1 eurosime, 18-20.04.2011, linz, austria trends of micro- and nanoelectronics in the european...
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••• 1EuroSimE, 18-20.04.2011, Linz, Austria
Trends of Micro- and Nanoelectronics in the European
R&D Programme
Vesselin Dontchev
Nanoelectronics Components and Systems
Information Society & Media Directorate-GeneralEuropean Commission
Disclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission
••• 2EuroSimE, 18-20.04.2011, Linz, Austria
Presentation outline
Europe 2020 – a new strategy for the EU Current EC funding of EU Research (ICT in
particular) Nanoelectronics- Examples of research
projects dealing with simulation Today’s opportunities: ICT WP 2011-12 Information on the future programme (2014+) Summary
••• 3
• Smart Growth: knowledge and innovation economy
• Sustainable growth: greener and competitive economy
• Inclusive growth: high employment, knowledge
people and social and territorial cohesion
EUROPE 2020: A EU strategy for smart, sustainable and inclusive growth
5 EU Targets – translated into national ones
7 Flagship initiatives – EU & national action
A new strategy - EUROPE 2020
EuroSimE, 18-20.04.2011, Linz, Austria
••• 4
Europe 2020: 5 EU Headline Targets (translated in national and regional ones)
By 2020: • 75 % (now 69) employment rate (% of population aged 20-64 years)
• 3% (now 1,8 % only) investment in R&D (% of EU’s GDP)
• “20/20/20” 20% cut in greenhouse gas emissions (compared to 1990)
20% increase in use of renewable energy
20% cut in energy consumption through improved efficiency
• < 10% (now 15) early school leavers & min. 40% (now 31) hold tertiary degree
• 20 million less people (now 80) should be at risk of poverty
EuroSimE, 18-20.04.2011, Linz, Austria
••• 5EuroSimE, 18-20.04.2011, Linz, Austria
Presentation outline
Europe 2020 – a new strategy for the EU Current EC funding of EU Research
(ICT in particular) Nanoelectronics - Examples of research
projects dealing with simulation Today’s opportunities: ICT WP 2011-12 Information on the future programme (2014+) Summary
••• 6
EUROSTARS
PEOPLE
Capacities (INFRASTRUCTURES)
IDEAS - ERC SMEs and SME Associations
ICT-FET (Flag Ships)
COOPERATION
Joint
Programming
Ageing (More Years Better Lives) Climate Knowledge (Clik-EU)Seas and OceansAntimicrobial resistanceUrban EuropeWater challenges
The EU’s research and innovation landscape
DeploymentFundamental Applied InnovationDevelopment
EC
Funds
National
and
Regional
Funds
Eureka!ERANET+
ERANETJTI Artemis, Eniac Clean Sky, IMI, FCH
Art. 169 AAL Bonus EMRP
PPP
PPP (recovery packages)Energy Efficient BuildingsFuture of FactoriesGreen carsFuture Internet
CIP competitiveness &innovation programme
••• 7
FP7: total of 50 B€ (2007-13)
Ideas; 7510; 15%
JRC; 1751; 3%
Cooperation; 32413; 65%
People; 4750; 9%
Capacities; 4097; 8%
FP7: Council/Parliament Co-decision
EuroSimE, 18-20.04.2011, Linz, Austria
5 major specific programmes:
••• 8
FP7 Cooperation Specific Programme
Socio-economic sciences and the
humanities
Security
SpaceHealth
Food, agriculture,
biotechnology
Transport
Nanosciences, nanotechnologie
s, materials, production
technologies
Environment
EnergyICT -
Information and
Communication Technologies
9.1 B€ (2007-13)
+700M€ for eInfrastructures from the Capacities programme
EuroSimE, 18-20.04.2011, Linz, Austria
10 key thematic areas:
••• 9••• 9
Fu
ture
& E
mer
gin
g
Tec
hn
olo
gie
s (F
ET
)
1. Network and Service Infrastructures
ICT for socio-economic challenges
Bas
ic IC
T te
chno
logi
es &
in
fras
truc
ture
s
~10% ~9%
~11%
International cooperation, Horizontal actions
3. Components and Systems
4. Digital Content and Languages
2. Cognitive Systems and Robotics
5. ICT for Health, Ageing, Inclusion & Gov.
~26%
~6%
~17%
~7%
~11%
6. ICT for Lower-Carbon Economy
~12%
7. ICT for Manufac. & Enterprise
8. ICT for Learning & Cultural Resources
~6% ~4%
+JTIs
+AAL
PPP
2 PPPs
incl FI PPP
Challenges in the ICT programme 2011-2012 (What is the money spent on?)
••• 10
M€ 2007 2008 2009 2010 2011 2012 2013 TOTAL
FP7 ICT 1 189 1 217 1 227 1 241 1 382 1 582 1 760 9 598
CIP 58 52 105 113 120 135 149 732
Financial support – FP7: master & shape research & development
– CIP: ensure wider uptake & better use of research
– + Regional and Structural Funds,…
FP7-CIP/ICT Budget Profile:
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2nd half of FP7 – significant increase of funding !
••• 11
• In 2011, the FP7 ICT Programme is in its 5th year of implementation
• 7 main calls have been launched and evaluated
– Total number of projects ~1200
• Launch of two JTIs and AAL initiative– 4 Calls launched for ENIAC with 130 M€ (EC
contribution) 4th call is ongoing
• WP 2011-12 done, WP 2013 (1.76 B€) is in preparation
ICT in FP7: Where do we stand?
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••• 12
• ICT in the FP supports collaborative R&D projects
– industry - academia from at least 3 MS or AS
– Project size between 3M€ and 20 M€ of funding
– 4 to 20 partners per project
• Supports ~17 000 researchers and engineers/year
• During 2007-10
– ~ 5000 distinct organisations, ~14000 participations
– ~ 1250 projects running (FP6 + FP7)
ICT in FP7
EuroSimE, 18-20.04.2011, Linz, Austria
••• 13EuroSimE, 18-20.04.2011, Linz, Austria
Presentation outline
Europe 2020 – a new strategy for the EU Current EC funding of EU Research (ICT in
particular) Nanoelectronics - Examples of research
projects dealing with simulation Today’s opportunities: ICT WP 2011-12 Information on the future programme (2014+) Summary
••• 14
EuroSimE, 18-20.04.2011, Linz, Austria
AtomicsAdvanced Front-End Technology Modeling
for Ultimate Integrated Circuits
FP6 IST programme
Consortium
BudgetTotal Cost: 4.4M€EC : 2.5 M€
OBJECTIVESDevelopment of TCAD models suitable for
a) materials (strained and unstrained SiGe alloys, strained Si, SOI, etc);
b) processes (activation and diffusion of dopants, formation of extended defects, including low-temperature and millisecond annealing, point-defect engineering)
employed at the 32 nm technology node and beyond.
MOTIVATION
TCAD can save 30% development time
and costs (ITRS 2008)
ExampleDependence of dopant solubility on strain (Ahn et al. PRB 2009)
The models are- implemented in simulation software Sentaurus (Synopsys)- validated with respect to industrial needs (STM)
http://www.iisb.fraunhofer.de/en/arb_geb/atomics.htm
••• 15
EuroSimE, 18-20.04.2011, Linz, Austria
AtemoxAdvanced Technology Modeling
for Extra-Functionality Devices
BudgetTotal Cost: 4.1M€EC Contribution: 2.85 M€
ConsortiumObjectives - extend the capabilities of TCAD to the prediction of - leakage currents in CMOS structures- the alternative doping processes considered for a reduction of leakage currents.
Key Issues• Full set of missing models for simulating leakage currents in
CMOS derivatives → providing extra functionality to the basic NE technology with sizes 22 nm CMOS transistors.
• Implementation and integration of the models into the Sentaurus TCAD platform of Synopsys.
• Evaluation of the integrated models by STMicroelectronics.
Expected impact Predictive simulations of CMOS derivatives in industrial
environments at an early stage of development. Significant reduction of development time and costs. Extending the EU knowledge and skills in NE Competitiveness of EU industry in CMOS derivatives
http://www.atemox.eu/
••• 16EuroSimE, 18-20.04.2011, Linz, Austria
Presentation outline
Europe 2020 – a new strategy for the EU Current EC funding of EU Research (ICT in
particular) Nanoelectronics - Examples of research projects
dealing with simulation Today’s opportunities: ICT WP 2011-12 Information on the future programme (2014+) Summary
••• 17
ICT Work Programme 2011-2012
Challenge 3: Alternative Paths to Components and Systems
Objectives:
3.1. Nanoelectronics
3.2 Smart components and smart systems
3.3 Embedded systems
3.4 Computing Systems
3.5 Photonics
3.6 Organic Electronics and Photonics
••• 18
Objective 3.1:
Very Advanced Nano-electronics Components
Target outcomes:
• Beyond CMOS technology• Circuit - technology solutions • Nano-manufacturing and Joint Equipment
Assessment • Coordination and Support Actions
Call 8
60M€
ICT Work Programme 2011-12
EuroSimE, 18-20.04.2011, Linz, Austria
••• 19
Two complementary funding schemes
FET Proactive
• Top-down approach• Set of novel pre-defined themes
FET Open• Bottom-up approach• Open to any research idea
Nano-electronics related topics with EU funding ~ 30M€/year:Molecular-scale systems, Tera-scale computing, Quantum-ICT, Bio-Chemistry-based ICT and Towards zero power ICT
Future & Emerging Technologies – FETSupporting high-risk transformative research in ICT
EuroSimE, 18-20.04.2011, Linz, Austria
ICT Work Programme 2011-12
••• 20
European vision of the More Moore and More than Moore domains
More than Moore: Diversification
Mo
ore
’s L
aw:
Min
iatu
riza
tio
n
Bas
elin
e C
MO
S:
CP
U, M
emo
ry, L
og
ic
130nm
90nm
65nm
45nm
32nm
22nm
Extended CMOS
Analog/RF Passives HV PowerSensors
ActuatorsBiochips
InformationProcessing
Digital content System-on-Chip
(SoC)
Interacting with people and environmentNon-digital content SoC & System-in-
Package (SiP)
Combining SoC and SiP: Higher Value Systems
Beyond & Extended CMOS technologies need to meet the criteria of systemability, integratability and manufacturability
Nanoelectronics”Small, smaller, smarter”
- Advanced components in advanced systems enabling pervasive applications -
Beyond CMOS
••• 21
• To ensure interaction between system competences and device technology to better incorporate the device in a system to perform a given function.
• To address energy efficiency needs (e.g. for mobile applications).
• Nanoelectronics devices as system enablers should provide solutions for global challenges
• To prepare for “beyond” traditional shrinking (ITRS roadmap)
35 nmGate Length
Objective 3.1: Advanced Nanoelectronics Technology
S y s t e m a b i l i t y
EuroSimE, 18-20.04.2011, Linz, Austria
••• 22
ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms.
• Future developments in Beyond CMOS and More than Moore as an extended-CMOS vision. No disconnection from the advanced silicon CMOS in order to keep the impact of its results on the applications and markets.
• Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures.
• Integrateability of novel technology with CMOS and their reliability become key factors.
Objective 3.1: Advanced Nanoelectronics Technology
I n t e g r a t a b i l i t y
EuroSimE, 18-20.04.2011, Linz, Austria
••• 23
European equipment and material companies i) Access to nano-manufacturing and to advanced technologies positive feedback ii) Joint assessment and demonstration platform
Evidence of reproducible equipment parameters Stimulate the access to world wide equipment market
(especially important for SMEs)
Semiconductor Equipment for Wafer Bonding with Plasma Activation
EV Group, CEA-LETI, Soitec
3D Integration of Bulk Si WafersEV Group, CEA-LETI,
STMicroelectronics Crolles II
Low Energy and Dose Implant TestSEMILAB, Fraunhofer IISB,
ST Microelectronics Crolles II,NXP Crolles R&D
Ruthenium Atomic Vapor Deposition Competitiveness in Nanoelectronic
Device GenerationsAIXTRON, Fraunhofer IISB, Infineon
Munich
Metrology Using X-Ray TechniquesJordan Valley, CEA-LETI,
STMicroelectronics Crolles II,NXP Crolles R&D
Objective 3.1: Manufacturing and Equipment assessment
EuroSimE, 18-20.04.2011, Linz, Austria
M a n u f a c t u r a b i l i t y • Concept to be taken into account at early stages of research• From prototype to a reliable manufacturing of devices with predefined
reproducible parameters.
••• 24
1. Phenomena and Effects * Quantum and atomic scale ; * Electro-thermo-mechanical* Transport (drift, diffusion ); * System integration at the nanoscale
2. New materials * Graphene; Gemanene; * CNT;* Nanowires; * Complex magneto-electric lattices.
3. Devices* New switches (+molecular) and interconnects; * Emerging memories;* Ferromagnetic logics; * Spin devices; * Nano-photonics devices and interconnects; * Carbon based; * MEMs, NEMs
4. Models for cross technology and cross IP level simulation
5. Multi-physics and multi-scale models, which can predict devices and circuits up to non-equilibrium systems.
Objective 3.1 Modelling and simulation
Modeling & Simulation – increasing importance (save costs !)
models measurements (challenging due to the miniaturization)
••• 25
Dates
Open: 26 July 2011 Close: 17 January 2012 (at 17:00 Brussels local time)
Funding schemes:
a) Beyond CMOS technology: STREPs b) Circuit-technology solutions: STREPs and at least 1 IPc) Nano-manufacturing and joint equipment assessment: STREPs and at least 1
IPd) Support measures: CSAs
Indicative budget distribution - 60 M€:
IP/STREP 55 M€ CSA 5 M€
Objective 3.1 Information about call 8
••• 26
ICT Proposers’ Day 201119 - 20 May, Budapest
Networking for European ICT R&D
• Aim of the event:
to prepare for Calls 8 and 9 (together >1 B€)– by networking and partnerships building
– by first-hand information from >100 EC officials
• Structure:
– thematic sessions with presentations of proposal ideas
– information stands & meeting points
• Registration:
free of charge, open from January 2011http://ec.europa.eu/ictproposersday
EuroSimE, 18-20.04.2011, Linz, Austria
••• 27EuroSimE, 18-20.04.2011, Linz, Austria
Presentation outline
Europe 2020 – a new strategy for the EU? Current EC funding of EU Research (ICT in particular) Nanoelectronics - Examples of research projects dealing
with simulation Today’s opportunities: WP 2011-12 Information on the future Common Strategic
Framework (CSF) for R&I funding (2014+) Summary
••• 28
What is next?
2010 2011 2012 2013 2014
FP7ICT WP 2011-12
ICT WP 2013
FP8 + CIPII
CSF(Common Strategic Framework)
Preparatory work
Strengthen, focus & simplify EIPs
KETs
Light and fast
MAFF 2014+Externalisation
• 9 Feb Green Paper• Feb-May Consultation based on Green Paper• 10/6 Consultation ‘wrap-up’ event in Brussels• June Proposal for next MAFF• Dec Legislative proposal(s) for CSF
••• 29
Common Strategic Framework (CSF) for EU R & I funding ( 2014+ )
Three key messages
• More clarity of goals and strategy, - Higher impact on competitiveness / society,
- More EU added value
• Simplification Procedures but also of programmes/instruments
→ To attract wider constituency, smaller entities
• Work across silos– research-innovation-policy priorities– between themes and disciplines– EU-MSs, public-private
EuroSimE, 18-20.04.2011, Linz, Austria
• Limited set of funding schemes - common across all activities
• Unique Rules for Participation• Simplified cost-reimbursement
approach with enhanced use of lump sums and flat rates.
••• 30
3 sets of challenges, 4 types of activities, (funding schemes)” Draft
Some first and preliminary thinking (from ICT theme)
EuroSimE, 18-20.04.2011, Linz, Austria
Common Strategic Framework for EU R&I funding (2014+)
A challenge oriented R&I frameworkA shift in the drive: From means/instruments to goals
Societal challenges
Industrial leadership
Excellence in science
Roadmap based partn.
(Focus)
Open, light (be flexible)
Infrastr., skills(attract)
Piloting (test,
duffuse)
e.g. Living labs
e.g. Clean rooms,
Innovation clusters
E-Infrastruct.
Pilots
Pilots
••• 31
Summary
EUROPE 2020
- renewed emphasis on R&D&I as a basis for smart, sustainable and inclusive
growth.
MAFF 2014+, CSF
2011-2012 is key for the preparation: New opportunities for improvements and for
holistic integrated views to face grand challenges (EU and global)
Nanoelectronics has a major input to these processes
Modeling & Simulation – increasing importance
Participate in Call 8 !!!
« Time is ready. Let us profit from these exciting times and take action ---- together -----”
EuroSimE, 18-20.04.2011, Linz, Austria
••• 32
THANK [email protected]
Information Society and Media:http://ec.europa.eu/information_society
http://cordis.europa.eu/fp7/ict/nanoelectronics/mission_en.html
European research on the web:http://cordis.europa.euhttp://www.eniac.eu
!!!! Take part in the consultation processes !!!!!!!! 2011 is a year of change, you can influence the future !!!!
http://ec.europa.eu/yourvoice/consultations/index_en.htm
EuroSimE, 18-20.04.2011, Linz, Austria
••• 33EuroSimE, 18-20.04.2011, Linz, Austria
••• 34
State Variable
Device
Data Representation
Architecture
Material
SETs
Molecular
Spintronics Quantum
Scaled CMOS Ferromagnetic
Quantum
Analog
Digital
Reconfigurable
Morphic
Von Neumann
Silicon
Carbon
Macro molecules
Complex metal oxides
Qubit
Spin orientationMolecular state
Electric charge Strongly correlated electron state
Phase state
Multicore
Nanostructured mat’ls
Patterns
Polarization
State Variable
Device
Data Representation
Architecture
Material
SETs
Molecular
Spintronics Quantum
Scaled CMOS Ferromagnetic
Quantum
Analog
Digital
Reconfigurable
Morphic
Von Neumann
Silicon
Carbon
Macro molecules
Complex metal oxides
Qubit
Spin orientationMolecular state
Electric charge Strongly correlated electron state
Phase state
Multicore
Nanostructured mat’ls
Patterns
Polarization
Nanostructured mat’ls
State Variable
Device
Data Representation
Architecture
Material
SETs
Molecular
Spintronics Quantum
Scaled CMOS Ferromagnetic
Quantum
Analog
Digital
Reconfigurable
Morphic
Von Neumann
Silicon
Carbon
Macro molecules
Complex metal oxides
Qubit
Spin orientationMolecular state
Electric charge Strongly correlated electron state
Phase state
Multicore
Nanostructured mat’ls
Patterns
Polarization
State Variable
Device
Data Representation
Architecture
Material
SETs
Molecular
Spintronics Quantum
Scaled CMOS Ferromagnetic
Quantum
Analog
Digital
Reconfigurable
Morphic
Von Neumann
Silicon
Carbon
Macro molecules
Complex metal oxides
Qubit
Spin orientationMolecular state
Electric charge Strongly correlated electron state
Phase state
Multicore
Nanostructured mat’ls
Patterns
Polarization
Nanostructured mat’ls
Systemability, integratability, manufacturability
Transversal Research ProjectsMulti-disciplinary
cooperation
-System-technology interaction-Nanofabrication-Energy efficiency-Next switch-Universal memory-3D integration-Novel architectures
- Advanced component technology + advanced system design- Beyond CMOS , Extended CMOS
For systems 2020 and beyond
Work Programme 2011-12General concepts
••• 35
Target outcomes
Beyond CMOS technology• New switches and interconnects with energy efficiency gain; • Emerging memories; • Nano-photonics devices and interconnects; • Carbon based electronic devices
Circuit-technology solutions • Architectures including energy efficiency, spin devices ferromagnetic logics, Si with molecular switches• Circuit design, methodology and tools addressing e.g. D-A-C• Technology addressing 3D integration, MtM, photon-electron integration, power dissipation, etc.• Modelling and simulation
Nano-manufacturing and Joint Equipment Assessment • Manufacturing approaches to Beyond CMOS and MtM and their integration with nanoCMOS including 3D• Metrology/inspection analysis concepts; assembly and packaging• Joint assessment of equipment/metrology, process solutions
Coordination and Support Actions • Access to training CAD tools, advanced technologies, design kits, education blocks, prototyping• Roadmap, benchmark and strategy papers• Stimulation of young people towards electronics careers, training, education• International cooperation – Japan, USA, Taiwan, Korea• Support coordination and standartisation actions, preparatory work for 450 mm
Objective 3.1: Very Advanced Nano-electronics Components
••• 36
ICT Work Programme 2013
• continuity with 2011-12 WP• effective bridge to the next CSF for R&I.
Budget: 1.53B€
Timing - three main phases: • Options and orientations: Sept.- Dec. 2011• Drafting: Jan. - March/April 2012• Decision: April/May-July 2012
••• 37
Common Strategic Framework for EU R&I funding (2014+)
3 sets of challengesSocietal Challenges
Health and wellbeing; Safe food and sustainable agriculture; Secure, clean and efficient energy; Green transport; less congestion; Efficient use of resources & materials; Inclusive and safe society
Creating Industrial Leadership & Competitive Frameworks
Leadership in enabling technologies & FET; Access to risk finance; Integrating research, education and innovation; High potential SMEs
Excellence in the Research Base
Frontier research (ERC & FET), Skills and career development (Marie Curie); Research infrastructures incl. eInfrastructures
A challenge oriented R&I frameworkA shift in the drive: From means/instruments to goals
••• 38
Four simplified funding schemes addressing:
• Roadmap-based partnerships (focus !)
• Open, light and fast scheme (be agile, flexible! )
• R&I infrastructures, innovation clusters, skills (attract!)
• Pilot actions in real-life settings (test and diffuse!)
Common Strategic Framework for EU R&I funding (2014+)
••• 39
• Limited set of funding schemes - common across all activities
• Unique Rules for Participation of the CSF that will provide a set of common principles applicable to all actions
• Radically simplified cost-reimbursement approach with enhanced use of lump sums and flat rates
Common Strategic Framework for EU R&I funding (2014+)
Simplification
••• 40
Timeline
• February Green Paper
• 4.02.2011 European Council devoted to research & innovation
• Feb-May Consultation based on Green Paper
• 10.06.2011 Consultation ‘wrap-up’ event in Brussels
• June Proposal for next MАFF
• December Legislative Proposal(s) for CSF and impact assessment
EuroSimE, 18-20.04.2011, Linz, Austria