wet etch and clean - entegris · wet etch and clean (wec) processes touch wafers more than any...

wet etch and clean

wet etch and clean

Wet Etch and Clean (WEC) processes

touch wafers more than any single

application in the semiconductor

fab. WEC processes modify and clean

the wafer surface with a critical

influence to meet the demanding

yield requirements of an effective

fab. These processes utilize the most

aggressive chemistries: strong acids,

oxidizers, solvents, high temperatures

and highly concentrated substances.

The process materials and parameters

must be controlled to levels other

industries cannot achieve in terms

of repeatability and consistency.

Entegris provides the solutions

to succeed under these extreme

conditions.

wet etch and clean

ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 1

table of contentsSection 1: About Entegris

Purify, Protect and Transport ..................................................... 2

Global Presence ........................................................................... 3

Enabling Innovation .................................................................... 4

Close to Our Customers .............................................................. 5

WEC Solutions ............................................................................. 6

Section 2: Product/Solutions

PURITYOverview ................................................................................... 8

Chemical Compatibility Chart ............................................... 9

Torrento® Filter Family .......................................................... 10

QuickChange® ATM and ATE Filters .................................... 12

QuickChange Plus 1500/3000 Filters .................................... 14

Intercept® Plus HPM Filters ................................................. 16

Guardian™ ECD Cartridge Filters ....................................... 18

Microgard™ Plus LE Cartridge Filters ................................. 20

Protego® IPA and LTX/HTX Purifiers ................................... 22

Wafergard® MAX In-line Teflon® Gas Filters ...................... 24

AMC Tool Top Filters .............................................................. 26

MATERIALS MANAGEMENTMicroenvironment Protection Solution ................................ 28

¾", 1" and 1¼" Integra® Valves ............................................. 30

CR4, CR8 and CH8 Manual and Pneumatic Valves.............. 32

Flaretek® 90° Sweep Elbows ................................................. 34

PrimeLock® Fittings .............................................................. 36

Microenvironment Transport Solutions ................................ 38

PROCESS CONTROLNT® Conductivity Sensor, Model 8800 and NT Conductivity Analyzer, Model 8850 ................................. 40

NT High-Temperature Flowmeter, Model 4401 ................... 42

NT Integrated Flow controller, Model 6510 and 6520 ......... 44

pHasor® X Heat Exchanger ................................................... 46

NT Pressure Transducers ....................................................... 48

Dymension® Manifolds ........................................................... 50 Entegris Analytical Services .................................................. 52

«» WET ETCh aNd ClEaN «» ENTEGRIS INC. ENTEGRIS INC. «» WET ETCh aNd ClEaN «» 32

Entegris provides innovative materials science-enabled solutions for applications across key semiconductor processes to help chip makers solve manufacturing challenges, enhance yield and gain sustainable competitive advantage.

purify, protect and transport

bulk chemicalAs wafer sizes continue to increase and line widths shrink, purity requirements become more stringent and precise chemical blending becomes more critical. Whether it’s transport or storage, mixing or dispense, Entegris has solutions to meet bulk chemical handling needs.

chemical mechanical planarizationFrom filtration, liquid and slurry handling, Entegris products enable the CMP process.

wet etch and cleanUltrapure liquids and gases are purified, protected and transported with Entegris filters, purifiers, valves, fittings and sensing and control products.

wafer handlingEntegris provides wafer handling products to protect and transport prime wafers, wafers being processed, finished wafers, bare die and packaged devices. Products include wafer carriers, wafer shippers, mask and reticle carriers, bare die trays, horizontal wafer shippers, chip trays and film frame shippers.

photolithographyEntegris’ broad product line enables lithography processing with gas filters and diffusers, purifiers and purifier systems, wafer and reticle handling, liquid filtration, purification and control.

With 2,800 employees worldwide, Entegris thrives on the challenge to meet our customers’ expectations through a global network of service, technology, manufacturing and applications support teams, all built upon a tradition of product and process innovation.

global presence

lab capabilities

North America

Colorado Springs

San DiegoDecatur

FranklinBurlington

BillericaChaskaMinneapolis

Europe and Israel

Dresden

Moirans

Kiryat-Gat

Montpellier

Lyon

Asia and Japan

SingaporePenang

Kulim

Osaka

Tokyo

YonezawaSeongnam-si

Beijing

FukuokaShanghai

Tainan

TaoyuanHsinchu

Wonju-si

Analytical Services Product Testing Material Science• Airborne molecular contamination • Performance testing • New material development

• Surface contamination • Particle testing • Material characterization

• Applications support • Electrostatic charge • Material selection

• Root-cause analysis • Vibration • Material incoming inspection

• Flow rate optimization • Applications support

• Applied statistics

• Safety and industry standardization

• DOT and UN regulations

• CE marking

Entegris 2012Industries Served

Semiconductor, Compound Semi/LED, Data Storage, Flat Panel, PV Solar, Energy Storage, Life Sciences

Sales $716 million

Patents Holds 288 U.S. patents

and 568 patents in other countries

Number of Employees 2,800 worldwide

Stock listing ENTG on NASDAQ


The technology roadmaps to produce the next generation of semiconductor devices and microelectronics are presenting unprecedented technological challenges, as well as ever increasing pressure to improve yields and productivity. As the leading provider of contamination control products and services to the global semiconductor and microelectronics industry, Entegris is using a wide array of analytical and materials science expertise to develop comprehensive solutions to contamination issues in the fab.

enabling innovation

Electronics that are smaller, faster, cheaper and more functional

Leveraging our materials science expertise

ITRS 2010 2012 2014 2016

Node 32 22 14 10

DRAM 1/2 Pitch (nm) 45 32 25 20

Critical Particle Size (nm) 20 15 10 5

Critical Metal Ions (ppt) 1000 1000 100 TBD

Molecular Contaminants Surface Airborne Airborne Airborne

Industry

Lithography 193 nm Immersion Lithography EUV

Wafer Size 300 mm 450 mm

Entegris TechnologiesLiquid and Gas Filtration Continuous Improvement and Purification Filtration products: smaller pore size, higher flow, higher retention

Purification products: volatile organics, AMC, moisture

Wafer Handling Advanced 300 mm Microenvironment Control 450 mm prototypes

Mask Handling Carriers to prevent reticle haze EUV mask carriers

Fluid Handling Components for a wider range of process conditions, precise real-time sensing and control

Coatings New coating technologies for components used in next generation semiconductor processing

Direct sales and local support gives us the opportunity to achieve customer intimacy.

Customer intimacy helps us better understand our customers’ needs through direct feedback and roadmap sharing.

By aligning our material science, engineering and R&D initiatives, we can develop indispensable contamination control solutions to solve our customers’ roadmap challenges.

close to our customers

Application and Process�Knowledge

We Respond�Quickly with Prototypes

We Develop Relevant Final Solution

Relevant,Trusted,

TechnologyPartner

We Listen

Customer�views Entegris as solutions provider

Customer shares sensitive product

roadmap information

Customer enters� problem-solving�

relationship

Customer provides feedback

on prototype performance

Pilot Capability�at Most Sites

Expand Applications�Excellence

Direct Engagement�

by Engineering Teams

Faster New Product

Development

Entegris Milestones1966: Founded as Fluoroware, Inc.

2000: Begins trading under the ENTG symbol on NASDAQ

2005: Merges with Mykrolis Corporation, a leading provider of liquid filtration and gas purification products and systems

2006: Expands manufacturing facility in Kulim, Malaysia

2007: Acquires Surmet Corporation’s high-purity semiconductor coatings business

2008: Acquires Poco Graphite, an industry leader in high-performance graphite and silicon carbide

2009: Acquires PureLine Co., a fluid handling component manufacturer, in Kangwon-do, Korea

2011: Opens manufacturing facility in Hsinchu, Taiwan

2012: Opens the Advanced Technology Center, manufacturing for 450 mm and EUV, in Colorado Springs, CO

Acquires Entegris Precision Technology, a HDPE drum blowmolding facility, in Yangmei, Taiwan

Opens new facility to provide specialized silicon and diamond- like coatings in Lyon, France


Immersion/Batch Wafer Processing

Chemical delivery

aMC

Valve Manifold Box

Chemical Mixing System

Spray/Single Wafer Processing

For over 40 years, Entegris has been at the forefront of providing comprehensive microcontamination control solutions – with products and services that surround key processes such as wet etch and clean, lithography, CMP and wafer handling.

Our expertise in material science and contamination control enables our customers to meet the demands of the market by reducing costs, enhancing yields, increasing productivity, and improving process control.

wet etch and clean solutions

The following pages highlight 22 products designed to solve your fab challenges by providing best-in-class purification, materials management and process control solutions.>>>

Challenge

Purity Materials Management Process Control

Torr

ento

® 20

nm

& 1

5 nm

Liq

uid

Filte

rs

Quic

kCha

nge®

ATM

and

ATE

Filt

ers

Quic

kCha

nge

Plus

150

0/30

00 F

ilter

s

Inte

rcep

t® P

lus

HPM

Filt

ers

Guar

dian

™ EC

D Ca

rtrid

ge F

ilter

s

Mic

roga

rd™

Plus

LE

Cart

ridge

Filt

ers

Prot

ego®

IPA

& L

TX/H

TX P

urifi

ers

Waf

erga

rd®

MAX

In-l

ine

Teflo

n® G

as F

ilter

s

AMC

Tool

Top

Filt

ers

Spec

tra™

FOU

P

¾”,

1" a

nd 1

¼"

Inte

gra®

Val

ves

CR4/

CR8/

CH8

Man

ual &

Pne

umat

ic V

alve

s

Flar

etek

® 90

° Sw

eep

Elbo

ws

Prim

eLoc

k® F

ittin

gs

Proc

ess

Carr

iers

NT® 8

800

Noni

ntru

sive

Cond

uctiv

ity S

enso

r NT

885

0 Co

nduc

tivity

Ana

lyze

r

NT 4

401

High

-Tem

pera

ture

Flo

wm

eter

NT 6

510/

6520

Inte

grat

ed F

low

Con

trol

lers

pHas

or®

X He

at E

xcha

nger

NT

Pres

sure

Tra

nsdu

cers

Dym

ensio

n® M

anifo

lds

Anal

ytic

al S

ervi

ces

Customer Challenges

Proc

ess

Improve yield • • • • • • • • • • • • • • • •

Fast time-to-yield with new products • • • • • • • • • • • • •

Process flexibility • • • • • • • • •

Man

ufac

turin

g

Improve wafer throughput

• • • • • • • • • • • • •

Improve tool uptime • • • • • • • • • • • • •

Maintain and control operating conditions and process parameters

• • • • • • • • •

Maintain clean wafer environment • • • • • • • • • • • •

Equi

pmen

t Reduce calibration of sensors and equipment

• • •

Reduce scheduled and unscheduled maintenance

• • • • • • • • • • • • • • •

Cost

Chemicals and gases • • • • • • • • • • • •Filters • • • • • • • • •Energy (Electricity / Air) • • • • • • •Components • • • • •

ENTEGRIS, INC. «» WET ETCh aNd ClEaN «» 9

PUR

ITY

« » WET ETCh aNd ClEaN «» ENTEGRIS, INC.8

Good Compatiblity Possible : Usage is Application Specific Not Compatible

chemical compatibility guide

Developed from Mykrolis® microcontamination technologies, Entegris liquid contamination control solutions are specifically designed for filtration of chemicals used in data storage

processes and ensure higher flow rate, particle retention and longer lifetime, leading to higher productivity and lower cost of ownership.

liquid contamination control solutions

ChEMICal NaME Mic

roga

rd

Guar

dian

dE

V/Pl

us

Inte

rcep

t

Guar

dian

ECd

Fluo

roga

rd a

T

Qui

ckCh

ange

To

rren

to

Met

al Io

n Pu

rifie

r

ChEMICal dISTRIBUTION

Acetic Acid (glacial)

Ammonium Hydroxide

Hydrochloric Acid

Hydrogen Peroxide

Sulfuric Acid (96%)

Acetone

Ethyl Lactate Ethylene Glycol

Mineral Spirits

PGMEA (Propylene Glycol Monomethyl Ether Acetate)

Tetramethylammonium Hydroxide (TMAH) 25%

TMAH 2.5%

WaFER ClEaNING

DHF (Dilute Hydrofluoric Acid) SPM (Sulfuric Acid 96% + Hydrogen Peroxide @120°C) SC1 (@ 40-90°C) SC2 (@ 25-90°C) DI Water Rinse @ 20°C *1

DI Water Rinse @ 80°C *2

IPA (Isopropyl Alcohol) @ 20°C *3

ETChING

Silicon Etch (HF + Acetic Acid + HNO3)Buffered Oxyde Etch (HF + NH4F + H2O)

Nitride Etch (Phosphoric Acid 85% @120-160°C)

Aluminium Etch (H3PO4 + HNO3 + Acetic + H2O)

CU PlaTING

Copper Sulfate + Sulfuric AcidCitric Acid

Recommended product *1 Protego LTX *2 Protego HTX *3 Protego Plus IPA


PUR

ITY

20 nm and 15 nm retention with ultra-high flow rate performance. The new standard for nondewetting Teflon®* filters.

• Torrento filters provide high-yield, rapid bath cleanup cycles, extended filter life, fast changeouts and cleanliness - all in a prewet package for ease-of-use.

• Torrento ATE/AT3 cartridges and disposable filters are designed for recirculation bath applications, while Torrento 1500/3000 disposable are useful for single wafer processing.

• Torrento 1500/3000 are only available in 15 nm retention with maximum operating temperature to 95°C.

Optimized for leading-edge recirculated bath processes like SPM, SC1, SC2, DHF, etc. in process technology nodes 45 nm.

FEaTURE adVaNTaGE BENEFITGround breaking new high-flow Teflon membrane technology

• 20 nm and 15 nm particle removal with highest retention efficiency

• Exceptional flow performance without compromising retention

• Highly uniform pore size distribution insures high retention of small particles and long life

• Minimized particle-related wafer defects through optimal bath cleanup

• Increased OEE through reduced process cycle time

• Lower COO and increased OEE through extended filter lifetime

New device construction with more surface area in each filter

• Lower flow resistance• Higher flow• Extended lifetime

• Lifetime exceeds closest competitor by 20 percent in SPM process chemistry

• Reduced overall maintenance and replacement costs related to wet bench pumps as the low filter resistance design reduces pump strokes—reducing wear and tear

Maintains industry proven and reliable nondewetting technology

• No risk related to membrane technology

• Maintains advantages of QuickChange technology

• Fast qualification and rapid ROI• Low COO and high OEE through

fast installation/qualification, stable performance, long life

Available in cartridge and disposable formats

• Maximize installation flexibility • Seamless installation in existing tools

Torrento Filter Family

performanceTorrento’s revolutionary membrane technology provides improved retention at exceptional flow rates.

• High-flux membrane for high-flow recirculating applications

• Advanced particle retention to 15 nm

• High cleanliness performance during startup and product use

3X nm

5X nm

6X nm

<2X nm

<1X nm

Critical Feature / Pitch Size

Critical particle size: single digit nm

Critical particle size: 16 nm

Critical particle size: 22.5 nm

Critical particle size: 31.8 nm

Critical particle size: 45 nm

HigherFlow Rate

Part

icle

Ret

entio

nH

ighe

r Next Generation Technology

Filter Performance Guide

0.000

0

0.125

0

0.187

5

0.250

0

0.312

5

0.375

0

1.000

0

0.000

0

0.125

0

0.187

5

0.250

0

0.312

5

0.375

0

1.000

0

41 m

m L

LS (a

.u.)

1.0

0.8

0.6

0.4

0.2

0

Torrento ATE 20 nm QuickChange ATE 30 nm

4036322824201612840

QuickChange 3000 0.03 µm Torrento 3000 15 nm

@ 0.088 µm particle by SP2

41 nm llS versus Filter Rating and Bath life Torrento Plus 3000 15 nm in SC1 (Nh4Oh/h2O2) on dNS SU 3100

Product

Torrento aTE 20 nm

Torrento aT3 15 nm

Torrento Plus aT3 15 nm

Application Recirculation, bulk, viscous chemistries

Single pass, recirculation, bulk Recirculation, viscous chemistries

Membrane material Advanced PTFE - modified Advanced PTFE - modified Advanced PTFE - modified

Support materials Standard PFA Standard PFA Improved PFA

Media area 2 m² 3 m² 3 m²

Filter footprint Standard cartridge and disposable

Standard cartridge and disposable

Standard disposable only

Flow rate 0.2 KgF/cm² 23 L/min 22 L/min 17 L/min

Temperature rating 180°C 180°C 180°C

Metal cleanliness options

<10 µg/device STD, <3 µg/device UCM

Cartridge <25 ug/device STD,Disposable <10 ug/device STD,

Cartridge <10 ug/device UCM,Disposable <3 ug/device UCM

<3 µg/device UCM

* For Industrial Use Only. Not for use in food, drug, cosmetic or medical devices manufacturing, processing or packaging operations.

Tailored by application needs

Proven performance


PUR

ITY

FEaTURE adVaNTaGE BENEFIT

Nondewetting PTFE* membrane with prewet packaging

• Eliminates prewetting and flushing cycles

• High purity, ultra-clean, ready-to-use filter

• Consistent flow performance in outgassing chemistries

• Higher yields and longer life through consistent filter performance

• Increased tool time and decreased COO through longer filter life

• Decreased COO through reduced work/chemical consumption

High membrane surface area • ATE design incorporates 35% more membrane than ATM

• Lower flow resistance• Higher flow• Extended lifetime

• Minimized particle-related wafer defects through optimal bath cleanup


• Lower COO and increases OEE through extended filter lifetime

• Reduced overall maintenance• Reduced replacement costs related to wet

bench pumps through reducing wear and tear

High retention • Smaller particle removal, 30 nm • Cleaner device, higher yield needed for advanced technology nodes

Industry proven and reliable nondewetting technology

• No risk related to membrane technology • Fast, risk-free qualification and rapid ROI

Low metal extractables • Reduction in qualification time, ensures ultra-clean processing, low risks of metallic contamination of wafer

• Higher yield and wafer throughput

QuickChange aTM and aTE Filters

QuickChange ATE chemical filters enable rapid nano-particle removal via low pressure drop and high chemical flow rates.

• High flow, long-life prewet filter that delivers yield enabling particle protection, ease-of-use and rapid changeouts

• Reliable nondewetting membrane technology

Optimized for aqueous low and high temperature applications like SC1, SC2, SPM, aggressive acids and bases.

performanceQuickChange does not lose performance due to dewetting.

• QuickChange nondewetting filters do not dewet

• Entegris’ nondewetting filter membrane delivers yield enabling performance by providing consistent retention and flow properties

Customer Evaluation: QuickChange ATM reduces wafer defects

• RCA cleaning station (SC1 and SC2) at a device maker

• QuickChange ATX 100 nm and ATM 50 nm were installed on both a SC1 and SC2 baths

• Graph indicates a significant reduction of defects on wafers together with an improved flow rate after the installation of a QuickChange ATM 50 nm

QuickChange ATX 100 nm QuickChange ATM 50 nm

Defe

ct n

umbe

r

defect Counting Improvement at RCa Cleaning Step Following The Installation of QuickChange aTM 50 nm

frequently asked questionsHow long does my filter remain wet?QuickChange filters stay wet even when exposed to air or outgassing chemicals. This assures stable performance and long life even in strongly out-gassing applications.

What are the membrane areas of QuickChange ATM and ATE?QuickChange ATE provides 35 percent more flow at 30 nm single pass retention when compared to the industry standard ATM configuration under equivalent pressure conditions.

average Pressure drop in SC2 at 80°C (due to drain and Refill Cycles of New Membranes

with and without QuickChange Modification)



PUR

ITY

Nondewetting membrane technology in a low-profile prewet disposable filter that delivers protection, ease-of-use, rapid change out and safety for smaller volume applications.

• Superior filtration efficiency and flow rate provided by a nondewetting pleated membrane

• Highest retention rating with capability down to 30 nm

• Unmatched purity and safety ideal for critical applications

Optimized for aggressive chemicals like SC1, SC2, SPM and all hot temperature chemicals.

QuickChange Plus 1500/3000 Filters

The QuickChange Plus is the next generation of the QuickChange 1500 and 3000 filters.

• QuickChange ATM membrane

• New membrane improves retention and flow rate

performance

FEaTURE adVaNTaGE BENEFITNondewetting PTFE* membrane filter prewet and packaged in high-purity DI water

• Eliminates prewetting and flushing cycles. Eliminates chemical usage while reducing system downtime during filter changeouts. Saves time, greatly increases equipment uptime

• Higher yields and increased overall equipment efficiency


O-ring free design • High-purity connections avoid potential sources of contamination

• Minimized particle-related wafer defects through optimal bath temperature control

• Both fluid streams remain separate

Available in retention ratings of 30 nm, 50 nm and 100 nm

• Provides excellent small particle retention to ensure minimal particles remain on wafer surface

• Safe and ultra clean, higher yield, needed for advanced technology nodes

• Increase OEE through reduced particle contamination

Compact, easy-to-install design • Allows quick installation and minimizes downtime while limiting the handling of hazardous chemicals during installation and disposal

• Requires less space for changeout. Minimizes downtime and simplifies changeout.

frequently asked questionsWhat are the chemical compatibility recommendations?

QuickChange Plus disposable filters are recommended for use with aqueous-based chemicals at ambient temperatures (including H2SO4, H3PO4, HNO3, HF, HCl, BOE, NH4F, H2O2, TMAH, NH4OH, and ozonated water) and elevated temperature applications (including SC1, SC2, piranha etch, and metal etch).

What are the available retention ratings?

100 nm, 50 nm and 30 nm

What connection types are available?

Flaretek Super Pillar® Super type 300 Pillar

Liquid Flow Rate (L/min)

0 1 2 3 4 5 60

0 .1

0 .2

0 .3

0 .4

0 .5

0 .6

0

2

4

6

8

Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(PSI

)

200 nm

100 nm

50 nm


0 1 2 3 4 5 60

0 .1

0 .2

0 .3

0 .4

0 .5

0 .6

0

2

4

6

8

Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(PSI

)

30 nm

100 nm

50 nm

QuickChange 1500/3000

QuickChange Plus 1500/3000

30 nm NA 3.6

50 nm 3.2 4.9

100 nm 2.5 3.8

Retention Rating (LRV)

QuickChange 3000 disposable Filter (1/2” Fitting)


0 1 2 3 4 5 60

0 .1

0 .2

0 .3

0 .4

0 .5

0 .6

0

2

4

6

8

Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(PSI

)

30 nm 100 nm

50 nm


Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(PSI

)

QuickChange 3000 disposable Filters (Typical 8 mm and 3/8” Fitting)

QuickChange Plus 3000 disposable Filters (Typical 8 mm and 3/8” Fitting)

Note: QuickChange Plus 1500 and 3000 will replace QuickChange 1500 and 3000.

Flow Rate Improvement Up to 38%QuickChange Plus 3000 disposable Filter

(1/2” Fitting)



PUR

ITY

Highest flow hydrophilic UPE membranes with the greatest particle removal for submicron batch baths and single wafer tools.

Intercept is the most advanced UPE liquid microcontamination platform available from Entegris:

• Highest single pass retention

• Dual particle capture mechanism

• The fastest bath cleanup time

• Longest filter lifetime

• Lowest COO

Optimized for acid based process chemicals such as DHF, DHCl, BOE and critical DHF final processes.

Intercept Plus hPM Filters

• Intercept removes particles in typical DHF applications by an additional mechanism to sieving: Physisorption

• Particle retention below rated pore size is achieved, enhancing process capability

performance

Customer Evaluation

Intercept 200 nm vs. PTFE* filter 100 nm in DHF

• Intercept reaches much lower particle level in bath and reaches low particle levels immediately after bath changeoutsFEaTURE adVaNTaGE BENEFIT

Advanced membrane technology

• Dual particle capture can improve process performance and reduce on-wafer particle defects

• Higher yield and throughput through efficient nanoparticle removal

High flow rate • Reduced bath cleanup time • Increase wafer throughput and yield through faster bath cleanup

Hydrophilic membrane • No prewetting or flush-up required for rapid start-up

• Eliminates IPA prewet and the risk of chemistry interactions

• Increase tool up-time through fast filter installation/qualification

Universal filter design • One filter fits many applications• Recommended for batch or single

wafer tools• All polyethylene cartridge provides clean

drop-in replacement for existing filters

• Fast ROI through easy implementation

10 nm, 20 nm and 30 nm sieving retention ratings available

• Highest single pass retention at rated pore size

• Higher yield and throughput through efficient nanoparticle removal

by Nonsieving

by Sieving by CakePore

Pore

dual Particle Capture Technology = Process Insurance

0

10

20

30

40

50

60

70

80

Part

icle

s pe

r mL

(65–

100

nm)

10 per. Mov. Avg. (PTFE filter 100 nm)

10 per. Mov. Avg. (Intercept HP filter)

Comparison of Particle Counts in 0.46% hF(One Bath lifetime)

“Particle Control for Advanced Wet Process”, Parekh et al., European Semiconductor May 2004



PUR

ITY

Guardian ECD (Etch-Clean-Deposition) is constructed of hydrophilic, high-flow polysulfone membrane with high purity HDPE supports.

• high flow and bath recirculation performance

• excellent particle removal in single pass and recirculating applications

• retention range from 30 nm to 0.1 µm

• membrane is non-interactive with typical metal deposition additives

Ideal for dilute and low temperature acids and bases used in WEC processes. Highly effective in nickel & copper plating applications.

Guardian ECd Cartridge Filters

FEaTURE adVaNTaGE BENEFITAsymmetric membrane M Pleat design for more surface area

• High flow • Fast bath cleanup• Prefiltration layer included

• Higher throughput• Extended filter life time

Hydrophilic membrane • Eliminates microbubbles• Self wetting: no solvent for

prewetting or flushing

• Increaseed yield• Lower COO

Low particle shedding

Low extractable level

30 nm retention

• Improved chemistry cleanliness • Increased yield

Proprietary non-interactive polysulfone membrane

• Stable additives concentration over time

• Metal Plating specific: — Enhanced process consistency

performance

frequently asked questions

Asymmetric membraneMore stable flow/Longer life

Asymmetric membraneMore stable flow/Longer life

Larger pore size upstream

Smaller pore size downstream





Recirculation Time

0 hour 1 hour 2 hours 3 hours

CVS

Resu

lt (m

L/L)

Accelerator Suppressor Leveler

How does Guardian ECD help improve process performance for electrolytic deposition applications?• Enhanced additives concentration stability over

time due to low adsorption of plating additives by the membrane

• Improved process stability• Longer life time due to assymetric membrane

design

What are the wet etch and wet clean chemicals compatible with Guardia ECD?

Guardian ECD is recommended for dilute acids and bases like DHF, BOE and certain photoresist strip processes.

asymmetric Membrane More stable flow/longer life

Asymmetric PS membrane:

• longer life time

• more stable flow in high loading applications like copper plating and post CMP cleans

Inert surface modification:

• Concentrations of additives in Cu ECP processes do not change over time

Cleaned Guardian ECd 0.03µm


PUR

ITY

Microgard Plus patented UPE membrane shows the highest retention efficiency of any membrane. It offers low surfactant binding and spontaneous wettability in solvents.

• High retention efficiency of up to 99.999% at rated particle size

• Removal of microbubbles and gels

• Low pressure drop

• Low leaching of ionic/metallic contamination from filter

Optimized for solvent filtration, filtration of photochemicals, photoresist stripping at temperatures below 60°C.

Microgard Plus lE Cartridge Filters

FEaTURE adVaNTaGE BENEFIT3 nm and 5 nm asymmetric UPE

High retention efficiency (≥99.9%)

• 3 nm retention for the tightest membrane technology available in the industry

• Asymmetric membrane increases flow and reduces pressure drop

• Reduce defects • Increase throughput

All-polyethylene construction special cleaning

• Entegris’ proprietary cleaning technology insures the lowest levels of organic and metal extractables

• Eliminate the potential for the filter to be a source of contamination to your process

Superior wettability with solvents • Eliminates prewetting • Provides more consistent filtration

• Stable performance• Reduces chemical usage while

reducing system downtime

performance


Why does Microgard Plus provide superior downstream cleanliness?

Microgard Plus filters are extensively cleaned during manufacturing and are entirely constructed from high-density and ultrahigh molecular weight polyethylene, providing them better initial cleanliness and lower extractables than filters constructed from polypropylene, polysulfone, polyethersulfone or nylon.

Why does Microgard Plus hold back gels more effectively than PTFE filters?

The string and node structure of PTFE allows gels to pass through easily. The sponge-like structure of UPE prevents gels from passing through the membrane and additionally provides higher loading capacity.

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

18

16

14

12

10

8

6

4

2

00

0 1 2 3 4 5 6 7

5 10 15 20 3025Typical Flow Rate (L/min) – 1 cP @ 20°C (68°F)

GPM

Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(PSI

D)10 nm 20 nm

30 nm

0.05 nm

0.1 nm

0.2 nm

Microgard Plus 10” Filters

Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(PSI

D)

GPM543210

0 5 10 15 20

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

20

16

12

8

4

0

3 nm

Flow Rate (L/min) — 1 cP @ 20°C (68°F)

5 nm

10 nm

Microgard Plus lE 10” asymmetric UPE Filters

Pleated 0.05 µm PTFE filter

UPE 0.1 µm filter

10,000

1,000

100

10

12 3 4 5 6 87 9 10 11 12 13 1514 16 17 18 19 2120

Dispense Number

Part

icle

s/w

afer

>0.

15 µ

m

UPE vs. PTFE Membrane Particle Count Comparison

Filter Type

Tota

l Def

ects

20 nm 10 nm 5 nmAsymmetric

First run

Confirmation run

Total defectivity Comparison by Filter


PUR

ITY

Protego Plus metal ion purifiers deliver ultimate protection from metal ion contamination in critical cleaning applications.

• Multi-metal ion removal in a single pass

• Available in a variety of purifier designs

• Protego IPA Purifiers are specially designed to remove metal ions for IPA Dryer process with 15 nm particle retention.

• Protego Plus LTX products are designed for low-temperature DI water applications from ambient to 60°C; while HTX products for critical application to 80°C.

Optimized for solvent filtration, filtration of photochemicals, photoresist stripping at temperatures below 60°C.

Protego IPa and lTX/hTX Purifiers

FEaTURE adVaNTaGE BENEFITPurifier technology with PES and UPE membrane filtration

• Single device for ease of use • Metal purification and >99.9% particle retention efficiency

Exceptional coverage of ion exchange groups

• High multi-element removal rate • Excellent removal of broad spectrum of metals for improved device yield performance in DI Water

New Grafted Membrane technology • Greater stability at higher temperatures

• Extended service life

Improved product cleanliness • Faster resistivity/TOC flush-up • Fast tool start up and less tool idle time

Cross-linked Ion Exchange technology • Improved stability of IEC technology • Increased process lifetime

performance

How do Protego Plus purifiers remove metal ions?

Protego Plus purifiers utilize ion exchange functional groups that are cross-link grafted on to a substrate membrane. These ion exchange groups reduce metal cations by up to 99.9% efficiency and the cross-linking ensures lower extractables and shedding in the process.

Are Protego Plus purifiers also filters?

Yes. Protego Plus purifiers have capability to remove metals cations while also having tight filter retention as an all-in-one purifier/filter. Different retentions are available for DIW to meet all fab process needs.

20 nm

0.05 µm

50 10 15 20 25 30

10 2 3 4 5 6 7

0.1 µm

Purifier

Typical Flow Rate (L/min) — 1 cP @ 25°C (77°F)

Protego Plus LTX 10” FiltersGPM

Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(PSI

D)

7.5

6.0

4.5

3.0

1.5

0

0.6

0.5

0.4

0.3

0.2

0.1

0

Protego Plus lTX 10" Filters

ProductProtego Plus lT/lTX Protego

Protego Plus hT/hTX

Protego Plus IPa

Application DI Water DI Water IPA

Purifier Only Option Yes No No

Pore Size Rating 0.1, 0.05 µm & 20 nm 0.10 & 0.05 µm 15 nm

Membrane Material Hydrophilic UPE (0.05, 0.1µm), Hydrophilic PS (0.02 µm)

Hydrophilic PES PTFE

Ion Exchange Media X-LINK PE-IX Media X-LINK PE-IX Media IX Media

Ion removal Cation Cation Cation

Ion Exchange Capacity 10" type 82/105 meq/10" unit 16 meq/POU

74/110 meq/10" Unit 480 meq/P1500 POU 1.2 meq/P3000 POU

Supports, Materials of Construction HDPE HDPP PFA

Optional POU Materials HDPE N/A N/A

Membrane Area 0.54 / 0.68 m2 10", 0.12 m2 POU

0.48 / 0.77 m2 10" 0.20 m2 P1500 0.49 m2 P3000

Max. Forward Differential Pressure 0.27 MPa @ 25°C 0.27 MPa @ 25°C 0.39 MPa @ 25°C

Max. Backward Differential Pressure 0.27 MPa @ 25°C 0.27 MPa @ 25°C 0.26 MPa @ 25°C

Max. Operating Temperature 60°C 80°C 70°C

Tailored by application needs



PUR

ITY

A superior particulate filtration for ultrapure gas applications.

• Targets a wide flow range up to at least 1000 slpm

• Exceptionally low pressure differential

• Ozone compatibility

• Attractive pricing

• Multiple performance options

• Small footprint for on-tool efficiency

• Increased warranty (dependent on performance option)

Optimized for high flow and low delta pressure applications.

Wafergard MaX In-line Teflon Gas Filters

FEaTURE adVaNTaGE BENEFITHigh flow • Lower pressure drop • Efficiently save time and costs

Smaller footprint • Easier implementation • Easy to implement and install

Incoming gas minimizes process defects

• Higher removal efficiency • Remove particles greater than 0.003 µm (99.9999999%)

• Downstream cleanliness

All PTFE*/PFA filter cartridge • Excellent compatibility with high-purity gases, including nitrogen and CDA

• High corrosive tolerance for o-ring seal less

• Possible high temp. baking until 120° C

Pre-conditioned • Fast startup (Silver only) • Fast dry down (Silver only)• Low out gases (Silver only)

Available in VCR, Swagelok and butt weld fittings

• Many kind of fitting variation • Meet a variety of needs


performance


What are the key critical design that constitute a good and clean filter?

Good filter design should avoid the moving parts in its flow path, e.g. springs fitting, dead trap, O-ring seals as such design will induce or generate particular indirectly. Good surface finish help to increase the through put by having the quick start-up (lower dry down time) and pro-long filter life cycle (prevention of residual gas entrapment).

How do you determine flow rate and pressure drop in gas filter?

Good filter should be able to strike a balance between good filtration efficiency (high retention value, e.g. 9 LRV) and a good range of flow rate that still retain its good differential pressure value (e.g. lower pressure drop) and clean in the way that it does not out-gas particulate and molecular contaminants.

Wafergard MaX In-line 1⁄2" FittingsWafergard MaX In-line 1⁄4" Fittings

Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(psi

d)

Wafergard MAX In-line 1⁄4” Fittings

0 100 200 300 400 500 600

1.2

1.0

0.8

0.6

0.4

0.2

0

15

12

9

6

3

0

SLPM Flow Rate @ 23°C (73°F)


1.03 bar inlet(15 psig)




Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(psi

d)

0 200 400 600 800 1000 1200

1.0

0.8

0.6

0.4

0.2

0

14

12

10

8

6

4

2

0






Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(psi

d)


0 100 200 300 400 500 600

1.2

1.0

0.8

0.6

0.4

0.2

0

15

12

9

6

3

0







Diff

eren

tial P

ress

ure

(bar

)

Diff

eren

tial P

ress

ure

(psi

d)

0 200 400 600 800 1000 1200

1.0

0.8

0.6

0.4

0.2

0

14

12

10

8

6

4

2

0







PUR

ITY

aMC Tool Top Filters

performance

FEaTURE adVaNTaGE BENEFITHigh removal efficiency (>95%) • Removes critical acids, bases and organics

from the fab ambient• Reduces contamination risk

Proprietary chemistry developed with key scanner manufacturers

• Protects optics and process • Qualified by leading fabs

High surface area • Low pressure drop • Reduces energy requirements and cost

Optimized blend of treated, untreated activated carbons and ion-exchange media

• Balanced mix to match lifetimes for all contaminant classes

• Provides targeted contaminant removal

Data driven See it. Control it. methodology

• Clearly identifies critical AMC levels in customer’s facility

• Provides tailored, application specific filtration solutions

Product backed by Entegris OEM certified, ISO 17025 accredited laboratory services

• Product performance windows are clearly defined

• Provides assurance that all performance claims are verified with supporting data

Available in a range of sizes to satisfy various installation requirements, including tool-top, fan filter unit, tool interface or in-tool housing in all equipment front-end modules (EFEM) and process modules

• Field tested and proven • Easy to implement and install

Filter lifetime estimate: actual filter life is determined by measuring the fab’s chemical challenge concentration, downstream quality and testing of returned filters.

Pressure Loss vs. Velocity

Velocity (ft/min)

Pres

sure

Los

s (P

a +/

- 25

%)

120

100

80

60

40

20

00 50 100 150 200

100

95

90

85

80

75

70

Typical Lifetime

Lifetime (ppb-hrs ±25%)

Rem

oval

Eff

icie

ncy

(%)

0 100,000 200,000 300,000 400,000 500,000

Acids

Organics

Bases

A unique chemistry removes critical contaminants at a low pressure drop for the production tools.

• High removal efficiency >95%

• Removes critical acids, bases and organics from the fab ambient to reduce contamination risk

• Long life

• Removes a comprehensive array of AMCs in a single filter cell

Optimized for process tool Airborne Molecular Contamination control.

Entegris AMC tool-top filters provide AMC protection for all semiconductor process tools including: wafer metrology, reticle inspection, ALD, EPI, diffusion, CVD, PVD, wet etch, wafer clean, dry etch and CMP.

frequently asked questionsHow do I choose the correct filter for my application?

Our recommendation is based on different parameters such as: AMC targeted, flow rate, maximum pressure drop acceptance, mechanical dimension and expected lifetime.

How do we determine filter lifetime?

Entegris provides on site and post mortem analysis to optimize filter changeouts.


MA

TERIALS M

AN

AG

EMEN

T

Microenvironment control: a system approach

• Entegris Barrier Material (EBM) to improve purge duration, quicker purge down time and less absorption/desorption of outgassing from wafers

• Snorkel purge option to rapidly purge down to low moisture and oxygen levels while directing airflow between the wafers

• Clarilite® Wafer for maintaining low moisture or oxygen conditions for extensive time frames

Microenvironment Protection Solution

The Spectra™ FOUP is a 25+1 capacity front opening unified pod (FOUP) that provides high-performance wafer transport, optimum automation integration and low cost of ownership for your facility.

• High-strength assembly

• Wafers retained against shock and vibration

• Meets all applicable SEMI® standards

• Uses STAT-PRO® 3000 carbon-filled PEEK material at all wafer contact points

• One piece molded shell

• Optional configuration available for a conductive shell to increase protection

• Microenvironment control

Optimized for below 45 nm processing.


What kind of identification options are offered?• Various shell colors for segregation• Colored inserts on handles• License plate• Molded-in bar code• Print-on-demand labels• Laser marking

Why 25+1 slots instead of 25?• One slot can be used for a test or

monitor wafer


• New latch mechanism• Dual action wafer retainer• Wafer contacts are all PEEK• Wafer edge contact only• Purge capable

• Increases FOUP sealing and conductance• Increases ESD protection• Reduces airborne molecular

contamination (AMC) and backside particles

• Improves yields

• Molded one-piece carbon-filled PEEK wafer supports integrated with shell

• Greatly reduced tolerance issues• Precise wafer plane performance

• Increases tool uptime• Improves reliability and

interoperability on loadports• Improves tracking through

molded-in barcodes and RF tags

• Simple, reliable POD assembly • Has minimum part count and no metal parts

• Snap fit parts

• Improves COO• Improves cleaning and drying

cycle time• Field replaceable units for FOUP

refurbishing

• EBM configuration • Allows significant extension of purged environment (low moisture)

• Quicker purge down time

• Protects wafers longer from conditions that allow corrosion or hazing due to moisture

• Snorkel purge • Higher airflow• Directs airflow between wafers

• More effective purge than traditional techniques

Purging with inert gas will remove moisture and oxygen during or between critical process steps. Etching and deposition steps are prime examples.

• Reduces corrosion and hazing issues

• Improve yield

• Improve queue processing time

• Helps control environmental contamination due to:

- Outside contamination (atmosphere) - Outgassing of the wafers - Outgassing of the FOUP (humidity)

performance

Challenges in wafer microenvironment control - O2 & h2O control -

0

5

10

15

20

25

30

35

40

45

0 10 20 30 40 50 60 70 80 90

Standard PC FOUP

EBM FOUP

100 110 120 130 140

Time (min)

Hum

idity

(% R

H)

Relative humidity (h2O) recovery over time after a FOUP purge

EBM Spectra-S

Process acid Base Organic O2 h2O dopant

Gate Oxide • • •Ultra Shallow Junction • • • •Copper seed to plate interface •Exposed Copper Corrosion • •Reticle Storage • •HSG (hemispherical glass) Poly • • •Salicide contact formation • • • •SiGe • • •EPI/Pre-EPI • • •Lithography (photoresist sensitivity)

•


MA

TERIALS M

AN

AG

EMEN

T

FEaTURE adVaNTaGE BENEFITAll wetted material in PFA and PTFE

• Extremely robust and reliable• Excellent chemical resistance

• Increases tool and valve uptime

¾” Integra has unique internal radius

• Enables a fully swept flow path• Reduces shear

• Increases flow efficiency

Innovative diaphragm design • Maximizes stroke, enabling a high flow rate in a small footprint

• Saves valuable equipment space

No external metal parts • Maintains chemical integrity• Offers high reliability

• Higher yields and wafer throughput

Repair kits available • Field serviceable • Increases equipment uptime

1" and 1¼" Integra valves have no touch bellows diaphragm design

• Minimizes particle generation • Increases cleanliness and valve reliability

Design provides reliable service for UHP applications where space is limited and high flow is required.

• Designed for high flow chemical distribution applications

• Unique design allows for higher flow in a small footprint

• Wide range of repair kits available

• Available with a variety of connection options including PrimeLock, Flaretek, PureBond®, and Super 300 Type Pillar.

• Vacuum rated

Optimized for wet etch and clean applications: SC1, SC2, SPM, H2SO4 and H3PO4.

¾˝, 1˝ and 1¼˝ Integra Valves

Internal radius for ¾” Integra:

• Eliminates sharp inside corners

• Optimizes the outer radius of the swept flow path

• Eliminates dead spots

• Decreases pressure drop, thereby increasing flow with a smaller footprint

What configurations are available?2-way and sampling configurations• Pneumatic valve with normally open and normally

closed designs available with remote sensing option• Multi-turn manual valve with optional safety lock

out tag out

What are the pressure and temperature ratings for Integra 3/4" and 1" valves?• ¾” DS12 valves

— Forward and backward pressure rating up to 552 kPa (80 PSIG) at room temperature

— Forward and backward pressure rating up to 207 kPa (30 PSIG) at 165°C

• ¾” DH12 valves — Forward and backward pressure rating up to 552 kPa (80 PSIG) at room temperature — Forward and backward pressure rating up to 207 kPa (30 PSIG) at 180°C

• 1" DS16 and 1¼" DS20 valves — Forward and backward pressure rating up to 552 kPa (80 PSIG) at room temperature — Forward and backward pressure rating up to 276 kPa (40 PSIG) at 93°C


performance

Port Connection

FlowFactor CV

FlowFactor KV

3⁄4" Flaretek, PrimeLock 6.7 95.73⁄4" PureBond 8.2 117.1

1" Flaretek, PrimeLock 9.8 140.0

1" PureBond 10.9 155.7

¾” Integra Valve:

Port Connection

FlowFactor CV

FlowFactor KV

3⁄4" Flaretek, PrimeLock 7.2 1033⁄4" PureBond 10.4 149

1" Flaretek, PrimeLock 12.4 177.1

1" PureBond 13.6 194.2

1” Integra Valve:

Port Connection

FlowFactor CV

FlowFactor KV

1" PureBond 15.0 214.2

1¼" PrimeLock 16.5 235.6

1¼” Integra Valve:

The ¾ Integra valve's fully swept flow path increases flow capacity, decreases pressure drop and reduces shear, thereby improving overall fab efficiency


MA

TERIALS M

AN

AG

EMEN

T

FEaTURE adVaNTaGE BENEFITModular design • Ease of assembly

• Easily configured into custom manifolds• Compact footprint

• Improves serviceability• Allows tool manufacturer to

optimize space

High-temperature capability • Solves variety of critical issues including photoresist stripping

• Improves yield

Vented actuator design • Able to withstand corrosive environments • Improves realibility• Extends product lifetime

Variety of end connections • Versatility and ease in system design • Improves cost of ownership

Available in 3-way configurations

• Three-ported directional valve design • Enables simplification of system design

Corrosion Resistant (CR4, CR8 and CH8) is the next generation valve specifically designed for corrosive environments.

• Modular design – manifoldable

• Small footprint

• High-temperature capability

• High-purity corrosive chemical handling

CR4 is ideal for low flow wet etch and clean applications and high temperature corrosive chemical handling.

CR8/CH8 is ideal for mid flow wet etch and clean, low volume bulk chemical delivery and high-temperature applications.

CR4, CR8 and Ch8 Manual and Pneumatic Valves

• Sealed actuator with separate actuator vent port

• Ability to vent the actuator through a separate vent line to a controlled environment

What configurations are available?• Pneumatic, toggle or multi-turn actuators• ¼’’ to ¾’’ ports size• Flaretek, PureBond, Pillar S300 or PrimeLock

connections • Options for position indicators, restricted open

and close, LOTO etc…

Is there a 3-way CR valve available?Yes, it is available ¼’’ to ¾” pneumatically actuated.

Are all CR valves actuators manifoldable?Yes, all 2-way and 3-way valve types with all actuator configurations can be manifolded.

When should I choose CH8 vs CR8?When temperature exceeds 130°C (226°F), CH8 should be selected. CH8 can support up to 180°C (365°F).

Why should I use CR4 instead of SG4? • CR4 has no exposed metal hardware and will be

more resistant to corrosive environments. • Higher temperature capabilities compared to SG4

series• Improve ease of field reparability • CR4 is a direct replacement for SG4


performanceCR8 cut view

performance continuedCR4 CR8/Ch8

Orifice 1⁄4” 1⁄2”

Media temperature range 21°C - 160°C CR8: 21°C - 130°C CH8: 21°C - 180°C

Inlet/outlet pressure rating at RT CR4: 80 PSIG / 40 PSIG CR4 HP: 80 PSIG

80 PSIG

Cv 0.29 - 0.84 2.4 - 3.4

Reliability Tested over 2.1 million cycles Tested over 4 million cycles


MA

TERIALS M

AN

AG

EMEN

T


Optimized 90° radius • Reduces total system pressure drop • Increases overall equipment lifetime

• Increases flow• Reduces fluid shear

• Improves yield

• Reduces dead volume • Improves yield by reducing large particles on wafers

• Decreases turbulence • Maintains chemical integrity

Flaretek 90° Sweep Elbows

Flaretek 90° elbow with optimized radius eliminates sharp corners to dramatically reduce pressure drop and increase flow. Manufactured from 100% virgin HP PFA material.

• No dead spots

• Increases flow rate in same footprint as standard elbows

• Decreases fluid turbulence for CMP chemical health

Optimized for high volume bulk chemical distribution and CMP slurry applications.

performance• 60% lower pressure drop through

the fitting compared to the standard 90° elbow

• Smallest footprint sweep available, making it practical for OEM tools

• Reduced footprint design saves assembly time

Achieve better results than standard 90° elbows

• Standard 90° elbow burst pressure: 644 PSIG (average)

• Sweep 90° elbow burst pressure: 825 PSIG (average)

Standard vs. Sweep Elbow

frequently asked questionsWhat fitting sizes and accessories are available?• Fitting sizes: ½”, ¾” and 1”• Spacesaver or PureBond connections available• FlareLock® II, PVDF, PFA, CPFA nut availableWhat are the pressure and temperature ratings?

Pressure and temperature ratings are the same as a standard 3⁄4” 90° elbow fitting. Visit www.entegrisfluidhandling.com for additional information.

How can I find the appropriate fitting?

You can generate fitting part numbers based on your specifications and search the extensive online catalog on: • The web at www.entegrisfluidhandling.com• The mobile selection tool at:

m.entegrisfluidhandling.com

Flow Pattern Comparison Standard vs. Sweep Elbow at 5 GPM

¾” P/N USE12FN-3

2 x 2.20” 2 x 2.20”

Scan QR Code

Fittings mobile selection tool

www.entegrisfluidhandling.com


http://m.entegrisfluidhandling.com


MA

TERIALS M

AN

AG

EMEN

T

Primelock Fittings

The simplest, cleanest and most robust PFA fitting on the market.

• PrimeLock fittings ensure leak-free performance in the most demanding chemical applications

• Easy to assemble, heat is not required

• The audible and visible indicator allows users to verify the proper makeup of the connection

• Broad range of sizes and configurations: ¼” to 1¼" elbows, unions, reducers, caps, tees, minimum tube unions and adapters

• Expanded on a wide range of Entegris products: Chemlock® filter housing, Torrento 15 nm liquid filter, NT pressure transducers, CR4 ¼" and CR8 ½” series valves and Integra ¾”, 1” and 1¼” series valves.

Ideal for high purity, corrosive chemical handling, low surface tension chemistries and high-temperature applications.

FEaTURE adVaNTaGE BENEFITEase of assembly • Audible and visual indication of proper

fitting makeup • Consistent and repeatable fitting

makeup

PFA wetted surfaces • Broad chemical compatibility • Simplifies product selection

Robust thread design • Three backup seals• No cross threading• Quick makeup• Increased sealing forces

• Consistent leak-free connection

Unique seal design • Nonwetted insert eliminates multiple entrapment, leak points and flow interruptions

• Improved process

Capable of 200°C (392°F) temperature rating, all sizes

• Simplifies product selection • Lower design cost

No heat required to flare tubing • Reduces operator variability • Saves time and money

performanceThe unique seal design removes the insert from the flow stream

• Reduces entrapment

• Reduces leak points

• Eliminates flow interruptions

Primelock Cross-section 3 Backup Seals

PrimeLock fittings are compatible with high-temperature chemical processes:

• At temperatures up to 200°C at 40 psi

• At room temperatures it is rated to 120 psi

Pressure vs. Temperature Rating

frequently asked questionsWhen should I use PrimeLock fittings?PrimeLock fittings can be used in high-purity, corrosive chemical handling, semiconductor applications, solar, LED, flat panel display and with low surface tension chemistries. Also, used in high- temperature applications up to 200°C.

Is the pressure vs. temperature rating depend on the size?No, same specification for all sizes ¼” through 1¼”

How can I find the appropriate fitting?

You can generate fitting part numbers based on your specifications and search the extensive online catalog on: • The web at www.entegrisfluidhandling.com• The mobile selection tool at:

m.entegrisfluidhandling.comScan QR Code

Fittings mobile selection tool


http://m.entegrisfluidhandling.com


MA

TERIALS M

AN

AG

EMEN

T

Wide range of microenvironment products for transport and protection of critical wafers during wet applications.

• Designed to fit your equipment needs

• Wide range of materials to allow chemical compatibility

• Strong technical support to enable customized solutions

• Large variety of optional products (tweezers, lab products, etc.)

Optimized for WEC, hot temperature applications.

Microenvironment Transport Solutions

frequently asked questionsWhat materials are available for these solutions?• High-purity process wafer carrier material• Translucent perfluoroalkoxy (PFA)

What are the temperature limits? — Continuous use (process enhancement): 165°C — Continuous use (traditional): 180°C — Wafer insertion: 250°C

What identification options are available?• Laser marking• Hot stamping• Barcoding• Alphanumeric ID tag• RF ID tag

FEaTURE BENEFIT• Chemical resistant PFA material• Industry standard equipment

interface (H-bar)• Quick and even solution coverage

and drainage

• Enables high purity during wet processing

• Enables automation during processing

• Easy interface with existing tools• Higher yields and wafer

throughput

• Reduced surface area, volume and mass enables smaller tank sizes

• Design minimizes chemical carry over and reduces wafer masking

• Reduces PFA wafer supports• Rail features (notches) for

accurate location on equipment

• Increases yield and process purity• Maintains wafer integrity during

wet processes• Enables more repeatable wafer

access, higher temperature processing and longer useful lifetime

• Enables easy interfacing with tools

a200 a192

PEC* 300 mm

200

mm

300

mm

*Process enhancement cassette


PROCESS CO

NTRO

l

High-purity flow-through conductivity sensor for highly accurate measurement of chemical conductivity in wet applications.

• All PFA electrodeless conductivity sensor – rated up 140°C

• High sensitivity, wide rangeability

• On-Line sensor and analyzer diagnostics communicate real-time measurement faults with history event log

• Selection of tubing line sizes: 1⁄2“, 3⁄4“, or 1”

• Rapid temperature compensation

Optimized for aggressive chemicals used during wet etch and clean (HF, HCI, NaOH, KOH, NH4OH, TMAH) and for diluted to high concentration binary process solutions.

NT Conductivity Sensor, Model 8800 and NT Conductivity analyzer, Model 8850

FEaTURE adVaNTaGE BENEFITThe only all PFA material flow-through electrodeless conductivity sensor

• Compatible with typical semiconductor process chemistries

• Decreases particle contamination and improves yield

The NT model 8800 uses multiple Toroid sensors

• Reduces signal to noise with a better signal resolution

— Highly accurate — Expanded measurement range

• Increases measurement accuracy

Temperature compensating • Real-time conductivity measurement corrected for temperature

• Increases lab efficiency for process verification

Unique in-situ precision calibration method

• Isolates personnel from aggressive process solutions during calibration

• Increases tool uptime with maintenance safety and process accuracy

performance

application overview

The NT nonintrusive conductivity sensor, model 8800:

• Allows in-situ chemical measurement

• Conductivity monitoring for wet benches and chemical delivery systems

• Supports up to 3 sets of application configurations. Remote range and application switching using PLC compatible contact inputs

• Simple to use, calibration plug and in-line calibration method eliminates personnel safety issues

a typical semiconductor application

PPM µS Wt. %

100 630 0.01

300 1490 0.03

1000 2420 0.1

3000 5100 0.3

11700 1

34700 3

62000 5

118000 20

Process Tool

140001200010000

8000

6000

4000

2000

0

PPM

Mic

ro S

iem

ens

0 2000 4000 6000 8000 10000 12000

µShydrofluoric acid Conductivity

Works with typical semiconductor etching solutions such as hydrofluoric acid (HF), hydrochloric acid (HCL), nitric acid (HNO3), sulfuric acid (H2SO4), etc.

Conductivity of hF concentration by weight

Bath

NT 8800

NT 8850 Conductivity and temperature output

Pump

Monitors the depletion of hydrofluoric acid (HF) in a bath


PROCESS CO

NTRO

l

NT high-temperature flowmeter, model 4401 is designed for use in ultrapure, high-temperature applications. Incorporates same pressure sensor technology as the NT electronic flowmeter, model 4400.

• Effectively handles process temperatures up to 180°C (365°F)

• No moving part to generate particles

• Nonmetallic sensing technology for reliable measurement

• Flow ranges up to 0 - 120 l/min

• Easy installation in any orientation

• Same response time as proven NT model 4400

Ideal to obtain valuable and critical diagnostic information which is used to monitor and control high-temperature, aggressive chemical processes in wet etch and clean applications, precision blending and metering.

FEaTURE adVaNTaGE BENEFITPFA, PTFE and other high-purity fluoropolymer wetted surfaces

• Compatible with highly corrosive wet etch and clean processes

• Resistant to harsh chemical environments and external spraydowns

• Improves yield• Lower cost of ownership through

increased tool uptime

No moving parts • Does not generate particles• Provides repeatable and reliable

measurements

• Improves yields • Improves thoughput

Nonmetallic sensing technology • Does not generate contamination • Improves yields• Lower cost of ownership through

extended service time

Pressure output included • Eliminate needs for additional instrumentation

• Lower overall tool cost• Improves process control

Easy to retrofit and upgrade existing applications

• Adds flow and pressure measurement capability for high-temperature applications

• Improves process control on existing platforms

performance

Process temperature 10° - 180°C (50° - 356°F) (consult factory for specific application support and expanded capabilities)

Operating pressure 0 - 414 kPa (0-60 PSIG)

Flow measurement accuracy

±1% full scale > 20-100% of full scale flow range

± 2.5% full scale 10-20% of full scale flow range

Pressure measurement accuracy

±1% of full scale includes combined effects of linearity, hysteresis and repeatability

Pres

sure

Dro

p ∆

(PSI

)

Pres

sure

Dro

p (k

Pa)

% Full Scale Flow Rate(Standard Flowmeter Using Deionized Water)

6.0

4.0

2.0

0.0

0.45

0.30

0.15

0.00

0% 20% 40% 60% 80% 100%

Pressure drop vs. Flow Rate

frequently asked questionsWhen should I use NT high-temperature flowmeter, model 4401 vs. NT electronic flowmeter model 4400?NT model 4401 is recommended when process temperature is above 65°C (149°F).

When should I use a PFA vs. CTFE sensor interface? • PFA should be used for solvents, select chemicals or

if sensor module temperature could go above 40°C during purging.

• CTFE should be used for most aqueous chemical solutions and select solvents. The sensor module temperature must be maintained below 40°C during purging.

Please refer to chemical compatibility chart for sensing and control products: http://www.entegris.com/Resources/assets/3960-2602-0912.pdf

How do I select a suitable flow range for a given chemical?Please use our web based calculator to apply viscosity and density correction for all NT flowmetershttp://www.entegrisfluidhandling.com/VDT/

NT high-Temperature Flowmeter, Model 4401

http://www.entegris.com/Resources/assets/3960-2602-0912.pdf


http://www.entegrisfluidhandling.com/VDT/


PROCESS CO

NTRO

l

NT Integrated Flow Controller, Model 6510 and 6520

FEaTURE adVaNTaGE BENEFITPTFE and other high-purity fluoropolymer wetted surfaces

• Corrosion resistant • Maintains high purity process

Pressure output included • Eliminates needs for additionnal instrumentation

• Improves metrology • Improves process control• Lowers cost

Compact footprint • Easy for field installs and OEM designs with limited space

• Upgrades older equipment• Allows tool manufacturers to

optimize space

Discrete alarm output • Improved diagnostics • Increases tool uptime by improved systems troubleshooting


6510 6520

Sensor interface CTFE, PFA CTFE, PFA

Flow range 0-15 mL/min to 0-1250 mL/min 0-2.5 L/min to 0-40 L/min

Flow measurement accuracy

±1% full scale >20-100% of full scale flow range ±2.5% full scale 10-20% of full scale flow range

Repeatibility ±0.5% full scale >20-100% of full scale flow range ±1% full scale 10-20% of full scale flow range

Pressure measurement 0-414 Kpa (0-60 PSIG)

Pressure accuracy ±1% of full scale

Process temperature 10 – 65°C (50 -149°F)

Size 852 cm3 (smallest IFC on the market)

1744 cm3

NT integrated flow controllers, model 6510 and 6520 are designed for critical dispense applications, chemical blending, on-demand chemical mixing applications.

• PTFE wetted surface for high-purity applications

• No moving parts offers reduced contamination potential

• Nonmetallic sensing technology based on differential pressure provides reliable measurement

• Compact design

NT model 6510 is ideal for aggressive chemical applications where accurate dispense or dosing is needed.

NT model 6520 is ideal for high-flow applications such as bulk delivery or tool liquid dispense.

performance

Enhancements to valve motor and diaphragm provide improved flow control, added safety and contamination protection.

What are the NT Integrated Flow Controller requirements?• Line pressure must be at least 10 PSIG• Sizing for flow control: target flow (nominal flow)

should be within 35 - 90% of a flow controller's flow range

• Maximum working pressure: 60 PSIG

Do bubbles affect pressure/flow measurement?No, NT Integrated flow controllers combine differential pressure based flowmeter and leading edge control valve to create a closed loop flow controller.

What types of sensor interfaces are available?CTFE, PFA or CTFE (hydrofluoric acid compatible).

How do I choose the right interface for my application?• CTFE should be used for most aqueous chemical

solutions and select solvents• PFA should be used for solvents, select chemicals

and process temperatures above 40°C• CTFE (Hydrofluoric acid compatible) should be used

for HF applicationsPlease refer to chemical compatibility chart for sensing and control products: http://www.entegris.com/Resources/assets/3960-2602-0912.pdf



http://www.entegris.com/Resources/assets/3960-2602.pdf


PROCESS CO

NTRO

l

Preserves absolute fluid purity with maximum heat control and transfer

• Ideal where fluid temperature control is desired

• The device is fully bonded without o-rings

• Constructed from 100% PFA

• Very low trace ionic metals: <10 µg/unit

Optimized for low and high temperature aqueous applications like SC1, SC2, SPM, aggressive acids and bases.

phasor X heat Exchanger

FEaTURE adVaNTaGE BENEFITLarge contact surface area from 0.3 m² to 0.8 m²

• Maximizes heat transfer and heat control during critical etching steps

• Higher yields and increased overall equipment efficiency


O-ring free design • Eliminates maintenance and material compatibility concerns while maintaining seal integrity and fluid purity

• Minimized particle-related wafer defects through optimal bath temperature control

• Both fluid streams remain separate

All PFA shell construction • Provides excellent chemical compatibility and ensures chemical cleanliness and ultimate safety

• Safe and ultraclean, higher yield, needed for advanced technology nodes

• Increases OEE through reduced particle contamination

Compact, easy-to-install design • Allows a controlled process fluid temperature with a low pressure drop over the fluid paths

• Increases equipment space savings

performance

frequently asked questionsWhat configurations are offered?PHX03 (0.3 m2) and PHX08 (0.8m2) are offered to meet a variety of needs.

phasor X PhX 03 Flow vs. Pressure drop at 22°C

phasor X PhX 08 Flow vs. Pressure drop at 22°C

0.0 4.5 9.0 13.6 18.2 22.70.00

0.40

0.80

1.20

1.60

2.000 1 2 3 4 5

12.0

10.0

8.0

6.0

4.0

2.0

0.0

Flow Rate (GPM)

Flow Rate (L/min)

Pres

sure

Dro

p (P

SID)

Pres

sure

dro

p (k

Pa)

Tube

Shell

0.0 4.5 9.0 13.6 18.2 22.70.00

0.20

0.60

0.40

0.80

1.20

1.00

1.400 1 2 3 4 5

9.0

8.0

7.0

6.0

5.0

4.0

3.02.0

1.0

0.0

Flow Rate (GPM)

Flow Rate (L/min)

Pres

sure

Dro

p (P

SID)

Pres

sure

dro

p (k

Pa)

TubeTube

ShellShell

S-line Flow Path Configuration U-line Flow Path Configuration99.1 mm (3.90”)

317.5 mm (12.50”)

99.1 mm (3.90”)

515.6 mm (20.30”)

170.2 mm (6.70”)

101.6 mm (4.00”)

119.4 mm (4.70”)

101.6 mm (4.00”)

121.9 mm (4.8”)

322.6 mm (12.70”)

What is the maximum heat transfer efficiency?• This efficiency has been rated between 4–12 L/min

at 20 PSI line pressure• The maximum heat transfer has been measured at

620–800 w/m2, °K (110–140 BTU/hr. f2, °F)


PROCESS CO

NTRO

l

« » WET ETCh aNd ClEaN «» ENTEGRIS INC. 48

Provide accurate and reliable inert pressure measurements.

Measure gas or liquid pressure, allowing you to monitor process conditions for increased safety and system performance.

• No moving parts or fill fluids help reduce contamination potential

• Nonmetallic sensing technology provides reliable measurement

• Compact design

• Dymension manifold mountable

• Kalrez®, PTFE, Sapphire, PFA and CTFE

Optimized for aggressive chemical applications.

NT Pressure Transducers

FEaTURE adVaNTaGE BENEFITAll wetted parts are constructed of PTFE, sapphire and other high-purity polymers for corrosion resistance

• Compatible with typical semiconductor process chemistries

• Improves yields by increasing particle performance

Provides compatibility and easy integration with electronic displays and monitoring systems

• Enables tool interaction with pressure transducer and offers increased accuracy in pressure measurements

• Increases overall equipment efficiency

Single port and flow through styles offered in industry standard Flaretek and Pillar Super 300 fittings

• Compact design enables easy installation

• Improves system design flexibility

No moving parts or fill fluids • Reduces contamination potential • Increases tool uptime

performance• Provides reliable pressure

measurement where manual gauges only provide approximate pressure results

• Pressure transducers can help determine filter lifetime where critical contamination control is needed

frequently asked questionsWhere can I use NT pressure transducers?• System diagnostics• System pressure monitoring for tool queuing• Pressure at chemical distribution modules, valve

manifold boxes and point-of-use• Differential pressure in filtration systems• Integrated into custom valve manifoldsCan NT pressure transducers, model 4100 be used in high-temperature applications?Yes, contact Entegris for more information.

How long can model 4150 and 4250 survive 49% Hydrofluoric acid (HF) at 23°C?Estimated 10 years.

How do I choose the right interface material for my application on pressure transducers, model 4100 and 4210?• CTFE should be used for most aqueous chemical

solutions and select solvents• PFA should be used for solvents, select chemicals

and process temperatures above 40°C.• For hydrofluoric acid applications, contact Entegris

for more information.Please refer to chemical compatibility chart for sensing and control products:http://www.entegris.com/Resources/assets/3960-2602-0912.pdf

Monitor Pre-, Post- and Differential Pressure

NT Model Pressure Transducer(for inlet pressure)

NT Model Pressure Transducer(for outlet pressure)

NT Dual Channel Display

Filter Housing

Flow

Differential pressure set-point for filter replacement

Monitoring differential Pressure To Schedule Filter Replacement


PROCESS CO

NTRO

l

« » WET ETCh aNd ClEaN «» ENTEGRIS INC. 50

Customized fluid control that optimizes space saving inside equipment, provides low cost of ownership and allows a wide range of valve types.

• Customized distribution manifold

• Modular method of mounting valves to a manifold block

• Optimized flow path

• Replaceable parts on the manifold (fittings)

• Interchangeable valves

Optimized for wet etch and clean applications and VMB replacement in chemical distribution.

dymension Manifolds

FEaTURES adVaNTaGE BENEFITSurface mounted valves • Repairable

• Interchangeable valves• Increased equipment uptime

Low dead volume designs • Reduces internal volume• Reduces cross contamination

• Efficient chemical flush out• Reduced cycle time

Complex flow path and control in a single component

• Smaller footprint• Fewer connecting points

• Lower cost of ownership (COO)

Integrated mixing • Reduces flow volume to mix point • Faster chemical mix response time

• Media temperatures up to 160°C

• Media pressures to 80 PSI

• PFA and PTFE wetted surfaces for broad chemical compatibility

performance

frequently asked questionsWhat is the process and how long does it take to create new manifold designs and prototypes?• Design system and relevant schematic together

with customer• Perform computational analysis if required• Manifold price quoted within two days of

design freeze• Drawings sent to customer for approval

within 2–5 days• Quick-turn prototypes completed in 2 weeks

What are the available valve options?• Normally open/closed actuators• Restricted actuation valves• Manual toggle valves• 3–way valves• Needle valves• Suckback valves• Integrated fixed bypass valves• 1⁄4”–1” orifice size valves

Computational Fluid dynamics

Reduced Footprint

17 cm

53 cm

Discrete component assembly (53 cm) Equivalent function in a manifold solution (17 cm)

Flow trajectory and blending analysis Mixing performance analysis

• Designed using computational fluid dynamics

- Mixing analysis - Flow velocity - Pressure drop analysis and optimization


PROCESS CO

NTRO

l

Air sampling and analysis

• ASML® and Nikon® approved lab ISO 17025 accredited

• Serving OEM requirements for lens and filter change compliance programs

• Trouble shooting for AMC process and environmental issues

• Assessment of filter performance on track, scanner and HVAC systems

• Baseline studies for new fabs and cleanrooms

Optimized for the detection of airborne molecular contaminants in air below 100 ppb, ambient and high pressure air analysis, photolithography applications, the validation and calibration of “online” or “continuous” monitors, and materials outgassing studies.


On-site service use impingers for cations (base) and anions (acids) and Tenax® for organics

• Easy implementation on site, customized support

• Optimization of airborne molecular control in the fab

Interstack filter sampling • Enables early warning before filter breakthrough

• 33, 66 and 100 percent life control

• Preventive maintenance• Filter lifetime optimization

OEM approved lab, 20+ years experience in the semiconductor industry

• Formatted reports in compliance with OEMs

• Data interpretation

• Secure lens protection

Postmortem filter analysis Reports: • Removal efficiency • Remaining capacity• Contaminants removed

• Filter lifetime optimization• Better understanding of the process

Measurement of low molecular weight silicon organic compounds

• Specific measurement of TMS, HMDSO and D3 levels in the photolithobay

• Secure lens protection

ISO 17025 accredited lab • Highest quality and competence standards

• Peace of mind for the customer, low failure rates, ease-of-use through trained operators

Entegris analytical Services

performance

frequently asked questionsAre the Entegris labs approved by the scanner vendor serving OEM requirements for the lens compliance program?Yes, Entegris is working with the OEMs and reports ambient and filter outlet analysis of acid, base and organic compounds as per the scanner manufacturer definitions of organics.

Entegris can also perform analysis to calibrate on-line monitoring devices, or to solve specific contamination issues in the fab.

25-Jul-2006 + 16:31:31Operator: rcp

0.01 2.01 4.01 6.01 8.01 10.01 12.01 14.01 16.01 18.01 20.01 22.01 24.01Time0

100

%

0725r610 Scan EI+ TIC

5.39e9

1.37

5.09

4.91

3.22

2.02

3.84

5.57

8.02

5.637.17

6.47

10.38

9.628.55

10.5018.80

16.8712.44 20.64

(mainlib) Cyclopentasiloxane, decamethyl -10 40 70 100 130 160 190 220 250 280 310 340 370

0

50

100

28 45 59

73

154 193 223 251

267

323 339

355

O

Si

O

Si

O

Si

OSi

O

Si

Entegris® and the Entegris Rings Design®, Flaretek®, Torrento®, QuickChange®, Chemlock®, Intercept®, FlareLock®, Protego®, Wafergard®, PureBond®, Spectra™, Clarilite®, Integra®, NT®, Dymension®, pHasor®, PrimeLock®, Guardian™, Microgard™, Mykrolis®, STAT-PRO® are trademarks of Entegris | Teflon® is a registered trademark of E. I. du Pont de Nemours and Company | Pillar® is a registered trademark of Nippon Pillar Packing Company, Ltd. | Kalrez® is a registered trademark of DuPont Dow Elastomers, L.L.C. | SEMI® is a registered trademark of Semiconductor Equipment and Materials International Corporation | Tenax® is a registered trademark of Buchem B.V. Corporation | Nikon® is a registered trademark of Nikon Corporation | ASML® is a registered trademark of ASML Netherlands B.V. Corporation

NORTH AMERICA

Massachusetts Entegris, Inc. Corporate Headquarters 129 Concord Road Billerica, MA 01821 USA Tel. +1 978-436-6500 Fax +1 978-436-6735

MinnesotaEntegris, Inc. 101 Peavey Road Chaska, MN 55318 USA Tel. +1 952-556-3131 Fax +1 952-556-1880

Customer Service Tel. +1 952-556-4181 Tel. 800-394-4083 (toll-free within

North America)Fax +1 952-556-8022 Fax 800-763-5820 (toll-free within

North America)

EUROPE

FranceCustomer Service Center for Southern, Western and Northern Europe Entegris S.A.S. Parc Centr’ Alp Ouest 196 rue du Rocher de Lorzier 38430 Moirans France Tel. +33 (0) 4 76 35 73 50 Fax +33 (0) 4 76 35 73 80

GermanyCustomer Service Centers for Eastern and Central Europe Entegris GmbH Hugo-Junkers-ring 5 Gebaude 107 Industriegebiet Klotzsche 01109 Dresden Germany Tel. +49 (0) 351-79597-0 Fax +49 (0) 351-79597-499

IsraelEntegris Israel Limited Izmargad Street 12 Kiryat-Gat Israel Tel. +972 (0) 73 221 00 00 Fax +972 (0) 73 221 00 22

JAPAN

Nihon Entegris K.K. Regional Headquarters Mita-Kokusai Bldg. 4-28, 1-Chome Mita Minato-Ku Tokyo, Japan 108-0073 Tel. +81 3-5442-9718 Fax +81 3-5442-9738

Nihon Entegris K.K. Shin-Osaka Prime Tower Bldg. 1-1, Nishinakajima 6-Chome Yodogawa-Ku Osaka, Japan 532-0011 Tel. +81 6-6390-0594 Fax +81 6-6390-3110

Nihon Entegris K.K. Hakataekihigashi 113 Bldg. 13-9 Hakataekihigashi 1-Chome Hakata-Ku Fukuoka, Japan 812-0013 Tel. +81 92-471-8133 Fax +81 92-471-8134

ASIA/PACIFIC

ChinaEntegris (Shanghai) Microelectronics Trading Co., Ltd. Unit 606-609, Tower 1 German Centre No. 88, Ke Yuan Road Zhangjiang Hi-Tech Park Shanghai 201203 P.R. of China Tel. +86 21 2898 6710 Fax +86 21 5080 5598

Entegris (Beijing) Microelectronics Trading Co., Ltd. Room 1105, Zhaolin Mansion No. 15 Ronghua Middle Road BDA, Beijing 100176 P.R. of China Tel. +86 10 5107 8379 Tel. +86 10 5107 8300 Fax +86 10 5107 8326

ASIA/PACIFIC

KoreaEntegris Korea, Ltd. 8F, Seongok B/D 4-1, Sunae-dong Bundang-gu, Seongnam-city Kyunggi-do, Korea 463-825 Tel. +82 31 738-5300 Fax +82 31 738-5301

MalaysiaEntegris (Malaysia) Sdn Bhd Unit 14 & 15, Lower Level 5 (Executive Wing), Hotel Equatorial No. 1 Jalan Bukit Jambul 11900 Bayan Lepas, Penang MalaysiaTel. +60-4-427-4200Fax +60-4-641-3294

SingaporeEntegris Singapore Pte Ltd. 31 Kaki Bukit Road 3 Techlink, #06-08/11 Singapore 417818 Tel. +65 6745-2422 Fax +65 6745-4477

TaiwanEntegris Asia LLC, Taiwan Branch 14F, No. 120, Sec. 2, Gong Dao Wu Road Hsinchu City 30072 Taiwan R.O.C. Tel. +886-3-571-0178 Fax +886-3-572-9520

Entegris Singapore Pte Ltd. Taiwan Science Park Branch1F., No. 6-7, Duxing Road East Dist. Hsinchu City 30072 Taiwan (R.O.C.)Tel. +886 3 565 3000 Fax +886 3 565 3099

Entegris Asia LLC, Taiwan Branch Rm. 313/314, 3F., No. 6, Zhongxin Road Xinshi Dist. Tainan City 74148 Taiwan (R.O.C.)Tel. +886 6 589 6008 Fax +886 6 501 3799

Entegris regional customer service centersREGION TELEPHONE FAXNorth America 800-394-4083 800-763-5820Germany +49 (0) 351 795 97-0 +49 (0) 351 795 97-499France +33 (0) 4 76 35 73 50 +33 (0) 4 76 35 73 80United Kingdom +33 476 357 354 +33 476 357 380Italy +33 476 357 352 +33 476 357 380Israel +972 (0) 73 221 00 00 +972 (0) 73 221 00 22Japan +81 3-5442-9718 +81 3-5442-9738Malaysia +60-4-427-4200 +60-4-641-3294Korea +82-31 738-5300 +82-31 738-5302Taiwan +886-3-571-0178 +886-3-572-9520Singapore +65 6745-2422 +65 6745-4477China +86 21 2898 6710 +86 21 5080 5598

wet etch and clean - entegris · wet etch and clean (wec) processes touch wafers more than any...

Documents