tom mcmullen week 3 25/2/2013 – 1/3/2013. leti wafer thinning project flow phase 1 idproject...
TRANSCRIPT
LETI WEEKLY STATUS REPORT
Tom McMullen
Week 3
25/2/2013 – 1/3/2013
LETI wafer thinning project flowPhase 1
ID Project Name Owner Days Start End 3-Feb 10-Feb 17-Feb 24-Feb 3-Mar 10-Mar 17-Mar 24-Mar 31-Mar 5-Apr 12-Apr 19-Apr 26-Apr
1.0 Thin Wafer Assemblies T. McMullen 0 1-Feb 30-Sep
Week 1 Week 2 Week 3 Week 4 Week 5 Week 6 Week 7 Week 8 Week 9
1.1
PHASE 1 - Layout and mask production, first 2 wafers with microbumps delivered to Advacam LETI - 3D 10 1-Feb 29-Mar
LETI accpets CERN proposal
1.1.1 Send gds to LETI T. McMullen 5 1-Feb 8-Feb
1.1.2Send 2 FEI4b wafers to LETI R. Bates 5 1-Feb 6-Feb
1.1.3
Confirm step size on wafer and centre ofset variation on wafer LETI 5 1-Feb 6-Feb
1.1.4Layout and mask production LETI 10 1-Feb 11-Feb
Deliverable 1: Microbumb
gds files
1.1.4
First 2 wafers with micro bumps delivered to Advacam LETI 49 12-Feb 2-Apr
Deliverable 2: First 2 wafers
with micro bumps
delivered to Advacam
Current
Deliverable
Target not met
Action ListPhase 1 and 2
Action What Who When Comment4 Top metal align key information TMcM 22/5/2003 Alignment key config taken from FEI4 CAD – now with LETI
5 CERN purcahsing info for STFC TMcM 14/2/2013 Confirmed to be ok by Richard
6 Further funding for flip-chip process Rbates\Cbuttar 31/3/2013Richard awaiting information back from Hienze regarding
this
7 Bow measurement set-up TMcM 31/2/2013 visit SMC and set up program for bow measurement
8 Sensors for flip chipping All 31/3/2013 Sensor availablilty for flip-chip process - Meeting rqd
9 Assembly probe test solution TMcM 19/3/2013 Pobe test solution for flip-chipped assemblies - yield maps
10 FEI4B probe card and probe set-up Rbates/TMcM 19/3/2013 FEI4B test solution for assembly testing yeild maps
Highlights and issues 1 Cash for flip-chip bonding
We have the funding for the thinning work with LETI but will need further funding for the flip-chip process at Advacam
Richard has contacted Heinz regarding this and awaiting feedback. Didier and Peppe have declined to contribute at this time as they have already submitted their proposals for the next 2 years
We will need this further funding by the end of phase 1 (week 9 from Gant on previous slide) to test the LETI micro-bumps
Receipt of purchase CERN feedback on receipt of purchase prior to the end of March was not possible with a DAI.
An invoice can be created using EDH and needs to be confirmed if this will suffice. Richard has confirmed with STFC that their will be no issues with a receipt of purchase prior to
the end-of-March deadline
Top Metal layer gds information is required for the alignment scheme. Richard is trying to source this information but its painfully slow and holding up progress. Deliverable 1 has been missed due to this. LETI are still confident on meeting deliverable 2 provided we get this information ASAP. Alignment key configuration taken from FEI4 and ‘instanced’ into FEI4B. 120nm offset in y-axis,
this is a little above 1% of the smallest CD of the alignment marks and should be well within alignment tolerance. Gds sent to LETI and awaiting information if it’s ok and final layout configuration.
Micro-bumps are designed and wafer mapping completed
Highlights and Issues 2 Meeting required to discuss sensor availability
for the flip-chip processAmount of sensors for flip-chipping – good statistical
analysis required for micro-bump yield. LETI input required
We will need to resolve funding for the flip-chip process prior so we know how many we can process for the whole project
FEI4b Assembly testingFEI4b probe card requiredTest equipment/apparatus requiredSemi-auto testing solution required for assemblies
Alignment key proposal
- Rectangle entourant le motif alignement grossier
- Alignement fin Croix / carré
Photos wafers
LETI wafer thinning project flowPhase 2
To be published in next report