Possible Risks
Parker O-ring no break or seam Case designed for available O-ring
PAI X-ring double seal unreliable when bent
O-ring cord Custom sizing Break or Seam On failed 10022
Install method Benefits Possible Risks
Square groove O-ring unsecured
Dove tail groove Secure install
2nd Line of
Defense
Protective CaseCase Structural material
Material/product Benefits Possible Risks
Titanium BiocompatibleElectrical shielding
Stainless Steel BiocompatibleElectrical shielding
May corrode
Aluminum Electrical shieldingLeast robust metal
May corrode
ABS plastic printing Made at RIT On failed 10022Not water tight
Product Cost ($) Reliability
Availability
Bio-compatible
Key Risk associated with selection process
Selected Design
Outer Layer
of Protect
ion
Locktite 5248 In Lab 3 5 5 Failed last team
Master Bond Jacket$650-$800
4 3 5 ?
Wire Port
sealing
Sealcon cord grip $4/$14 each
5 3 1 Bulky size
Heat shrink boot $10 each 4 1 1 Permanent installation
Adhesive heat shrink$15/ In Lab
4 3/5 1 Durability
O-ringsParker O-ring $13 5 3 1
Design case for O-ring sizes
PAI X-ring$0 Sample
3 2 1 Unreliable when bent
O-ring cord $2 3 3 1 Has seam
O-Ring Groove
Square groove Included 4 3 - Less secure installation
Dove tail groove (AL/SS/Ti)
+65/100/150
5 1 -Expense/ production time
Structural
Material
Titanium $470 5 1 5Expense/ production time
Stainless Steel $420 5 2 5Expense/ production time
Aluminum $300 4 3 1 Least robust metal
ABS plastic printing $200 2 4 1 No shielding/ Porous
Case Concept Selection
Insulation.
Heatsink paste/grease Pasted applied directly to
component
Heatsink Pad Remain sold at room
temperature and then soften at heatsink operating temperature
Electrical Potting Epoxy
Stable material (hard) Resistance to temp. up to 200 oC Very good resistance to chemicals Cracks easily
Insulation Cont.
Wire Types Calmont Wire and Cable Stranded Single-Conductor (P10022) Thoratec Corporation (HeartMate II)
Wire
Insulation and Wire Concept Selection
Cost ($)
Flexibility
Reliability
Availability
Bio-compatible
Risk associated with selection
Selected Design
Insulation
(Heat sinks)
Heat Sink Pad <$20
n/a
2 5 No
Heat Sink Paste/ grease
<$5 n/a
4 5 No
Electrical Potting
$20-$50
n/a
5 5 No May break
Wire Calmont Wire and Cable
? 4 5 1 Yes Time(product is custom made)
Stranded Single-Conductor
<$5 1 3 5 yes Wire does not have max flexibility
System Overview
Transmit digital signal Wired Wireless Through power
Transmit analog signal Multiplex Convert to Digital Multiplex through power
Chip Technology Microcontroller FPGA
Clock Internal Wired
Protocol Use Existing Invent One
Major Electrical Choices
Current Layout Skin
Main
Controller+
A/D
+
Battery
Pump
Motor
Control
Linear Amplifier
BloodPump
SA
MCC
MCO
LADS LAOP
LAOG
MCP
SP
LAP
Senior Design P10021-P10022 Layout
MCP
Main
Controller+
A/D
+
Battery
Skin
SA
MCC MC
O
PADSPAOP
PAP+MCP+SP
SP
Motor
Control
SA
PWM
Gen.
BloodPump
PAP
PADS
MCC
NSD
Chip
+
Elect.
Chip
+
Elect.
Option 1
Main
Controller+
A/D
+
Battery
Pump
Motor
Control
Linear Amplifier
BloodPump
SA
MCC
MCO
LADS LAOP
LAOG
MCP
SP
LAP
SA Micro.
+
Elect.
Micro.
+
Elect.SP
Skin
NSD
SP
Option 1 DetailsS
ign
al
Wir
es
Do
ub
led
AW
G
Dia
me
ter
Am
ps
Re
du
ce t
o
Pw
r W
ire
s
Sig
na
ls W
ire
s
SP 2 36 0.3 0.12 2 0MCO 3 28 1 1 3 3LAOP 4 28 1 1 4 4LAOG 1 1 26 1 4 2 2NSD 0 36 0.3 0 1 0
12 9 3Signal
SATotal
Bandwidth kbs625625
Inside Body: Micro
Total Wires
Option 2
Main
Controller+
A/D
+
Battery
Skin
SA
SP
SA
NSD
Micro.
+
Elect.
Motor
Control
MCC
MCO
MCP
PAOP
LAP
PADS
BloodPump
Micro.
+
Elect.PADS
LAP
Linear
Amp.
Option 2 DetailsS
ign
al
Wir
es
Do
ub
led
AW
G
Dia
me
ter
Am
ps
Re
du
ce t
o
Pw
r W
ire
s
Sig
na
ls W
ire
s
LAP 3 1 26 1 5 4 4MCO 3 28 1 1 3 3NSD 0 36 0.3 0 2 0
9 7 2Signal
SAMCCTotal
Bandwidth kbs
Inside Body: Linear Amplifier + Micro
Total Wires
6257
632
Option 3
Main
Controller+
A/D
+
Battery
Skin
SA
SP
SA
NSD
Micro.
+
Elect.
Motor
Control
MCC
MCO
MCP
PAOP
PAP
PADS
BloodPump
Micro.
+
Elect.PADS
PAP
PWM
Gen.
Option 3 DetailsS
ign
al
Wir
es
Do
ub
led
AW
G
Dia
me
ter
Am
ps
Re
du
ce t
o
Pw
r W
ire
s
Sig
na
ls
Wir
es
PAP 2 2 26 1 5 4 4MCO 3 28 1 1 3 3NSD 0 36 0.3 0 2 0
9 7 2Signal
SAPADSTotal
62579
704
Inside Body: PWM Generator + Micro
Total WiresBandwidth kbs
Option 4
Main
Controller+
A/D
+
Battery
Linear Amplifier
LADS LAOP
LAOG
LAP
Skin
MCP
SA
MCC MC
O
SP
Motor
Control
SA
MCC
NSD
Micro.
+
Elect.
Micro.
+
Elect.BloodPump
MCP
Option 4 DetailsS
ign
al
Wir
es
Do
ub
led
AW
G
Dia
me
ter
Am
ps
Re
du
ce t
o
Pw
r W
ire
s
Sig
na
ls
Wir
es
MCO 3 28 1 1 3 3LAOP 4 28 1 4 4 4LAOG 1 1 26 1 4 2 2NSD 0 36 0.3 0 2 0
11 9 2Signal
SAPADSTotal
79
Total WiresBandwidth kbs
625
704
Inside Body: Motor Controler + Micro
Option 5
MCP
Main
Controller+
A/D
+
Battery
Skin
SA
MCC MC
O
LADSLAOP
PAP+MCP+SP
SP
Motor
Control
SA
Linear
Amp.
BloodPump
PAP
LADS
MCC
NSD
Micro.
+
Elect.
Micro.
+
Elect.
LAOG
Option 5 DetailsS
ign
al
Wir
es
Do
ub
led
AW
G
Dia
me
ter
Am
ps
Re
du
ce
to
Pw
r W
ire
s
Sig
na
ls
Wir
es
LAP 3 1 26 1 5 1 1NP 0 2 22 1.2 6 2 2
NSD 0 36 0.3 0 2 05 3 2
SignalSA
MCCLADSTotal
79711
Bandwidth kbs625
7
Inside Body: Linear Amp. + Motor Controler + Micro
Option 6
MCP
Main
Controller+
A/D
+
Battery
Skin
SA
MCC MC
O
PADSPAOP
PAP+MCP+SP
SP
Motor
Control
SA
PWM
Gen.
BloodPump
PAP
PADS
MCC
NSD
Micro.
+
Elect.
Micro.
+
Elect.
Option 6 DetailsS
ign
al
Wir
es
Do
ub
led
AW
G
Dia
me
ter
Am
ps
Re
du
ce t
o
Pw
r W
ire
s
Sig
na
ls
Wir
es
NP 0 2 22 1.2 6 2 2NSD 0 36 0.3 0 2 0
43 38.0519 4 2 2
SignalSA
MCCPADSTotal
Inside Body: PWM Generator + Motor Controller + Micro
779
711
Bandwidth kbs625
Design Evaluation
Wire count pwr / sig
AWG 36 28 26 22 36 28 26 22 36 28 26 22 36 28 26 22 36 28 26 22 36 28 26 22
Count 3 7 2 0 2 3 4 0 2 3 4 0 2 7 2 0 2 0 1 2 2 0 0 2Selection Criteria Weight Rating Score Rating Score Rating Score Rating Score Rating Score Rating Score
Cable is more Flex 9 2 18 3 27 3 27 2 18 6 54 8 72Eliminate as many wires
as poss 8 2 16 3 24 3 24 2 16 6 48 8 64Transmit power to
internal Compnents w/ less wires 9 2 18 5 45 5 45 2 18 7 63 7 63
Must work with current system 9 9 81 5 45 8 72 9 81 5 45 8 72
Heat produced by conponents 5 9 45 6 30 6 $ 30 7 35 3 15 3 15
Reliable 9 9 81 6 54 6 54 8 72 4 36 4 36Labor 9 8 72 5 45 6 54 6 54 2 18 2 18
Labor w/ Dr. Day Help 9 8 72 5 45 7 63 7 63 7 63 9 81Cost 3 8 24 6 18 6 18 6 18 5 15 5 15
Day to day EM Noise resistant 9 0 0 0 0 0 0
Total 355 288 324 312 294 355
Total w/ Dr. Day Help 355 288 333 321 339 418
2/2
Option 4 Option 5 Option 6
9/2 3/2
M/C Micro LIN M/C Micro PWM M/C Micro
Option 1 Option 2 Option 3
9/3 7/27/2
PWM MicroMicro LIN Micro
Notes NotesNotesNotesNotesNotes
Selected Design
Risk Assessment
Yevgeniy Popovskiy Select Chip Component Pricing
Vince Antonicelli Circuit Design Component Pricing
Craig LaMendola Determine Case Dimensions Create Case Drawings Material Selection with customer
Chrystal Andreozzi Identify Wire in the Cable Electrical Reliability Testing
Team Contact manufactures and get pricing Verify that different components will assumable
Next Steps
?