worried about nothing? - science and technology … · · 2017-01-17worried about nothing?...
TRANSCRIPT
Worried About Nothing?Worried About Nothing? Measurement and Safety in
Vacuum Practice
Cleaning Components of Vacuum Systems
Joe Herbert and Keith MiddlemanVacuum Science Group
ASTeC Daresbury Laboratory (CLRC)
March 25th-26th 2003 IoP Congress - Edinburgh
Introduction
ASTeC = Accelerator Science and Technology CentreAccelerator Physics (11)Insertion Devices and Magnet Physics (7)Radio Frequency and Diagnostics (8)Vacuum Systems (5)Geodesy & Alignment (0)
Vacuum Science GroupProvides the ‘Vacuum’ design and specification for ASTeC projects.Research Programme (E.G. Cleaning, NEG, Characterisation of Materials, Evaluation of Equipment)
March 25th-26th 2003 IoP Congress - Edinburgh
Outline of Presentation
(1) Why Do We Need To Clean for Vacuum?
(2) Vacuum System Design Issues
(3) Simple Cleanliness Checks
(4) More Extensive Testing
(5) Science of Cleaning
(6) Problems Associated with Large Scale Facilities
(7) Search for New Cleaning Procedures
Joe Herbert
Keith Middleman
March 25th-26th 2003 IoP Congress - Edinburgh
(1) Why Do We Need To Clean For Vacuum?
We Don’t! NecessarilyIt Depends Upon What We Need Vacuum For
Vacuum Regime Required (Type of Flow)Ultimate PressureLeak RateCleanliness
∴ “To Clean or Not To Clean” & “Degree of Cleanliness”
⇒ Depends upon Application!
March 25th-26th 2003 IoP Congress - Edinburgh
Examples
Irrespective of application - Manufacturer Desires Attractive Appearance!
Characteristics of a Surface (Surface Properties) altered by ‘Contamination’ at the Surface.
Process Poisoned by ‘Contaminants’
Quality of an In-Vacuum Process Severely Affected By Presence of ‘Contaminant’ Gas Phase Molecules
!
‘Contaminant’ - What is a contaminant in one application may be an essential constituent of another!
March 25th-26th 2003 IoP Congress - Edinburgh
Why Clean for - Accelerator Vacuum Systems
Transport of Particles and EM RadiationLoss Reduction
Reduce Scattered Radiation for Health & Safety
Maintain Clean In-Vacuum SurfacesPrevent Particle Target PoisoningMaintain Efficient Optical Properties for EM Radiation Transport
To Provide a Controlled Atmosphere
March 25th-26th 2003 IoP Congress - Edinburgh
(2) Vacuum System Design Issues
The Vacuum Engineer Should Consider the Following at the Design Stage:
How All Parts Can Be Cleaned (Initial and In Service)Component Level CleanFull Assembly CleanSub-Assembly Clean
Cleaning PlantSizeRobustnessRisks/Protection Methods
Trapped AreasSolvent Trapping
March 25th-26th 2003 IoP Congress - Edinburgh
Vacuum Design Issues
Material ChoicePorosityEffect of cleaning on toleranceMultiple Materials
Varying Effects from Cleaning ProcessRisk of Electro-chemical cell
Assessment of Cleaning Effectiveness
March 25th-26th 2003 IoP Congress - Edinburgh
(3) Simple Cleanliness Checks
Visual Inspection (use of hand lens)Solvent TrapsDirt TrapsSurface RoughnessStreaking / Marking / Spotting
SmellOilsCleaning Fluids
RubbingSessile Drop
Oils/Greases
March 25th-26th 2003 IoP Congress - Edinburgh
(4) More Extensive Testing - A
Surface Analysis Techniques (Detailed Surface Composition)
AES - Auger Electron Spectroscopy
SIMS - Secondary Ion Mass Spectrometry
Scanning Electron Micrograph
LIMA - Laser Ionisation Mass Analysis
March 25th-26th 2003 IoP Congress - Edinburgh
More Extensive Testing - B
Phenomenological Testing (Surface Vacuum Performance)
Total Outgassing Desorption
Partial Outgassing Desorption
Stimulated Desorption
Friction
Electron Induced
Ion Induced
Thermal
Process Stimulated
March 25th-26th 2003 IoP Congress - Edinburgh
Application for Storage Ring Vacuum Systems
UHV Total Pressures Required ~ 1x10-9 mbarMaintain Satisfactory Lifetime Stored Electron Beam
Low Presence of High Mass SpeciesElectron Scatter ∝ Atomic Number2
Hydrocarbons < 1%Pump Lubricants < 0.1%
Phenomenological Comparison Testing is EmployedCompare Total and Partial Pressures with Standard ValuesElectron Stimulated Desorption (ESD) Comparisons
Simulation for Photon Stimulated Desorption (PSD)
March 25th-26th 2003 IoP Congress - Edinburgh
(5) Science of Cleaning
Keith Middleman to continue………..
March 25th-26th 2003 IoP Congress - Edinburgh
(5) Science of Cleaning
Vacuum is limited by the materials used and how they are prepared.
For UHV we need to have ‘clean’ surfaces
Bakeout
March 25th-26th 2003 IoP Congress - Edinburgh
Science of CleaningSolvent - A solvent is a substance that dissolves another substance or substances to form a solution (a homogeneous mixture). The solvent is the component in the solution that is present in the largest amount or is the one that determines the state of matter (i.e. solid, liquid, gas) of the solution.
Surfactants - surface active agent
Hydrophobe
Hydrophile
March 25th-26th 2003 IoP Congress - Edinburgh
Science of Cleaning
Penetrating and Wetting agents Surfactants which change the chemical composition of the hydrophobic
and hydrophilic ends of the molecule, this opens up the possibility of
Detergency Foaming Emulsifying Solubilising Dispersing
Chelators - remove the hardness in water
Saponifiers - convert animals fats into natural soaps
March 25th-26th 2003 IoP Congress - Edinburgh
Cleaning Techniques
Physical Methods Blowing Bead Blasting Dry Ice cleaning Cutting and Grinding Polishing
Passivation - techniques which reduce outgassing Oxide films Nitride coatings (TiN, BN) Active films (NEG coatings)
March 25th-26th 2003 IoP Congress - Edinburgh
Cleaning Techniques
Special Cleaning Techniques Ultrasonic cleaning - widely used
Electropolishing Glow discharge Air Baking Chemical Baking
Heaters
Surface
Ultrasonic Waves
Cavitation bubbles
Contaminant
Passivation
March 25th-26th 2003 IoP Congress - Edinburgh
Typical Cleaning AgentsAgent Examples Advantages Disadvantages DisposalWater Cheap, readily
availableNeed de-min for cleanliness.
Not a strong solventTo foul drain
Alcohols Ethanol,methanol, iso-
propanol
Relatively cheap andreadily available.
Quite good solvents
Need control – affect workers;some poisonous; some
flammable; stringent safetyprecautions.
Evaporate or controlleddisposal.
OrganicSolvents
Acetone, ether,benzene
Good solvents,evaporate easily with
low residue.
Either highly flammable orcarcinogenic
Usually evaporate
CFC’s FreonTM
(CFC-113)Excellent solvents;
evaporate easily withlow residue
Banned Strictly controlled, mustnot be allowed to
evaporate
Chlorinatedhydrocarbons
Trichloroethylene (TrikeTM)
Excellent solvents.Non-toxic. Low boiling
point. Low residue
Trike may be banned. Toxic,require stringent safety
precautions.
Strictly controlled
Detergents Aqueous solutions,non toxic. Cheap and
readily available.Moderate solvents.
Require careful washing anddrying of components. Can
leave residues.
To foul drain anddilution
Alkalinedegreasers
AlmecoTM,sodium
hydroxide
Aqueous solutions,non- toxic. Moderate
solvents
Can leave residues and maythrow particulate precipitates
Requiresneutralisation, thendilution to foul drain.
March 25th-26th 2003 IoP Congress - Edinburgh
SRS Cleaning Procedure
SR S A N K A BESSY II
Hot w ater jet w ith detergent Coarse cleaning with Chesterton(KPC820)
W ipe off surface dirt
Surface stripping with alum inabeads
Rinse in hot de-m in w ater U ltrasonic w ith trichloroethane
Ultrasonic wash in hot Triklone Ultrasonic wash in hot P3-Alm eco 18
Treatm ent w ith hotperchloroethylene (120°C)
Vapour W ash in hot Triklone Rinse in de-m in water Ultrasonic cleaning in hot P3-A lm eco 18 for 10 m inutes.
R inse w ith de-m in water D ry in warm dust free air, bagand seal.
R inse for 15 m inutes w ith tapw ater.
Im m erse in hot alkaline bath ofP3-Alm eco 36 at 60°C
W ash in hot de-m in w ater for 90m inutes.
R inse in de-m in water Open air drying and cooling ofcom ponents.
Dry in w arm , dust free air, bagand seal.
March 25th-26th 2003 IoP Congress - Edinburgh
(6) Problems with Large Scale Cleaning FacilitiesUltrasonic Bath
March 25th-26th 2003 IoP Congress - Edinburgh
Problems with Large Scale Cleaning FacilitiesVapour wash
March 25th-26th 2003 IoP Congress - Edinburgh
Problems with Large Scale Cleaning FacilitiesWater Jet and Detergent Phase
March 25th-26th 2003 IoP Congress - Edinburgh
Problems with Large Scale Cleaning Facilities
Drying Oven Personal Exposure Monitor
March 25th-26th 2003 IoP Congress - Edinburgh
Problems with Large Scale Cleaning Facilities
COSHH Assessment - Health and Safety
Risk Assessment - every procedure
Storage of Chemicals - Special bunded areas
Environmental issues - correct removal
Monitoring Systems - personal and atmospheric
Legislation
March 25th-26th 2003 IoP Congress - Edinburgh
Problems with Large Scale Cleaning Facilities
Current LegislationVienna Convention - 1985Montreal Protocol - 1987
Amendments - most recent 2000 Protection of the Ozone Layer CFC’s HCFC’s Carbon Tetrachloride Methyl Chloroform Other halogenated hydrocarbons
Why Change?Reclassification of 1,1,2-Trichloroethylene (TrikeTM)
Improved Health and Safety regulations
March 25th-26th 2003 IoP Congress - Edinburgh
(7) Replacement of 1,1,2-Trichloroethylene
What is important to us?Thermal outgassing and ESDThroughput method of measuring outgassing rates
Comparative Tests - existing procedure proven for 20 years
Pump
P1 P2
Conductance, C
Sample
Q = P1 - P2A
C
March 25th-26th 2003 IoP Congress - Edinburgh
Thermal Outgassing Results
Experiment Total outgassingrate (mbar
l/s/cm2)
Net outgassing rate(mbar l/s/cm2)
Blank Run 1.97 x 10-12 -
Noncontaminatedsample run
2.35 x 10-12 3.76 x 10-12
Contaminatedsample run
6.57 x 10-12 4.6 x 10-12
Contaminatedsample run
through n-propylbromide
1.22 x 10-11 1.023 x 10-11
March 25th-26th 2003 IoP Congress - Edinburgh
Future Possibilities
Other solvents Further n-propyl bromides Non flammable ethers
Aqueous systems e.g. Micro 90
March 25th-26th 2003 IoP Congress - Edinburgh
Conclusions
The level of vacuum required or the process determines the standard of cleanliness required.
Vacuum is often limited by the surface properties of the materials used.
Various methods used to condition materials for vacuum.
There is no one defining cleaning process that works