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Understanding Strip (Finite) and Slot (Infinite) Ground based EM simulations in ADS ADS offer three ways in which designers can model the return path (ground) for their structures to perform EM simulations. This short tutorial note explains about each of them so that designers can choose the appropriate method while simulating their structures using ADS Momentum EM solver. Option1: Using Cover Plate for Ground This is usually the default option where we can notice cover plate at the bottom of the substrate stack up. Limitation with this option is that it can only be defined either at the Top or Bottom side of the stackup definition and not on intermediate layers. This option works best with typical Microstrip or Stripline configuration as used in traditional RF/Microwave circuit designs. Whenever Cover is defined in the stackup, this is picked as default return path (GND) for all + Signal Pins placed in the layout. In other words it is like defining PEC (Perfect Electrical Conductor) and beyond this no other substrate layers can exist. Also, it is not possible to create any defect in the ground plane while using this option. Incase defected ground is needed then one has to look for other 2 options (Strip and Slot) discussed in this tutorial note. Impact of Cover definition in layout: Cover definition in the stackup doesn’t change how layout is drawn in any manner, designers just need to draw their desired signal traces/shapes on their STRIP layers and connect + Pin at the desired places on the STRIP layer as per their layer mapping in stackup definition. In above snapshot we can notice that “cond” layer is used as main STRIP layer in which we would like to design our circuit. During EM simulation, negative pin will automatically be place right beneath + Pin for return current modeling on this Perfect Conductor Cover plate…..

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Page 1: Understanding Strip (Finite) and Slot (Infinite) Ground ... Strip (Finite) and Slot (Infinite) Ground based EM simulations in ADS ... This short tutorial note explains about each of

Understanding Strip (Finite) and Slot (Infinite) Ground based EM simulations in ADS

ADS offer three ways in which designers can model the return path (ground) for their structures to perform EM simulations. This short tutorial note explains about each of them so that designers can choose the appropriate method while simulating their structures using ADS Momentum EM solver.

Option1: Using Cover Plate for Ground

This is usually the default option where we can notice cover plate at the bottom of the substrate stack up. Limitation with this option is that it can only be defined either at the Top or Bottom side of the stackup definition and not on intermediate layers. This option works best with typical Microstrip or Stripline configuration as used in traditional RF/Microwave circuit designs. Whenever Cover is defined in the stackup, this is picked as default return path (GND) for all + Signal Pins placed in the layout. In other words it is like defining PEC (Perfect Electrical Conductor) and beyond this no other substrate layers can exist. Also, it is not possible to create any defect in the ground plane while using this option. Incase defected ground is needed then one has to look for other 2 options (Strip and Slot) discussed in this tutorial note. Impact of Cover definition in layout:

Cover definition in the stackup doesn’t change how layout is drawn in any manner, designers just need to draw their desired signal traces/shapes on their STRIP layers and connect + Pin at the desired places on the STRIP layer as per their layer mapping in stackup definition. In above snapshot we can notice that “cond” layer is used as main STRIP layer in which we would like to design our circuit. During EM simulation, negative pin will automatically be place right beneath + Pin for return current modeling on this Perfect Conductor Cover plate…..

Page 2: Understanding Strip (Finite) and Slot (Infinite) Ground ... Strip (Finite) and Slot (Infinite) Ground based EM simulations in ADS ... This short tutorial note explains about each of

Option2: Using Slot Plane for Ground

Another simple option to define return path (ground) is to use Slot Plane definition in the substrate stackup. Slot planes can be defined on any of the layers (top, bottom or intermediate) in the stackup editor and pretty simple to use. While defining Slot plane, one need to select a drawing layer from the layer list available in the substrate editor window and same has to be mapped on the interface of dielectrics as shown below:

Impact of Slot Plane definition in layout:

One thing to remember while using Slot Plane is that it is “negative” layer and it has to be drawn accordingly in layout. If we want full solid plane on SLOT layer as a ground plane then nothing has to be drawn on Layout on Slot layer (pc1 in our example above) but if we need defected ground or VIA clearance etc then we need to draw desired shape in the layout Example1: Line on “cond” layer and solid ground on “pc1” slot layer

Here, we can see we haven’t drawn anything on “pc1” layer in layout because we want solid ground plane (remember, it is negative layer…..)

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Example2: Interconnecting VIA for cond and cond2 metal layers

Here we can see that we have drawn object on “pc1” i.e. slot layer where we don’t want ground plane to exist. Apart from this circular area we shall have ground plane…..remember that SLOT is a negative layer for layout drawing purposes.

Also remember while using SLOT layer in our stackup definition we only need to place Pins on Signal lines i.e. “cond” and “cond2” and respective –ve Pins are automatically placed at nearest SLOT layer right beneath + Pins.

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Port Editor Window:

Looking at the port editor window we can observe that –ve Pin for each termination is defined as Gnd which refers either to the Cover Plate or SLOT available in the stackup editor and designers don’t need to worry about the –ve pins.

While working with Allegro or Xpedition etc kind of Layout softwares, kindly don’t confuse this Gnd used in Port editor window to the GND layers which you may have in your Allegro or Xpedition etc kind of layout designs. These are two different things and shouldn’t be mixed up. Simulating Slots in Ground Planes

Slots in ground planes are treated in a special manner by Momentum. An electromagnetic theorem called the equivalence principle is applied. Instead of attempting to simulate the flow of electric current in the wide extent of the ground plane, only the electric field in the slot is considered. This electric field is modeled as an equivalent magnetic current that flows in the slot. Momentum does not model finite ground plane metallization thickness. Ground planes and their losses are part of the substrate definition.

Option3: Using Strip Plane for Ground

Third and final way to define ground plane is to use finite ground plane approach in ADS layout. To define the finite ground approach, the layers which are supposed to be used as Ground should be defined as regular STRIP conductor mapping and the interface should be defined as STRIP plane (which is the default option in substrate editor)

We can define the properties of this layer like any other conductor by defining the Conductor material/Conductivity, Thickness etc as shown below.

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Impact of Strip Plane definition in layout:

While using Strip plane method of defining finite ground pattern is pretty straightforward in terms of layout and we just need to draw the ground plane as we desire. Additional workload on designers while using Finite ground approach is to make sure:

a. There should be a –ve Pin placed on desired ground layer nearest possible to the +ve Pin b. Designers need to define proper + and – Pin pairing for each termination necessary

Example1: Line on “cond” layer and finite ground on “pc1” layer We can notice a simple transmission line drawn on “cond” layer and the finite ground shape being drawn on “pc1” layer in the snapshot below

While placing Pins for simulation, we need to make sure that there is a Pin present on desired ground layer for every Pin on Signal layer. In present case we shall have 2 Signal Pins placed on “cond” layers which shall be used as +ve Pins and 2 corresponding Pins on “pc1” layer which shall be used as –ve Pins to make +/- pairs. Note: It is not mandatory to have ground plane to be always defined on a separate layer. It is possible to have regular signal lines and ground plane to be on the same metal layer like is the case while using CPW (Coplanar Waveguide) based structures.

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Port Editor Window:

Default Port Editor window will appear as shown above with all 4 ports shown as 50 Ohm terminations but that is not the case for us. Also, need to remember that there is nothing called Gnd where return current would be referred to. We are using Finite ground approach and we need to define where we want return current to travel and how the fields will be excited in our structure. Depending on the order in which Pins are placed, we can drag and drop Pins placed on ground layer to the –ve terminals of the Ports in Port Editor window as shown below

In our case P1 and P3 are + and – terminals for Port1 and P2 and P4 are + and – terminals for Port2 resulting in 2-port network simulation.

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Example2: Line on “cond” and “cond2” layers with interconnecting VIA and ground plane on “pc1” layer Here is another example of lines on “cond” and “cond2” layers interconnected by a VIA drawn on “hole” layer as per the stackup definition

Snapshot with cond and cond2 layer switched off….

Zoomed-In view of the VIA transition where the clearance was created in “pc1” layer to avoid VIA getting shorted with ground plane on “pc1” layer

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Simulation and Results Comparison between STRIP and SLOT ground

approach

In order to compare results obtained by Finite Ground (Strip) or Slot ground approach, we shall run

simulation on examples shown previously and results are summarized below. Care is taken to make

sure simulation; mesh settings etc are kept common for respective cases

Example1: Long Transmission Line

We can notice here that responses are pretty comparable with very minor differences which may be

due to the different formulations used for finite ground and Slot mode simulation approach but TDR

showing impedance predicted is nearly the same so either mode of simulation should serve the

purpose.

Benefit of using SLOT mode for complex designs where lot of conductor is present on ground layers

is that it saves significant amount of simulation time and memory requirements with minimal loss of

accuracy and not to forget time spent on + & - Pin pairing for each Terminations.

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Example2: Lines with Interconnecting VIA

Again we can notice that responses agree pretty well for 2nd case as well.

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