tm - nxp semiconductors · tm freescale™ and the freescale logo aretrademarksof freescale...

27
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. LTE Layer 1 Software on the MSC8156 DSP Built on StarCore ® Technology July 2009 Vincent Martinez Baseband DSP System Engineer

Upload: lythu

Post on 16-Apr-2018

236 views

Category:

Documents


5 download

TRANSCRIPT

TM

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009.

LTE Layer 1 Software on the MSC8156 DSP Built on StarCore® Technology

July 2009

Vincent MartinezBaseband DSP System Engineer

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 2

Agenda► Introduction

• Broadband Wireless Technology Timelines• 3G Evolution – from Thin to Thick Data Pipe• Multicore DSP Roadmap based on StarCore®

► LTE standard overview• LTE overview• SC-FDMA and OFDMA• LTE L1 Channel Overview• Multi User (MU) - MIMO

► Software overview• LTE Layer 1 Software Components• Algorithms• L1 Matlab Reference Model• Uplink Processing Chain• Manager API Example• MAPLE Abstraction Layer

► Implementation proposal on MSC8156• MSC8156 device overview• Performance Analysis Methodology• Use case definition & System Architecture• Summary

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 3

Introduction

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 4

Broadband Wireless Technology Timelines

Source: Rysavy ResearchNote: Throughput rates are peak network rates. Radio channel bandwidths indicated. Dates refer to initial network deployment except 2006 which shows available technologies that year.

2006 2007 2008 2009 2010 2011

3GPP GSM EDGE Radio Access Network Evolution

EDGEDL: 474 kbpsUL: 474 kpbs

Evolved EDGEDL: 1.1 MbpsUL: 947 kbps

3GPP UMTS Radio Access Network Evolution

HSDPA/HSUPADL: 14.4 MbpsUL: 5.76 Mbps

in 5 MHz

HSDPADL: 14.4 MbpsUL: 384 kbps

in 5 MHz

Rel 7 HSPA+DL: 28 Mbps

UL: 11.5 Mbpsin 5 Mhz

Rel 8 HSPA+DL: 42 Mbps

UL: 11.5 Mbpsin 5 Mhz

LTE 4X4 MIMODL: 326 MbpsUL: 86 Mbps

in 20 MHz

LTE 2X2 MIMODL: 173 MbpsUL: 58 Mbps

in 20 MHz

3GPP Long Term Evolution

Mobile WiMAX Evolution Fixed WiMAX

Wave 1DL: 23 MbpsUL: 4 Mbps

10 MHz 3:1 TDD

Wave 2DL: 46 MbpsUL: 4 Mbps

10 MHz 3:1 TDD

IEEE 802.16m

CDMA2000 EvolutionUMB 4X4 MIMODL: 280 MbpsUL: 68 Mbps

in 20 MHz

UMB 2X2 MIMODL: 140 MbpsUL: 34 Mbps

in 20 MHz

EV-DO Rev BDL: 14.7 MbpsUL: 4.9 Mbps

in 5 MHz

EV-DO Rev ADL: 3.1 MbpsUL: 1.8 Mbpsin 1.25 MHz

EV-DO Rev 0DL: 2.4 MbpsUL: 153 kbpsin 1.25 MHz

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 5

3G Evolution – from Thin to Thick Data Pipe

► Increasing flexibility for data rates and bandwidth► Algorithm differentiation and flexibility require high-performance

multicore DSPs for programmability combined with integrated or attached accelerators for cost and power efficiency

3G LTE Significantly Outperforms 3G Standards

WCDMA0.5 Mbpsat 5MHz

HSDPAUp to

14 Mbps DLat 5MHz

HSPA+Up to

42 Mbps DLat 5MHzHSUPA

Up to 5 Mbps UL

at 5Mhz

3G-LTE300+ Mbps DL

at 20 MHz

2003 – 2004 2005 – 2006 2007 – 2008 2009 – 2010 2011 – 2012

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 6

MSC8122

MSC8112/3

Perf

orm

ance

2006 – 2007 2008 20092004 – 2005

Multicore DSP Roadmap based on StarCore®

Binary Code Compatible

► Quad core► 500-MHz SC140► 8 (16-bit)

GMACs► 1.4Mbyte RAM► 90nm

MSC8126

► Quad core► 500-MHz SC140► 8 (16-bit) GMACs► Integrated Turbo

& Viterbi COPs► 1.4 Mbyte RAM► Ethernet, Serial► 90nm

MSBA8100 ► Multicore DSP SoCs► Next generation

StarCore Core► Positioned for 3G-

LTE, TDD-LTE, WiMAX, TD-SCDMA, 3GPP, 3GPP2

► Next generation process technology

MSC8156 FutureStarCore DSP

Enabled

► Accelerator device for 3G-LTE, TDD-LTE, WiMAX, TD-SCDMA, 3GPP, 3GPP2

► Turbo, Viterbi, FFT, DFT

► 512 KB internal RAM► DDR2► PCI► Dual Serial RapidIO™

ports x4 (3.125 Gbaud)► Companion for

MSC8144► 90nm

► Quad core► 1-GHz SC3400 cores► 16 (16-bit) GMACs► 10.5 Mbyte RAM► Dual 1G Ethernet (SGMII)► ATM/Utopia► Integrated Security Accel.► Serial RapidIO™ port x4

(3.125 Gbaud)► 90nm

MSC8144/E

MSC81xx

Future

Sampling

Alpha Sampling

Production

► Tri & Dual core► 400/300-MHz SC140

Starcore cores► 8 (16-bit) GMACs► 1.4Mbyte RAM► 90nm► 2008 intro

Enabled with AdvancedBaseBand

Accelerators

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 7

LTE standard overview

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 8

LTE overview

►LTE facts

3GPP LTE (ongoing) WiMAX 802.16e

Base standard Currently v8.5.0 IEEE® 802.16e-2005

Duplex method FDD/TDD TDD (FDD optional)

Downlink OFDMA OFDMA

Uplink SC-FDMA OFDMA

Channel BW (MHz) 1.25, 2.5, 5, 10,15, 20 5, 7, 8.75, 10 (1.25~20 opt)

Frame size 10 ms TDD 5 ms TDD

Modulation DL QPSK/16QAM/64QAM QPSK/16QAM/64QAM

Modulation UL QPSK/16QAM/64QAM QPSK/16QAM

Channel Coding DL Turbo / CC Turbo / CC

Channel Coding UL Turbo / CC Turbo / CC

Throughput (DL/UL) 100/50 Mbps (20 MHz) ~40 shared (10 MHz, TDD)

HARQ Incremental redundancy Chase combining

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 9

Single Carrier FDMA (SC-FDMA) and OFDMA

► The symbol mapping in OFDM happens in the frequency domain.

► In SC-FDMA, the symbol mapping is done in the time domain.

► Appropriate subcarrier mapping in the frequency domain allows control of the PAPR

► SC-FDMA enables frequency domain equalizer approaches like OFDMA

S/P

X(k) x(n)

CyclicPrefix

Frequency Domain Time Domain

IFFT P/S

SubcarrierMapping

X(k)x(n)

CyclicPrefix

Frequency Domain

Time Domain

IFFT P/SDFT

Time Domain

OFDMA(downlink)

SC-FDMA(uplink)

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 10

LTE L1 Channel Overview

DL

UL

Data ControlDL-SCH PCH BCH MCH

PDSCH PBCH PMCH

CFI HI DCI

PHICH PDCCHPCFICH

UL-SCH RACH

PUSCH PRACH

UCI

PUCCH

Transport ChannelsPhysical Channels

Dir Transport Channel

Physical Channel

Usage Coding

DL DL-SCH PDSCH DL data channel Turbo 1/3

PCH PDSCH Paging channel for call initialization

Turbo 1/3

BCH PBCH Broadcast channel for general cell information

Conv. 1/3

MCH PMCH Multicase channel Turbo 1/3

CFI PCFICH Control format indicator, encodes the number of DL-CCH OFDMA symbols

Block Code 1/16

HI PHICH HARQ feedback channel

Repet. 1/3

DCI PDCCH DL control channel with subframe scheduling information

Conv. 1/3

UL UL-SCH PUSCH UL data channel Turbo 1/3

RACH PRACH Random access channel for UE connection init

64 ZC signatures

UCI PUCCH UL control channel for CQI and HARQ feedback

Reed Muller encoding

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 11

Multi User (MU) – MIMO

► LTE Uplink: classic SIMO or MU-MIMO for enhanced data rates

► MU-MIMO: several users are transmitting data simultaneously onto the same frequencies.

► MIMO Decoder: Tx users streams demultiplexed at Equalization stage. Equalization based on MMSE, IRC or iterative cancellations (SIC)

Tx Rx

Channel

sisoh

SISO/SIMO: (1xM)

MIMO: (2xM)

Tx1

Tx2

1x

2x

1y

2y

my

11h

12h

mh2

Rx1

Rx2

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 12

Software Overview

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 13

LTE Layer 1 Software Components► Application Layer: Integration and

application scheduler functionality.► LTE Library: The OS independent

implementation of the LTE Layer1 functionality.

► Multicore Framework: Responsible for memory management, multicore communication and low level resource scheduling.

► MAPLE Abstraction Layer: Thin layer to abstract OS implementation details for controling the MAPLE HW accelerator. (Multi Accelerator Platform for BaseBand, details in next slides)

► Coherency Abstraction Layer: Function library with services to handle the coherency management.

► IF1 and IF4 interfaces: Cover the protocol and LTE specific aspects of the interface with PQ and FPGA.

► Operating System: Operating system services and driver level support for device peripheral access.

Application Layer

Framework

IF1

LTESP LibIF4

MAPLEAbstraction

SoftwareCoherencyAbstraction

Operating System

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 14

L1 Matlab Reference Model

► Maintaining LTE Matlab model for fast algorithm validation

Channel estimator MIMO detector Equalization Modulation Demapper HARQ Combining

► Matlab model also serves as Golden Reference DSP C code included through MEX files Ability to generate test vectors

► High simulation speed• Between 10 kbps to 150 kbps

real time speed depending on config

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 15

Uplink Processing Chain

CP Removal FFT Guard Removal Ref Vec Correlation IDFT User Path Separation DFT

SNR estimationMatrix interpolationMMSE EqualizationIDFTDemodMappingDeScrambling

Chnl De-Interleav. DC Demux Code Block Deconcatenation

Sub-block De-interlSoft Combining Turbo Decoding CB CRC Check

CB DeSegmentationTB CRC Check

CP Removal FFT Guard Removal Ref Vec Correlation IDFT User Path Separation DFT

RxAnt0

RxAnt1

IDFTDemodMappingDeScrambling

Chnl De-Interleav. DC Demux Code Block Deconcatenation

Soft Combining Turbo Decoding CB CRC Check

.

.

.

.

Soft Combining Turbo Decoding CB CRC Check

CB DeSegmentationTB CRC Check

Soft Combining Turbo Decoding CB CRC Check

SBL1_PHULSPM_RSP

SBL1_PHULSPM_PRB

SBL1_PHULSPM_VRB

SBL1_PHULSPM_DCdemux

SBL1_PHULSPM_CBP

SBL1_PHULSPM_TBP

Sub-block De-interl

Sub-block De-interl

Sub-block De-interl

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 16

Application Layer

Framework

IF1

LTESP LibIF4

MAPLEAbstraction

SoftwareCoherencyAbstraction

Operating System

Manager API ExampleINT32 SBL1_PHULSPM_PRB(

SPM_PRB_DYNAMIC_T *spm_prb_dynamic,void *spm_prb_static,SPM_PRB_CTRL_DYNAMIC_T *spm_prb_ctrl_dynamic,SYS_CONFIG_T *sys_config,SWC_T *swc_handler,type_dftpe_mal maple_handler)

(1) SPM_PRB_DYNAMIC_T•pointers to the buffers specific to the current manager call instance.

(2) SPM_PRB_STATIC_T•pointers to the buffers common to all the instances of this manager.

(3) SPM_PRB_CTRL_DYNAMIC_T•control parameters that are specific to the current manager call instance (the number of allocations, number of codeblocks…)

(4) SYS_CONFIG_T•system configuration parameter information, setup at system initiation (sector bandwidth, the number of antennas, etc.)

(5) SWC_T•pointers to the software coherency functions (cache flush and cache invalidate).

(6) type_dftpe_mal•pointers to the Maple abstraction function for IDFT / DFT / TurboDecoder / ViterbiDecoder

6 5

432

1

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 17

MAPLE Abstraction Layer► MAPLE Abstraction Layer (MAL) is responsible

for the encapsulation of the MAPLE interaction based on SDOS drivers.

► The goal is to keep the SP Lib independent of the underlaying OS while allowing a close integration of the MAPLE accelerator in the processing chains

► MAL API covers:• MAPLE init functionality for LTE mode• FFTPE, DFTPE and TVPE drivers

configured for LTE operation• Callback functions

Master Slave PE

Dispatch & post msg

Get msg &FMWK sched

Manager execution

Idle: Mape AbstractionPolling mechanism

PE execution

Manager execution

FMWK sched &Post msg #0

Master Slave PE

Dispatch & post msg

Get msg &FMWK sched

Manager execution

PE executionManager executionFMWK sched

ISR post msg #1

FMWK sched &Post msg #0

Blocking Non-BlockingMAPLE

Call BackProcess

L1 SW Manager

MAPLE Drivers

MAPLE Feedback

Application layer

SPKernal 2

MAPLE Abstraction

SPKernal 1

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 18

Implementation Proposal on MSC8156

TMFreescale Semiconductor Proprietary Information. Freescale™ and the Freescale logo are trademarksof Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. 19

MSC8156E – Broadband Wireless DSP • 6 SC3850 Cores Subsystems (up to 6GHz/48GMACS) each

with:• SC3850 DSP core at up to 1GHz (8GMACs 16b or 8b)• 512 Kbyte unified L2 cache / M2 memory. • 32 Kbyte I-cache, 32Kbyte D-cache, WBB, WTB, MMU, PIC

• Internal/External Memories/Caches• 1056 KByte M3 shared memory (SRAM)• Two DDR 2/3 64-bit SDRAM interfaces at up to 800 MHz

• CLASS – Chip-Level Arbitration & Switching Fabric• Non-Blocking, fully pipelined, low latency• Full fabric 12 masters to 8 slaves, up to 512 Gbps throughput

• MAPLE-B – Baseband Accelerator• Turbo/Viterbi Decoder up to 160/115 Mbps, supporting: 3G-

LTE, 802.16, 3G, CDMA2K standards• FFT/DFT accelerator up to 280/180 Msps DFT

• Security Engine (Talitos 3.1)• Data and Code Protection (AES, SHA, Kasumi, SNOW3G)

• High Speed Interconnects• Dual 4x/1x Serial RapidIO at 1.25/2.5/3.125 Gbaud• PCI-e 4x/1x

• Dual RISC QUICCEngine® supporting• Dual SGMII/RGMII Gigabit Ethernet ports • Eth. L1 Protocols, Talitos control and sRIO offload

• TDM Highway• 1024 ch., 400Mbps, divided into 4 ports of 256

• DMA Engine 16 bi-directional channels w/ external req/ack • 8 hardware semaphores• Other Peripheral Interfaces

• SPI, UART, I2C, 32 GPIO, 16 Timers, 96KB boot ROM, JTAG/SAP, 8 WDT

• Technology• 45nm SOI, 1V core, 2.5, 1.8/1.5V I/O• FCBPGA (29x29) 1mm pitch, RoHS

SharedMemory1056 KB

DDR 2/3 Memory

Controller

CLASS – Non-Blocking Switch Fabric

6 cores

H/W Semaphores

I²C, UART, GPIOs

CLASS –

Non-B

locking Switch Fabric

CLASS –

Non-B

locking Switch Fabric

DMA Engine

MAPLE-BBasebandAccelerator

SerDes x4

On-Chip Network

2x SRIO 4x/1x,1x PCIe 4x/1x

2x Gigabit Ethernet, SPI

SecurityProcessing

Engine

SerDes x4

SC3850 core

32KB L1I-Cache

32KB L1D-Cache

512KB Unified M2/L2

TDM Highway4 ports

DDR 2/3 Memory

Controller

Alpha Sampling Now

SC3850 core

32KB L1I-Cache

32KB L1D-Cache

512KB Unified M2/L2

SC3850 core

32KB L1I-Cache

32KB L1D-Cache

512KB Unified M2/L2

SC3850 core

32KB L1I-Cache

32KB L1D-Cache

512KB Unified M2/L2

SC3850 core

32KB L1I-Cache

32KB L1D-Cache

512KB Unified M2/L2

SC3850 core

32KB L1I-Cache

32KB L1D-Cache

512KB Unified M2/L2

TMFreescale Semiconductor Proprietary Information. Freescale™ and the Freescale logo are trademarksof Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. 20

MSC8156 MAPLE-B Throughput & Compliance DataTechnology Accel. Standard Compliance Data Rates Comments3G-LTE, TDD-LTE

Turbo 3G-LTE (Evolved UTRA) turbo decoding as specified in 3GPP TS 36.212, section 5.1.2.2

up to 160 Mbps (8 iterations)up to 200 Mbps (6 iterations)

Max Log Map or Linear Log Map (MAX*)Support Rate-De-Matching (sub-block de-interleaving and de-interlacing)CRC calculation

Viterbi 3G-LTE (Evolved UTRA) channel decoding as specified in 3GPP TS 36.212, section 5.1.2.1

up to 100 Mbps (K=7 with tail biting) Multi-iteration decoding

FFT/DFT FFT sizes - 128, 256, 512, 1024, 2048 pointsDFT sizes - Variable lengths DFT/IDFT processing of the form 2k·3m·5n·12, up to 1536 points

FFT – up to 280 Mega samples/secDFT – up to 175 Mega samples/sec

Advanced scaling optionsGuard bands insertion in iFFT

CRC Transport and Code Block CRC for UL and DL up to 12 Gbps CRC check or insertion

WiMAX Turbo WiMAX OFDMA turbo decoding as specified in IEEE® 802.16™-2005 standard

up to 156 Mbps (8 iterations)up to 195 Mbps (6 iterations)

Max Log Map or Linear Log Map (MAX*)Support Rate-De-Matching (sub-block de-interleaving and de-interlacing)

Viterbi WiMAX OFDMA turbo decoding as specified in IEEE® 802.16™-2005 standard

up to 100 Mbps (K=7 with tail biting) Multi-iteration decoding

FFT FFT sizes - 128, 256, 512, 1024, 2048 points FFT2048 – up to 280 Mega samples/secFFT1024 – up to 350 Mega samples/sec

Advanced scaling optionsGuard bands insertion in iFFT

CRC PHY Burst CRC for UL and DL up to 12 Gbps CRC check or insertion

HSPA+ Turbo 3GPP turbo decoding as specified in 3GPP TS 25.212, section 4.2.3.2.

up to 131 Mbps (8 iterations)up to 165 Mbps (6 iterations)

Max Log Map or Linear Log Map (MAX*)Support EDCH Rate De-Matching

Viterbi 3GPP viterbi decoding as specified in 3GPP TS 25.212, section 4.2.3.1.

up to 115 Mbps (K=9 zero tail)

ProgrammingModel

ALL Buffer descriptors paradigm for allocation of data and control parametersSharing of MAPLE-B modules in multiple devices using SRIO‘GO’ command activation, no DSP core pre-processing or intervention are required

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 21

Performance Analysis Methodology

Development steps used to perform capacity analysis on MSC8156:

1. 3GPP LTE standards detailed analysis2. LTE Matlab Model:

• Validation of full LTE chain functionality, uplink and downlink• Research, development and performance validation of algorithms (Channel Estimation,

MIMO Equalizer, RACH, HARQ Combining)3. StarCore C code implementation

• Code generation• Fixed point validation, feeding code back in Matlab with mexfiles• Target cycles measurements on MSC8156 simulator and ADS boards • Code optimization

4. Real time integration• Integration of all LTE Layer 1 Software Components• Validation of real time throughput and latency

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 22

Port 0

DDR

DDR2/DDR3

FLASH

CPRI-sRIO

Bridge

GbE

QorIQ

GbE PHY

GbEGbE

LBsRIO

Port 1

PHY

Ant.

Bac

k Pl

ane

Use case definition & System Architecture

4x

4x

4x

sRIOSwitch

DD

R

DD

R2

GbEGbE

sRIO

DD

R

DD

R2

GbEGbE

sRIO

MSC8156

DSP

MSC8156

DSP

sRIO

sRIO

LTE - FDD: • 20 MHz• 4x4 MIMO DL, up to 300 Mbps • 2x4 MIMO UL, MMSE MIMO Equalizer, up to 150 Mbps• 1 device DL, 1 device UL (+remote TVPE of DL device)• 1 master core per device for I/O and application scheduling

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 23

Port 0

DDR

DDR2/DDR3

FLASH

CPRI-sRIO

Bridge

GbE

QorIQ

GbE PHY

GbEGbE

LBsRIO

Port 1

PHY

Ant.

Bac

k Pl

ane

Use case definition & System Architecture

4x

4x

4x

sRIOSwitch

DD

R

DD

R2

GbEGbE

sRIO

DD

R

DD

R2

GbEGbE

sRIO

MSC8156

DSP

MSC8156

DSP

sRIO

sRIO

LTE - FDD: • 20 MHz• 4x4 MIMO DL, up to 300 Mbps • 2x4 MIMO UL, MMSE MIMO Equalizer, up to 150 Mbps• 1 device DL, 1 device UL (+remote TVPE of DL device)• 1 master core per device for I/O and application scheduling

DL Device:Cores: From transport block encoding down to

physical channel MappingMaple: IFFT

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 24

Port 0

DDR

DDR2/DDR3

FLASH

CPRI-sRIO

Bridge

GbE

QorIQ

GbE PHY

GbEGbE

LBsRIO

Port 1

PHY

Ant.

Bac

k Pl

ane

Use case definition & System Architecture

4x

4x

4x

sRIOSwitch

DD

R

DD

R2

GbEGbE

sRIO

DD

R

DD

R2

GbEGbE

sRIO

MSC8156

DSP

MSC8156

DSP

sRIO

sRIO

LTE - FDD: • 20 MHz• 4x4 MIMO DL, up to 300 Mbps • 2x4 MIMO UL, MMSE MIMO Equalizer, up to 150 Mbps• 1 device DL, 1 device UL (+remote TVPE of DL device)• 1 master core per device for I/O and application scheduling

UL Device:Cores: Channel estimation,

MIMO Detector,Equalization,LLR calculation.

Maple: FFT, IDFT, Turbo Dec.

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 25

Summary

►LTE standard designed for high throughput with 4x4 MIMO OFDMA in Downlink and 2x4 MIMO SC-FDMA in Uplink. Real challenge for:

• High signal processing complexity for advanced algorithms• Complex system SW architecture in multicore environment• Very high data rates and low latency systems

►Freescale LTE Layer1 enablement software components include • Advanced Signal Processing library with key algorithms• a Multicore Framework• all needed application & abstraction layers for a smooth integration

►Freescale DSP MSC8156: The MAPLE-B baseband accelerator together with the advanced StarCore cores provides key factor for current and future BaseBand systems design with very high data throughput and low latency requirements

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. 26

Q&A

►Thank you for attending this presentation. We’ll now take a few moments to review the audience questions, and then we’ll begin the question and answer session.

26

TM