wilfriedhaensch and tymon barwicz ibm t.j. watson research … panel 05-31-16.pdf · 2018. 1....

© 2016 IBM CorporationTymon Barwicz et al.

Cost-Efficient Photonic Packaging March, 2016

© 2016 IBM Corporation

High-Throughput Photonics Packaging for Cost-Efficiency and Scalability.

Wilfried Haensch and Tymon BarwiczIBM T.J. Watson Research Center, NY USA

ECTC Panel May 2016



2

Silicon chip(s)

Everything else� assembly� testing� fiber connector(s)� laser(s)� etc.

Need to reduce the cost of “everything else” for large scale deployment

Leverage high-throughput microelectronic assembly lines for photonics packaging

Manual Custom Tools

Leverage cost-eff iciency of microelectronics in package not just w afer

Silicon Photonics May be Hampered by Everything But the Silicon

Standard IC Tools

High-Throughput Photonics Packaging for Cost-Eff iciency and Scalability

ECTC Panel May 2016

Component cost



Comparing approaches to photonic packaging

3

Bill of materials

Tools amortization

LaborR&D

cost

Manual assembly $$ $ $$$ $

Automated - custom

tools$ $$$ $ $$$

Automated - conv.

pick & place tools$$ $ $ $$$

• High-throughput automation appears as logical trend with volume/complexity

• Share pick & place tools with IC assembly gives high tool amortization

• Relegating packaging IP to SiPh chip minimizes reconfiguration cost of assembly tools and jigs

Relative cost structure


ECTC Panel May 2016



Challenges to leveraging high-throughput tools for photonics

4

1. Limited placement accuracy of ± 10 µm

Photonic chip

Polymer ribbon

10 µm fiber mode

Mode expansionon wafer

Connect at largest mode for tolerances

2. Inflexible pick-and-place handling

Avoid small-mode fibers for cost and tolerances

Vacuum pick-tip handling Pressure-sensing movement only vertical

Integrate polymer lid for fiber handling

Vacuumpicktip

Chip assembly

Self-alignment for 1-2 µm accuracy Mode engineering for max tolerances


ECTC Panel May 2016



Our solutions to low-cost and scalable photonic packaging

5

• All approaches fully compatible with existing high-throughput assembly tools.• Minimum number of parts and assembly steps for cost efficiency and scalability

Flip-chipelectrical connections

Standard MT fiber interface

Flip-chipelectrical connections

Standard MT fiber interface

Cleaved fiber array

Direct flip-chip assembly of InP die

Polymer waveguides in flexible ribbon

Photonic die

InP laser array

Si

Parallelized fiber assembly Compliant polymer interface

InP die


ECTC Panel May 2016



6

Parallelized fiber assembly

• Low cost pick & place assembly in high-throughput tools.

• Any number of fibers in 1D array.

• In-plane coupling for CWDM bandwidth with full fiber mode

V-groove array

InP dies

Attach regionfor InP die Photonic die

Polymer lid

12 fiber array

Wavelength (µm)

Lo

ss to

fib

er

(dB

)

1.26 1.28 1.3 1.32 1.34 1.36

-3

-2

-1

TETM

0.8 dB

-1.3 dB

O-band converter response

Fiber core

Si

Adhesive

100 µm

Mechanical design

V-groove Suspended region

Metamaterialfiber coupler

Si

SiO2

MT ferrule

200 nm


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Compliant polymer interface

7

InP dies

Si photonic die

Polymer ribbon

Ferrule

Polymer coupling region

Ferrule lid

• Large number of optical ports

• Flexible for mechanical reliability

• Self-aligned assembly (±1-2 µm) in high-throughput tools (±10 µm)

Si alignment groove

Polymer ridge

20 µm

Si chip

Polymer ribbon

Si waveguides

Polymer waveguides

1.46 1.50 1.54 1.58

-1.0

-1.5

-2.0

-2.5

-3.0

-3.5Fib

er

to S

i lo

ss (

dB

)

Wavelength (µm)

TE

TM

Active aligned at fiber connector

Optical performance �� 1.8 dB peak

A few design details

MT interface


ECTC Panel May 2016



Self-aligned photonic flip-chip assembly for InP integration

8

Pick and place (±10 µm), then anneal (< ±1 µm)

InP die with laser array

Photonic die or wafer10

µm

Solder induced self-alignment

Photonic die

10 µm

Stop on bottom die

Stop on top die

Bottom die/wafer

Top die

Butting

Cross-section after assemblyInfrared view through assembly

Pad on bottom diePad on top die

Tackfluid

50 µm

• Tighter alignment than in fibers as universally achievable mode size is smaller • Self-alignment with lithographic stops in standard high-throughput tools• Optical demo with 1.1 dB chip-to-chip transmission submitted for publication


ECTC Panel May 2016



Conclusion

9

Our vision is the integration of photonic packaging

within microelectronic packaging facilities.

� Same facility, different “node”

� Same tools, different processes/jigs

Parallelized fiber assembly Compliant polymer interface Self-aligned photonic flip-chip

Demonstrated photonic packaging compatible with high-throughput

microelectronic facilities

Working on bringing 3 solutions to the photonics community

Requirement � MEMS-like process for self-alignment structures on wafer.


ECTC Panel May 2016



Team and Acknowledgment

10

IBM T.J. Watson, NY USADesign, fabrication, analysis

Former ‘IBM – Burlington’ Chip manufacturing

IBM Bromont – C2MIAssembly, measurement

Follow our progress

Through our IBM project website � Google “Silicon nanophotonic packaging.”

IBM Research - TokyoRibbon-ferrule assembly

Outside partners

Shotaro TakenobuPolymer ribbon fabrication

Masato ShiinoCustom ferrule fabrication

Ted LichoulasEddie Kimbrell

Fiber stub fabrication


ECTC Panel May 2016

wilfriedhaensch and tymon barwicz ibm t.j. watson research … panel 05-31-16.pdf · 2018. 1....

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