ultra low loop bonding chip scale package bonding · bonding, the vibration characteristics of the...

CAPABILITY CONSISTENCYADAPTABILITY RELIABILITY

Courtesy of ASM

Courtesy of ASM

Multi-Tier Bonding Stacked-Die BondingAdvanced Stacked-Die Looping for Pyramid& Overhang Stacking

BPP UseableWire Ø (µm)

Recommended SPTPart Number

70

60

50

45

25

25

232020

PI-33085-435F-ZP34T-375

PI-30075-355F-ZP34T-300

PI-28063-335F-ZP34T-250PI-25063-305F-ZP34T-250PI-23055-281F-ZP34T-250

Tri-Tier, Quad Tier Bonding for Fine Pitch& Ultra Fine Pitch Application



100

9080

7060

25

2525

2525

PI-35130-585F-ZP34T

PI-35120-535F-ZP34TPI-35100-515F-ZP34T

PI-33090-435F-ZP34TPI-30080-355F-ZP34T

Ultra Low Loop Bonding Chip Scale Package BondingLow Loop & Short Wire Capability



1009080

7060

252525

2525

PI-35130-585F-ZP34T-XXXPI-35120-535F-ZP34T-XXXPI-35100-515F-ZP34T-XXX

PI-33090-435F-ZP34T-XXXPI-30080-355F-ZP34T-XXX

Standard Forward, Standard Reversed& Special Low Loop



100

9080

7060

25

2525

2525

PI-35130-585F-ZP34T-520

PI-35120-535F-ZP34T-520PI-35100-515F-ZP34T-520

PI-33090-435F-ZP34T-520PI-30080-355F-ZP34T-520

P R O G R A M M E D

I N T E L L I G E N C E

Programmed with

Your Solutions in Mind!

80µm BPP100µm BPP

www.smallprecisiontools.com

We reserve the right to make changes to design or specifications at any timewithout notice. Bonding responses shown may vary depending upon thebonding parameters, device metallization, substrate, etc, used.

The advancement in bonding technology and the market demandfor faster, smaller and better product, again poses newchallenges for the wire bonding process. The transition fromfine-pitch (FP) to ultra fine-pitch (UFP) volume production, andthe emergence of stacked die, multi-tier and low-K bonding hasincreased the level of difficulties in the wire bonding processwith more yield loss due to lifted ball, wire shorts, etc.

In compliance with these new bonding requirements, SPT hasembarked on an extensive study to develop a new generationand high-performance capillary. Designed with advancedprocess diagnostic tools, the new capillary design, known asthe PI (Programmed Intelligence) capillary has been extensivelytested in a variety of wire bonders and packages. In all tests,the PI capillary has demonstrated superior bonding performancewith good repeatability and portability using a wide range ofbonding platform.

Programmed Intelligence

P.I. Capillary

The PI capillary was derived from a series of physical modelingand finite element analysis (FEA) studies to analyze the stresslevel at the tip and transition profile for different designs, asthese are locations where breakage is most likely to occur. Anexample of the analysis – in this case, for the PI design is asshown below. Among the options considered, the PI designshowed the lowest overall stress. This result was validatedthrough destructive test, which showed that the breaking loadfor the PI design is 7% higher as compared to other designoption.

Ultra Fine Pitch Bonding Fine Pitch BondingBGA & QFP Bonding Application



50

45

40

35

30

2320

20

18

15

12

PI-28063-335F-ZP34TPI-25063-305F-ZP34T

PI-23055-281F-ZP34T

PI-21050-251F-ZP34T

PI-18045-221F-ZP34T

PI-15038-181F-ZP34T

BGA Bonding Application

40µm BPP

35µm BPP30µm BPP



10090

807060

2525

252525

PI-35130-585F-ZP34TPI-35120-535F-ZP34T

PI-35100-515F-ZP34TPI-33090-435F-ZP34TPI-30080-355F-ZP34T

60µm BPPSPT Roth Ltd

Werkstrasse 28, CH-3250 Lyss, Switzerland

Tel : + 41 32 387 80 80

Fax : + 41 32 387 80 88

E-Mail : [email protected]

Small Precision Tools Inc

1330 Clegg Street, Petaluma, CA 94954, USA

Tel : + 1 707 765 4545

Fax : + 1 707 778 2271


SPT Asia Pte Ltd

970 Toa Payoh North, #07-25/26, Singapore 318992

Tel : + 65 6253 5577

Fax : + 65 6250 2725


Small Precision Tools (Phil) Corp

35 Libertad Street, Mandaluyong City 1550, Philippines

Tel : + 632 533-7067

Fax : + 632 531-5780


Small Precision Tools Co Ltd

A2 Building, Liyuan Economic Development Zone,Wuxi, Jiangsu, P.R.China 214072

Tel : + 86 510 516 1968

Fax : + 86 510 516 5233


SPT Japan K.K.

9th floor, Shin-Yokohama U.U Building,2-5-2, Shin-Yokohama, Kohoku-ku,Yokohama-shi, Kanagawa, 222-0033 Japan

Tel: +81-45-470-6288

Fax: +81-45-470-6755

E-Mail: [email protected]

Laser interferometry technique is also used to determine theoptimum capillary profile through amplitude of vibrationmeasurement along the overall profile of the capillary. In wirebonding, the vibration characteristics of the capillary is animportant factor as its indicates the efficiency of the transfer ofthe ultrasonic energy from the bonding tool to the bond padinterface. Through the various design optimization, the PI designhas shown to be more responsive to the bonding parameters,producing better bond integrity.

DataSource

Design A Design BP.I.

Design

Stress @ Tip(x1011 Pa) Simulation 0.1269 0.1253 0.1167

BreakageLoad (gf)

Simulation 228 238 245

Figure 1: Correlation of the simulation data with the results ofdestructive test

Based on the various simulation and diagnosis, the PI capillarydesign was conceived. Actual bonding responses were testedusing standard QFP and BGA package for a 70um bond padpitch (BPP). The PI capillary was shown to be more responsiveto the bonding parameter producing better results on all themeasures (ball size, ball shear and stitch pull). In contrast, otherdesign options would require higher bond force and moreultrasonic power to achieve the same bond integrity. Thisobservation correlated with the result from the laserinterferometry test.

Today, the PI capillary has been qualified and used in volumeproduction by major assembly houses for a broad range ofbonding applications. Depending on the specific bondingapplication, the PI design can be used together with any existingdesign feature, such as the DFX (for small ball large wirebonding), CSP (for short loop/low wire bonding, BSB (ball stitchon ball bonding), Infinity (extended tool life), etc. Indeed, the PIcapillary has proved to be a new revolution in bonding solution.

Amplitude of Vibration (nm)

Design A Design BP.I.

Design

454 488 544

Figure 2: Laser interferometry test results

P.I. is Capillary ‘Intelligence’ Unprecedented

Design A Design BReadings P.I. Design

52.6 53.325 53.8Ball size (µm)

24.41.41

Ball sheared

25.01.48

Ball sheared25

25.71.33

Ball sheared

Ball shear (gf)Standard deviationFailure mode

7.32100% Break

@ stitch

7.41100% Break

@ stitch25

7.54100% Break

@ stitch

Stitch pull (gf)Standard deviationFailure mode

Designed with Advanced Process Diagnostic Tools

Stress @Transition(x109 Pa)

Simulation 0.6632 0.5687 0.5417

Figure 3: Average results from actual bonding responses

PORTABILITY REPEATABILITY

Apr

il 20

05

ultra low loop bonding chip scale package bonding · bonding, the vibration characteristics of the...

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