RA

WC

ON

2003,

Work

shop W

S1

WLA

N a

nd R

FIC

Tec

hnol

ogie

s

WLA

N M

arke

t /

WLA

N M

arke

t /

Tech

nolo

gy O

verv

iew

Tech

nolo

gy O

verv

iew

Sanj

ay M

oghe

Sanj

ay M

oghe

Mic

ro L

inea

r Co

rp.

Mic

ro L

inea

r Co

rp.

Aug

ust

200

3A

ugus

t 2

003

Out

line

WLA

N M

arke

t /

App

licat

ions

WLA

N M

arke

t /

App

licat

ions

WLA

N s

tand

ards

W

LAN

tec

hnol

ogy

Wir

eles

s co

nver

genc

eW

LAN

issu

es /

Fut

ure

tren

dsCo

nclu

sion

s

In T

he N

ews.

.

Cisc

o bu

ys L

inks

ys f

or $

500m

Inte

l spe

nds

$300

m t

o m

arke

t Ce

ntri

no c

hip

Com

eta

Net

work

s –

join

t ve

ntur

e of

IBM

, AT&

T,

Inte

l –20

,000

hot

spot

s by

200

5T-

Mob

ile o

pera

tes

2000

Sta

rbuc

ks h

otsp

ots

Veri

zon

inst

alls

Wi-F

i at

pay

phon

esCi

sco

anno

unce

d W

i-Fip

hone

sM

cDon

alds

–1h

r fr

ee w

ith

a Va

lue

Mea

lPu

blic

atio

ns a

re f

lood

ed w

ith

daily

WLA

N a

rtic

les

Mor

e th

an 1

Mill

ion

item

s on

Goo

gle

sear

ch o

n W

LAN

vs.

15K

on

RFIC

Positive

Signs

for

WLA

N M

arke

tB

usi

nes

s W

eek “

The

gra

ssro

ots

movem

ent

is c

atch

ing o

n i

n

Co

rpo

rate

Am

eric

a…”

Mor

e or

gani

zati

ons

usin

g or

pilo

ting

WLA

NS.

Pe

netr

atio

n is

45%

tod

ay v

ersu

s 8%

in 2

001.

75%

pr

ojec

ted

by e

nd o

f 20

03*

Hot

spot

s sp

rout

ing,

gai

ning

use

r in

tere

stN

oteb

ooks

incr

easi

ngly

bec

omin

g W

LAN

cap

able

. W

ill b

e st

anda

rd f

or m

ost

note

book

s by

2H

03W

LAN

pri

ces

are

drop

ping

rap

idly

mak

ing

them

ev

en m

ore

popu

lar

with

con

sum

ers

Grea

ter

com

fort

wit

h W

LAN

s du

e to

incr

easi

ng

awar

enes

s am

ong

cust

omer

s th

at s

ecur

ity

issu

es

are

bein

g so

lved

Wireles

s Dat

a La

ndsc

ape

802.1

1a,b

,g

Wir

ele

ss L

AN

s

Blu

eto

oth

2.5

/3G

20M

bp

s

10M

bp

s

2 M

bp

s

1 M

bp

s

56 K

bp

s

19.2

Kb

ps

9.6

Kb

ps

Lo

cal

Wid

eC

overa

ge A

rea

Cir

cu

it &

Packet

Data

Cellu

lar,

CD

PD

, R

IM

Data Rates

Sour

ce: C

isco

Sys

tem

s, R

F So

lutio

ns

Sa

tellit

e

54M

bp

s

802.

11 G

row

ing

Rap

idly

•H

ighly

successfu

l•

Low

Cost

•S

tandard

•H

igh T

hro

ughput

(11M

b/s

+)

•E

me

rgin

g a

s W

AN

•E

rodin

g 3

G T

arg

et

Mark

et

3G L

ags

Beh

ind

•T

enta

tive D

eplo

ym

ents

•H

igh C

ost

•S

tandard

Battle

s•

Low

Thro

ughput

(144K

b/s

)•

Targ

et

mark

et

ero

din

g t

o 8

02.1

1

WLA

N A

dopt

ion

Ga

rtn

er:

•N

earl

y 2

5%

of

mob

ile

bu

sin

ess

use

rs h

ad

ha

ve

som

e 8

02

.11

ca

pa

bil

itie

s b

y t

he

end

of

20

02

•T

her

e w

ill

be

5.4

mil

lio

n W

LA

N u

sers

by

20

03

•C

urr

entl

y 3

0%

of

larg

e co

mp

an

ies

ha

ve

WL

AN

, ex

pec

ted

to g

row

to

67

% o

f th

e la

rges

t 1

,00

0

com

pan

ies

by e

nd

of

2004

•A

s m

an

y a

s 19 m

illi

on

wo

rker

s w

ill

use

WL

AN

by

20

06

IDC

:

•8

02

.11

b c

ap

ab

ilit

y,

pro

ject

ed t

o g

row

fro

m 8

35

,00

0 i

n 2

00

1 t

o 4

.2 m

illi

on

ho

mes

by

20

04

Syn

erg

y R

esearc

h:

•S

ale

s of

WL

AN

eq

uip

men

t to

res

iden

tial

an

d s

mall

bu

sin

esse

s gre

wm

ore

th

an

25 p

erce

nt

in

the

fou

rth

qu

art

er,

to $

22

5M

Bu

sin

ess W

eek:

•S

tarb

uck

s h

as

Wi-

Fi

in 6

00 s

tore

s, a

nd

wil

l b

e in

4,0

00 s

tore

s b

y e

nd

of

2003

•O

ver

90%

of

new

lap

top

s w

ill

be

Wi-

Fi

read

y b

y 2

005,

up

fro

m 3

5%

by y

ear

end

2003

Which

ban

d do

you

like

2.4G

Hz

ISM

Ban

d5G

Hz

UN

II B

and

•83M

Hz

Ban

d•3

Non

-Ove

rlapp

ing

Dat

a C

hann

els

•“b”

=DSS

S C

CK

(11M

B/s

)•“

g”=

OFD

M (5

4MB

/s)

•3 x

100

MH

z B

ands

•12

Non

-Ove

rlapp

ing

Dat

a C

hann

els

•(4 in

eac

h ba

nd)

•“a”

= O

FDM

(54

MB

/s)

5.1

5 -

5.2

5G

Hz

5.2

5 -

5.3

5G

Hz

5.7

25 -

5.8

25G

Hz

2.4

-2.4

83

5G

Hz

Dual B

and O

pera

tion P

rovid

es:

•Inte

rfere

nce

Miti

gatio

n•C

onge

stio

n M

itiga

tion

802.

11a

5.8

GH

z

54M

bps

802.

11b

2.4

GH

z

11M

bps

802.

112.4

GH

z

1M

bps

802.

11g

2.4

GH

z

22M

bps

802.

11a/

b/g

2.4

GH

z +

5.8

GH

z80

2.11

a/b

2.4

GH

z +

5.8

GH

z

802.

11a

Dua

l-Ban

d

802.

11b/

g

1994

2000

2002

2001

2003

80

2.1

1x M

ark

et M

igra

tio

n80

2.11

x mar

ket

evolut

ion

WLA

N M

arke

t is E

xploding

Ship

men

ts t

ripl

ed in

200

2an

d wi

ll do

uble

in 2

003

802.

11g

over

take

s 11

b,

requ

irin

g hi

ghly

line

ar,

mor

e ef

fici

ent

PAs

Com

bo a

dopt

ion

acce

lera

tes,

by

2004

re

pres

ents

mor

e re

venu

e th

an 8

02.11

b+g

55

Mu

50

Mu

45

Mu

40

Mu

35

Mu

30

Mu

25

Mu

20

Mu

15

Mu

10

Mu

5M

u

0M

u

2002

2003

2004

2005

Com

bo

802.1

1a

802.1

1g

802.1

1b

WLA

N IC

Ship

ments

sourc

e:

Alli

ed/R

F S

olu

tions

WLA

N H

ardw

are

Opt

ions

Co

mp

ac

tFla

sh

PC

MC

IA c

ard

s

PC

Im

ini-

PC

IU

SB

Access P

oin

tsG

ate

ways

SD

Oth

er A

ddre

ssab

le M

arke

ts

Cellu

lar

+WLA

N

Tele

mat

ics

Set

Top

Box

Sate

llite

Rad

io

Cord

less

Pho

nes

Cons

umer

Elec

tron

ics

Hot

Spo

ts a

re h

ot

Ag

gre

ga

tor

-Roa

min

g &

Sof

twar

e

Ho

t S

po

t

Op

era

tors

-Net

wor

ks

Ve

nu

es

-Loc

atio

ns

Bra

nd

s-E

nd u

sers

Hot

spo

t In

dust

ry s

egmen

ts

Out

line

WLA

N M

arke

t /

App

licat

ions

WLA

N s

tand

ards

W

LAN s

tand

ards

W

LAN

tec

hnol

ogy

Wir

eles

s co

nver

genc

eW

LAN

issu

es /

Fut

ure

tren

dsCo

nclu

sion

s

WLA

N S

tand

ards

Sum

mar

ySt

anda

rdFr

eqP

hyTh

rupu

tR

ange

Std

Rat

ified

Chi

ps A

vail

Prod

Ava

ilB

lueto

oth

2.4

GF

HS

S1M

b/s

30ft

Part

ial 2000

Q201

Lim

ited V

ol

802.1

1b (

Wi-F

i)2.4

GD

SS

S11M

b/s

200-3

00ft

1999

Q101

Hig

h V

ol

802.1

1g

2.4

GO

FD

M22-5

4M

b/s

200-3

00ft

2Q

02

4Q

02

1Q

03

802.1

1a

5G

OF

DM

54M

b/s

100-3

00ft

1999

4Q

01

1Q

02

Hip

erL

AN

/25G

OF

DM

54M

b/s

100-1

50ft

2Q

02

3Q

02

??

•C

urr

en

t acti

ve 8

02.1

1 t

ask g

rou

p p

roje

cts

Task G

rou

pP

roje

ct

Targ

et

Date

to

Co

mp

lete

Key F

eatu

res

TG

EM

AC

En

han

cem

en

ts -

Qo

SJu

ly 2

004

ED

CF

, E

PC

F (

Po

ll A

ccess)

TG

G2.4

GH

z H

igh

Data

Rate

Ju

ly 2

003

54M

bp

s i

n 2

.4G

Hz

TG

Fin

ter

Access P

oin

t P

roto

co

lJu

ly 2

003

AP

Mg

mt

TG

H802.1

1a S

pectr

um

Mg

mt

No

v 2

003

Tx P

wr

Co

ntr

ol

TG

IE

nh

an

ced

Secu

rity

Mech

an

ism

sJu

ly 2

004

Ad

van

ce E

ncry

pti

on

Sta

nd

ard

(A

ES

)

Tem

po

ral

Key I

nte

gri

ty P

rotc

ol

(TK

IP)

TG

J4.9

GH

z J

ap

an

Ju

ly 2

004

OF

DM

op

era

tio

n a

t 4.9

GH

z

TG

KR

ad

io R

eso

urc

e M

easu

rem

en

tJu

ly 2

004

Wir

ele

ss N

etw

ork

Mg

mt

WN

GW

irele

ss N

ext

Gen

era

tio

nN

/AC

all

fo

r In

tere

st

co

mm

itte

e

HS

TG

Hig

h T

hro

ug

hp

ut

Stu

dy G

rou

p2H

- 2

006

Data

rate

s >

54M

bp

s

to b

e T

Gn

in

Sep

t -0

3

IEE

E 1

394

IEE

E 8

02.1

1

IEE

E

802.1

5/.16./18/.19/.20

Blu

eto

oth

Eu

rop

e

ET

SI

Ja

pa

n

MM

AC

/PC

OF

DM

Fo

rum

5G

IAG

Ca

ble

La

bs

Wi-

Fi A

llia

nce

(fo

rmally W

EC

A)

3G

PP

IEEE

802

.11

Liaiso

ns w

ith

othe

r or

ganiza

tion

s

802.

11 N

ew A

reas

of

Inte

rest

Wir

eles

s N

ext

Gene

rati

on (W

NG)

WLA

N a

nd 3

G in

terw

orki

ng

Mes

h N

etwo

rkin

gEx

pans

ion

into

WA

N c

over

age

Tele

mat

ics

HTS

G (H

igh

Thro

ughp

ut S

tudy

Gro

up)

>54M

bps

Inno

vati

ve a

rchi

tect

ures

MIM

O A

nten

nas,

and

mul

tipl

e re

ceiv

ers

Task

Gro

up T

Gn in

Sep

tem

ber

2003

Spec

ial C

omm

itte

esRe

side

ntia

l –En

terp

rise

App

licat

ion

usag

e m

odel

sCh

anne

l usa

ge m

odel

s

Out

line

WLA

N M

arke

t /

App

licat

ions

WLA

N s

tand

ards

W

LAN t

echn

olog

yW

LAN t

echn

olog

yW

irel

ess

conv

erge

nce

WLA

N is

sues

/ F

utur

e tr

ends

Conc

lusi

ons

WLA

N I

C te

chno

logy

cho

ices

Wha

t ar

e th

e ke

y te

chno

logy

iss

ues?

Wha

t is t

he r

ight

app

roac

h –

syst

em o

n a

chip (SO

C)

or s

yste

m o

n a

pack

age

(SOP)

?W

hat

is t

he r

ight

WLA

N c

hip

arc

hite

ctur

e –

dire

ct

conv

ersion

, du

al c

onve

rsion

etc.

Mod

ule

tech

nology

cho

ices

Which

is

the

righ

t pr

oces

s?Si

CM

OS,

SiG

e Bi

CMOS,

GaA

s HBT

, M

ESFE

T,

PHEM

TSi

ngle b

and

vs.

multiba

nd,

802.

11 a

/b/g

Sing

le s

tand

ard

vs. multist

anda

rd, 80

2.11

, GS

M,

GPRS

, W

CDM

A, W

iMax

Sing

le b

and

mig

rati

ng t

o m

ulti

band

Mul

tim

ode

Ope

rati

on ie

. 80

2.11

b t

o 80

2.11

g to

802

.11a,

b,g

Hig

h Pe

rfor

man

ceLo

ng R

ange

–M

any

Curr

ent

802.

11a

Prod

ucts

Hav

e Lo

w Ra

nge

at 5

4 M

bps

Low

Powe

r Co

nsum

ptio

nH

igh

Dat

a Ra

tes

Acc

ess

Pt. v

s. N

IC A

rchi

tect

ures

NIC

car

ds n

eed

lowe

r po

wer

diss

ipat

ion

than

acc

ess

poin

tsA

ddit

iona

l Fea

ture

sBr

idge

Pro

duct

sSm

all S

ize

Low

Prod

ucti

on C

ost

Flex

ible

Arc

hite

ctur

eEa

rly

Mar

ket

Entr

y

WLA

N S

yste

m a

nd M

arke

t Re

quirem

ents

Syst

em o

n a

chip

(SO

C) v

sSy

stem

on

a pa

ckag

e (S

OP)

tra

deof

fsH

igh

Perf

orm

ance

Dua

l Ban

d W

LAN

s Re

quir

e M

ulti

ple

Proc

esse

s•

GaA

s H

BT f

or P

A•

PHEM

T fo

r LN

A /

Swi

tch

•M

CM T

echn

olog

y LT

CC /

Sof

tbar

d fo

r In

tegr

ated

Ant

enna

/

PA /

Swi

tch

/ LN

A•

NIC

Car

d an

d A

cces

s Po

int

May

Hav

e D

iffe

rent

Nee

ds•

802.

11b

Onl

y W

LAN

Chi

ps H

ave

Easi

er S

pecs

for

SO

C

Wha

t ar

e th

e righ

t W

LAN

tech

nology

cho

ices

, SO

C or

SOP?

How

Muc

h In

tegr

ation?

Dep

ende

nt u

pon

Syst

em A

rchite

ctur

e /

Part

itioning

Highe

r In

tegr

ation

Lowe

rs C

ost

(up

to a

point

)High

Inte

grat

ion

Doe

s Not

Allo

w Fl

exib

ility

Acc

ess

Point

and

NIC

Car

ds h

ave

diff

eren

t IC

nee

dsBr

idge

Pro

duct

sM

ulti A

nten

naEx

tra

Long

Ran

geDua

l Co

nver

sion

vs.

Single

Conv

ersion

Arc

hite

ctur

esSh

ould P

A, LN

A S

witc

hes

be I

nteg

rate

d on

the

Sam

e Ch

ipIn

tegr

ating

High

Perf

orman

ce P

As,

Tou

gh in

CMOS

SiGe

Bip

olar

/ B

iCM

OS

-Lo

w Co

st /

Hig

h Pe

rfor

man

cePL

L an

d D

igit

al F

unct

ions

Are

Bet

ter

Don

e in

CM

OS

Hig

h pe

rfor

man

ce M

ulti

-Ban

d A

rchi

tect

ures

Are

Bet

ter

Don

e in

SiG

eSi

CM

OS

/ Bi

CMO

S –

Very

Low

Cos

t /

Perf

orm

ance

Iss

ues

for

mul

tiba

nd o

pera

tion

Good

for

Sin

gle

Band

Arc

hite

ctur

es a

nd D

igit

al F

unct

ions

Ga

As

MES

FET

/ H

BT –

Low

to M

oder

ate

Cost

/ H

igh

Perf

orm

ance

Hig

h Pe

rfor

man

ce R

F Fu

ncti

ons,

i.e.

LN

A, P

A s

witc

h ar

e be

tter

don

e in

GaA

sW

hat

is B

est?

(low

er c

ost

and

high

er p

erfo

rman

ce)

1)H

igh

Perf

orm

ance

SiG

e Pr

oces

s wi

th H

igh

Yiel

ds; o

r2)

Low

Perf

orm

ance

CM

OS

Proc

ess

with

Low

Yie

lds

Wha

t is t

he R

ight

Pro

cess

Te

chno

logy

for

WLA

Ns

Fair

Good

Fair

Fair

Very

Goo

dVe

ry G

ood

Dig

ital

Func

tion

s

Fair

Good

Good

Fair

Very

Goo

dVe

ry G

ood

PreS

cale

rs

Fair

Good

Good

Fair

Good

Very

Goo

dVC

O

Very

Goo

dPo

orPo

orVe

ry G

ood

Fair

Fair

RF S

witc

h

Very

Goo

dFa

irVe

ry G

ood

Very

Goo

dFa

irFa

irPA

Very

Goo

dGo

odVe

ry G

ood

Very

Goo

dGo

odGo

odM

ixer

s

Very

Goo

dGo

odGo

odVe

ry G

ood

Good

Good

LNA

pHEM

TSi

GeH

BTGa

AsH

BTGa

AsF

ETRF

CM

OS

BiCM

OS

Func

tion

RFIC

Tec

hnolog

y by

Fun

ction

OFD

M S

yste

ms

Requ

ire

Hig

h Pe

rfor

man

ceH

igh

Dyn

amic

Ran

geSi

gnif

ican

t Ba

ck-O

ff in

PAs

Hig

h Pe

rfor

man

ce L

AN

and

Swi

tche

sM

ulti

band

and

Div

ersi

ty A

nten

nas

with

Swi

tche

sLo

w Ph

ase

Noi

seVC

Os

Si C

MO

S O

K fo

r Si

ngle

Ban

d b/

g bu

tM

ulti

band

/ H

igh

Powe

r O

pera

tion

Dif

ficu

lt w

ith

Si C

MO

S (Y

ield

Iss

ues)

GaA

s H

BT G

ood

for

Hig

h Ef

fici

ency

Low

Cur

rent

and

Low

EVM

PAs

Bott

om L

ine

–Mul

tiba

nd W

LAN

Sys

tem

s Re

quir

e H

igh

Perf

orm

ance

RF

with

Nee

d fo

r M

ulti

ple

Proc

ess

and

Syst

em o

n a

Pack

age

Tech

nolo

gy

WLA

N S

yste

ms

Requ

ire

High

Perf

orman

ce

WLA

N t

echn

olog

y ch

oice

co

mpa

riso

nO

ptim

um p

roce

ss t

echn

olog

y de

pend

s on

WLA

N

mar

ket

/ pr

oduc

t ne

eds

/sys

tem

arc

hite

ctur

eM

ark

et

Perf

orm

an

ce

Tech

no

log

y c

ho

ices

/ co

st

PA

Tra

nsceiv

er

Inte

gra

ted

T

ran

sceiv

er

/PA

Rati

ng

P-S

i C

MO

SP

-SiG

e B

iCM

OS

P-G

aA

s H

BT

T-S

i C

MO

ST-S

iGe B

iCM

OS

T-G

aA

s H

BTT

/P--

Si C

MO

T/P

-SiG

e B

iCM

OT/P

-GaA

s H

BT

802.1

1 b

perf

orn

mance

23

54

56

3.5

4.5

6

802.1

1 g

perf

orn

mance

1.5

35

45

63

4.5

6

802.1

1 a

perf

orn

mance

13

53.5

56

2.5

4.5

6

802.1

1 a

/b/g

perf

orn

mance

13

52

56

1.5

4.5

6

802.1

1b

cost

11

11

1.2

31.2

1.2

3

802.1

1g

cost

1.5

1.2

1.4

1.5

1.4

31.6

1.4

3

802.1

1a

cost

2.5

21.8

1.8

1.8

3.5

2.4

23.5

802.1

1a/b

/gcost

42.5

23

24

42.2

4

optim

um

technolo

gy c

hoic

e f

or

perf

orm

ance /

cost

Key

to a

Suc

cess

ful Ra

dio

Inte

grat

e as

muc

h as

pos

sibl

e on

a

chip

wit

hout

lowe

ring

yie

lds

Tim

e to

Mar

ket

–Ti

me

Is Y

our

Enem

y, M

CM A

llows

One

to

Mee

t th

e To

ugh

Spec

s -

Qui

ckly

MCM

app

roac

h is

bet

ter

if t

he

syst

em r

equi

res

diff

eren

t IC

pr

oces

s, m

any

filt

ers

and

pass

ives

(L

, C, R

s) o

utsi

de t

he c

hip

Non

802

.11

stan

dard

s ba

sed

radio

applicat

ions

–mou

se, ke

yboa

rd, e

tc.

App

licat

ions

: PC

mou

se, k

eybo

ard,

aud

io h

eads

ets,

gam

e co

ntro

llers

Requ

irem

ents

Low

cost

, lo

w po

wer,

sm

all s

ize,

1M

bps

data

rat

esA

ppro

ach

Use

Mic

ro L

inea

r M

L272

4, M

L 27

22, S

ingl

e-ch

ip

tran

scei

vers

at

900

or

2.4

GHz

tran

scei

vers

Pa

ckag

e ra

dio

/ ba

seba

nd /

mic

ro c

ontr

olle

r is

a

smal

l pac

kage

Bene

fits

–le

ss o

verh

ead,

lowe

r co

st, o

ptim

ized

rad

io,

base

band

/ pr

oces

ses

for

the

appl

icat

ion

like

PC

keyb

oard

, mou

se, w

irel

ess

gam

e co

ntro

llers

etc

.80

2.11

dat

a sy

stem

s ca

n be

too

exp

ensi

ve f

or s

ome

low

cost

dat

a ap

plic

atio

ns

Non

802

.11

stan

dard

ba

sed

radio

solution

for

dat

a ap

plicat

ions

ML2

724

•2.

4GH

z si

ngle

-chi

p FS

K tr

ansc

eive

r•

Dou

ble

conv

ersi

on L

ow I

F A

rchi

tect

ure

•Cl

osed

-loop

dir

ect

VCO

mod

ulat

ion

with

on-

chip

pre

mod

filt

er•

Aut

omat

ic s

elf-

alig

ned

chan

nel f

ilter

ing

for

opti

mum

sen

siti

vity

•

No

exte

rnal

SA

W f

ilter

s or

tan

k ck

t. n

eede

d•

DIG

In

-D

IG o

ut•

1.5 M

bps

•M

ore

than

10

Mill

ion

2.4

GHz

radi

os s

hipp

ed

Micro

Linea

r M

L272

4 Tr

ansc

eive

r

Filt

er

Alig

nm

ent P

LL

Div

ider

TR

FO

2.4

GH

z

Outp

ut

Quadra

ture

Dow

nm

ixers

Quadra

ture

Div

ider

1.6

GH

z

VC

O

DO

Dig

ital outp

ut

AO

UT

Analo

g O

utp

ut

DIN

Tra

nsm

it D

ata

Ref.

Div

ider

Contr

ol

Regis

ters

Serial

Contr

ol B

us

RS

SI

P.D

.

FR

EF

Mode

Contr

ol

Div

ide

by 2

Tw

o-p

ort

Modula

tor

F to V

RS

SI

RR

FI

2.4

GH

z

Receiv

e I

nput

Test

Mux.

PA

ON

RX

ON

XC

EN

DA

TA

CLK

EN

VT

UN

EQ

PO

Tra

nsm

it

Mix

er

Data

Filt

er

Mu

x.

Mux.

1st

IF F

ilter

2nd I

F F

ilter

Tota

l Ra

dio

Mod

ule

Solution

•O

nly

one

cera

mic

BPF

•N

o SA

W f

ilter

s•

No

LC t

ank

circ

uits

•2-

laye

r PC

B•

27 x

41m

m•

20 d

Bm T

x po

wer

•-9

5 dB

m R

x se

nsit

ivit

y•

200

ma

Txcu

rren

t•

80 m

a Rx

cur

rent

Micro

Linea

r Ra

dio

Mod

ule

Basi

c W

irel

ess

Cont

rolle

r Bl

ock

Dia

gram

Baseb

an

d C

on

tro

ller

Tra

nsceiv

er

ML

2724

Do

ut

Din Data

Clk

En

XC

EN

RX

ON

RS

SI

Refe

rence

XT

AL

OS

C

RR

FI

TR

FO

T/R

Sw

itch

BP

F

LN

A

Analo

g

Jo

ystick

DC

Regula

tor

AA

Ba

tte

ries

32kH

z

XT

AL

3.3

v

AD

C

UA

RT

XT

AL

re

f

GP

IO

GP

IOR

TC

AD

C

Dig

ital

Sw

itche

s

GP

IO

Pw

r D

wn

Micro

Linea

r M

odule

PA

s

pa

ssiv

es / b

ias

pa

ssiv

es / b

ias

pow

er

am

plif

ier

-11a

-11b/g

-D

ual-band

pow

er

am

plif

ier

pow

er

am

plif

ier

sw

itch

/ L

NA

PA

Mo

du

le

Fro

nt-

End

Module

Sw

itch

Div

ers

ity, T

x/R

x

LN

A

-5 G

Hz L

NA

-S

w /

LN

A

-P

A /

LN

A

Filt

ers

-B

PF

-L

PF

-B

alu

n

1 2 3

14

15

16

12

11 9

76

5

3

4

F

C C C

C

R

4

8

10

13

G

R

C

D

1

13

9

8 C

G

D

LN

A

PA

PA

WLA

N F

ront

-end

Mod

ule

Bene

fits

of

MCM

sM

CM a

llow

impr

oved

per

form

ance

and

fle

xibi

lity

Pout

, gai

n, f

unct

iona

lity,

spe

cs e

tc. c

an b

e ch

ange

d fo

r di

ffer

ent

cust

omer

s in

the

sam

e pa

ckag

eCa

n m

ix d

iffe

rent

pro

cess

es, C

MO

S, G

aAs

HBT

, LT

CC f

ilter

s, p

assi

ves

Qui

ck d

evel

opm

ent

tim

eM

odul

e de

velo

pmen

t ti

mes

are

abo

ut 5

0% o

f th

e IC

dev

elop

men

t ti

mes

due

to

fast

er la

min

ate

fab.

tim

eSi

mpl

icit

y, le

ss p

arts

and

eas

e of

use

Cust

omer

s pr

efer

1 p

art

over

5 o

r 10

par

tsCu

stom

ers

with

poo

r RF

kno

wled

ge c

an u

se M

CMs

easi

ly

WLA

N M

odule

Baseband

Pro

cessor

and

Media

Access

Contr

olle

r (M

AC

)

Tra

nsce

ive

rF

ront-

en

d

USB Interface

Sin

gle

chip

802.1

1 a

/b/g

S

ingle

chip

802.1

1 a

/b/g

MC

M i

s poss

ible

in n

ear

MC

M i

s poss

ible

in n

ear

futu

re w

ith 2

futu

re w

ith 2

-- 4 h

ighly

4 h

ighly

inte

gra

ted c

hip

sin

tegra

ted c

hip

s

MC

Ms

MC

Ms

wil

l pla

y a

key

role

in

wil

l pla

y a

key

role

in

PD

As

PD

As ,

ce

ll p

hones

, sm

all

thin

, c

ell

phones

, sm

all

thin

no

teb

oo

ks

and

WL

AN

SD

car

ds

no

teb

oo

ks

and

WL

AN

SD

car

ds

like

like

Sych

ipS

ych

ipW

LA

N 6

06

0W

LA

N 6

06

0

Out

line

WLA

N M

arke

t /

App

licat

ions

WLA

N s

tand

ards

W

LAN

tec

hnol

ogy

Wireles

s co

nver

genc

eW

ireles

s co

nver

genc

eW

LAN

issu

es /

Fut

ure

tren

dsCo

nclu

sion

s

Conv

erge

nce

Inte

grat

ed c

ellu

lar

and

Wi-F

i net

work

Wid

e ar

ea c

over

age

for

note

book

s, P

DA

, cel

l ph

ones

Inte

grat

ed t

elep

hony

and

Wi-F

i net

work

Lowe

r co

st f

or lo

ng d

ista

nce

calls

Inte

grat

ed o

f Bl

utoo

th a

nd W

i-Fi n

etwo

rkW

ide

area

cov

erag

e an

d m

ore

netw

ork

opti

ons

for

note

book

s, P

DA

, cel

l pho

nes

Inte

grat

ed C

ellular

/ W

LAN

chipse

tW

hy d

oes

it m

ake

sens

eLo

wer

cost

, bet

ter

perf

orm

ance

, eas

e of

use

Mar

kets

for

inte

grat

ed C

ellu

lar

/ W

LAN

chi

pset

PDA

, Cel

l pho

nes,

Not

eboo

k PC

s2G

, 2.5

G v

s. 3

GD

ata

Rate

sW

LAN

–11

to

54M

bps

2G –

14.4

Kbps

3G –

2Mbp

s, G

SM /

GPR

S /

CDM

A20

0 /

WCD

MA

Stan

dard

802.

11a,

b,g

and

GSM

/ G

PRS

/ W

CDM

ACo

vera

geW

LAN

–sm

all a

rea,

Hot

els,

air

port

s, h

ot s

pots

Cellu

lar

–wi

de m

etro

polit

an a

rea

Featu

res

•allo

w h

andheld

s t

o a

ccess d

ata

and m

ake

wirele

ss v

oic

e c

alls

•fu

lly c

om

plia

nt

with I

EE

E 8

02.1

1a/b

WLA

N

sta

ndard

s

•ru

ns o

n G

SM

(Glo

ba

l S

yste

m f

or

Mo

bile

Com

munic

ations)

and G

PR

S (

Genera

l P

acket

Radio

Serv

ice)

netw

ork

s

• •

Ap

plicati

on

s•

voic

e +

WLA

N P

CM

CIA

card

for

note

book o

r

PD

A

•E

mbedded a

ddin

g W

LA

N t

o c

ell

phone

• •em

ail

•str

eam

ing v

ideo

•voic

eWLA

N c

overa

ge

WLA

N c

overa

ge

(vo

ice

+ h

igh

data

thro

ughpu

t)

Cellu

lar

covera

ge

Cellu

lar

covera

ge

(vo

ice

+ low

da

ta th

roughput)

Tra

ve

ling

Hot S

pot

Offic

e

Ho

me

Inte

gra

ted

Ce

llula

r /

WL

AN

ch

ipse

tIn

tegr

ated

cellular

WLA

N c

hips

et

Out

line

WLA

N M

arke

t /

App

licat

ions

WLA

N s

tand

ards

W

LAN

tec

hnol

ogy

Wir

eles

s co

nver

genc

eW

LAN iss

ues

/ Fu

ture

tre

nds

WLA

N iss

ues

/ Fu

ture

tre

nds

Conc

lusi

ons

WLA

N iss

ues

Lim

ited

in b

uild

ing

rang

e –

up t

o 30

0 fe

et

Lowe

r da

ta r

ate

at lo

nger

dis

tanc

esA

bsen

ce o

f ne

twor

k m

anag

emen

t ca

pabi

lity

to a

void

con

gest

ion

Poor

Qua

lity

of S

ervi

ceSi

gnif

ican

t co

sts

to e

nhan

ce a

nd e

xpan

d th

e W

LAN

net

work

sIn

terf

eren

ce w

ith

othe

r W

LAN

sys

tem

s in

th

e ar

ea

WLA

N iss

ues

Stan

dard

s ar

e Ev

olvi

ngW

hich

sta

ndar

d wi

ll wi

n 80

2.11

b, g

or

a/b/

gCo

vera

ge is

Spo

tty

Secu

rity

is n

ot r

elia

ble

Net

work

Man

agem

ent

cost

s ar

e hi

ghIn

tero

pera

bilit

y is

lim

ited

Busi

ness

mod

els

of m

any

star

tups

qu

esti

onab

leCa

n th

e m

arke

t su

stai

n m

ore

than

70

WLA

N

star

tups

Mis

cella

neou

s –

Billi

ng, n

etwo

rk s

cala

bilit

y

Futu

re t

echn

olog

y tr

ends

Mor

e in

tegr

atio

n on

chi

p -

sing

le c

hip

CMO

S, S

iGe

802.

11b

solu

tion

Hig

her

inte

grat

ion

MCM

sM

ulti

-ban

d ra

dios

Mul

ti-s

tand

ard

radi

os –

inte

grat

ion

of

cellu

lar

and

WLA

N n

etwo

rks

Act

ive

/ M

ulti

ple

ante

nnas

, MIM

O s

yste

m,

exte

nded

ran

ge W

LAN

Inte

rfer

ence

mit

igat

ion

WLA

N s

yste

m o

ptim

izat

ion

Conc

lusion

s

WLA

N m

arke

t is

gro

wing

rap

idly

and

the

indu

stry

sh

ows

sign

s of

tak

ing

off

in a

big

way

WLA

N t

echn

olog

y wo

rks

well

and

is c

ost

effe

ctiv

eVo

lum

e wi

ll dr

ive

the

pric

e do

wn f

urth

er80

2.11

b, g

and

a/b

/g s

tand

ards

wel

l es

tabl

ishe

d an

d im

prov

ing

furt

her

with

en

hanc

emen

tsW

LAN

tec

hnol

ogy

is im

prov

ing

rapi

dly

and

is

gett

ing

inte

grat

ed w

ith

othe

r br

oadb

and

tech

nolo

gies

i.e.

. 3G

/ ce

llula

r, C

able

TV,

DSL

, Bl

ueto

oth,

BW

A a

nd w

ill p

lay

a ke

y ro

le in

wir

eles

s la

st m

ile s

olut

ions