02 - principles of boundary scan
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The Principles Of The Principles Of BB SSBoundaryBoundary--ScanScan
LLLesson 2Lesson 2October 2009
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The Test ChallengeThe Test Challenge
Find the failures before your customers do!
More than 90% of the PCBs produced will contain at least one structural fault
Ref: Charles Robinson and Amit Verma, Teradyne Inc., APEX 2002
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The functional testing approachThe functional testing approachAdvantages
Exercises the product the way it will be used in the field functionallyExercises the product the way it will be used in the field functionally
Very effective at assuring quality standards are met
DisadvantagesDisadvantages
Test prepared manually, often requiring input from the design engineer
Faults found at functional test may be difficult to diagnose, requiring designer participation
Most factories have a bone-pile of boards that fail functional test
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The structural testing approachThe structural testing approachAdvantages
Tests are generated automatically, by intelligent software tools,Tests are generated automatically, by intelligent software tools, using an exhaustive list of the potential structural faults on the board
Detection and diagnosis of faults can be precise and to the pin level
Disadvantages
Intended to detect manufacturing faults only solder problems, incorrect parts, etc. (not design faults)
Only valuable if sufficient test point access is available Only valuable if sufficient test point access is available
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Traditional structural testingTraditional structural testingPotentially
defectivewire bond
Openunder BGA
Short topower or ground
ESDdamage
BGABGA
Power or
Inner board layersBridging
GND
In-circuit testing will have difficulty finding these types of faults
Inner board layers,blind vias
Bridgingfault
In circuit testing will have difficulty finding these types of faultsBoundary-scan can help!
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Test Finds Finds short,Detects
test coverage with boundary-scan
BGA
wire bond open,
s-a-0 or s-a-1ESD damage
BGATAP
Power orGND
Provides access toblind vias, inner layers
Finds solder bridgeunder BGA
FFixture is greatly simplified or eliminated
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Adopted in 1990 by the IEEE as Standard 1149.1
IEEE 1149.1 BoundaryIEEE 1149.1 Boundary--Scan StandardScan StandardAdopted in 1990 by the IEEE as Standard 1149.1
Prepared by the Joint Test Action Group (JTAG) Originally for testing boards and devices
1149.1 is an IC standard1149.1 is an IC standardSerial 4-wire (5th is optional) TAP interface That Provides Access To
Device I/O PinsDefines a set of operations outside the chips normal operation
Semiconductor manufacturer is responsible for:Designing device for compliance to the IEEE 1149.1 Standard
Many components are now Boundary-Scan compliantMany components are now Boundary Scan compliantMicroprocessors, CPLDs, ASICs, FPGAs, DSPs & MemoryFLASH Memory is programmable, via Boundary-Scan
Providing A Compliant BSDL fileProviding A Compliant BSDL file
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What is IEEE 1149.1 boundaryWhat is IEEE 1149.1 boundary--scan?scan? A chip level standard adopted A chip-level standard, adopted
by the IEEE in 1990 4 (or 5) added pins form the Test
Access Port (TAP) Additional logic inside the IC: scan
cells on I/Os, controller & registers
Data from the boundary-scan
IC Core
source (on TDI) can be loaded into the device
and read from the device pins on TDO
TDOTDI Bypass
Instruction Reg.TDO
Optional 5th line TRST active low asynchronous reset TMS
TCKController
ID Register
Every I/O on a compliant IC becomes a test point TRST
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IEEE 1149.1 ArchitectureIEEE 1149.1 Architecture
Internal
Core Logic
Shift-DRShift Bypass
Shift IR Identification
Bypass
TDI TDOShift IR Identification
Instruction
TAPTMSTCK
TDI TDO
ControllerTCK
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IEEE 1149.1 State MachineIEEE 1149.1 State MachineTest-Logic Data Register Instruction RegisterTest Logic
Reset
Run-TestIdle
SelectIR-scan
SelectDR-scan
1
0 1 1 1
00
0
Data Register Instruction Register
Capture-IR
Shift-IR
Capture-DR
Shift-DR
1
1
1
1
00
00
Exit1-IR
Pause-DR
Exit1-DR
Pause-IR
11
1
0
0
0
0
Exit2-IRExit2-DR
Update-DR Update-IR
1
1
1
1
00
TMS: 0,1
Update DR1 1 00
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The Instruction RegisterThe Instruction RegisterDecoded Output to
Selected Data Registers
Internal
core logic
Hold ElementsIdentification
Instruction
TAPcontroller
TMS
TCK
TDI TDOBypass
Decoder
TDI TDOTMS Clock-DR Shift RegisterTDITMS
TCK
TRST
TestAccess
Port
TAP
Clock-DRShift-DRUpdate-DRCapture-DRTCKClock-IRShift-IRUpdate-IR
0 1IR Length 2>
TRST(optional) controller Capture-IR
Select
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BoundaryBoundary--Scan InstructionsScan Instructions
Instruction Code Selected Data Register
Bypass/
111..11 Bypass (Initialized state)mandatorySample/Preload
Extest
Intest
000..00Boundary-ScanBoundary-Scan
Boundary-Scan
mandatory
IdcodeRunBistScan
Identification or BypassInternal BISTInternal Scan
optional
Usercode
ClampHighZ
Internal ScanIdentificationBypass: outputs from BS cellsBypass: outputs in High Z stateHighZ Bypass: outputs in High-Z state
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The BoundaryThe Boundary--Scan (DATA) RegisterScan (DATA) RegisterX-Bit Shift Register
A Data Register Selected by One Of The
Instructions:
- EXTEST
SAMPLE PRELOAD
Internal
core logic
- SAMPLE PRELOAD
- INTEST
- ????
TDI TDOBypass
Identification
Instruction
Parallel Input and/or Output TMSTCK
TAPcontroller
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Cell Types of the Boundary RegisterCell Types of the Boundary Register
TDI TDO
CELL CELLINPUT
CORE LOGIC
CELL
CELL
2-STATE OUTPUT
INPUT
CLOCK
CELL CELLLOGIC CELL
CELL
CELL
3-STATE OUTPUTCELLINTERNAL
BI-DIRECTIONAL
CELLCELL
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Bypass (DATA) RegisterBypass (DATA) RegisterOne Bit Shift Stage
Selected by BYPASS Instruction Internal
No Parallel Output
Captures a Hardwired 0
core logic
Identification
TDI TDOBypass
GShift-DR
Instruction
TAP
controller
TMS
TCK
_11 1DTDI
0
C DRTDO
C1Clock DR
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Identification RegisterIdentification RegisterMain Function: Identify the Device
32-Bit Shift Register
Selected by IDCODE Instruction
No Parallel Output
Captures a 32 Bit Hardwired Word
Internal
core logicCaptures a 32 Bit Hardwired Word
If No Identification Register
Is Present, The BYPASS Instruction Identification
TDI TDOBypass
Must be SelectedInstruction
TAPcontroller
TMS
TCK
**Part of infrastructure test
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Device identification code structureDevice identification code structure
Version Part Number Manufacturer 1
31 28 27 12 11 1 0
4 Bits 16 Bits 11 Bits 1 Bit
Compressed FormOf JEDEC Code
Manufacturers Own Coding
Version Code
GShift-DR
Of JEDEC CodeOwn Coding
_11 1D
0 / 1TDI
Clock DR
TDO
C1Clock DR
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Applying boundaryApplying boundary--scan to the PCBscan to the PCB Example of a PCBScan device #1 Example of a PCB
with one boundary-scan chain
Typically only a
Scan device #1
Scan device #2TDI
TDOTMS
TCK
T
A
P
Typically, only a fraction of the ICs need to be scan-compliant
TCK
Scan device #3
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Alternate partitioning (2 chains)Alternate partitioning (2 chains) Chains are testedScan device #1 Chains are tested
concurrently for max throughput with no loss of test
Scan device #1
Scan device #2TDI
TDOTMS
T
A
P
1
coverage
Up to 4 chains with single QuadPOD
TCK
Provides valuable design flexibility*
*To be discussed
Scan device #3
*To be discussed in DFT sectionTDI
TDOTMS
TCK
T
A
P
2
TCK
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TAP2D I/O
Board LevelBoard LevelApplicationsApplications Digital I/O
scan moduleApplications Applications
Testing
TAP1
uP
+
ClustersR
Connector Infrastructure Interconnections
TAP
FPGA
PLD
Memory A/D buses & control signals
P
R
SD
Flash memories
Programming
CPLDs, FPGAsSD
F
Cluster Cluster
F
Connector(w/ AutoWrite)
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Infrastructure Capture test Infrastructure Capture test TCKTCK
TMSTMS
Test logic reset
Select-DRRun-test/idle
Select-IRCapture-IR
Shift-IRExit-1
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BoundaryBoundary--Scan Test PrincipleScan Test PrincipleStage 1 Shift Data to Output cellStage 1 Shift Data to Output cell
1
core core0
1 0
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BoundaryBoundary--Scan Test PrincipleScan Test PrincipleStage 2 Update Data from Output Cell to NetStage 2 Update Data from Output Cell to Net
11
core core
1
0 0
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BoundaryBoundary--Scan Test PrincipleScan Test PrincipleStage 3 Capture Data from Net to Input cell
1 11
core core0 00
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Stage 4 Shift Captured Data OutBoundaryBoundary--Scan Test PrincipleScan Test Principle
Stage 4 Shift Captured Data Out
1
core core0
0 1
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Ieee 1149 4
Extensions to the IEEE 1149.1 StandardExtensions to the IEEE 1149.1 StandardIeee 1149.4 Released in 1999 Analog testing, voltage measurement and current driving
Drive and sense analog values via 2 additional pins and busses internal to the ICU / Up until now, very limited deployment/nonexistent
JTAG offers analog evaluation kits
Ieee 1149.6 Approved March 20, 2003 For high-speed AC-coupled nets and differential signaling
Ieee 1532Ieee 1532 Latest version: Dec. 11, 2002 Standardizes PLD programming among various vendors
Allows concurrent programming, mixed vendor chains BSDL files include the programming algorithms BSDL files include the programming algorithms
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The ShowThe Show
October 2009