11 to: mouser electronics · 85℃, 85%rh, maximum voltage 135 1,000 h 0 pass high temp storage ......
TRANSCRIPT
Microdevices Operations Division http://www.epson.com
11th October, 2013
To: Mouser Electronics
Change Notice on Package Products
First of all we would like to take this opportunity to thank you for the excellent business
relationship between the two companies and we look forward to a successful on-going partnership
in future.
In this letter, we would like to inform Engineering change of small type QFP (Quad Flat
Package) products which are assembled at one of our subcontractors.
1. Description of Change
- Lead-frame, Mold compound material, Chip thickness
Please refer to attached sheets for detail.
2. Reason of Change
- Because of discontinuation of relevant lead-frame, our subcontractor needs to change lead
-frame supplier. In this opportunity, they proposed to apply standard condition to those
package products.
- We verified that their plan could achieve same quality level as for current parts.
3. Objective Products
Epson P/N: Please see attached list
Applicable packages are as follows;
P-LQFP048-0707-0.50 (QFP12-48Pin) P-TQFP048-0707-0.50 (TQFP12-48Pin)
P-LQFP100-1414-0.50 (QFP15-100Pin) P-TQFP100-1414-0.50 (TQFP15-100Pin)
P-LQFP128-1414-0.40 (QFP15-128Pin) *( ) Epson Package name
4. Implementation Schedule
- To start EC parts shipments in May 2014
- Depending on your order quantity and our inventory status, the concrete schedule will be
determined. It will be available at your sales contact.
5. Requests
In order to secure current lead-frame, please inform us your ordering plan through Apr.2014
by 24th Oct.2013.
If you have any questions or concerns, please also let us know by 24th Oct.2013.
Your understanding and cooperation will be highly appreciated.
Sincerely yours,
Tomomasa Sakashita
General Manager of IC sales department
Micro Devices Operations Division
SEIKO EPSON CORP.
Microdevices Operations Division http://www.epson.com
0106-0005-01(Rev.1.1)
Epson P/N PKG TYPE
S1D13503F01A200 P-LQFP100-1414-0.50 (QFP15-100Pin)
S1D13504F00A200 P-LQFP128-1414-0.40 (QFP15-128Pin)
S1D13517F00A100 P-LQFP128-1414-0.40 (QFP15-128Pin)
S1R72U06F12E100 P-LQFP048-0707-0.50 (QFP12-48Pin)
*( ) Epson Package name
Microdevices Operations Div. 15-1-2_E
Package Product
Production Condition Change
JEITA Package Name :P-LQFP128-1414-0.40
(Epson Package Name :QFP15-128)
Seiko Epson Corp.
Microdevices Operations Division
Page.2 Microdevices Operations Div. 15-1-2_E
Change Contents and Background
<Change contents>
Lead-frame, Mold compound material, IC chip thickness
<Background>
We have subcontracted assembly process of some products since 2003.
While the subcontractor has proceeded engineering changes, it had been
agreed that the changes would not applied to our existing products, but only
to new products, in consideration of long term relation ship.
However, it becomes unavoidable this time, because discontinuation of
relevant lead-frame was decided.
Through several discussion with subcontractor, we determined to accept their
proposal to apply their standard condition, in order to maintain stable supply
of applicable package products for long term.
Page.3 Microdevices Operations Div. 15-1-2_E
Description of Change
Current New Changing
point Reason
Lead-
frame Cu frame Cu frame
Maker
Discontinuation at current
supplier
Mold
compound
material
CEL9000series UL Flammability;
UL-94 V-0
Halogen free
EME-G600series UL Flammability:
UL-94 V-0
Halogen free
Maker/
Low
material
Apply standard mold
compound material and
process condition for new lead-
frame
IC chip
thickness 400μm 300μm
Thickness
Take standard thickness and
process condition for new lead-
frame at subcontractor
Page.4 Microdevices Operations Div. 15-1-2_E
Changing point /Anxious point Verification Results
Changing
point Anxious point Verification item Results Data
Lead-
frame Maker
Dimensions/Tolera
nce Dimensions data OK Page5,6
Lead strength Lead strength
test OK Page8
Solderability Solderbility test OK Page8
Mold
compound
material
Maker/
Low
material
Reliability Reliability test
OK
Page8
IC chip
thickness Thickness
IC Chip damage
due to stress from
IR reflow and field
condition
Analysis after
soldering heat-
resistance and
Temperature
cycle test
OK
Page9
Page.5 Microdevices Operations Div. 15-1-2_E
Comparison of each dimension before/ after the change
Package length, width:D, E
Overall length, width
:HD, HE
Co planarity:y
Seated height:AMAX
Stand-off height:A1
Package height:A2
Terminal pitch:e
Terminal width:b
Terminal thickness:c
Length of flat part
of terminal:L
Terminal length:L1
Angle of terminal
flat portions:θ
Measurement Result of External Dimension
Page.6 Microdevices Operations Div. 15-1-2_E
Item / Spec. Current New
Average Cpk Average Cpk
E 7±0.1 6.988 7.67 6.988 8.10
D 7±0.1 6.990 6.21 6.997 8.25
HE 9±0.4 9.003 14.12 9.004 12.14
HD 9±0.4 9.004 11.75 9.001 16.52
AMAX Max 1.7 1.520 8.05 1.557 9.91
A1 0.1 -0.08/+0.1 0.121 6.84 0.120 5.17
A2 1.4±0.1 1.406 5.73 1.405 7.88
e 0.5±0.08 0.502 9.77 0.501 18.82
b 0.13~0.27 0.224 4.09 0.226 4.63
c 0.09~0.2 0.160 3.51 0.162 2.34
θ 0~10° 3.6° 3.81 3.8° 5.60
L 0.3~0.7 0.554 8.20 0.552 6.63
L1 1±0.3 1.010 13.07 0.997 21.11
y Max 0.08 0.017 6.56 0.014 9.47
Unit(mm)
Judged no problem, because measurement data of each dimension shows over Cpk1.67.
Measurement Result of External Dimension
Page.7 Microdevices Operations Div. 15-1-2_E
Comparison of Appearance
Though external appearance is different at Index mark ( ),
there are no change of external dimension and its tolerance.
Appearance of current part and EC part is as follows;
Current New
Page.8 Microdevices Operations Div. 15-1-2_E
We judged that the Engineering change makes no problem, based on the test result performed in same condition as for current parts.
Reliability Test Results of EC parts
Test Items Test condition n Terms of Test Failure
count
Judgment
High Temp Bias Test 125℃, Maximum voltage 135 1,000 H 0 Pass
High Temp and
High Humidity Bias Test
85℃, 85%RH, Maximum voltage 135 1,000 H 0 Pass
High Temp storage
Test
Ta=150℃ 45 1,000 H 0 Pass
Temp cycle Test -65℃~150℃ each 10 minute 45 200 cyc. 0 Pass
Pressure cooker
Test
Ta=121℃, 100%RH 2.0E5 Pa 45 200 H 0 Pass
Reflow Test Moisture treatment Reflow 45 3 Times 0 Pass
lead strength (Pull) 2.5N, 10sec 22 1 Time 0 Pass
Lead strength
(Bending)
90°Bending 22 2 Times 0 Pass
Solderability1 Steam aging 4H→Solder dipping
245℃, 5sec
22 1 Time 0 Pass
Solderability2 150℃,16H →Solder dipping 245℃,
5sec
22 1 Time 0 Pass
Page.9 Microdevices Operations Div. 15-1-2_E
Purpose : Check IC chip damage by change of IC chip thickness
Product :Sampling per each Package type Evaluation condition:Pre-condition(Soldering Heat-resistance)
+Temperature Cycle Test -65℃~150℃ 500cyc. -> Decap Mold compound material ->Dipping in KOH
aqueous solution(10wt%)for 10min.-> Chip visual inspection
Result : No damage remarked on IC after Stress test
<sample photo>
No damage to Passivation
and Al-interconnection
Analysis after Soldering Heat-resistance and Temperature Cycle Test
Page.10 Microdevices Operations Div. 15-1-2_E
Summary of Qualification Result
・Lead-frame
Material, External dimension : no change
Terminal strengthen and solderability : equal to current parts
・Mold Compound Material
Heat-resistance, Reliability : equal to current parts
Flammability (UL-94 V-0), Halogen Free compliance : no change
・IC Chip thickness
Change of IC chip thickness makes no damage to IC chip.
・Conclusion
We judged that there should be no concern with new parts, because any
problem was not remarked in our evaluation. We also refer to the fact that
our subcontractor has produced over 1000Mpcs in this condition as their
standard since 2009.
-> You can take the EC parts in your production by current handling
way without any adjustment.
Microdevices Operations Div. 15-1-0_E
Package Product
Production Condition Change
JEITA Package Name : P-LQFP100-1414-0.50
(Epson Package Name : QFP15-100)
Seiko Epson Corp.
Microdevices Operations Division
Page.2 Microdevices Operations Div. 15-1-0_E
Change Contents and Background
<Change contents>
Lead-frame, Mold compound material, IC chip thickness
<Background>
We have subcontracted assembly process of some products since 2003.
While the subcontractor has proceeded engineering changes, it had been
agreed that the changes would not applied to our existing products, but only
to new products, in consideration of long term relation ship.
However, it becomes unavoidable this time, because discontinuation of
relevant lead-frame was decided.
Through several discussion with subcontractor, we determined to accept their
proposal to apply their standard condition, in order to maintain stable supply
of applicable package products for long term.
Page.3 Microdevices Operations Div. 15-1-0_E
Description of Change
Current New Changing
point Reason
Lead-
frame Cu frame Cu frame
Maker
Discontinuation at current
supplier
Mold
compound
material
CEL9000series UL Flammability;
UL-94 V-0
Halogen free
EME-G600series UL Flammability:
UL-94 V-0
Halogen free
Maker/
Low
material
Apply standard mold
compound material and
process condition for new lead-
frame
IC chip
thickness 400μm 300μm
Thickness
Take standard thickness and
process condition for new lead-
frame at subcontractor
Page.4 Microdevices Operations Div. 15-1-0_E
Changing point /Anxious point Verification Results
Changing
point Anxious point Verification item Results Data
Lead-
frame Maker
Dimensions/Tolera
nce Dimensions data OK Page5,6
Lead strength Lead strength
test OK Page8
Solderability Solderbility test OK Page8
Mold
compound
material
Maker/
Low
material
Reliability Reliability test
OK
Page8
IC chip
thickness Thickness
IC Chip damage
due to stress from
IR reflow and field
condition
Analysis after
soldering heat-
resistance and
Temperature
cycle test
OK
Page9
Page.5 Microdevices Operations Div. 15-1-0_E
Comparison of each dimension before/ after the change
Package length, width:D, E
Overall length, width
:HD, HE
Co planarity:y
Seated height:AMAX
Stand-off height:A1
Package
height:A2
Terminal pitch:e
Terminal width:b
Terminal thickness:c
Length of flat part
of terminal:L
Terminal length:L1
Angle of terminal
flat portions:θ
Measurement Result of External Dimension
Page.6 Microdevices Operations Div. 15-1-0_E
Item / Spec. Current New
Average Cpk Average Cpk
E 14±0.1 13.972 2.76 13.971 2.74
D 14±0.1 13.976 1.97 13.973 2.69
HE 16±0.4 16.039 5.50 16.028 7.86
HD 16±0.4 16.024 8.51 16.034 7.51
AMAX Max 1.7 1.510 8.29 1.512 12.62
A1 0.1 -0.08/+0.1 0.107 2.40 0.109 4.21
A2 1.4±0.1 1.394 7.19 1.397 5.95
e 0.5±0.08 0.500 6.15 0.500 4.13
b 0.17~0.27 0.210 4.25 0.210 2.67
c 0.09~0.2 0.135 3.23 0.135 3.06
θ 0~10° 3.5° 3.48 3.2° 2.13
L 0.3~0.75 0.473 6.58 0.484 6.03
L1 1±0.3 1.029 7.38 1.035 10.37
y Max 0.08 0.023 4.53 0.025 3.49
Unit(mm)
Judged no problem, because measurement data of each dimension shows over Cpk1.67.
Measurement Result of External Dimension
Page.7 Microdevices Operations Div. 15-1-0_E
Comparison of Appearance
Though external appearance is different at Index mark ( ),
there are no change of external dimension and its tolerance.
Appearance of current part and EC part is as follows;
Current New
Page.8 Microdevices Operations Div. 15-1-0_E
We judged that the Engineering change makes no problem, based on the test result performed in same condition as for current parts.
Reliability Test Results of EC parts
Test Items Test condition n Terms of Test Failure
count
Judgment
High Temp Bias Test 125℃, Maximum voltage 135 1,000 H 0 Pass
High Temp and
High Humidity Bias Test
85℃, 85%RH, Maximum voltage 135 1,000 H 0 Pass
High Temp storage
Test
Ta=150℃ 45 1,000 H 0 Pass
Temp cycle Test -65℃~150℃ each 10 minute 45 200 cyc. 0 Pass
Pressure cooker
Test
Ta=121℃, 100%RH 2.0E5 Pa 45 200 H 0 Pass
Reflow Test Moisture treatment Reflow 45 3 Times 0 Pass
lead strength (Pull) 2.5N, 10sec 22 1 Time 0 Pass
Lead strength
(Bending)
90°Bending 22 2 Times 0 Pass
Solderability1 Steam aging 4H→Solder dipping
245℃, 5sec
22 1 Time 0 Pass
Solderability2 150℃,16H →Solder dipping 245℃,
5sec
22 1 Time 0 Pass
Page.9 Microdevices Operations Div. 15-1-0_E
Purpose : Check IC chip damage by change of IC chip thickness
Product :Sampling per each Package type Evaluation condition:Pre-condition(Soldering Heat-resistance)
+Temperature Cycle Test -65℃~150℃ 500cyc. -> Decap Mold compound material ->Dipping in KOH
aqueous solution(10wt%) for 10min.-> Chip visual inspection
Result : No damage remarked on IC after Stress test
<sample photo>
No damage to Passivation
and Al-interconnection
Analysis after Soldering Heat-resistance and Temperature Cycle Test
Page.10 Microdevices Operations Div. 15-1-0_E
Summary of Qualification Result
・Lead-frame
Material, External dimension : no change
Terminal strengthen and solderability : equal to current parts
・Mold Compound Material
Heat-resistance, Reliability : equal to current parts
Flammability (UL-94 V-0), Halogen Free compliance : no change
・IC Chip thickness
Change of IC chip thickness makes no damage to IC chip.
・Conclusion
We judged that there should be no concern with new parts, because any
problem was not remarked in our evaluation. We also refer to the fact that
our subcontractor has produced over 1000Mpcs in this condition as their
standard since 2009.
-> You can take the EC parts in your production by current handling
way without any adjustment.
Microdevices Operations Div. 12-1-1_E
Package Product
Production Condition Change
JEITA Package Name :P-LQFP048-0707-0.50
(Epson Package Name : QFP12-48)
Seiko Epson Corp.
Microdevices Operations Division
Page.2 Microdevices Operations Div. 12-1-1_E
Change Contents and Background
<Change contents>
Lead-frame, Mold compound material, IC chip thickness
<Background>
We have subcontracted assembly process of some products since 2003.
While the subcontractor has proceeded engineering changes, it had been
agreed that the changes would not applied to our existing products, but only
to new products, in consideration of long term relation ship.
However, it becomes unavoidable this time, because discontinuation of
relevant lead-frame was decided.
Through several discussion with subcontractor, we determined to accept their
proposal to apply their standard condition, in order to maintain stable supply
of applicable package products for long term.
Page.3 Microdevices Operations Div. 12-1-1_E
Description of Change
Current New Changing
point Reason
Lead-
frame Cu frame Cu frame
Maker
Discontinuation at current
supplier
Mold
compound
material
CEL9000series UL Flammability;
UL-94 V-0
Halogen free
EME-G600series UL Flammability:
UL-94 V-0
Halogen free
Maker/
Low
material
Apply standard mold
compound material and
process condition for new lead-
frame
IC chip
thickness 400μm 300μm
Thickness
Take standard thickness and
process condition for new lead-
frame at subcontractor
Page.4 Microdevices Operations Div. 12-1-1_E
Changing point /Anxious point Verification Results
Changing
point Anxious point Verification item Results Data
Lead-
frame Maker
Dimensions/Tolera
nce Dimensions data OK Page5,6
Lead strength Lead strength
test OK Page8
Solderability Solderbility test OK Page8
Mold
compound
material
Maker/
Low
material
Reliability Reliability test
OK
Page8
IC chip
thickness Thickness
IC Chip damage
due to stress from
IR reflow and field
condition
Analysis after
soldering heat-
resistance and
Temperature
cycle test
OK
Page9
Page.5 Microdevices Operations Div. 12-1-1_E
Comparison of each dimension before/ after the change
Package length, width:D, E
Overall length, width
:HD, HE
Co planarity:y
Seated height:AMAX
Stand-off height:A1
Package height:A2
Terminal pitch:e
Terminal width:b
Terminal thickness:c
Length of flat part
of terminal:L
Terminal length:L1
Angle of terminal
flat portions:θ
Measurement Result of External Dimension
Page.6 Microdevices Operations Div. 12-1-1_E
Item / Spec. Current New
Average Cpk Average Cpk
E 7±0.1 6.988 7.67 6.988 8.10
D 7±0.1 6.990 6.21 6.997 8.25
HE 9±0.4 9.003 14.12 9.004 12.14
HD 9±0.4 9.004 11.75 9.001 16.52
AMAX Max 1.7 1.520 8.05 1.557 9.91
A1 0.1 -0.08/+0.1 0.121 6.84 0.120 5.17
A2 1.4±0.1 1.406 5.73 1.405 7.88
e 0.5±0.08 0.502 9.77 0.501 18.82
b 0.13~0.27 0.224 4.09 0.226 4.63
c 0.09~0.2 0.160 3.51 0.162 2.34
θ 0~10° 3.6° 3.81 3.8° 5.60
L 0.3~0.7 0.554 8.20 0.552 6.63
L1 1±0.3 1.010 13.07 0.997 21.11
y Max 0.08 0.017 6.56 0.014 9.47
Unit(mm)
Judged no problem, because measurement data of each dimension shows over Cpk1.67.
Measurement Result of External Dimension
Page.7 Microdevices Operations Div. 12-1-1_E
Comparison of Appearance
Though external appearance is different at Index mark ( ),
there are no change of external dimension and its tolerance.
Appearance of current part and EC part is as follows;
Current New
Page.8 Microdevices Operations Div. 12-1-1_E
We judged that the Engineering change makes no problem, based on the test result performed in same condition as for current parts.
Reliability Test Results of EC parts
Test Items Test condition n Terms of Test Failure
count
Judgment
High Temp Bias Test 125℃, Maximum voltage 135 1,000 H 0 Pass
High Temp and
High Humidity Bias Test
85℃, 85%RH, Maximum voltage 135 1,000 H 0 Pass
High Temp storage
Test
Ta=150℃ 45 1,000 H 0 Pass
Temp cycle Test -65℃~150℃ each 10 minute 45 200 cyc. 0 Pass
Pressure cooker
Test
Ta=121℃, 100%RH 2.0E5 Pa 45 200 H 0 Pass
Reflow Test Moisture treatment Reflow 45 3 Times 0 Pass
lead strength (Pull) 2.5N, 10sec 22 1 Time 0 Pass
Lead strength
(Bending)
90°Bending 22 2 Times 0 Pass
Solderability1 Steam aging 4H→Solder dipping
245℃, 5sec
22 1 Time 0 Pass
Solderability2 150℃,16H →Solder dipping 245℃,
5sec
22 1 Time 0 Pass
Page.9 Microdevices Operations Div. 12-1-1_E
Purpose : Check IC chip damage by change of IC chip thickness
Product :Sampling per each Package type Evaluation condition:Pre-condition(Soldering Heat-resistance)
+Temperature Cycle Test -65℃~150℃ 500cyc. -> Decap Mold compound material ->Dipping in KOH
aqueous solution(10wt%)for 10min.-> Chip visual inspection
Result : No damage remarked on IC after Stress test
<sample photo>
No damage to Passivation
and Al-interconnection
Analysis after Soldering Heat-resistance and Temperature Cycle Test
Page.10 Microdevices Operations Div. 12-1-1_E
Summary of Qualification Result
・Lead-frame
Material, External dimension : no change
Terminal strengthen and solderability : equal to current parts
・Mold Compound Material
Heat-resistance, Reliability : equal to current parts
Flammability (UL-94 V-0), Halogen Free compliance : no change
・IC Chip thickness
Change of IC chip thickness makes no damage to IC chip.
・Conclusion
We judged that there should be no concern with new parts, because any
problem was not remarked in our evaluation. We also refer to the fact that
our subcontractor has produced over 1000Mpcs in this condition as their
standard since 2009.
-> You can take the EC parts in your production by current handling
way without any adjustment.