Via Filling Machine

DP-HF Model V1.0Circuit Automation, Inc.Phone 1.714.763.7762

© CAI April 27, 2008

Why via filling?

Allows the size of PCB to shrinkCreates more space on the surfaceAllows via-in-pad technologyBuilt up multilayer's with stacked

vias

Commercially Available Materials

Peters PP 2794 PP 2795Sanei Kaguku (PHP-900 series)Taiyo THP-100DX1 VFDuPont CB100Preferred Paste thickness is in the

450 centipoises range.

DP-HF Features

No Viton SealsSingle Chamber fillingSelf Aligning Print headVacuum system for blind viasUnique application head reduces

wasteWaste collection systemFill entire panel

24” X 30”610 X762mm

Max Size

Auto Loader

TouchScreen

Vacuum Chamber

Filled Via Holes

DP-HF Process

Appropriate size Fill Head is installed. Panel is loaded into clamp Panel is transported into machine Start and Stop Fill positions are chosen for

first panel or stored recipe is selected. Filling parameters are chosen. Panel is filled. Panel is transported to load section. Panel is removed

New Ink Pump

New Direct Inject Head

Head for 18’ (454mm) Panel

Seal Adjuste

rs

Adjustment Feedback

17.6 filling area447mm)

Non Viton fill head

Micro-Adjust Fill Head

Panel Load/Unload Door

Heavy Duty Strong Clamp

Waste Collection System

New Whisper Drive System

4 lead screw Belt driven, extra

smooth transfer fill rate

Large Capacity Vacuum Pump

7.4 hp177cfm pump

Manual Control Screen

MMI Screens

High Performance 2nd Generation

Contact Circuit Automation 5292 System DriveHuntington Beach, CA 92649

1.714.763.4180 ph 1.714.763.4181 faxwww.circuitautomation.com