02 - principles of boundary scan

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  • The Principles Of The Principles Of BB SSBoundaryBoundary--ScanScan

    LLLesson 2Lesson 2October 2009

  • The Test ChallengeThe Test Challenge

    Find the failures before your customers do!

    More than 90% of the PCBs produced will contain at least one structural fault

    Ref: Charles Robinson and Amit Verma, Teradyne Inc., APEX 2002

    October 2009

  • The functional testing approachThe functional testing approachAdvantages

    Exercises the product the way it will be used in the field functionallyExercises the product the way it will be used in the field functionally

    Very effective at assuring quality standards are met

    DisadvantagesDisadvantages

    Test prepared manually, often requiring input from the design engineer

    Faults found at functional test may be difficult to diagnose, requiring designer participation

    Most factories have a bone-pile of boards that fail functional test

    October 2009

  • The structural testing approachThe structural testing approachAdvantages

    Tests are generated automatically, by intelligent software tools,Tests are generated automatically, by intelligent software tools, using an exhaustive list of the potential structural faults on the board

    Detection and diagnosis of faults can be precise and to the pin level

    Disadvantages

    Intended to detect manufacturing faults only solder problems, incorrect parts, etc. (not design faults)

    Only valuable if sufficient test point access is available Only valuable if sufficient test point access is available

    October 2009

  • Traditional structural testingTraditional structural testingPotentially

    defectivewire bond

    Openunder BGA

    Short topower or ground

    ESDdamage

    BGABGA

    Power or

    Inner board layersBridging

    GND

    In-circuit testing will have difficulty finding these types of faults

    Inner board layers,blind vias

    Bridgingfault

    In circuit testing will have difficulty finding these types of faultsBoundary-scan can help!

    October 2009

  • Test Finds Finds short,Detects

    test coverage with boundary-scan

    BGA

    wire bond open,

    s-a-0 or s-a-1ESD damage

    BGATAP

    Power orGND

    Provides access toblind vias, inner layers

    Finds solder bridgeunder BGA

    FFixture is greatly simplified or eliminated

    October 2009

  • Adopted in 1990 by the IEEE as Standard 1149.1

    IEEE 1149.1 BoundaryIEEE 1149.1 Boundary--Scan StandardScan StandardAdopted in 1990 by the IEEE as Standard 1149.1

    Prepared by the Joint Test Action Group (JTAG) Originally for testing boards and devices

    1149.1 is an IC standard1149.1 is an IC standardSerial 4-wire (5th is optional) TAP interface That Provides Access To

    Device I/O PinsDefines a set of operations outside the chips normal operation

    Semiconductor manufacturer is responsible for:Designing device for compliance to the IEEE 1149.1 Standard

    Many components are now Boundary-Scan compliantMany components are now Boundary Scan compliantMicroprocessors, CPLDs, ASICs, FPGAs, DSPs & MemoryFLASH Memory is programmable, via Boundary-Scan

    Providing A Compliant BSDL fileProviding A Compliant BSDL file

    October 2009

  • What is IEEE 1149.1 boundaryWhat is IEEE 1149.1 boundary--scan?scan? A chip level standard adopted A chip-level standard, adopted

    by the IEEE in 1990 4 (or 5) added pins form the Test

    Access Port (TAP) Additional logic inside the IC: scan

    cells on I/Os, controller & registers

    Data from the boundary-scan

    IC Core

    source (on TDI) can be loaded into the device

    and read from the device pins on TDO

    TDOTDI Bypass

    Instruction Reg.TDO

    Optional 5th line TRST active low asynchronous reset TMS

    TCKController

    ID Register

    Every I/O on a compliant IC becomes a test point TRST

    October 2009

  • IEEE 1149.1 ArchitectureIEEE 1149.1 Architecture

    Internal

    Core Logic

    Shift-DRShift Bypass

    Shift IR Identification

    Bypass

    TDI TDOShift IR Identification

    Instruction

    TAPTMSTCK

    TDI TDO

    ControllerTCK

    October 2009

  • IEEE 1149.1 State MachineIEEE 1149.1 State MachineTest-Logic Data Register Instruction RegisterTest Logic

    Reset

    Run-TestIdle

    SelectIR-scan

    SelectDR-scan

    1

    0 1 1 1

    00

    0

    Data Register Instruction Register

    Capture-IR

    Shift-IR

    Capture-DR

    Shift-DR

    1

    1

    1

    1

    00

    00

    Exit1-IR

    Pause-DR

    Exit1-DR

    Pause-IR

    11

    1

    0

    0

    0

    0

    Exit2-IRExit2-DR

    Update-DR Update-IR

    1

    1

    1

    1

    00

    TMS: 0,1

    Update DR1 1 00

    October 2009

  • The Instruction RegisterThe Instruction RegisterDecoded Output to

    Selected Data Registers

    Internal

    core logic

    Hold ElementsIdentification

    Instruction

    TAPcontroller

    TMS

    TCK

    TDI TDOBypass

    Decoder

    TDI TDOTMS Clock-DR Shift RegisterTDITMS

    TCK

    TRST

    TestAccess

    Port

    TAP

    Clock-DRShift-DRUpdate-DRCapture-DRTCKClock-IRShift-IRUpdate-IR

    0 1IR Length 2>

    TRST(optional) controller Capture-IR

    Select

    October 2009

  • BoundaryBoundary--Scan InstructionsScan Instructions

    Instruction Code Selected Data Register

    Bypass/

    111..11 Bypass (Initialized state)mandatorySample/Preload

    Extest

    Intest

    000..00Boundary-ScanBoundary-Scan

    Boundary-Scan

    mandatory

    IdcodeRunBistScan

    Identification or BypassInternal BISTInternal Scan

    optional

    Usercode

    ClampHighZ

    Internal ScanIdentificationBypass: outputs from BS cellsBypass: outputs in High Z stateHighZ Bypass: outputs in High-Z state

    October 2009

  • The BoundaryThe Boundary--Scan (DATA) RegisterScan (DATA) RegisterX-Bit Shift Register

    A Data Register Selected by One Of The

    Instructions:

    - EXTEST

    SAMPLE PRELOAD

    Internal

    core logic

    - SAMPLE PRELOAD

    - INTEST

    - ????

    TDI TDOBypass

    Identification

    Instruction

    Parallel Input and/or Output TMSTCK

    TAPcontroller

    October 2009

  • Cell Types of the Boundary RegisterCell Types of the Boundary Register

    TDI TDO

    CELL CELLINPUT

    CORE LOGIC

    CELL

    CELL

    2-STATE OUTPUT

    INPUT

    CLOCK

    CELL CELLLOGIC CELL

    CELL

    CELL

    3-STATE OUTPUTCELLINTERNAL

    BI-DIRECTIONAL

    CELLCELL

    October 2009

  • Bypass (DATA) RegisterBypass (DATA) RegisterOne Bit Shift Stage

    Selected by BYPASS Instruction Internal

    No Parallel Output

    Captures a Hardwired 0

    core logic

    Identification

    TDI TDOBypass

    GShift-DR

    Instruction

    TAP

    controller

    TMS

    TCK

    _11 1DTDI

    0

    C DRTDO

    C1Clock DR

    October 2009

  • Identification RegisterIdentification RegisterMain Function: Identify the Device

    32-Bit Shift Register

    Selected by IDCODE Instruction

    No Parallel Output

    Captures a 32 Bit Hardwired Word

    Internal

    core logicCaptures a 32 Bit Hardwired Word

    If No Identification Register

    Is Present, The BYPASS Instruction Identification

    TDI TDOBypass

    Must be SelectedInstruction

    TAPcontroller

    TMS

    TCK

    **Part of infrastructure test

    October 2009

  • Device identification code structureDevice identification code structure

    Version Part Number Manufacturer 1

    31 28 27 12 11 1 0

    4 Bits 16 Bits 11 Bits 1 Bit

    Compressed FormOf JEDEC Code

    Manufacturers Own Coding

    Version Code

    GShift-DR

    Of JEDEC CodeOwn Coding

    _11 1D

    0 / 1TDI

    Clock DR

    TDO

    C1Clock DR

    October 2009

  • Applying boundaryApplying boundary--scan to the PCBscan to the PCB Example of a PCBScan device #1 Example of a PCB

    with one boundary-scan chain

    Typically only a

    Scan device #1

    Scan device #2TDI

    TDOTMS

    TCK

    T

    A

    P

    Typically, only a fraction of the ICs need to be scan-compliant

    TCK

    Scan device #3

    October 2009

  • Alternate partitioning (2 chains)Alternate partitioning (2 chains) Chains are testedScan device #1 Chains are tested

    concurrently for max throughput with no loss of test

    Scan device #1

    Scan device #2TDI

    TDOTMS

    T

    A

    P

    1

    coverage

    Up to 4 chains with single QuadPOD

    TCK

    Provides valuable design flexibility*

    *To be discussed

    Scan device #3

    *To be discussed in DFT sectionTDI

    TDOTMS

    TCK

    T

    A

    P

    2

    TCK

    October 2009

  • TAP2D I/O

    Board LevelBoard LevelApplicationsApplications Digital I/O

    scan moduleApplications Applications

    Testing

    TAP1

    uP

    +

    ClustersR

    Connector Infrastructure Interconnections

    TAP

    FPGA

    PLD

    Memory A/D buses & control signals

    P

    R

    SD

    Flash memories

    Programming

    CPLDs, FPGAsSD

    F

    Cluster Cluster

    F

    Connector(w/ AutoWrite)

    October 2009

  • Infrastructure Capture test Infrastructure Capture test TCKTCK

    TMSTMS

    Test logic reset

    Select-DRRun-test/idle

    Select-IRCapture-IR

    Shift-IRExit-1

    October 2009

  • BoundaryBoundary--Scan Test PrincipleScan Test PrincipleStage 1 Shift Data to Output cellStage 1 Shift Data to Output cell

    1

    core core0

    1 0

    October 2009

  • BoundaryBoundary--Scan Test PrincipleScan Test PrincipleStage 2 Update Data from Output Cell to NetStage 2 Update Data from Output Cell to Net

    11

    core core

    1

    0 0

    October 2009

  • BoundaryBoundary--Scan Test PrincipleScan Test PrincipleStage 3 Capture Data from Net to Input cell

    1 11

    core core0 00

    October 2009

  • Stage 4 Shift Captured Data OutBoundaryBoundary--Scan Test PrincipleScan Test Principle

    Stage 4 Shift Captured Data Out

    1

    core core0

    0 1

    October 2009

  • Ieee 1149 4

    Extensions to the IEEE 1149.1 StandardExtensions to the IEEE 1149.1 StandardIeee 1149.4 Released in 1999 Analog testing, voltage measurement and current driving

    Drive and sense analog values via 2 additional pins and busses internal to the ICU / Up until now, very limited deployment/nonexistent

    JTAG offers analog evaluation kits

    Ieee 1149.6 Approved March 20, 2003 For high-speed AC-coupled nets and differential signaling

    Ieee 1532Ieee 1532 Latest version: Dec. 11, 2002 Standardizes PLD programming among various vendors

    Allows concurrent programming, mixed vendor chains BSDL files include the programming algorithms BSDL files include the programming algorithms

    October 2009

  • The ShowThe Show

    October 2009