www.rmdinc.com erik johnson 1 christopher stapels 1, sharmistha mukhopadhyay 1, paul linsay 1, rory...
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www.rmdinc.com
Erik Johnson1
Christopher Stapels1, Sharmistha Mukhopadhyay1, Paul Linsay1, Rory Miskimen2, Skip Augustine3,
and James Christian1
1Radiation Monitoring Devices, Inc., Watertown, MA2University of Massachusetts, Amherst, MA3Augustine Engineering, Encinitas, CA
Support from DOE
Instrument Research & Development Group
Instrument Research& Development
Solid-State Photomultiplier for the PRIMEX PbWO4 Calorimeter
www.rmdinc.com 2 DNP: Oct. 26, 2008
Solid-State Photomultipliers Used for detecting light
pulses from scintillation events.
Array of photodiodes readout in parallel.
Each diode has a binary response to single photons.
The response to each diode is associated with a large gain, providing good signal to noise.
The number of triggered diodes is proportional to the incident light intensity.
Radiation Monitoring Devices, Inc. has built these devices using CMOS technology, which allows integrated circuits on the same silicon die.
0
500
1000
1500
0 100 200 300 400 500
Channel
Cou
nts
1 p.e.
2 p.e.
3 p.e.
4 p.e.
5 p.e.
6 p.e.
7 p.e.
8 p.e.
9 p.e.
10 p.e.
11 p.e.
12 p.e.
13 p.e.
14 p.e.
15 p.e.
16 p.e.
www.rmdinc.com 3 DNP: Oct. 26, 2008
Geiger Photodiodes
SSPMs are built as an array of Geiger Photo-Diodes (GPD).
GPD is a reversed biased photodiode operated beyond the diode breakdown voltage.
Single pixel DE = Quantum Efficiency•Geiger Probability Geiger Probability is the potential of an electron-hole
pair to generate a self-sustained avalanche. Quenching:
Passive: ballast resistor, Rq
Active: Use transistor to drop the voltage to quench the diode.
p-layer
n-layer
Vb
-
+
Optical Photon
Rq
www.rmdinc.com 4 DNP: Oct. 26, 2008
SSPM Design
2 x 2 SSPM array 1.5x1.5mm2 ea. Fill Factor: 61% Gain @ 1 V: 2x106
QEmax: 48% at 520 nm
Number of Pixels: 2024
3 mm
3 mm
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Spectral Response
Electronic noise: Small effect (large signal gain) Scintillator: Major contribution Detector: Various factors contribute
Photon detection (statistical fluctuations) Thermally generated dark noise (dark counts) Excess noise (cross-talk, after pulsing) SSPM Statistics
2
Detector
2
orScintillat
2
Electronic
2
EEEEEEEE
Energy Resolution:
0 500 1000 15000.0
0.5
1.0
1.5
2.0
2.5 CsI(Tl)
3 x 3 x 3 mm3
22Na12.4 % FWHM @ 511 keV
T = 0 oC
Nor
mal
ized
Cou
nts
Energy (keV)
www.rmdinc.com 6 DNP: Oct. 26, 2008
Detection Efficiency
guard ring
p-substrate
n+ p+
n-well
p-substrate )()(, XgX VPQEVDE
300 400 500 600 700 8000
10
20
30
40
50
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1
Qu
an
tum
Effi
cie
ncy
(%
)
Wavelength (nm)
2
Re
lativ
e P
WO
4 Em
issi
on
0 2 4 6 8 10 12 140
20
40
60
80
100
120
Ge
ige
r P
rob
ab
ility
(%
)
Excess Bias (V)
632 nm 420 nm
Junction is fully depleted, QE ~ independent of excess bias. Electron and hole ionization rates are different. Geiger probability is dependent on whether electron or hole
creates the avalanche.
1. Nuclear Instruments and Methods in Physics Research A 376 (1996) 319-3342. IEEE Transactions on Nuclear Science, 55, 3 (2008) 1289-1294
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Standard Noise SourcesCross Talk
Adjacent pixels trigger due to hot-carrier emission.
After PulsingGeiger pulses due to trapped
carriers.
0 2 4 6 8 100
100
200
300
Da
rk C
ou
nt R
ate
(H
z/m
2 )
Excess Bias (V)
T = 22 oC
0 2 4 6 8 10
1.00
1.02
1.04
1.06
1.08
1.10
Afte
r P
ulse
Mu
ltip
lier
Excess Bias (V)
T = 22 oC
Dark CountsThermally excited carriers
inducing an avalanche.
Magnitude of the noise sources Fluctuations due to these sources effect the noise. Fluctuation is proportional to the magnitude Dark counts are handled with Poisson statistics. Cross talk and after pulsing are handled as excess noise terms.
All sources increase with excess bias.
0 1 2 3 4 5 6 7 8 9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Cro
ss T
alk
Mul
tiplie
r
Excess Bias (V)
T = 22 oC
www.rmdinc.com 8 DNP: Oct. 26, 2008
250 260 270 280 290 300 310 3200
20
40
60
80
100
120
140
160
Da
rk C
ou
nt R
ate
(H
z/m
2 )
Temperature (K)
Vx = 5 V
Maxwell-Boltzmann
DCR = n*e-E/kT
Temperature DependenceCross Talk
Adjacent pixels trigger due to hot-carrier emission.
After PulsingGeiger pulses due to trapped
carriers
250 260 270 280 290 300 310 3200.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
Afte
r P
uls
e M
ulti
plie
r
Temperature (K)
Vx = 5V
Dark CountsThermally excited carriers
inducing an avalanche.
Decreases Dark counts: thermal excitation is suppressed. Cross talk: hot carrier emission is reduced. (Preliminary)
Increase in after pulsing Longer trap life times Mitigated by two effects
• Fast scintillators (integration times): sample fewer after pulses.• Noise is affected by fluctuations in output charge: the charge from after pulses is
smallest near the initial pulse in time.
250 260 270 280 290 300 310 320
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
Cro
ss T
alk
Mul
tiplie
r
Temperature (K)
Vx = 5V
www.rmdinc.com 9 DNP: Oct. 26, 2008
Non-Linear Behavior
0 500 1000 15000
5000
10000
15000
20000
Cou
nts
Energy (keV)
FWHM = 22% • 22Na • LYSO: 1.5 x 1.5 x 3 mm3
• Few Pixels• Illustration of Saturation
Effect
Non-linear response of SSPM.
Non-linear transformation between number of triggered pixels and event energy.
Account for non-linear response for accurate energy resolution
An “effective integration time” may effectively increase the total number of pixels in the SSPM
0 200 400 6000
200
400
600
800
1000
1200
1400 Na-22
1275 keV
511 keV (12.1% FWHM)
Cou
nts
Pixels Triggered
0 5k 10k 15k 20k 25k 30k0
59
117
176
234
293
351
410
468
<
Trig
gere
d P
ixel
s>
Light Intensity (photons)
Max. Pixels = 441
www.rmdinc.com 10 DNP: Oct. 26, 2008
SSPM Statistics
0 10000 20000 300000
5
10
15 Measured w/o noise w/ noise
Wid
th in
Pix
els
Trig
gere
d (1)
Light Intensity
2
2 1
t
dark
t
ttl
t
SSPMt
n
n
n
n
n
n
Fnt
Excess NoiseCross-talkAfter Pulsing
BinomialSSPM Statistics
Poisson Dark Counts
Pulsed Laser: 635-nm: ~5 ns wide
2
22
Detector
1
t
dark
tSSPM
t
nE
n
n
nF
nEt
Poisson – Good approximationin Linear Response Region
Energy resolution affected by SSPM statistics when event triggers > 30% of total pixels
The distribution function for the SSPM has a lower and upper bound: Use binomial statistics.
www.rmdinc.com 11 DNP: Oct. 26, 2008
Core Design Energy Resolution
2 V Excess Bias Not Optimized T = 0 °C
0 500 1000 15000.0
0.5
1.0
1.5
2.0
2.5 CsI(Tl)
3 x 3 x 3 mm3
22NaFWHM @ 511 keV
SSPM 12.4 % PMT 11.7 %
Nor
mal
ized
Cou
nts
Energy (keV)
300 400 500 600 700 8000
10
20
30
40
50
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
CsI
Qu
an
tum
Effi
cie
ncy
(%
)
Wavelength (nm)
PWO4
Re
lativ
e E
mis
sio
n
PWO4: 38.2%
CsI: 38.4%
www.rmdinc.com 12 DNP: Oct. 26, 2008
All-Digital SSPM All-Digital SSPM Pixel-level comparator
(signal processing) & active quenching qSSPM Vx(T): (Linear) Fill factor trade-off (reflected
light recovery) Provide feedback to make
excess bias constant qSSPM is constant
16% Fill Factor 400 pixels per quadrant Testing in progress Feedback Pixel
xJtrigSSPM VCNq
www.rmdinc.com 13 DNP: Oct. 26, 2008
Plans for PRIMEXPhase-I Task List
Determine the detector and readout requirements for the photodetector and ADC.
Establish a robust readout protocol for monolithic integration of detector channels.
Examine temperature dependences for SSPMs and PMTs.
Develop external ADC modules with temperature compensation.
Evaluate performance of ADC unit when coupled to PMT and SSPM.
Provide a cost analysis of design options. Develop design concepts for SSPM integrated with
an ADC. Write Phase I report and Phase II proposal.
Key Task Evaluate at RMD using 60Co
source. Packaging: light tight and cooled Ship to Jefferson Lab for test
beam evaluation. Recently Started Phase-II proposal due mid-March
PbWO4
SSPM
PMT Cooled and Dry Vessel
www.rmdinc.com 14 DNP: Oct. 26, 2008
Cost AnalysisResearch Prototype Intermediate Production
20 x 20 m2 pixel
50k pixel device
8.2 x 8.2 mm2 Device Size
2 133 1333
Part or Process per Unit Costs
SSPM $5,000 $75 $8
Design and Layout $10,000 $0 $0
CMOS Mask Set Included $675 NRE $0
Packaging Included $75 $8
PCB $100 $50* $5 - $50
Data Interface $650 (ADI: HSC-ADC-EVALCZ) $6* (USB Interface) $6
ADC $220 (ADI: AD9230-250EBZ) $60* (ADI: AD9230BCPZ-250) $0† - $60
Power Supply Regulator $50 $12* $0†
Voltage Supply (AC Adapter) $10 $10 $10
Assembly $800 $50 $10
Total per Device $17,130 $1013 $47 - $152
• Costs are in US Dollars and are best estimates* Bulk purchase reduction † Inclusion in the CMOS layout Photodetector and power supply
www.rmdinc.com 15 DNP: Oct. 26, 2008
Summary
Solid-State Photomultipliers Compact High Gain CMOS: Integrated Signal Processing Low Cost Provide PMT-like Energy Resolution
Future Plans Evaluation at RMD with test sources Evaluation at JLab Provide a more complete cost analysis (compare PMT to
SSPM with integrated signal processing).
www.rmdinc.com 16 DNP: Oct. 26, 2008
Application with SSPMs
0 500 1000 15000.0
0.5
1.0
1.5
2.0
2.5 CsI(Tl)
3 x 3 x 3 mm3
22Na12.4 % FWHM @511 keV
No
rma
lize
d C
ou
nts
Energy (keV)
www.rmdinc.com 17 DNP: Oct. 26, 2008
Temperature Dependence Accommodate large temperature range for useful device
TVVTCTVVPQENq BAJBAGttlSSPM )(
Breakdown voltage, VB
Proportional to temperature (~50mV per °C) Excess bias inversely proportional.
PG is proportional to the excess bias. (~9% per V)
Junction Capacitance, CJ (Preliminary) Inversely proportional to temperature (0.5fF per °C)
Constant applied bias, temperature decreases: Number of pixels increases Output charge per pixel increases
32 TTCTVq JXSSPM Junction CapacitanceGeiger Probability Excess Bias, Vx
www.rmdinc.com 18 DNP: Oct. 26, 2008
Device Conditions
2k
…
- Vb +
substrate
Preamp
Pulser
220 pF
ShapingAmp
MCA
Quadrant PixelC (fF)
PixelR
(k)
Recharge Time (ns)
Q1 130 160 21
Q2 270 250 67
Q3 330 290 96
Q4 170 200 34t
V
RC
t
V CVxVx
10 nF
Not Needed
Used for Signal Integration
www.rmdinc.com 19 DNP: Oct. 26, 2008
Electron/Hole Ionization
IEEE Transactions on Nuclear Science, 19, 9 (1972) 1056-1060