world wide sae han micro tech - 2009 september. sae han ... · sae han micro tech co., ltd. 02 03...

Electro Etching Technology Probe PinVision Inspection System

World Wide SAE HAN MICRO TECH

Jinjeop Factory : 739-4, Palya-ri, Jinjeop-eup, Namyangju-si, Gyeonggi-do, Korea (Zip code : 472-868)TEL : +82-31-529-8800 FAX : +82-31-528-1345

Seongnam Factory : SK APT. Factory #214/#08(09), 223-28, Sandaewon 1-dong, Jungwon-gu, Seongnam-si, Gyeonggi-do, Korea (Zip code : 462-705)

TEL : +82-31-732-1770 FAX : +82-31-625-1704 E-MAIL : [email protected] 2009

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www.probepin.com

Sae han Micro Tech co., Ltd. www.probepin.com02 03

Greetings! I am Hak Jun Kim, CEO of Saehan Microtech Co., Ltd.Despite its short 20-year history, the Korean semiconductor industry has grown remarkably, greatly contributing to the development of the Korean economy as a core growth booster.As a venture company for semiconductor-related nanotechnology, Saehan Microtech Co., Ltd. manufactures Probe Pin, a key component for semiconductor inspection, and Vision Microsystem for ultra-microcomponent inspection and is doing all that it can to become a significant part of the development of the Korean semiconductor industry.

Through untiring efforts to come up with technological advancements, effective business strategies such as selection and concentration, and to establish strategic alliances and technical cooperation with advanced companies, Saehan Microtech Co., Ltd. expects to acquire up-to-date technologies and to develop extensive marketing networks.

Also Saehan Microtech Co., Ltd. will try to maximize its production techniques and to develop new value-added products. Through these efforts, we promise to become a real nanotechnology leader ensuring utmost satisfaction to its customers.We are counting on your continued interest in and support of Saehan Microtech Co., Ltd. On behalf of the whole family, thank you very much, and may God bless all of you.

Hak Jun KimCEO of Sae Han Micro Tech Co., Ltd.

Introduction CompanyCompany Information

CEO’s Greetings

Saehan Microtech Co., Ltd. is a high-tech venture enterprise that develops the critical parts of inspection equipment for memory semiconductors, such as probe pins, vision inspection systems, and micro springs for microrobots. Its market was dominated by imported products before its establishment. With its excellent products, Saehan Microtech Co., Ltd. has maintained a continuous revenue growth rate over the past few years since its foundation in October 1999.

Having begun with a 50% domestic-market share for its products in 1999, the year it commenced with succeeding in developing its products, Saehan Microtech Co., Ltd. now supplies its products to 80% of the domestic market. The U.S., Japan, and Taiwan are also major markets for its products, which Saehan Microtech Co., Ltd. has been exporting since August 2002, beginning with the U.S., which has source technologies for its products, to Japan and Taiwan, which have the biggest demand for its products.

Participating actively in the Industry-University-Research Consortium for advice regarding R&D and process reform, Saehan Microtech Co., Ltd. has also developed a vision inspection system based on its own technologies by hiring quality control experts, has raised the competitiveness of its products to the world-class level, and is dedicated to building its own brand image. Further, Saehan Microtech Co., Ltd. maintains major R&D performance records, such as the development of microprecision products and comprehensive inspection equipment, and takes part in national research projects supervised by the Ministry of Commerce, Industry and Energy and by the Ministry of Science and Technology.We will do our very best to grow as a strong and robust firm equipped with competitive quality and technologies that can fully satisfy the needs of our international and domestic customers.

Company History1999. 102000. 062002. 062003. 102003. 12

2004. 042005. 022005. 032005. 052006. 032006. 032007. 042008. 01

2008. 09

Founded Saehan Microtech Co., Ltd.

Was registered as a venture business

Obtained ISO9001 certification

Moved the Saehan Microtech Co., Ltd. to Jinjeop Factory

Obtained ISO14001 certificationCEO Hak Joon Kim was awarded “2003 Excellent Small and Medium Enterpriser”

Founded and obtained approval for Saehan Microtech Co., Ltd. R&D Center

Was approved as an INNO-BIz company

Founded Propin USA, its local subsidiary in the U.S.A.

Founded YOTOKU, its joint-venture corporation in Taiwan

Established the Saehan Microtech Co., Ltd. Sungnam branch

Was approved as an advanced technical center (ATC)

Was approved as a components and materials specialty company

Registered Domestic PatentPatent name: visual checking method for sheet-type devices

Expanded and moved the Saehan Microtech Co., Ltd. Sungnam branch

Company Mission and VisionMission We will contribute to advancing the national cutting-edge industry and to enhancing human civilization and welfare through the development and utilization of precision processing technology.

VisionWe will introduce the Initial Public Offering (IPO) and the Employee Stock Ownership Plan (ESOP) in 2012.

Vision DeclarationWe will advance our technology with much passion and effort, and will achieve continuous growth by training our human resources and meeting all our customers’ demands. In 2012, we will realize transparent administration by introducing IPO, and all our employees will become co-owners of the company through ESOP.


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Wire Etching Probe Shape

Wire Etching ProbeCantilever type

(Type A) (Type B)

Location Location

Wire Etching Probe Specification

Specification(type A)

W : TungstenR : RheniumN : NickelP : Plated

Taper Length(1.75㎜)

Needle Diameter (150㎛)

Needle Length (64㎜)

WRNP - 150 - 175 - 640

X - Position

Taper Diameter

Taper Length

Probe Length

Probe Diameter

①

②

③

④

⑤

ITEM

Name Dimension Acceptable Error

InspectionRemark

WRNP 150 - 175 - 640

175㎛ ~ 215㎛

67㎛

1.75㎛

64㎛

150㎛

※ If you want detail, please email to [email protected]

-

± 2㎛

± 100㎛

± 1㎛

± 5㎛

Distance from the tip to the positionwhere its Diameter is 30㎛.

Diameter of the Taper measured at 400㎛ from the 30㎛ Diameter location

Taper Length

Probe needle Length

Probe needle Diameter

Probessummary

Probe card is an interface between an electronic test system and a semiconductor wafer. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitthe testing and validation of the circuits at the wafer level, usually before they are diced and packaged. It consists, normally, of a PCB and some form of contact elements, usually metallic, but possible use of other materials as well. Probe cards are broadly classified into Cantilever type, Vertical type, and MEMS type depending on shape and forms of contact elements.

MEMS TypeIn 2006 an electroforming section of R&D department in SHMT was settled and with a high technology, the electroforming section is carrying on a high performance plating.

Vertical TypeVertical probe is based on the well known cobra but substantially improved on alignment, planarity and reliability performances.

Cantilever TypeSHMT cantilever probe offers a suitable solution for a broad range of wafer test appliation. SHMT cantilever technology has been upgraded year by year reaching now a superior level.


Insulation Tubeless ProbeCantilever type

Full Coated Probe

Probe Length

Coating Length

Probe Diameter

CoatingThickness

Coatingmembrane

Probe

Coatingmembrane

Probe

Probe Length

Coating Length

Probe DiameterNon Coating LengthCoating

Thickness

Partial Coated Probe

Coating Probe SpecificationMaterial

Coating thickness

Probe diameter

Coating color

W, ReW

5㎛ ~ 30㎛

Ø80㎛ ~ Ø200㎛

Black, Red, Light Brown, Green


Machine Grinding Probe Specification

Advantage• New material(high Electrical, Mechanical properties)• Low pad damage & particle

Application• Memories, Non-memories, Logic, Automotive, Imaging, Microprocessor

Mechanically Grinding ProbeCantilever type


Manufacturing Process

Grinding Inspection

Paliney7, Neyoro G, BeCu

Ø70㎛~Ø300㎛, 25㎜~89㎜

1.0~4.0㎜,2.3°~6.0°(±0.2°)

7㎛↑ (±2㎛), Flat Tip

Available Materials

Diameters & Length

Taper Length & Angle

Tip Diameter & Tip Shape


Vertical ProbevertiCal type

Vertical Probe Shape

P7, BeCu

2.0, mil, 2.5mil, 3.0mil, 3.15mil, 4.0mil

30° & 60°(±1°)

Point tip, Flat tip, Spherical

Headed type, Headless type

2~3㎛±1㎛ (Parylene, Polyimide)

Vertical Probe Specification

P7 : Paliney7, BeCu : Beryllium Copper, 1mil : 25.4㎛※ If you want detail, please email to [email protected]

Applicable Material

Diameter

Tip angle & Shape

Tip shape

Head shape

Coating thickness

Head part

tip part

<Head Type> <Headless Type>

<Point tip> <Flat tip>

Advantage• Long life time • High electrical properties • Low particle

Application• Memories, logic, automotive, imaging, BGA, LCD panel devices with low pad damage requirements

head parT

bendinG

Tip

Bent ProbeCantilever type

Bent Probe Shape

Single bent probe

Bending Anlge : PASSReference Diameter : PASSBending Length : PASSTip Dia : PASS

Bending Anlge : 104.8Reference Diameter : 79.2Bending Length : 30.9Tip Dia : PASS

Two bent probe Inspection of bent probe

Double bent probe

Specification


Spec.

Production range

Standard error

Material

Tip diameter

10㎛ ~ 40㎛

± 2㎛

Bending angle

90˚ ~ 150˚

± 1˚

Bending length

350㎛ ~ 1200㎛

± 15㎛

Tip shape

FlatRadius

Probe - Whole item


Blade Probeplate type

Manufacturing Process

Blade Probe Specification• Material : BeCu, BeNi, STS304, Phosphor Bronze, etc

Raw Material

Etching Stripping Inspection

PR Coating Exposure Development

Blade Probe Au plated Insulation coating

BeCu

BeNi

STS 304

H 210 ~ 250

HT Over 370

XHMS Over 330

TM Over 400

- -

Material Heat Treatment(Hv) Hardness Hole Length Min. Width Min. Round ±5㎛ ±10㎛ 20㎛ 30㎛

±5㎛ ±10㎛ 25㎛ 35㎛

±5㎛ ±10㎛ 25㎛ 40㎛

±10㎛ ±15㎛ 30㎛ 60㎛

±10㎛ ±20㎛ 50㎛ 120㎛ ±10㎛ ±20㎛ 50㎛ 180㎛

±10㎛ ±20㎛ 70㎛ 200㎛

±5㎛ ±10㎛ 20㎛ 20㎛

±5㎛ ±10㎛ 20㎛ 30㎛

±5㎛ ±10㎛ 25㎛ 35㎛

±15㎛ ±20㎛ 70㎛ 200㎛

Thickness(㎛)20253050100150200152025200

Advantage• Freely shape • Fine pitch probe • Supply shortly • Low particle

Application• Memory, Non-memory, Display

Wire ProbevertiCal type

Wire Probe Shape

Tungsten, Paliney7, Beryllium Copper

40㎛, 50㎛, 70㎛, 90㎛, 100㎛Flat tip, Round tip

Flat tip, Round tip, Taper tip

5~10㎛

Applicable Material

Diameter

Head Shape

Test Point Shape

Coating thickness

Head

W au-070-30 (HF-tr)Test point tip shape: round

head tip shape : Flat

pin Length : 30mm

pin diameter : 0.07mm

Surface : au plating

Material : Tungsten

test point

<Flat> <Round> <Flat> <Round> <Taper>

Wire Probe Specification

Applications• FPC, FPCB, TCP, COF Open/Short test


Fine Pitch Array ShapePhotolithography

Order Poducts

MEMS Probemems type

Advantage• Freely shape • Fine pitch probe • High - precision

Application• Memory, Non-memory, Display

Metal Blade Probeplate type

Metal Blade Shape

Probe

Blade

Advantage• Freely shape • Supply shortly

Advantage• Freely shape • Supply shortly

Application• LED, High-frequency test

Application• LED, High-frequency test

Specification Probe Sheet Material BeCu, W, ReW, P7 Sn Plated PhBz Thickness Ø80㎛ ~ Ø200㎛ 400㎛ Assembly SnPb SnPb Spec. Order Production Order Production


Specification Probe Sheet Material BeCu, W, ReW, P7 Ceramic(Au patterning) Thickness Ø80㎛ ~ Ø200㎛ 250㎛ Assembly SnPb SnPb Spec. Order Production Order Production

Ceramic Blade ProbeCeramic Blade Shape

Substrate

Conductive Element

Probe

MEMS Probe Specification Pitch Thickness Precision Material Hardness Max. size

10㎛ ~ 10㎛ ~ 100㎛ ± 5% Ni, NiCo 400 ~ 450Hv 8”

Pitch = 30㎛, aspect ratio = 2:1 pitch = 40㎛, aspect ratio = 1.3:1 line = 6㎛, space = 4㎛

line = 6㎛, space = 4㎛ (1st & 2nd layer)

line = 15㎛, space = 25㎛ (4th layer)

A. Single layer

B. Multi layer

Pitch = 30㎛, aspect ratio = 3:1

Pitch = 20㎛, aspect ratio = 4.7:1

Stamp Metal mesh Micro gear

PR

wafer

PR

wafer

PR

wafer

15㎛

10㎛

15㎛

6㎛

6㎛

Ni/Ni alloy

Ni/Ni alloy

10㎛

47㎛

47㎛

20㎛20㎛


OEM Products Reliability Equipments

Bio-Medical Needle Probe

Auto Focus Spring

Measurement Device

Vision Inspection System

Reliability Test M/C

Specification Probe Shield Material W, ReW, P7, Pt, BeCu BeCu Dia. Ø50㎛ ~ Ø250㎛ Normal Assembly Epoxy Epoxy Spec. Order Production Order Production

Applications• High Frequency, Low-current, Low-capacitance

Specification Spec Material SUS, BeCu, MX215, YCuT, PhBr Thickness 25㎛ ~ 100㎛

Shape Order Production

Applications• Mobile phone camera module, Mobile vibrator, Slim speaker module

Specification Spec Electrode Stainless steel Insulator Teflon Length Order production Gauge 23G, 25G, 26G, 28G, 30G

Applications• Electromyography

Coaxial Cable Probe

world wide sae han micro tech - 2009 september. sae han ... · sae han micro tech co., ltd. 02 03...

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