tsv chip stacking meets productivity - semi.org kostner tsv chip... · tsv chip stacking meets...
TRANSCRIPT
![Page 1: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/1.jpg)
TSV CHIP STACKING MEETS PRODUCTIVITY
EUROPEAN 3D TSV SUMMIT 22-23.1.2013 GRENOBLE
HANNES KOSTNER
DIRECTOR R&D BESI AUSTRIA
![Page 2: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/2.jpg)
OVERVIEW
• Flip Chip Packaging Evolution
• The ‘Simple’ World of C4
• New Flip Chip Demands
• TCB Requirements for TSV Chip Stacking
• TCB Bonder Development
• Architectural considerations
• Innovation & Implementation
• Status and Outlook
• TCB Productivity
• Evaluations
![Page 3: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/3.jpg)
FLIP CHIP PACKAGING EVOLUTION THE ‘SIMPLE’ WORLD OF C4
![Page 4: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/4.jpg)
FLIP CHIP PACKAGING EVOLUTION NEW FLIP CHIP DEMANDS
ultra low-k wide I/O
low mechanical strength
MARKET DRIVERS
copper pillar & thin die
3D & fine pitch
integration density power consumption performance
Interconnect Technology
gradient bonding
Thermo Compression Bonding
![Page 5: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/5.jpg)
Applications
2D TC
3D TSV 2.5 & 3D
Panel
Strip
Singulated
(Boat)
Wafer
Side by Side
Stacked
2.5D TSV
TC
NCF
TC
CUF
TC
MUF
Technologies
TC
NCP
Upstream
Dispensing
Fluxing
C2S
C2C
C2W
Multi Chip
Inert
In-Situ
Dispensing
TC
The world of TC
FLIP CHIP PACKAGING EVOLUTION NEW FLIP CHIP DEMANDS
![Page 6: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/6.jpg)
Through Silicon Via‘s
Thin Die handling
Cu-Pillars & Stacking
2µm@10mm Co-Planarity
Fine Pitch
± 2µm Placement Accuracy
Insitu Soldering & Productivity Demands
200°C/s Heating & 100°C/s Cooling
I/O-Density & NCF
Bondforce ≤ 250N
FLIP CHIP PACKAGING EVOLUTION TCB REQUIREMENTS FOR TSV CHIP STACKING
Cu-Pillars & CUF
Bond Control
![Page 7: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/7.jpg)
Core Capability #1
Accuracy
Co-
Planarity
Core Capability #2
Bond
Control
Core Capability #3
TCB
TCB
3 TCB Core Capabilities
are essential for yield!
FLIP CHIP PACKAGING EVOLUTION TCB REQUIREMENTS FOR TSV CHIP STACKING
![Page 8: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/8.jpg)
TCB BONDER DEVELOPMENT ARCHITECTURAL CONSIDERATIONS
Rigid & Heavy Elastic & Lightweight
Accuracy Accurate Axis
Appropriate Alignment system
Thermal Drift Compensation
Accurate Axis
Appropriate Alignment system
Thermal Drift Compensation
Co-Planarity Rigid System Mechatronic Co-planarity
Control
Bond Control z-Stiffness Active z-Position Control
Productivity Limited by z-Stiffness & Weight
Fast Temp. Ramping
Lightweight Construction
Fast Temp. Ramping
Flexibility per footprint Architectural Limits Comparable to C4 FC Bonder
![Page 9: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/9.jpg)
Tilt due to elastic gantry deformation
Kinematic Restraint System
Mechatronics Solution
with
Coplanarity control
TCB BONDER DEVELOPMENT INNOVATION & IMPLEMENTATION – CO-PLANARITY CONTROL
![Page 10: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/10.jpg)
TCB BONDER DEVELOPMENT INNOVATION & IMPLEMENTATION – 250N BONDHEAD
![Page 11: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/11.jpg)
Heater
Tool
Chip
Heater
Tool
Chip
Cooling fluid (e.g. air)
Active Gas cooling
TCB BONDER DEVELOPMENT INNOVATION & IMPLEMENTATION
![Page 12: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/12.jpg)
Cooling ramp: -90°/sec
TCB BONDER DEVELOPMENT INNOVATION & IMPLEMENTATION
0
50
100
150
200
250
300
350
400
450
0 5 10 15 20
Tem
pera
tur
[°c
]
Time [s]
Temp P2[°C]
Temp P3[°C]
Temp P4[°C]
Temp P5[°C]
![Page 13: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/13.jpg)
0 1 2 3 4 5 t [s]
Typical TC P&P cycle (TC process time: 4s)
6 7
Phase 1:
• Bond
(TC process)
Phase 2:
• Move to rel. adjust
• Rel. Adjust
• Move to Pick
• Wait
Phase 3:
• Pick
• Move to ULC
Phase 4:
• ULC
• Move to Bond
tool temperature
221 °C
260 °C
T [°C]
180 °C 160 °C
1 2 3 4
160 °C
max cooling:
-50 °C/s
max ramping:
+100 °C/s
5.6
REL ULC MOVE MOVE MOVE MOVE WAIT Bond (TC process)
PIC
K
*) without inspections
WAIT interval
can be used
for inspection
STATUS AND OUTLOOK TCB PRODUCTIVITY - ACTUAL
![Page 14: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/14.jpg)
Phase 1:
• Bond
(TC process)
Phase 2:
• Move to rel. adjust
• Rel. Adjust
• Move to Pick
Phase 3:
• Pick
• Move to ULC
Phase 4:
• ULC
• Move to Bond
*) without
inspections
0 0.5 1 1.5 2 2.5 t [s]
tool temperature
221 °C
260 °C
T [°C]
160 °C
1 2 3 4
160 °C
max cooling:
-100 °C/s
max
ramping:
+200 °C/s
REL ULC MOVE MOVE Bond (TC process)
PIC
K
MOVE MOVE
2.5 s cyle time / b. head
based on +200/-100 °C/s
ramping
1400 UPH / bond head
Upside UPH: 2800 sprint UPH for machine
STATUS AND OUTLOOK TCB PRODUCTIVITY – UPSIDE POTENTIAL
![Page 15: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/15.jpg)
STATUS AND OUTLOOK EVALUATIONS
• 1st TC-Bonder Buyoff was very successful with first time dual head/single
pass assembly of Multi Layer TSV stacks @ 50µ die thickness
• 2nd Evaluation is ongoing
• In total we talk to 27 companies. All are decided to utilize TCB technology
sooner or later
12 OSATs
9 IDMs
2 Foundries
2 Fabless
2 Research Institutes
1 Material Supplier
![Page 16: TSV CHIP STACKING MEETS PRODUCTIVITY - SEMI.ORG Kostner TSV Chip... · tsv chip stacking meets productivity european 3d tsv summit 22-23.1.2013 grenoble hannes kostner director r&d](https://reader031.vdocuments.mx/reader031/viewer/2022013120/5aa88a877f8b9a77188babf2/html5/thumbnails/16.jpg)
SUMMARY