tiny package, high efficiency, step-up dc/dc converter€¦ · 11/12/2020 · 980k/1m + l1 3.3 to...

ZCC9266

1ZCC9266-06 June 2009

Featuresl 1.0V Low Start-up Input Voltagel High Supply Capability to Deliver 3.3V 100mA with

1 Alkaline Celll 17µA Quiescent (Switch-off) Supply Currentl Zero Shutdown Mode Supply Currentl 90% Efficiencyl 450kHz Fixed Switching Frequencyl Providing Flexibility for Using Internal and External

Power Switchesl Small SOT-26 & SOT89-5 Package

Pin Configurations

Applicationsl PDAl DSCl LCD Panell RF-Tagsl MP3l Portable Instrumentl Wireless Equipment

Tiny Package, High Efficiency, Step-up DC/DC Converter

Ordering Information

General DescriptionThe ZCC9266 is a compact, high efficiency, and low voltagestep-up DC/DC converter with an Adaptive Current ModePWM control loop, includes an error amplifier, rampgenerator, comparator, switch pass element and driverin which providing a stable and high efficient operationover a wide range of load currents. It operates in stablewaveforms without external compensation.

The low start-up input voltage below 1V makes ZCC9266suitable for 1 to 4 battery cells applications of providingup to 300mA output current. The 450kHz high switchingrate minimized the size of external components. Besides,the 17µA low quiescent current together with highefficiency maintains long battery lifetime.

The output voltage is set with two external resistors. Bothinternal 2A switch and driver for driving external powerdevices (NMOS or NPN) are provided.

(TOP VIEW)

SOT-26

Marking InformationFor marking information, contact our sales representativedirectly or through a distributor located in yourarea, otherwise visit our website for detail.

ZCC9266

Package TypeE : SOT-26X5 : SOT-89-5

Operating Temperature RangeC : Commercial StandardP : Pb Free with Commercial Standard

4

2

3

5

61CE

EXT

GND LX

VDD

FB

CE VDD FB

LXGND

1 2 3

45

SOT-89-5

www.zcc-china.com

zcc-china

ZCC-ChinaZCC-ChinaZCC-ChinaZCC-China MicroneMicroneMicroneMicrone ElectronicElectronicElectronicElectronic Co.,LtdCo.,LtdCo.,LtdCo.,Ltd ((((至诚微电子((((无锡))))有限公司))))

2

Typical Application Circuit

Figure 1. ZCC9266 Typical Application for Portable Instruments

Figure 2. High Voltage Applications

VDD

CE

EXT

GND

LX

FB

ZCC9266

CVDD1uF

R1860k/620k

R2100k

L1

4.7uHVIN

D1

1N5819C4100uF

+RVDD100

Q1N MOS

C30.1uF

C21uF

+

C1100uF

12V/9V300mA

RM0.22

3.1V to 5V for 12V2.8V to 5V for 9V

VDD

CE

EXT GND

LX

FB

C21uF

R11.6M/3M

R2980k/1M

+

L1

3.3 to 10 uHVIN

D1

1N5819VOUT3.3V/5V

C3100uF

C1100uF

+

ZCC9266

ZCC9266-06 June 2009 www.zcc-china.com

ZCC9266

ZCC9266


3

Figure 3. ZCC9266 for Higher Current Applications

Figure 4. ZCC9266 for Multi-Output Applications

VDD

CE EXT

GND

LX

FB

ZCC9266

C21uF

R11.6M/3M

R2980k/1M

+

L1

3.3 to 10 uHVIN

D1

1N5819

VOUT3.3V/5VC3

100uF

C1100uF

+

Q1N MOS

VDD

CE

EXTGND

LX

FBZCC9266

C21uF

R1620k

R2100k

L1

4.7uHVIN

R3100

Q1

N MOSC71uF

C510uF

C60.1uF

C81uF

C410uF

C310uF

C11uF

VOUT2+18V10mA

VOUT1+9V10mA

VOUT3-9V10mA

3.3V/5V


ZCC9266ZCC-ChinaZCC-ChinaZCC-ChinaZCC-China MicroneMicroneMicroneMicrone ElectronicElectronicElectronicElectronic Co.,LtdCo.,LtdCo.,LtdCo.,Ltd ((((至诚微电子((((无锡))))有限公司))))

4

Pin No.

ZCC9266CX5 ZCC9266CE Pin Name Pin Function

1 1 CE Chip enable ZCC9266 gets into shutdown mode when CE pin set to low.

-- 2 EXT Output pin for driving external NMOS

5 3 GND Ground

4 4 LX Pin for switching

2 5 VDD Input positive power pin of ZCC9266

3 6 FB Feedback input pin Internal reference voltage for the error amplifier is 1.25V.

Function Block Diagram

Functional Pin Description

Test Circuit

+-

Loop Control Circuit1.25V

VDD

R2

Q2N MOS

CE

FB Q1N MOS

R1

LX

Shut Down

Over Temp.Detector

VDD ZCC9266EXT

GND

VDD

CE

EXT GND

LX

FB

ZCC9266

C21uF

R11.6M/3M

R2980k/1M

L1

10uHVIN

D1

1N5819

VOUT3.3V/5V

C3100uF

C4102

A I (VDD)

A +

I (VIN)

+

C1100uF

C5106



5

Absolute Maximum Ratings

Electrical Characteristics

l Supply Voltage --------------------------------------------------------------------------------------------------- −0.3V to 7Vl LX Pin Switch Voltage ------------------------------------------------------------------------------------------ −0.3V to 7Vl Other I/O Pin Voltages ----------------------------------------------------------------------------------------- −0.3V to (VDD + 0.3V)l LX Pin Switch Current ------------------------------------------------------------------------------------------2.5Al EXT Pin Driver Current -----------------------------------------------------------------------------------------200mAl Package Thermal Resistance

SOT-26, θJC -------------------------------------------------------------------------------------------------------145 °C/WSOT-89-5, θJC ----------------------------------------------------------------------------------------------------45 °C/W

l Operating Junction Temperature ----------------------------------------------------------------------------125 °Cl Storage Temperature Range---------------------------------------------------------------------------------- −65°C to +150°C

(VIN = 1.5V, VDD set to 3.3V, Load Current = 0, TA = 25°C, unless otherwise specified)

NOTE:Absolute Maximum ratings are threshold limit values that must not be exceeded even for an instant under any conditions.Moreover, such values for any two items must not be reached simultaneously. Operation above these absolute maximumratings may cause degradation or permanent damage to the device. These are stress ratings only and do not necessarilyimply functional operation below these limits

Parameter Symbol Test Conditions Min Typ Max Units

Start-UP Voltage VST IL = 1mA -- 0.98 1.05 V

Operating VDD Range VDD VDD pin voltage 2 -- 6 V

Shutdown Current I (VIN) IOFF CE Pin = 0V, VIN = 4.5V -- 0.01 1 µA

Switch-off Current I (VDD) ISWITCH OFF VIN = 6V -- 17 25 µA

Continuous Switching Current ISWITCH VIN = CE= 3.3V, VFB = GND 0.4 0.55 0.7 mA

No Load Current I (VIN) INO LOAD VIN = 1.5V, VOUT = 3.3V -- 75* -- µA

Feedback Reference Voltage VREF Close Loop, VDD = 3.3V 1.225 1.25 1.275 V

Switching Frequency FS VDD = 3.3V 425 500 575 kHz

Maximum Duty DMAX VDD = 3.3V 85 95 -- %

LX ON Resistance VDD = 3.3V -- 0.3 1.1 Ω

Current Limit Setting ILIMIT VDD = 3.3V 1.6 2 2.6** A

EXT ON Resistance to VDD VDD = 3.3V -- 5 8.5 Ω

EXT ON Resistance to GND VDD = 3.3V -- 5 8.5 Ω Line Regulation ∆VLINE VIN = 3.5 ~ 6V, IL = 1mA -- 1.5 10 mV/V

Load Regulation ∆VLOAD VIN = 2.5V, IL = 1 ~ 100mA -- 0.25*** -- mV/mA

CE Pin Trip Level VDD = 3.3V 0.4 0.8 1.2 V

Temperature Stability for Vout TS -- 50 -- ppm/°C

Thermal Shutdown Hysterises ∆TSD -- 10 -- °C



6

Note :

* No Load Current is highly dependent on practical system design and component selection that cannot be covered by production

testing. Typical No Load Current is verified by typical application circuit with recommended components. No Load Current

performance is guaranteed by Switch Off Current and Continuous Switching Current.

** Current Limit is guaranteed by design at TA = 25°C.

***Load Regulation is not tested at production due to practical instrument limitation. Load Regulation performance is dominantly

dependent on DC loop gain and LX ON Resistance that are guaranteed by “Line Regulation” and “LX ON Resistance” tests in

production.



7

Typical Operating Characteristics (Refer to Test Circuit)

Efficiency vs. Output Current

0.1 1 10 100 1000Output Current (mA)

Effi

cien

cy (%

)

95

90

85

80

75

70

VOUT = 3.3V, TA = 25°C

VIN = 3.0V

VIN = 2.5V

VIN = 2.0V

VIN = 1.5V

VIN = 1.0V

Supply Current I(VIN) vs. Input Voltage

30

40

50

60

70

80

90

1.5 2 2.5 3 3.5Input Voltage (V)

Sup

ply

Cur

rent

( A

)

VOUT = 3.3V @ no load

µ

Supply Current I(VIN) vs. Input Voltage

0

30

60

90

120

150

180

1.5 2.0 2.5 3.0 3.5 4.0 4.5Input Voltage (V)

Sup

ply

Cur

rent

( A

)1

VOUT = 5V @ no load

µ

Input Current I(VDD) vs. Input Voltage

15

16

17

18

19

20

21

2.5 3.0 3.5 4.0 4.5 5.0

Input Voltage (V)

Inpu

t Cur

rent

( A

)

VOUT = 5V @ no load

µ

Efficiency vs. Output Current

000 001 010 100 1000Output Current (mA)

Effi

cien

cy (%

)

95

90

85

80

75

70

VOUT = 5V, TA = 25°C

VIN = 4.0VVIN = 3.5VVIN = 3.0VVIN = 2.5VVIN = 2.0V

VIN = 1.5V

Input Current I(VDD) vs. Output Current

0

50

100

150

200

250

0.01 0.1 1 10 100 1000Output Current (mA)

Inpu

t Cur

rent

( A

)

VIN = 3V, VOUT = 5V

µ


ZCC9266

9


8

VIN = 2V, VOUT = 3.3V @ 200mA

Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)

LX Pin Wave Form & Output Ripple

VIN = 1V, VOUT = 3.3V @ 100mA


Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)


VIN = 1V, VOUT = 3.3V @ 10mA

Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)

VIN = 2V, VOUT = 3.3V @ 10mA

Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)


Start Up Voltage vs. Output Current

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 30 60 90 120 150 180 210Output Current (mA)

Sta

rt U

p V

olta

ge (V

)

VOUT = 3.3V

(In C.R. mode)

Swichting Frequency vs. VDD Pin Voltage

100

200

300

400

500

600

0 1 2 3 4 5 6

VDD Pin Voltage (V)

Sw

itchi

ng R

ate

Freq

uenc

y (K

Hz)

. VIN = 2.4V to 2.8V

VIN = 1.2V to 2.2V

VIN = 3V to 5.6V

Sw

itchi

ng F

requ

ency

(kH

z)

Switching Frequency



9

VIN = 3V, VOUT = 3.3V @ 200mA

Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)


VIN = 2V, VOUT = 5V @ 200mA

Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)



Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)



Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)



Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)


VIN = 3V, VOUT = 3.3V @ 10mA

Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)




10

VIN = 4.5V, VOUT = 5V @ 200mA

Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)


VIN = 4.5V, VOUT = 5V @ 20mA

Out

put R

ippl

e L

X W

ave

Form

Time (1µs/Div)


VIN = 3V, VOUT = 3.3V

IOUT = 10mA 200mA

Time (50µs/Div)

Transient ResponseO

utpu

t Tra

nsie

nt V

olta

ge

Out

put T

rans

ient

Vol

tage

Time (50µs/Div)

Transient Response VIN = 2V, VOUT = 3.3V

IOUT = 10mA 200mA

Time (50µs/Div)

Transient Response

VIN = 4.5V, VOUT = 5V

IOUT = 10mA 200mA

Out

put T

rans

ient

Vol

tage

Time (50µs/Div)

Transient Response

VIN = 3V, VOUT = 5V

IOUT = 10mA 200mA

Out

put T

rans

ient

Vol

tage



11

Output Voltage vs. Temperature

4.84

4.86

4.88

4.9

4.92

4.94

4.96

4.98

5

-40 -10 20 50 80 110 140

Temperature

Out

put V

olta

ge(V

)

VIN = 3V, VOUT = 5V, IOUT = 100mA

(°C)

Output Voltage vs. Temperature

3.2

3.22

3.24

3.26

3.28

3.3

3.32

3.34

-40 -10 20 50 80 110 140

Temperature

Out

put V

olta

ge(V

)

VIN = 1.8V, VOUT = 3.3V, IOUT = 100mA

(°C)



12

Application Information

Output Voltage Setting

Referring to Typical Application Circuits, the outputvoltage of the switching regulator (VOUT) can be set withEq.1.

Feedback Loop Design

Referring to Typical Application Circuits. The selectionof R1 and R2 based on the trade-off between quiescentcurrent consumption and interference immunity is statedbelow:

l Follow Eq.1

l Higher R reduces the quiescent current (Path current= 1.25V/R2), however resistors beyond 5MΩ are notrecommended.

l Lower R gives better noise immunity, and is lesssensitive to interference, layout parasitics, FB nodeleakage, and improper probing to FB pins.

l A proper value of feed forward capacitor parallel withR1 can improve the noise immunity of the feedbackloops, especially in an improper layout. An empiricalsuggestion is around 0~33pF for feedback resistors ofMΩ, and 10nF~0.1µF for feedback resistors of tens tohundreds KΩ.

For applications without standby or suspend modes,lower values of R1 and R2 are preferred. For applicationsconcerning the current consumption in standby orsuspend modes, the higher values of R1 and R2 areneeded. Such “high impedance feedback loops” aresensitive to any interference, which require careful layoutand avoid any interference, e.g. probing to FB pin.

Prober ParasiticsFB Pin

R1

R2

VOUT

_Q+

Layout Guidel A full GND plane without gap break.

l VDD to GND noise bypass − Short and wide connectionfor the 1µF MLCC capacitor between Pin5 and Pin3.

l VIN to GND noise bypass − Add a capacitor close to L1inductor, when VIN is not an idea voltage source.

l Minimized FB node copper area and keep far awayfrom noise sources.

l Minimized parasitic capacitance connecting to LX andEXT nodes, which may cause additional switching loss.

Board Layout Example (2-Layer Board)

(Refer to Typical Application Circuits Figure 2 for theboard)

- Top Layer -

- Bottom Layer -

×OUTR1

V = ( 1+ ) 1.25VR2

Eq.1



ZCC9266

13

Outline Dimension

AA1

e

b

B

D

C

H

L

SOT- 26 Surface Mount Package

Dimensions In Millimeters Dimensions In Inches Symbol

Min Max Min Max

A 0.889 1.295 0.035 0.051

A1 0.000 0.152 0.000 0.006

B 1.397 1.803 0.055 0.071

b 0.250 0.559 0.010 0.022

C 2.591 2.997 0.102 0.118

D 2.692 3.099 0.106 0.122

e 0.838 1.041 0.033 0.041

H 0.080 0.254 0.003 0.010

L 0.300 0.610 0.012 0.024



ZCC9266

14

A

A

He e

b b1 b

D

C B

C1

D1b1

Dimensions In Millimeters Dimensions In Inches Symbol

Min Max Min Max

A 1.400 1.600 0.055 0.063

b 0.360 0.520 0.014 0.020

B 2.400 2.600 0.094 0.102

b1 0.406 0.533 0.016 0.021

C -- 4.250 -- 0.167

C1 0.800 -- 0.031 --

D 4.400 4.600 0.173 0.181

D1 -- 1.700 -- 0.067

e 1.400 1.600 0.055 0.063

H 0.380 0.430 0.014 0.017

5-Lead SOT-89 Surface Mount Package



tiny package, high efficiency, step-up dc/dc converter€¦ · 11/12/2020 · 980k/1m + l1 3.3 to...

Documents