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Henkel –Your partner worldwide Henkel Solutions

Defense & Aerospace Industry

Unless otherwise indicated, all marks used are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere. © Henkel Corporation, 2010. All rights reserved. 6460/LT-5294 (4/2010)

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Defense and Aerospace . . . . . . . . . 1, 2

Paste Adhesives . . . . . . . . . . . . . . . . 3, 4

Film Adhesives . . . . . . . . . . . . . . . . . . . 5

Underfills and Encapsulants . . . . . . . . 6

Conformal Coatings . . . . . . . . . . . . . . 7

Solder Pastes and Fluxes . . . . . . . . . . 7

PCTIM . . . . . . . . . . . . . . . . . . . . . . . . . . 8

TABLE OF CONTENTS

Henkel has more than 35 years of experience in supplying the defense and aerospace industry with Ablestik, Acheson, Emerson & Cuming, Loctite, Hysol and Multicore product solutions. We are qualified and specified by all major defense and aerospace OEMs and contractors, supporting our products through a worldwide sales, application engineering, research and development, and manufacturing network.

Our state-of-the-art products, certification to major defense and aerospace specifications, and technical expertise ensure that products built with Henkel electronic assembly materials will be the highest in performance and in reliability. We are committed to meeting and exceeding your requirements with:

• MIL-STD-883,Method5011 approved products

• NASAoutgassingASTME 595-77/84/90approvedproducts

• Provenfilmandpastetechnologyin defense and aerospace applications

• Customfilmpre-form manufacturing capability

• Low-risksupplychain


1

PCB AssemBly mArket solutions

DeFense AnD AerosPACe

Paste Adhesives

eCCoBonD Ce8500

eCCoBonD Ce3103

loCtite 3880

trA-DuCt 2902

eCCoBonD XCe-3104Xl

eCCoBonD 57C A/B

ABleBonD 8700e

ABleBonD 84-1lmisr4

ABleBonD 8175

ABleBonD 56C

eCCoBonD e3503-1

trA-BonD F112

eCCoBonD e8502-1

eCCoBonD 104 A/B

trA-BonD 2151

ABleBonD 8700k

ABleBonD 967-3

ABleBonD 84-3

ABleBonD 84-1lmit1

non-electrically Conductive

electrically Conductive

Defense and Aerospace

ABleBonD85-1

ABleBonD967-1

eCCoBonD Ce3535-1

trA-BonD 724-14C

Film Adhesives

electrically Conductiveelectrically insulating

and thermally Conductive

ABleFilm 5025e

emerson & CuminGCF3350

ABleFilm eCF561e

ABleFilmeCF564A

ABleFilmeCF568

emerson & CuminGCF3366

ABleFilm 550k

ABleFilm 561k

ABleFilm563k

ABleFilm564A

ABleFilm5020k

electrically insulatingelectrically Conductive

ABleBonD 958-11

2



Solder MaterialConformal

Coating

non-Conductive

PCTIM

thermal Pads

loCtite isostrate

loCtite Powerstrate

Xtreme

loCtite silverstrate

Fluxessolder Paste

Encapsulants

non-Conductive

Underfills

non-Conductive

Hysol FP4526

ABleBonD uF8807

emerson & CuminGXe1218

loCtite 3549

Hysol FP4451tD

Hysol FP4460

Hysol FP4470

styCAst 2651

styCAst 50500-1

styCAst 50500D

styCAst 2850Ft

Hysol PC12-007m

eCCoCoAt uV7993

Hysol PC18m

multiCore mP218

multiCore Ws200

multiCore HyDro-X 20

multiCore mFr301

Defense and Aerospace

non-electrically Conductive

electrically Conductive

3


DeFense AnD AerosPACePAste ADHesiVes: eleCtriCAlly ConDuCtiVe

PROD

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C (M

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ABLEBOND 84-1LMISR4

For small components or high speed dispense manufacturing, consider this die attach material.

MIL-STD-883, Method 5011

N/A 8,000 1 x 10-4 2.5 N/A 18 120 40/1501 hr.

@ 175°CN/A 12

ABLEBOND 84-1LMIT1

For the most demanding applications needing both excellent electrical and thermal conductivity, consider this paste for both dispense and screen printing.


Yes 22,000 1 x 10-4 3.6 1,885 2 wks. 103 52/200 1 hr. 2 hrs. 12

ABLEBOND 85-1

Eliminate migration or corrosion concerns and easily tune your high frequency modules with this gold-filled paste.


N/A paste 8 x 10-4 2 N/A 2 days 107 N/A 1 hr. 2 hrs. 12

ABLEBOND 967-1

Reduce risk to your delicate components with this low temperature cure, electrically conductive paste or increase your manufacturing through-put with a quick cure.

N/A Yes 14,0001.5 x 10-2 Good 1,200 2 days 75 68/216 15 min.

6 hrs. @ 65°C

12

ABLEBOND 8175

This MIL STD 883, MTD 5011 certified electrically conductive paste has a proven history for large die attach applications where CTE mismatch is an issue.


N/A 55,000 5 x 10-4 3.2 1,650 2 wks. 90 55/200 30 min.1 hr.

@ 130°C12

ABLEBOND 8700E

For quality assurance in long life expectancy programs, consider this large chip attach material with excellent performance in thermal cycling.


Yes 19,000 2 x 10-4 2.1 N/A 7 days 160 45/1201 hr.

@ 175°C2 hrs.

@ 160°C12

ECCOBOND 56C/CAT 11

High electrical and thermally conductive 2-component adhesive.

N/A Yes paste 2 x 10-4 3 800 4 115 N/A8 hrs.

@ 80°C2 hrs.

@ 100°C12 mos. @ 25°C

ECCOBOND 57C A/B

Convenient 1-to-1 mix ratio, high electrical and thermally conductive 2-component adhesive.

N/A Yes paste 6 x 10-4 7 700 1 N/A N/A45 min.

@ 100°C24 hrs. @ 25°C

12 mos. @ 25°C

ECCOBOND CE3103

For Sn, Sn/Pb and OSP-coated Cu metalizations, consider this lead-free dispensable adhesive alternative to SMD.

N/A N/A 40,000 7 x 10-4 N/A 1,150 24 109 45/146 3 min. 5 min. 6

ECCOBOND CE3535-1

Electrically conductive adhesive compatible with 100% tin finished components, providing a lead free alternative to solder.

N/A N/A 100,0003.3 x 10-3 N/A N/A 2 days N/A N/A

60 min. @ 150°C

10 min. @ 175°C

4 mos. @ -40°C

ECCOBOND CE8500

Low stress adhesive with high temperature characteristics and low modulus.

N/A N/A 120,000 5 x 10-4 4 450 2 days 24 N/A 40 min.2 hrs.

@ 110°C12

ECCOBOND XCE3104XL

For reliable SMD assemblies and improved fine pitch printing capability, utilize this electrically conductive paste.

N/A N/A 54,000 5 x 10-4 1.8 N/A 2 days 109 46/16015 min.

@ 125°C10 min.

@ 150°C6

LOCTITE 3880

Syringe or stencil dispense, silver conductive adhesive for solder replacement. Long work life. Can be stored in conventional refrigerator (-40°C freezer not required).

N/A N/A N/A 6 x 10-4 >2 600 N/A 40 45 6 min. 10 min.3 mos. @ 1°C

TRA-DUCT 2902

2-component, room temperature cure, general purpose, conductive adhesive.

N/A Yes 20,000 6 x 10-4 3 1,600 1 52 4924 hrs. @ 25°C

1-4 hrs. @ 65°C

N/A

4



PR

ODUC

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DESC

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150

°C

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OPT

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@

125

°C

STOR

AGE

LIFE

@

25°

C (M

ONTh

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ABLEBOND 84-3

Eliminate concerns of reliability and outgassing with this MIL-STD-883, MTD 5011 electrically insulating material for chip attach applications.


Yes 50,0003.5 x 1015 0.83 N/A 2 wks. 85 40/100 1 hr. 2 hrs. 12

ABLEBOND 958-11

This flexible electrically insulating paste offers you freedom in design through management of CTE mismatch.


N/A 45,000 5 x 1014 Good 2,700 2 wks. 89 15/45 1 hr.2 hrs.

@ 130°C12

ABLEBOND 967-3

Reduce risk to your delicate components with this low temperature cure electrically insulating paste or increase your manufacturing through-put with a quick cure.


N/A 7,000 2 x 1013 0.7 1,700 2 days 85 N/A 5 min. 6 hrs.

@ 65°C12

ABLEBOND 8700K

For quality assurance in long life expectancy programs consider this hybrid component attach material with excellent performance in thermal cycling.


Yes 45,0003.5 x 1014 0.5 N/A

30 days

165 20/551 hr.

@ 175°C2 hrs.

@ 160°C12

ECCOBOND 104 A/B

For high strength and chemical resistance, consider this adhesive.

N/A N/A 25,000 1 x 1015 N/A 1,800 12 225 60 3 hrs.6 hrs.

@ 120°C6

ECCOBOND E3503-1

For the attachment of high power LEDs and other heat sensitive devices, consider this long pot life, low temperature cure material.

N/A N/A 60,000 N/A 1.0 1,200 7 days 95 N/A30 min.

@ 100°C5 min.

@ 150°C6

ECCOBOND E8502-1

Low stress adhesive with high temperature performance and low modulus.

N/A N/A 45,000 4 x 1013 1 450 2 days 65 N/A 1 hr.90 min.

@ 120°C6 mos.

@ -20°C

TRA-BOND 724-14C

Polyurethane adhesive with excellent adhesion even in cyrogenic conditions.

N/A N/A 500,000 1 x 1010 N/A 1,700 30 min. N/A N/A72 hrs. @ 25°C

3 hrs. @ 74°C

N/A

TRA-BOND 2151

Thermally conductive adhesive. N/A Yes 40,000 10 x 1015 1.0 2,850 1.5 60 2524 hrs. @ 25°C

2-4 hrs. @ 65°C

12

TRA-BOND F112

Low stress, impact resistant, low viscosity adhesive.

N/A N/A 1,800 N/A N/A 3,000 1 100 6024 hrs. @ 25°C

1 hr. @ 65°C

N/A

PAste ADHesiVes: eleCtriCAlly insulAtinG

5


DeFense AnD AerosPACeFilm ADHesiVes: eleCtriCAlly ConDuCtiVe

Film ADHesiVes: eleCtriCAlly insulAtinG AnD tHermAlly ConDuCtiVe

PROD

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DESC

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TIM

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@ 1

50°C

CURE

OPT

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@

125

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STOR

AGE

LIFE

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-40

°C

(MON

ThS)

ABLEFILM 5025E

High conductivity and low flow enable efficient manufacturing and high performance. Also available in gold-filled version.

N/A N/A None 2 x 10-4 7 3,000 530 90 2, 4 3 30 min. 2 hours6 mos. @ 5°C

ABLEFILM ECF561E

MIL-STD-883, MTD 5011 certified electrically conductive film. Has a proven history for substrate attach, heat sink and grounding applications in defense and aerospace applications.


Yes None 2 x 10-4 3.5 2,500 528 902, 3, 4,

5, 63 30 min. 2 hours 12

ABLEFILM ECF564A

Electrically conductive film containing rubberized particles offering an excellent balance of strength, adhesion and flexibility. Specifically designed to maintain adhesion at elevated temperatures, ensuring effective grounding under extreme conditions.


N/A None 2 x 10-4 1,500 580 190 4 3 1 hour 2 hours6 mos. @ 5°C

ABLEFILM ECF568

High strength, flexible, electrically conductive film offering freedom in design through management of CTE mismatch.

N/A Yes Glass6.5 x 10-3 1.6 2,000 585 47 5

4 days

1 hour 2 hours 12

EMERSON & CUMING

CF3350

Eliminate any concerns of moisture and chemical corrosion with this high purity, low outgassing, electrically conductive film.


N/A Glass 4 x 10-4 3.8 2,200 N/A 150 53

days2 hours N/A 12

EMERSON & CUMING

CF3366

Reduce risk to your delicate components with this low temperature cure, high flow film.

N/A Yes Glass 3 x 10-4 0.9 5,100 530 113 5, 624

hours2 hours @ 95°C

4 hours @ 75°C

12

PROD

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WOR

K LI

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CURE

TIM

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@ 1

50°C

CURE

OPT

ION

@

125

°C

STOR

AGE

LIFE

@

-40

°C

(MON

ThS)

ABLEFILM 550K

Utilize an array of difficult-to-bond substrates with this high strength material.

N/A Yes Glass 7.2 x 1017 0.8 3,300 1,200 102 5 6 30 min. 2 hours 12

ABLEFILM 561K

This high strength, flexible, electrically insulating film offers you freedom in design through management of CTE mismatch.

N/A N/A Glass 1.0 x 1013 0.8 3,300 632 55 5 6 30 min. 2 hours 12

ABLEFILM 563K

For the high thermal conductivity, consider this electrically insulating high strength film.

N/A N/ANone

or Glass

1.2 x 1013 1.1 3,000 930 974 (None) 5 (Glass)

3 30 min. 2 hours 12

ABLEFILM 564A

Eliminate any concerns of moisture and chemical corrosion with this high purity, low outgassing, electrically insulating film.


N/A Glass 2 x 1014 0.29 3,800 N/A 140 4, 5 3

days2 hours N/A 12

ABLEFILM 5020K

Excellent adhesion to gold-plated surfaces and high strength ensure the integrity of your hermetic packages.


Yes Glass 8 x 1014 0.7 3,000 1,100 109 4, 5, 6 6 1 hour N/A 12

6


DeFense AnD AerosPACeunDerFill: non-ConDuCtiVe

enCAPsulAnts: non-ConDuCtiVe

PROD

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APPL

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MIL

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TIM

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OPT

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STOR

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-40

°C(M

ONTh

S)

ABLEBOND UF8807

Eliminate any concerns about moisture and chemical corrosion with this high performance cynate ester underfill.

Underfill N/A N/A 13,000 N/A 0.6 N/A 8 135 21/8030 min.

@ 165°C3 hrs.

@ 125°C12 mos. @ -40°C

EMERSON & CUMING

XE1218

Reworkability enables you to preserve your high value CSPs, BGAs and boards.

Underfill N/A N/A 1,400 4 x 1011 N/A N/A 24 15 7510 min.

@ 110°C22 min.

@ 100°C6 mos.

@ -20°C

hYSOL FP4526

Epoxy underfill designed for capillary flow under flip chip components.

Underfill N/A N/A 4,700 N/A N/A N/A 36 133 3330 min.

@ 165°CN/A

9 mos. @ -40°C

LOCTITE 3549

Next generation reworkable underfill for thermal mechanical reliability. Designed to snap cure at low temperatures to minimize thermal stress on PCBs. Fast flow for improved process time.

Underfill N/A N/A 2,200 8.1 x 10114 N/A N/A 14 days 26 675 min.

@ 120°C3 min.

@ 130°C6 mos.

@ 2-8°C

PROD

UCT

DESC

RIPT

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APPL

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MIL

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TIM

E

CURE

OPT

ION

@

125

°C

STOR

AGE

LIFE

@

-40

°C

(MON

ThS)

hYSOL FP4451TD

Tall dam version of FP4451 for applications requiring a taller narrower dam. Ionically clean.

Dam N/A N/A 300,000 N/A N/A N/A N/A 150 21

30 min. @ 125°C + 90 min. @ 165°C

90 min. @ 165C

12 mos. @ -40°C

hYSOL FP4460

High purity, low stress, glob top encapsulant with high moisture resistance and long working life.

COB N/A N/A N/A N/A N/A N/A 2 days 171 203 hrs.

@ 150°CN/A

9 mos. @ -40°C

hYSOL FP4470

High adhesion version of FP4450 for 260°C L3 JEDEC performance.

Fill N/A N/A 48,000 N/A N/A N/A N/A 148 1830 min.

@ 125°C90 min. @ 165C

9 mos. @ -40°C

STYCAST 50500D

For protection of wire bonds, consider this high purity material for use either as a dam or a glob top.

Dam N/A N/A 125,000 N/A 0.6 1,300 N/A 70 80 2 hrs. N/A4 mos.

@ -40°C

STYCAST 50500-1

For protection of wire bonded ICs, consider this flowable material for a fill.

Fill N/A N/A 35,000 N/A 0.6 N/A N/A 140 20 1 hr. N/A4 mos.

@ -40°C

STYCAST 2651/CAT 11

For excellent adhesion, low outgassing and certification to MIL-I-16923, consider this encapsulant.

Encapsulant MIL-I-16923 Yes 25,000 5 x 1016 0.66 9,000 4 N/A 401 hr.

@ 120°C8 hrs.

@ 80°C6

STYCAST 2850FT/CAT 11

For high thermal conductivity and low outgassing, consider this encapsulant.

Encapsulant N/A Yes 5,600 1 x 1015 1.02 N/A 4 115 31/981 hr.

@ 120°C8 hrs.

@ 80°C12

7


DeFense AnD AerosPACeConFormAl CoAtinG: non-ConDuCtiVe

PROD

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DESC

RIPT

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APPL

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@ 1

50°C

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OPT

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@

125

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STOR

AGE

LIFE

@

-40

°C

ECCOCOAT UV7993

For rugged protection without limiting your manufacturing through-put, consider this environmentally friendly, UV-conformal coating.

Conformal Coating

MIL-I-46058C

N/A 120 2.2 x 1016 N/A N/A N/A N/A N/A

UV tack, 50%

Humidity, 25°C for 100 hrs.

UV tack, 70%

Humidity, 25°C,

50 hrs.

6 mos. @ 125°C

hYSOL PC12-007M

Hysol PC12-007M is a 100 percent solids, general purpose, epoxy-printed circuit coating developed to meet military requirements. The coating is suitable for continuous operation up to 125ºC (257ºF) and may be used on any substrate offering good adhesion.

Conformal Coating

MIL-I-46058C

N/A7,500-20,000

1 x 1014 N/A N/A 1,5 N/A N/A2 hrs.

@ 75°CN/A

18 mos. @ 25°C

hYSOL PC18M

Solvent based, 1-component urethane conformal coating providing superior toughness, abrasion and solvent resistance.Meets MIL-I-46058C requirements.

Conformal Coating

MIL-I-46058C

N/A300-400

2 x 1013 N/A N/A N/A N/A N/A

2 hrs. @ 60°C

with 30%-50%

RH

7 days @ 25°C

with 30%-50%

RH

18 mos. @ 25°C

PROD

UCT

DESC

RIPT

ION

APPL

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ALLO

Y

MET

AL L

OADI

NG, %

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, G/M

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MULTICORE MP218

Halide-free, no-clean, pin-testable solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing.

No-clean tin leadSn62/Sn63/63S4 (anti-tombstoning)

89.5% - 90.0% 1.6 25-100 ROLD

MULTICORE WS200

High performance, water-washable solder paste. Residues are readily removed with DI water, without the need for a saponifer. WS200 has good open time with excellent print definition and soldering activity.

Water wash tin lead

Sn62/Sn63/63S4 (anti-tombstoning)

90.50% 0.8 25-101 ORH1

PROD

UCT

DESC

RIPT

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SOLI

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ACID

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MG

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APPL

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MULTICORE hYDRO X20

Water soluble flux formulated for use on electronic assemblies designed for water cleaning. Meets requirements of MIL-P-28809A.

20 24 ORH1 Spray/Foam

MULTICORE MRF301

No-clean, highly active, liquid flux for surfaces with poor solderability. 6.0 40 ROM0 Spray/Foam

solDer mAteriAl: solDer PAste

solDer mAteriAl: FluXes

8



PCtim: non-insulAtinG

PROD

UCT

DESC

RIPT

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ThER

MAL

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DANC

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°C-I

N2 /W

@ 8

0 PS

I

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@ 5

50 K

PA

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MAL

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TIVI

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PhAS

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MP.

, °C

VOLU

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GTh,

V/

MIL

TOTA

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ICKN

ESS,

IN.

LOCTITE POWERSTRATE XTREME

Unsupported film with superior thermal performance even at low pressures. Direct attach to heat sink at room temperature without adhesive.

0.003 0.022 3.40 45 N/A N/A 0.008

PROD

UCT

DESC

RIPT

ION

ThER

MAL

IMPE

DANC

E,

°C-I

N2 /W

@ 8

0 PS

I

ThER

MAL

IMPE

DANC

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°C-I

N2 /W

@ 5

50 K

PA

ThER

MAL

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NDUC

TIVI

TY, W

/MK

PhAS

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ANGE

TE

MP.

, °C

VOLU

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Oh

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GTh,

V/

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TOTA

L Th

ICKN

ESS,

IN.

LOCTITE ISOSTRATEIndustry standard, electrically insulating, phase change material

0.120 0.780 0.45 60 N/A4,500

minimum0.002 - 0.006

PCtim: eleCtriCAlly insulAtinG

PROD

UCT

DESC

RIPT

ION

ThER

MAL

IMPE

DANC

E,

°C-I

N2 /W

@ 8

0 PS

I

ThER

MAL

IMPE

DANC

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°C-I

N2 /W

@ 5

50 K

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TIVI

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/MK

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VOLU

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IN.

LOCTITE SILVERSTRATE

Excellent thermal performance particularly at higher pressures. Typically used on RF devices and SCRs where electrical conductivity is required (silver-filled).

0.003 0.022 3.14 51 2 N/A 0.004

PCtim: eleCtriCAlly ConDuCtiVe

Defense and Aerospace . . . . . . . . . 1, 2

Paste Adhesives . . . . . . . . . . . . . . . . 3, 4

Film Adhesives . . . . . . . . . . . . . . . . . . . 5

Underfills and Encapsulants . . . . . . . . 6

Conformal Coatings . . . . . . . . . . . . . . 7

Solder Pastes and Fluxes . . . . . . . . . . 7

PCTIM . . . . . . . . . . . . . . . . . . . . . . . . . . 8

TABLE OF CONTENTS

Henkel has more than 35 years of experience in supplying the defense and aerospace industry with Ablestik, Acheson, Emerson & Cuming, Loctite, Hysol and Multicore product solutions. We are qualified and specified by all major defense and aerospace OEMs and contractors, supporting our products through a worldwide sales, application engineering, research and development, and manufacturing network.

Our state-of-the-art products, certification to major defense and aerospace specifications, and technical expertise ensure that products built with Henkel electronic assembly materials will be the highest in performance and in reliability. We are committed to meeting and exceeding your requirements with:

• MIL-STD-883,Method5011 approved products

• NASAoutgassingASTME 595-77/84/90approvedproducts

• Provenfilmandpastetechnologyin defense and aerospace applications

• Customfilmpre-form manufacturing capability

• Low-risksupplychain


Henkel –Your partner worldwide Henkel Solutions

Defense & Aerospace Industry

Unless otherwise indicated, all marks used are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere. © Henkel Corporation, 2010. All rights reserved. 6460/LT-5294 (4/2010)

Henkel Corporation15350 Barranca ParkwayIrvine, CA 926181-949-789-25001-800-562-8483


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