update on various target issues presented by ron petzoldt d. goodin, e. valmianski, n. alexander, j....

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Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

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Page 1: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

Update on Various Target Issues

Presented by Ron Petzoldt

D. Goodin, E. Valmianski, N. Alexander, J. Hoffer

Livermore HAPL meetingJune 20-21, 2005

Page 2: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Accomplishments

1) We demonstrated improved tracking with 1st generation system

2) Evaluated impurity effects on target reflectivity

3) Modeled the impact of foam shell non-concentricity on DT ice non-concentricity

4) Calculated time limits for “handoff” of layered targets to an injector

5) Completed cryogenic coil resistance testing

Page 3: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

1)Improved tracking

Page 4: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

The “Gen-I” system is tracking targets full length for position prediction calculations • Improved laser beam collimation reduced cross-talk

between horizontal and vertical position measurements

Laser

D2 measurements taken in two horizontal positions 20 mm apart

Targetheight

0 mm

25 mm

-15

-10

-5

0

5

10

15

20

0 10 20 30

Vertical position

Measurement pixel change

D2 Old Optics

D2 New Optics

Page 5: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

-5.00

0.00

5.00

10.00

15.00

20.00

25.00

1 2 3 4 5 6 7 8 9 10

Shot number

Target Height (mm)

DCC Measured Pos

DCC Predicted Pos

Predict error

-5

0

5

10

15

20

25

1 2 3 4 5 6 7

Shot number

Target height (mm)

DCC Measured Pos

DCC Predicted Pos

Prediction error

Target position prediction improved from 2.0 mm to 0.49 mm (1 )

• Measured position in flight at two stations, predicted position at DCC, measured position at DCC, and compared measurement/prediction

• “Gen-II” tracking system is under evaluation (Graham Flint talk)

Gun D1 (4.1 m) D2 (8.7 m) DCC (17.7 m)

Shots fromOctober 2004

Shots from3 June 2005

Air rifle shotsAir rifle shots

Page 6: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

2)Impurity effects on target reflectivity- Impurities in DT supply- Transfer to the layering system- Impurities in the cryogenic fluidized bed- Transfer to the injector

Page 7: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Impurity gases can freeze on target surface and reduce target reflectivity

• <~1 m of air deposit is required for target reflectivity (water thickness must be even less)

• This could increase in-chamber target heating

Page 8: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Deposits during cool down in permeation cell are small

• Example: Assume 99.999% pure DT in permeation cell with 600 m DT layer with equal DT outside a 2.4 mm radius target

Impurity volume = V = 2 0.00001( ) 4π /3( ) 2.4 mm( )3

− 1.8 mm( )3

[ ] = 6.7 ×10−4 mm3

Impurity thickness = Δr =V

4πr2=

6.7 ×10−4 mm3

4 3.14( ) 2.4 mm( )2 = 9.26 nm

Page 9: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Maximum deposition rate at 10-6 Torr and 20 K is ~40 nm/min

• Example: N2 at 10-6 Torr = 1.310-4 Pa

Mass flux = Φm =ρ gv g

4=

2.25 ×10−8kg/m3( ) 123 m/s( )

4= 6.9 ×10−7kg/m2s

dx

dt=

Φm

ρ s

=6.9 ×10-7kg/m2s

1026 kg/m3= 6.7 ×10−10m/s = 40 nm/min

ρ =PM

RT=

1.33×10-4 Pa( ) 0.028 kg/mole( )

8.31 J/mole ⋅K( ) 20 K( )= 2.25 ×10-8kg/m3

• This would mean ~ 1 micron buildup would occur in 25 minutes

• Thus << 10-6 Torr is needed for the transfer to fluidized bed

Page 10: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Transferring targets in cryogenic vacuum should prevent significant cryo-deposits

• Cryogenic chamber in vacuum keeps vapor pressure low

Heat exchangers ~14 K

Fluidized bed ~19 K

Blower

Gas flow direction

Cryogenicchamber

Permeation Cell

Vacuum chamber ~10-6 Torr impurity gases

<<10-6 Torrimpurity gases

Page 11: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Most gases have extremely low vapor pressure in a cryogenic environment

• Design concepts allow << 10-6 Torr and negligible impurity buildup• Similar - negligible buildup in fluidized bed loop or in transfer to the injector

Approximate vapor pressure in Torr

4K 20 K 77K 150 K Triple PointTemperature

Water <10–13 <10–13 <10–1310-7 273 K

Carbondioxide

<10–13 <10–1310-8 10 217 K

Argon <10–1310-13 160 Above

critical temp84 K

Oxygen <10–1310-13 150 Above

critical temp54 K

Nitrogen <10–1310-11 730 >1 atm 63 K

Neon <10–1330 >1 atm >1 atm 25 K

Hydrogen 10-7 760 >1 atm >1 atm 14 K

Page 12: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

3)Impact of foam shell non-concentricity on DT ice non-

concentricity

Page 13: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Calculated total DT layer thickness is insensitive to foam non-concentricity (#1)

• We calculated DT temperature difference by initially assuming uniform DT layer thickness inside a non-concentric foam with a uniform outer surface temperature

T1

T2

kDT + f = ks1−δ kDT

δ

= 0.25 W/m ⋅K

ks = Thermal conductivity of foam solid = 0.065 W/mKkDT = Thermal conductivity of solid DT = 0.29 W/mK = Volume fraction DT = 90%

DT/foam

DT Offset of DT icelayer from center

2 m 10 m

T1 ( )K 19.6063 19.605683T2 ( )K 19.606609 19.607231ΔT ( )K 3.09E-4 1.548E-3

Page 14: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Calculated total DT layer thickness is insensitive to foam non-concentricity (#2)

• We then found the shift in inner DT center that leads to a uniform inner DT temperature (equilibrium)

T1

T2

Offset of DT iceouter layer fromcenter

2 m 10 m

Offset o f DT iceinner laye r fromcenter

-0.08m -0.4m

T1 ( )K 19.606454 19.606453T2 ( )K 19.606454 19.606454ΔT ( )K 0 1E-6

• Thus the total variation in ice thickness is estimated to be more than an order of magnitude less than the variation in the foam thickness

DT/foam

DT

Page 15: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Thermal conductivity model needs verification for solid DT in foam• Model has been tested for liquid DT in foam*

• Smaller crystals and possible void spaces in foam may cause reduced thermal conductivity

• LLE plans to measure thermal conductivity of D2 in foam • Results are insensitive to small changes in conductivity

D. E. Daney and E. Mapoles, Thermal conductivity of liquid hydrogen filled foam,Cryogenics, Vol. 27 (Aug. 1987) 427.

*

ks = 0.5*k (PS)= 0.0325 W/m•KkDT+Foam = 0.233

k(PS)= 0.065 W/m•KkDT+Foam = 0.250

ks = 2*K (PS)= 0.13 W/m•KkDT+Foam = 0.268

Offset DT+foam 10m 10m 10mOffset DT -0.84m -0.4m 0.03 mT1 ( )K 19.607766 19.606453 19.605243

T2 ( )K 19.607767 19.606454 19.605244ΔT ( )K 1E-6 1E-6 1E-6

Page 16: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Layer thickness in a layering sphere was less sensitive to DT/foam conductivity

Layering sphere (17.8 K) 1” diameter

He gas

Target

ks = 0.5*k (PS) k (PS)= 0.065 W/m•K

ks = 2*K (PS)

Offset DT+foam 10 m 10 m 10 mOffset DT 1.2 m 1.3 m 1.4 mT1 ( K) 19.7568 19.7557 19.7545

T2 ( )K 19.7568 19.7557 19.7545ΔT ( )K 0 0 0

With this assumption, the DT offset is still nearly an order of magnitude less than the foam offset

Page 17: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

4)Time limits for “handoff” of layered targets to an injector

Page 18: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

We investigated layer degradation after target removal from fluidized bed

• Low dnsv/dT for DT and high He-3 build up time (t) increase beta layering time constant

τ =ρs

KDT

Dn

t

E

Vs

Vv

h

hs

dnsv

dT T1

⎝ ⎜

⎠ ⎟−1

+s

G

⎣ ⎢ ⎢

⎦ ⎥ ⎥

ρs is solid DT density in molecules per unit volume, KDT is the thermal conductivity ofsolid DT, D is the diffusion coefficient, n is the total number density (He+DT), t is thetime since purifying the DT, E is the average energy released per beta decay, Vs is thevolume of solid DT, Vv is the volume of the vapor space, h is the diameter of the vaporspace, hs is the total thickness of the solid DT (sum of both sides), nsv is the density of thesaturated DT vapor, T is the temperature, s is latent energy of sublimation per DTmolecule, and G is the beta decay power per unit volume.

• A long layering time constant slows layer movement in a non-uniform temperature environment

0.01

0.10

1.00

10.00

100.00

10 12 14 16 18 20

Temperature (K)

dn/dT (moles/m^3•K)

T. P. Bernat, E. R. Mapoles, and J. J. Sanchez, Temperature- and Age-Dependence ofRedistribution Rates of Frozen Deuterium-Tritium, ICF Quarterly Report, January –March 1991, Vo l. 1, No. 2, UCRL-LR-105821-91-2, LLNL, Livermore, CA.

*

*

Page 19: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Layering time constant increases with decreased temperature

• Long layering time constant increases layer survival time in a temperature gradient

10

100

1000

10000

100000

10 12 14 16 18 20

Temperature (K)

Beta layering time constant (minutes)

Assumes baseline NRL target and 1 day He-3 buildup

Page 20: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Time to offset DT by 1% (after 1 day)

0.1

1.0

10.0

100.0

10 12 14 16 18 20

Temperature (K)

Time (minutes)

100 mK

200 mK

400 mK

Time to change layer uniformity depends on T and T

• Example: time available to transfer target is < 18 s

• Lower temperature would greatly increase time

18 s at 16 K and 100 mK across target

Page 21: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

5)Cryogenic coil resistance testing

Page 22: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Coil resistance dropped substantially when annealed

• Recall L/R>>25 ms is required to sustain coil current in an attractive force EM accelerator

• Previous results showed increased conductivity with welded annealed coil than soldered and not annealed

• New testing shows annealing is the major contributor

• L/R at 15 K and 0.9 Tesla annealed is 80 ms

59 Turn 5N Al e-beam welded Coil (lot Q3756)

0.001

0.01

0.1

1

0 20 40 60 80 100

Temperature

L/R time constant (s)

Annealed (B=0)

Annealed (B=0.9 T)

Not Annealed (B=0.9 T)

Not Annealed (B=0)

Accelerating CoilSabot Coil

Fr

Fr

Fz

Page 23: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Composition variations between lots significantly affect coil resistance

• Much higher low-temperature resistance!• Coil purity must be controlled to achieve

consistent results

57 Turn 5N Al e-beam welded Coil (lot Q115)Apparently less pure than lot Q3756

0.001

0.01

0.1

0 20 40 60 80 100

Temperature (K)

Time constant(s)

Not annealed B=0.9 T

Not annealed (B=0 T)

Annealed (B=0 T)

Page 24: Update on Various Target Issues Presented by Ron Petzoldt D. Goodin, E. Valmianski, N. Alexander, J. Hoffer Livermore HAPL meeting June 20-21, 2005

IFT\P2005-071

Summary

• External tracking position prediction accuracy improved by a factor of 4

• Impurity buildup on targets must be controlled

• Model indicates that total DT layer thickness is relatively insensitive to target foam non-concentricity– Experimental measurement of conductivity needed

• Low target temperature greatly increases DT layer shift time in temperature gradient– Sufficient time is available for target transfer with

low T

• Coil resistance was improved by annealing but varied with lot number on 5N Al wire