2006.10.24.R&D Center

Pretreatment for Innerlayers

V-Bond BO-7770V

2006.10.24.R&D Center2

PCB Manufacturing Process

１．Innerlayer Patterning

０．Multilayer Board

２．Pretreatment for Innerlayer

３．Laminate and Press

７．Assembly４．Outer Layer Patterning ５．Solder Mask ６．Final Surface Finish

Shipping

2006.10.24.R&D Center3

Multilayer Board & Pretreatment for Innerlayer

3 pieces of Innerlayer Boards

2 pieces of Copper Foil

4 pieces of Prepregs

Multilayer Board (8 layers)

Innerlayer Boards

Pretreatment for InnerlayerPretreatment for Innerlayer

To Enhance Adhesion

Black Oxide Treatment, Black Oxide Reduction Treatment

V-Bond Treatment

2006.10.24.R&D Center4

What is V-Bond ?

V-Bond, which is a alternative to chemicals for black oxide treatment or black oxide reduction treatment, is available for a pretreatment for innerlayer. Unique surface topography produced by V-Bond can enhance adhesion of copper to resin.

2006.10.24.R&D Center5

V-Bond BO-7770V Process20-30ºC, 10 - 40 S

40-50ºC, 15 - 40 S

Dip25ºC, 30 – 90 S

Water Rinse

Water Rinse

Water Rinse

Dry

2. Alkaline Cleaner 4%Caustic Soda

3. Predip (BO-7770VP)

4. BO-7770V

1. CB-7612 10 times dilution

3. Help to obtain good surface finish in BO-7770V process. Avoid dragging-in of rinse water into BO-7770V tank.

4. Roughen copper surface and produce organic copper film simultaneously resulting in producing copper surface having superior adhesion

25ºC, 30 - 60 S

2. Removal of residues of dry film

1.Removal of rust and dirt on a panel

2006.10.24.R&D Center6

V-Bond BO-7770V Features 1Sulfuric Acid - Hydrogen Peroxide Microetching Solution

Black Oxide Treatment V-Bond

Needle-shaped Copper Oxide = Physical Bonding

Peaks and Valleys ＝Physical Bonding

Organic Copper Film＝Chemical Bonding

＋

×30,000 CuCu

ResinResin

2006.10.24.R&D Center7

V-Bond BO-7770V Features 2Excellent Adhesion to High Tg・Halogen Free

Pb(lead)Free（High Heat Resistance）

Halogen Free

ApplicationDigital Appliance

（PC・Mobile Phone・Digital Camera)Amusement（PSP・NDS）

Automobile（Driving・Stopping・Turning）

High DensityHigh-frequency Thinner&LighterModelHigh Heat Resistance

Environment

High Heat ResistanceHigh-FrequencyHalogen Free

Innerlayer Materials

Prepreg

High Tg

Halogen Free Materials

2006.10.24.R&D Center8

V-Bond BO-7770V Features 3Comparison with Oxide Treatment

Contribution to Enhance Reliability

of PCB

Contribution to Enhance Reliability

of PCB

00.20.40.60.8

11.21.4

ピール強度（

N/m

m）

FR-4 高Tg材 ハロゲンフリー材

プリプレグ材料

黒化処理 V-Bond

Copper Foil :35μm

Peel StrengthV-Bond vs. Black Oxide Treatment

Peel

Str

engt

h (N

/mm

)

High TgPrepreg

Halogen Free

■Black Oxide Treatment ■ V-Bond

2006.10.24.R&D Center

V-Bond vs. Product M vs. Product BComparison of Topography & Peel Strength

2006.10.24.R&D Center10

V-Bond @ MEC

Copper Foil : Mitsui Mining and Smelting 3EC-Ⅲ

×3,500

Stage Angle ： 45°

1.0μmEtched

2.0μmEtched

1.5μmEtched

2006.10.24.R&D Center11

Product M @ M Company

1.0μmEtched

2.0μmEtched

1.5μmEtched

Copper Foil : Mitsui Mining and Smelting 3EC-Ⅲ

×3,500

Stage Angle ： 45°

2006.10.24.R&D Center12

Product B @ A Company

1.0μmEtched

2.0μmEtched

1.5μmEtched

Copper Foil : Mitsui Mining and Smelting 3EC-Ⅲ

×3,500

Stage Angle ： 45°

2006.10.24.R&D Center13

Topography and Roughness Etching Amount : 1.5μm

Product BProduct MV-Bond

×3,500

×10,000

RaRz

0.363.90

0.332.98

0.344.04

Each product provides unique topography. Topography is roughen in order of Product M, V-Bond & Product B.

2006.10.24.R&D Center14

Peel Strength GEA-67N (Hitachi Chemical)

0

0.2

0.4

0.6

0.8

1

1.2ピール強度（N/mm）

OxideTreatment

V-Bond 0.86 0.94 1.04

Product M 0.48 0.53 0.63

Product B 0.57 0.67 0.91

1.0um 1.5um 2.0um

Peel

Stre

ngth

(N/m

m)

2006.10.24.R&D Center15

Peel Strength GEA-679N (Hitachi Chemical)

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7ピール強度（N/mm）

Oxide Treatment 0.13

V-Bond 0.39 0.5 0.61

Product M 0.14 0.21 0.29

ProductB 0.33 0.4 0.45

1.0um 1.5um 2.0um

Peel

Stre

ngth

(N/m

m)

2006.10.24.R&D Center16

Peel Strength GEA-679F (Hitachi Chemical)

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7ピール強度（N/mm）

Oxide Treatment 0.48

V-Bond 0.46 0.58 0.63

Product M 0.21 0.25 0.33

Product B 0.36 0.5 0.62

1.0um 1.5um 2.0um

Peel

Stre

ngth

(N/m

m)

2006.10.24.R&D Center17

Peel Strength GEA-67BE(G) (Hitachi Chemical)

0

0.2

0.4

0.6

0.8

1ピール強度（N/mm）

Oxide Treatment 0.91

V-Bond 0.5 0.63 0.75

Product M 0.21 0.28 0.39

Product B 0.27 0.42 0.41

1.0um 1.5um 2.0um

Peel

Stre

ngth

(N/m

m)

2006.10.24.R&D Center18

V-Bond BO-7770V Features 4

With V-Bond Less Dirt Generated in the Treatment Tank Compared to Others.

V-Bond Product M

Dirt on the solution surface Less More

Frequency of replacement of whole working solution

Once three to six months

At least Once a month

Frequency of replacement of filter

When whole working solution is replaced. Once a month

2006.10.24.R&D Center19

V-Bond BO-7770V Features 5

Simple Control According to Panel Counter

Chemical Type Control Method

CB-7612

Caustic Soda

BO-7770VP

BO-7770V Copper concentration control can be automatic + Panel counter replenishment.

Solution level compensation + Panel counter replenishment

All chemicals employed in MEIKO ELECTRONICS (Wuhan) are replenished by panel counter.

2006.10.24.R&D Center20

V-Bond BO-7770V Features 6An automatic feed and bleed system accurately controls working solution Automatic Analysis Device

（Appearance）

Cu Concentration

Measured Time & Date

H2O2 Concentration

H2SO4 Concentration

Replenished amount of the fresh solution &

Operated time

Holding Cu concentration (45 ± 1 g/L) constant makes it possible to use the solution under stable conditions, and consequently it leads to a reliable quality.

Analysis result can be printed for records.

Analysis Cell

2006.10.24.R&D Center21

V-Bond BO-7770V Features 7Color of V-Bond treated copper surface can be qualified by L-values for process control.

Highly Reliable Control

Measurement of Etching RateMeasurement of L-value*

Concentrations of individual elements (Sulfuric Acid, Hydrogen Peroxide and Copper) in BO-7770V

+Information from a boardtreated with the solution

Check a status of BO-7770V working solution.

+

【Daily Control Method of BO-7770V】

A degree of copper roughened topography and a status of organic copper film can be observed according to L-value*.

A balance of an effective element in BO-7770V can be seen according to L-value*.

2006.10.24.R&D Center22

Actual Achievement of V-BondThere are thirteen companies employing V-Bond as of Oct. 2006. Production Volume : About 50,000 m2 / mon. in Japan, About 40,000m2 / mon. overseas

The table shows customers whose production amount is 5,000㎡/M or larger

Customers Date Throughput （㎡/mon.） Application

A Company Since Jun., 2002 10,000 （Full Introduction） Communication・Amusement

C Company Since Apr., 20035,000 （Full Introduction・Throughput will be still increasing）

Automobile

B Company Since Nov., 2002 4,000 (Vertical Line ・Full Introduction） Shield Board

D Company Since Nov, 2003 15,000 （Full Introduction） Automobile・Amusement

E Company Since Jun., 2006 5,000 （Combined Use of Black Oxide） Communication

F Company Since Apr., 200630 （Small Production, Prospect for Mass Production from Spring in 2007)

Car Navigation・

Electronic Control Unit

G Company Since Apr., 2006 7,000 （Combination Use of Black Oxide)Home Electronic Appliance・Automobile

H Company

（The Japanese Company in China.)

Since Aug., 200640,000 （From Oct. 2006）

（Second line was set up in Nov. 2006)Flat Panel Display

2006.10.24.R&D Center23

Support System

×10,000

銅銅

樹脂樹脂

Cu L 3.0 µm

Observation of Surface Topography by SEM

Elemental Analysis of Copper Surface（EPMA)

Analysis of Effective Element in Working Solution（HPLC）

Observation of Cross-section View

Observation Cross-section Surface by FE-SEM & Elemental Analysis

C K 3.0 µm

MEC will try the best to examine problems using all

analytical techniques when troubles arise

MECMEC