x3850x5techpresentation09 29-2010-101118124714-phpapp01

© 2009 IBM CorporationIBM Confidential

x3850 X5 Technical Presentation

March 30, 2009

Ralph M. Begun System Development Lead

[email protected]

Michelle GottschalkWW Product [email protected]

© 2009 IBM Corporation

System x and BladeCenter

2

IBM Confidential

NDA DISCLOSURE ONLY

x3850 X5 overview



3

IBM Confidential

NDA DISCLOSURE ONLY

IBM System x3850 X5Flagship System x platform for leadership scalable performance and capacityVersatile 4-socket, 4U rack-optimized scalable enterprise server provides a flexible platform for maximum utilization, reliability and performance of compute- and memory-intensive workloads.

System Specifications

4x Intel Xeon 7500-series CPUs 64 DDR3 DIMMs, up to 96 with MAX5 6 open PCIe slots (+ 2 additional) Up to 8x 2.5” HDDs or 16x 1.8” SSDs RAID 0/1 Std, Optional RAID 5/6 2x 1GB Ethernet LOM 2x 10GB Ethernet SFP+ Virtual Fabric / FCoEE Scalable to 8S, 128 DIMM Internal USB for embedded hypervisor IMM, uEFI & IBM Systems Director

Maximize Memory– 64 threads and 1TB capacity for 3.3x database and 3.6x

the virtualization performance over industry 2-socket x86 (Intel Xeon 5500 Series) systems

– MAX5 memory expansion for 50% more virtual machines and leadership database performance

Minimize Cost– Lower cost, high performance configurations reaching

desired memory capacity using less expensive DIMMs– eXFlash 480k internal IOPs for 40x local database

performance and $1.3M savings in equal IOPs storage

Simplify Deployment– Pre-defined database and virtualization workload optimized

systems for faster deployment and faster time to value

© 2009 IBM Corporation4

System x® and BladeCenter

MAX5

x3850 X5 and x3950 X5 Modelsx3850 X5 – Four Socket Scalable ServerIBM System x high end four-socket server with Intel 7500 Series processors, IMM, RAID 0,1, dualGigE, Emulex 10GigE, 2x1975W power supplies x3850 X5

x3850 X5 – Memory Expanded Four Socket Scalable ServerIBM System x high end four-socket scalable server with MAX5, IMM, RAID 0,1, dualGigE, Emulex 10GigE, 1x4QPI cable kit, 2x1975W power supplies

.

Workload Optimized ModelsRichly-configured models optimized for virtualization environments or database workloads

x3850 X57145-1RY 2x E7520 4 Core 1.86GHz18MB x4.8 95W (S4S), 4x4GB

7145-2RY 2x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 4x4GB

7145-3RY 2x E7540 6 Core 2.0GHzT,18MB x6.4 105W (S8S), 4x4GB

7145-4RY 2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB

7145-5RY 2x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S), 4x4GB

7145-E4Y2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB

x3850 X57145-2SY 4x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 8x4GB + eX5 MAX5, 2x2GB

7145-4SY 4x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB

7145-5SY 4x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB

x3950 X5 Virtualization Optimized Models

7145-4DX 4x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W. 64x4GB, +eX5 MAX5, 32x4GB, VMWare ESXi Hypervisor USB key

x3850 X5 Database Optimized Models

7145-5DY 2x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 4QPI, 8x4GB, 2x1975W, IMM, 1 x Intruder backplane, dual GigE, Emulex 10GigE

7145-4FY 4 x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W, 32x4GB, 16x1.8” 200GB SSD,RAID 5,67145-5GY 4 x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 130W, 32x4GB, 16x1.8”200GB SSD,RAID 5,6

x3850 X5 w/ MAX5



Intel Xeon chipset



Intel Boxboro-EX 4S design

• Connectivity– Fully-connected (4 Intel® QuickPath

interconnects per socket)– 6.4, 5.86, or 4.8 GT/s on all links– Socket-LS– With 2 IOHs: 82 PCIe lanes (72 Gen2

Boxboro lanes + 4 Gen1 lanes on unused ESI port + 6 Gen1 ICH10 lanes)

• Memory– CPU-integrated memory controller– Registered DDR3-1066 DIMMs running at

speeds of 800, 978 or 1066 MHz via on-board memory buffer

– 64 DIMM support (4:1 DIMM to buffer ratio)

• Technologies & Enabling– Intel® Intelligent Power Node Manager– Virtualization: VT-x, VT-d, & VT-c– Security: TPM 1.2, Measured Boot, UEFI– RAS features

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

Intel® QuickPath interconnects

BoxboroBoxboroX4ESI

BoxboroBoxboro

ICH10*

XeonXeon

XeonXeon

x8x8

2x4

x8 x4x8 x8x8

x16

x8 x4x8

x16

2x4

2x4

2x4 X4 P

CIe

Gen

1

XeonXeon

XeonXeon

6



• Modified Boxboro-EX ingredients to offer a new high-memory 2S platform

• Xeon 2S will only be validated with up to 2 IOHs

• Xeon 2S SKUs cannot scale natively (w/ QPI) beyond 2skts

• Xeon 2S SKUs can scale beyond 2skts with a node controller

• Comparison w/ Boxboro-EX & Tylersburg-EP:

Boxboro-EX 2S(2 IOH)

Tylersburg-EP(2 IOH)

# of cores per CPU Up to 8 Up to 4

QuickPath Interconnect

4^ 2

# of DIMMs 32 18

PCIe lanes 72+10 72+6

BoxboroBoxboroX4ESI

BoxboroBoxboro

ICH10*

XeonXeon XeonXeon

x8x8

2x4

x8

2x2

x4x8 x8x8

x16

x8

2x2

x4x8

x16

2x4

2x4

2x4 X4 P

CIe

Gen

1

Intel® QuickPath interconnects

Intel Boxboro-EX 2S Platform

Validated Configuration

7



Xeon® 7500/6500 Platform Memory

4 Socket platform capability (64 DIMMs):– Up to 16 DDR3 DIMMs per socket via up to four

Scalable Memory Buffers– Support for up to 16GB DDR3 DIMMs– 1TB with 16GB DIMMS

Memory types supported:– 1066MHz DDR3– Registered (RDIMM)– Single-rank (SR), dual-rank (DR), quad-rank (QR)

Actual system memory speed depends on specific processor capabilities. (see NHM-EX SKU stack for max SMI link speeds per SKU):

– 6.4GT/s SMI link speed capable of running memory speeds up to 1066Mhz– 5.86GT/s SMI link speed capable of running memory speeds up to 978Mhz**– 4.8GT/s SMI link speed capable of running memory speeds up to 800Mhz

RDI

MM

RDI

MM

RDI

MM

RDI

MM

SMB

XeonXeon7500/65007500/6500

4 SMI 2 DDR3

Up to 16 DIIMS

^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer

^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer** Memory speed sett by UEFI ; All channels in a system will run at the fastest common frequency

8



x3850 X5 system specifics



x3850 X5 – Chipset Basics

Intel

Xeon

Intel

Xeon

MB1MB1

MB1MB1

MB1MB1 MB1MB1

Intel

Xeon

MB1MB1

MB1MB1

MB1MB1MB1MB1

Intel

Xeon

Intel

BoxboroPCI-E

Intel

Boxboro PCI-E

DDR3 Memory DIMMs

Memory Buffer

SMI Link to CPU

Memory Card

MB1 MB2

1 3 8 6

2 4 7 5

Memory Controller (1 of 2 per CPU)

CPU’s connect via

QPI bus 6.4 GT/s max

Quick Path Interconnect



x3850 X5 – Block DiagramIntel Xeon Rack , Westmere EX drop in design, 4 CPUs, 64 DDR3, 7 PCIE, 8 HDD, QPI Cable to 8-socket

6.4GT/s

SMI (FBD2) 16 busesEach @ 6.4GT/s (2B Rd/1B Wr)

Cableor Wrap

Xeon CPU4

QPI

64 DDR3 DIMMs

32 buses @ 1066M

2 DIMMs per bus

QPI

Xeon CPU1

XeonCPU2

x8

x8x8 Slot 6

QPIQPI

Xeon CPU3

QPIQPI

Slot 1x16x4x8x8

Slot 2

SAS

Slot 3

PC3-10600R LP DIMMs1GB, x8, 1R, 1Gb2GB, x8, 2R, 1Gb4GB, x8, 4R, 1Gb8GB, x8, 4R, 2Gb16GB, x4, 4R, 2Gb

Xeon8-core

2.27 GHz

IBM CONFIDENTIAL

Boxboro1

ESI x4

ICH10Southbridge USB

LPCDVD

5709 EN

ESI x4

x8Slot 7

Slot 5

x4 + x4

Dual Gb

0

2

0

3

3

1

3

03

2

2

2

0

1

x4

Slot 4

10

1

0

1

1

Boxboro2

Memory Card 1

PROWL I/O and Power card

PCIe SAS connector on CPU card

MB1 MB2

1 32 4

8 67 5

0 01 1

12

Memory Card 3

MB1 MB2

1 32 4

8 67 5

0 01 1

21

Memory Card 4

MB1 MB2

2 41 3

7 58 6

0 01 1

34

Memory Card 7

MB1 MB2

1 32 4

8 67 5

0 01 1

21

Memory Card 8

MB1 MB2

2 41 3

7 58 6

0 01 1

34

Memory Card 2

MB1 MB2

2 41 3

7 58 6

0 01 1

43

Memory Card 5

MB1 MB2

1 32 4

8 67 5

0 01 1

12

Memory Card 6

MB1 MB2

2 41 3

7 58 6

0 01 1

43

STARSCREAM CPU Card

iBMC, TPM4 Back, 2 Front

8 Memory Cards

Cableor Wrap 2 Int, 2 iBMC

SATA

PCIe Slots 1-4 Full LengthSlot 2 has x8 connector

PCIe Slots 5-7 Half Length

Dual 10Gb



x3850/x3950 X5 - 4 Socket 4U EX platform

6 Fans

2x – 1975 W P/S

4U Rack Mechanical ChassisFront view

(2x) 1975W Rear Access Hot Swap, Redundant P/S

(4x) Intel Xeon EX CPU’s

(8x) Memory Cards – 8 1066MHxDDR3 DIMMs per card

7x - PCIe Gen2 Slots

2x 60mm Hot Swap Fans

(8x) Gen2 2.5” Drives

(2x) 120mm Hot Swap Fans

Dual USB

DVD Drive

Light PathDiagnostics

RAID Card



x3850 X5 rear view

QPI cables

(2x) 1975W Rear Access Hot Swap, Redundant P/S w/120mm fan

(4x) PCIe full length

(3x) PCIe half length x8

Emulex 10Gb Ethernet

Dual Backplane – SAS & SSD



x3850 X5 front view

(2x) 1975W Rear Access Hot Swap, Redundant P/S

(4x) Intel Xeon EX CPU’s

(8x) Memory Cards – 8 1066MHxDDR3 DIMMs per card 7x - PCIe Gen2 Slots

2x 60mm Hot Swap Fans

(8x) Gen2 2.5” Drives

(2x) 120mm Hot Swap Fans

Dual USB Light Path Diagnostics

RAID Card

DVD Drive

10Gb Ethernet Adapter



System Images - Interior

PS1

PS2

Boxborro 2

Boxborro1

M5015 RAID

HS Fan Pack

PCIe x16PCIe x4PCIe x8

PCIe x8PCIe x8PCIe x8

PCIe x8

USB

System Recovery Jumpers

CPU1

CPU2

CPU3

CPU4Slot 7

Slot 6

Slot 5

Slot 4

Slot 3

Slot 2

Slot 1

Mem Card 1

Mem Card 2

Mem Card 3

Mem Card 4

Mem Card 5

Mem Card 6

Mem Card 7

Mem Card 8

SAS Backplanes + HDD Cage



New x3850 X5 memory card

Specifications :64 DDR3 DIMMs32 buses @ 1066M2 DIMMs per bus

SMI - 16 busesEach @ 6.4GT/s (2B Rd/1B Wr)

PC3-10600R LP DIMMs1GB, x8, 1R, 1Gb2GB, x8, 2R, 1Gb4GB, x8, 4R, 1Gb8GB, x8, 4R, 2Gb16GB, x4, 4R, 2Gb



17

IBM Confidential

NDA DISCLOSURE ONLY

System Images – Chassis View

Front Access 120mm fans

Rear I/O Shutttle

Rear Access HS PSUs - lift up on handle then pull out

QPI Scalability Ports / Cables



18

IBM Confidential

NDA DISCLOSURE ONLY

System Images – CPU and Memory

Memory Cards

CPU and Heatsink installation



19

IBM Confidential

NDA DISCLOSURE ONLY

System Images - Options

M1015 RAID card and Installation bracket

8 HDD SAS Backplane



20

IBM Confidential

NDA DISCLOSURE ONLY 20

CP

U

MC2

MC1

Memory Buffer 2

Memory Buffer 2

Memory Buffer 1

Memory Buffer 1

DIMM 2

DIMM 1

DIMM 4

DIMM 3

DIMM 7 DIMM 5

DIMM 8 DIMM 6

DIMM 6DIMM 8

DIMM 7

DIMM 1 DIMM 3

DIMM 2 DIMM 4

DIMM 5

Memory Card 1

Memory Card 2

SMI Lane 1

SMI Lane 4

SMI Lane 2

SMI Lane 3

Channel 0

Channel 0

Channel 0

Channel 0 Channel 1

Channel 1

Channel 1

Channel 1

x3850 X5 DIMM Population Rules

General Memory Population Rules• DIMM’s must be installed in matching

pairs• Each memory card requires at least 2

DIMM’s

Memory Population Best Practices• Populate 1 DIMM / Memory Buffer on

each SMI lane 1st

• Populate 1 DIMM / Memory Buffer across all cards before moving to populate the next channel on the Memory Buffer

• Populate DIMMs furthest away from Memory Buffer 1st (ie – 1, 8, 3, 6) before populating 2nd DIMM in channel

• Memory DIMMs should be plugged in order of DIMM size

• Plug largest DIMMs first, followed by next largest size

• Each CPU & memory card should have identical amounts of RAM

Optimally expandable memory config is 2 memory cards / CPU, 4 DIMMs / memory card, equal amounts of memory / card

20



21

IBM Confidential

NDA DISCLOSURE ONLY 21

Card # PCIe Slot #

1 1

2 5

3 3

4 6

5 4

6 7

7 2

x3850 X5 PCIe Slot Population

Plug one PCIe card / Boxboro before moving to next set of slots

21



22

IBM Confidential

NDA DISCLOSURE ONLY

x3850X5 Supported Internal ServRAID adapters

22

ServRAID M1015

Features and Functions

• Two x4 internal SAS / SATA ports

• RAID Levels 0, 1, 10• LSI SAS2008 RAID on Chip

(ROC) • Low-profile PCIe ½ Length

card• X8 PCIe Gen 2 host interface

ServRAID M5015

Features and Functions

• Two x4 internal SAS / SATA ports• X8 PCI e Gen 2 host interface• RAID Levels 0, 1, 5, 10, 50 (6, 60

Optional)• 800MHz 72-bit ECC DDR2 SDRAM

Memory (512 MB)• LSI SAS2108 6Gb/s RAID on Chip• Low-profile PCIe ½ Length card• Encryption Services

• Instant Secure Erase• Local Key Management

• MegaRAID Management Suite• MegaRAID Storage Manager• MegaCLI (command-line

interface)• WebBIOS

• Intelligent Battery Backup Unit

Multiple RAID Adapters to meet Multiple Performance Requirements

22

Bertram:optional for x3850 X5, std on x3690



23

IBM Confidential

NDA DISCLOSURE ONLY

Emulex 10Gb Ethernet adapters for eX5 Superior 10Gb/s performance

– Dual-channel, 10Gb/s Ethernet Link speed– 3.6m packets per second (pps), full line rate– TCIP/IP stateless offloads– TCP Chimney Offload

Energy efficient design– Industry-leading performance per watt– Complements data center “green” initiatives

One platform for network and storage connection– Future-proof option to purchase an entitlement to enable

storage support (i.e. change personality)*– Simplifies I/O hardware choices for IT managers

•Lower Capital Expense (CapEx)•Lower Operational Expense (OpEx)

Two Options– Integrated for low cost, ordering ease– Option for expandability, flexibility

Extended Edge Connector

Integrated

Option



24

IBM Confidential

NDA DISCLOSURE ONLY

Rebranded Emulex CNA keyed for Slot 7 only

Initial support for 10Gb Ethernet Shipped with Copper Connectors,

SFP+ Optics are Optional Interoperability with mutliple

vendors switches– Upcoming BNT 10Gb ToR VFA Switch

for vNIC/NIC and FCoE functions– Cisco N5K, Brocade 10GbE switches

for NIC/FCoE Integration into IBM UEFI menus

IBM x3850X5 Integrated 10Gb NIC

Extended Edge Connector

24



25

x3850 X5 – Hardware; Speeds and Feeds

Processors 4 Socket Intel Xeon 7500 series (4) QPI Ports/Processor (4) SMI Ports/Processor

Memory (8) Memory Cards, 2 per CPU (16) Intel Memory Buffers total

• SMI Connected DDR3 DIMMs (64) Total DIMM Slots 1066 MHz DDR3 speed

• Processor QPI Speed Dependant 2, 4, 8 and 16GB Support

• Installed In Matched Pairs Memory Sparing and Mirroring Support

• Installed in Matched Quads

Chipset (2) Intel Boxboro IOH (QPI-to-PCIe Bridge)

• (36) PCIe Gen2 Lanes• (2) QPI Ports• (4) ESI Lanes To ICH10

Intel ICH10 Southbridge• (8) USB 2.0 Ports• 3Gb/s SATA DVD Connection

Networking Broadcom BCM5709C

• Dual 1Gb connection• x4 PCIe Gen2 Connection

Emulex 10Gb dual port custom• IBM Specific Adapter Option• Installs in PCIe Slot 7, x8 PCIe Gen2• V-NIC Capable

PCIe Slots Slot 1 PCIE Gen2 x16 Full Length Slot 2 PCIE Gen2 x4 Full Length (x8 mech) Slot 3 PCIE Gen2 x8 Full Length Slot 4 PCIE Gen2 x8 Full Length Slot 5 PCIE Gen2 x8 Half Length Slot 6 PCIE Gen2 x8 Half Length Slot 7 PCIE Gen2 x8 Half Length (10GbE)All slots 5Gb/s, full height



26

x3850 X5 – Hardware; Speeds and Feeds Cont.

2.5” StorageUp To (8) 2.5” HDD Bays

• Support For SAS / SATA and SSD SAS Drives

• 146GB / 10K / 6Gbps• 300GB / 10K / 6Gbps• 73GB / 15K / 6Gbps• 146GB / 15K / 6Gbps

SATA Drive• 500GB / 7200rpm

SSD Drive• 50GB

Configured with one or two 4-Drive backplanes

UEFI BIOS Next-generation replacement for BIOS-based firmware which provides a richer management experience Removes limit on number of adapter cards—important in virtualized environments Ability to remotely configure machines completely via command scripts with Advance Settings Utility

IMM Common IMM Across Rack Portfolio

• x3550M2• x3650M2• x3750 X5• x3850 X5• x3950 X5

300MHz, 32-bit MIPS Processor Matrox G200 Video Core 128MB Dedicated DDR2 Memory Avocent Based Digital Video Compression Dedicated 10/100Mb Ethernet 9-Pin Serial Port 128-bit AES Hardware Encryption Engine IPMI v2.0 Fan Speed Control Serial Over LAN Active Energy Manager/xSEC LightPath



x3850 X5 configuration flexibility

Base SystemShipping today

Memory Expansionwith MAX5

via QPIShipping today

Native Scalingvia QPI

Shipping today

Memory Expansion and Scaling with MAX5

via QPI and EXAAvailable 2011



Xeon 8-socket interconnect block diagram

QPI

Cable Links for QPI bus

Four QPI cables

1

24

3 3

42

1QPI3

03

02 200

2 2 2 2

20023 3

3 3

1

3 3

1

Cable cross connects CPUs 2 and 3



x3850 X5 with native QPI scaling

Intel

Xeon

Intel

Xeon

MB1MB1

MB1MB1

MB1MB1 MB1MB1

Intel

Xeon

MB1MB1

MB1MB1

MB1MB1MB1MB1

Intel

Xeon

Intel

BoxboroPCI-E

Intel

Boxboro PCI-E

Intel

Xeon

Intel

Xeon

MB1MB1

MB1MB1

MB1 MB1 MB1 MB1

Intel

Xeon

MB1 MB1

MB1 MB1

MB1MB1MB1MB1

Intel

Xeon

Intel

BoxboroPCI-E Intel

BoxboroPCI-E

Connects directly via QPI bus

QPI Cables



x3850 8-socket QPI scaling

A DB C

REAR VIEW OF CHASSIS

QPI 1-2 QPI 3-4x3850 #1

QPI 1-2 QPI 3-4x3850 #2



x3850 X5 with MAX5 using QPI

Intel

Xeon

Intel

Xeon

MB1MB1

MB1MB1

MB1MB1 MB1MB1

Intel

Xeon

MB1MB1

MB1MB1

MB1MB1MB1MB1

Intel

Xeon

Intel

BoxboroPCI-E

Intel

Boxboro PCI-E

MAX5

MB1MB1

MB1

MB1 MB1MB1

MB1

MB1

Connects directly to each CPU via QPI bus

6.4 GT/s

MB1 MB2

1 3 8 62 4 7 5

DDR3 Memory DIMMs

Memory Buffer

SMI Link to Firehawk

EXA port



x3850 X5 to MAX5 QPI cabling

eX5 Memory Drawer End x3850 X5 End



8-socket x3850 X5 with MAX5 using QPI and EXA

Connects directly to each CPU via QPI bus 6.4 GT/s

Connects via EXA



MAX5 1U Rack Mechanical Chassis Top view

Memory Buffers

Redundant 650W Power Supplies

QPI Link Ports EXA ScalabilityPorts

Firehawk Chipset

32 Memory Dimms

Lightpath Diagnostics

QPI attaches to systems EXA Scalability to other memory drawers

Easy front access



MAX5 front and rear views



MAX5 for System x front and rear views

Redundant 675W Power Supplies

Lightpath Diagnostics

QPI PortsEXA Ports

Hot swap fans

Front

Rear

System removes from chassis for easy access



MAX5 for System x top view

Memory Buffers

QPI Ports

EXA Ports

Firehawk Chipset

32 Memory Dimms

QPI attaches to systems EXA Scalability to other memory drawers



38

MAX5 – Hardware; Speeds and Feeds

Processors None!

Memory (32) Total DIMM Slots DDR3 DIMMs(8) Intel Memory Buffers total

• SMI Connected1066MHz DDR3 Speed

• Processor QPI Speed Dependant 1, 2, 4, 8 and 16GB Support

• Installed In Matched Pairs Memory Sparing and Mirroring Support

• Installed in Matched Quads

Chipset IBM Firehawk

• (8) SMI Lanes• (4) QPI Ports• (3) Scalability Ports

Usability Power sequences from host platform Memory configuration from host platform Multi-node configuration from host platform Lightpath enabled DSA supported



39

X65502Ghz / 18M / 6.4GT/s

E65402Ghz / 18M / 6.4GT/s

X75602.26Ghz / 24M / 6.4GT/s

X75502Ghz / 18M / 6.4GT/s

8S/Scalable 4S/Scalable

L75551.86Ghz / 24M / 5.86GT/s

E75301.86Ghz / 12M / 5.8GT/s

E75201.86Ghz / 18M / x4.8GT/s

X75422.66Ghz / 18M / 5.86GT/s

EX High Perf. LV

L75451.86Ghz / 18M / 5.86GT/s

E75402Ghz / 18M / 6.4GT/s

Turbo: 0/1/3/5

Turbo: 1/2/4/5

Stan

dard

Bas

ic

6-8 Cores 95W HT / Turbo / S8S

6 Cores 130WTurbo / S8SNo Hyper-Threading

8 CoresHyper-ThreadingTurbo: 1/2/3/3130W

6 CoresHyper-ThreadingTurbo: 0/1/1/2105W

4 CoresHyper-Threading95W-105W

95W

8C

6C

HPC

Turbo: 0/1/1/1

E65101.73Ghz / 12M / 4.8GT/s2S Only. Not Scalable2S Only. Not Scalable

105W

2S/Scalable

x3850 X5 / x3950 X5 – supported processors

Adv

ance

d



System Population Guidelines

Processors Base Systems contain 2 CPU 8-socket QPI scaling is supported with 4+4 CPU, all matching

Memory Each CPU needs at least one memory card Each memory card needs at least 2 DIMMs DIMMs must be installed in matching pairs Optimal memory performance requires 2 memory cards per CPU, with 4 DIMMs on

each memory card, equal amounts of memory per card. If memory mirrored, then DIMM’s must match in sets of 4 MAX5 memory expansion works best with DIMMs in sets of 4 MAX5 memory expansion works best with a ratio of 2/1 memory in host/expander

Drives Base systems contain backplane for 4 drives Maximum of 8 SFF SAS drives

I/O Adapters Alternate adapter population between IOH chipset devices; alternate between slots

(1-4) and (5-7)



4141

TrademarksTrademarks

The following are trademarks of the International Business Machines Corporation in the United States and/or other countries. For a complete list of IBM Trademarks, see www.ibm.com/legal/copytrade.shtml: AS/400, DBE, e-business logo, ESCO, eServer, FICON, IBM, IBM Logo, iSeries, MVS, OS/390, pSeries, RS/6000, S/30, VM/ESA, VSE/ESA, WebSphere, xSeries, z/OS, zSeries, z/VM

The following are trademarks or registered trademarks of other companies

Lotus, Notes, and Domino are trademarks or registered trademarks of Lotus Development CorporationJava and all Java-related trademarks and logos are trademarks of Sun Microsystems, Inc., in the United States and other countriesLINUX is a registered trademark of Linux TorvaldsUNIX is a registered trademark of The Open Group in the United States and other countries.Microsoft, Windows and Windows NT are registered trademarks of Microsoft Corporation.SET and Secure Electronic Transaction are trademarks owned by SET Secure Electronic Transaction LLC.Intel is a registered trademark of Intel Corporation* All other products may be trademarks or registered trademarks of their respective companies.

NOTES:

Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here.

IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.

All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions.

This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area.

All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

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