therm-jett - v4 - ss

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•Advanced Thermal Solutions | 89-27 Access Road, Norwood, MA 02062 | 781-769-2800 | www.qats.com Therm-Jett High Capacity Air Cooling For ATCA, PICMG and Computing Chassis January, 2009 Rev. 4 Advanced Thermal Solutions | 89-27 Access Road, Norwood, MA 02062 | 781-769-2800 | www.qats.com Product of Advanced Thermal Solutions, Inc. 89-27 Access Road Norwood, MA 02062 USA 781-769-2800

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Page 1: Therm-Jett - v4 - ss

•Advanced Thermal Solutions | 89-27 Access Road, Norwood, MA 02062 | 781-769-2800 | www.qats.com

Therm-Jett™High Capacity Air Cooling For ATCA,

PICMG and Computing Chassis

January, 2009

Rev. 4

Advanced Thermal Solutions | 89-27 Access Road, Norwood, MA 02062 | 781-769-2800 | www.qats.com

Product of Advanced Thermal Solutions, Inc.89-27 Access RoadNorwood, MA 02062 USA781-769-2800

Page 2: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™

Conventional coolingTherm-Jett™ cooling

• Conventional cooling for an ATCA or PICMG chassis has lower cooling capacity because of the air flow being parallel wit h the PCB.

• Therm-Jett™ increases the cooling capacity since the flow is ne ar-normal to the PCB – much higher heat transfer coeff icient.

• Therm-Jett™ has better cooling than complicated liquid cooling techniques with significantly lower cost and increa sed reliability.

Exhaust air PCB

Fan TrayPCB Impingement plate

Impinged air

Page 3: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™ Operational Principle

Delivering high capacity cooling (jet impingement) by introducing a perforated plenum in between PCBs or on top of a single PCB.

Perforated plenum made of sheet-metal –mounted either on the PCB or as integral part of the chassis

PCB

High heat transfer coefficient jet impingement

Page 4: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™

Assembled View with Cutaway Section for boards in a blade configuration

Air is pushed into the Therm-Jett™ intake by system fans

Then air is driven down through the Therm-

JetT™ impingement holes onto the target

board

BackplaneConnectors

Therm-Jett™

CPU Board

Page 5: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™

Therm-Jett™ Technology can be applied to 1U and larger chassis as well

Air is pulled into the 1U system through the standard front panel

Then air is driven out of the fans into the Therm-Jett™ baffle and

the over the perforated plate. Back pressure forces the air down through the perforated plate onto

the hot board underneath

Motherboad is under the Therm-Jett™ plate

1U Power Supply

Fans

Page 6: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™

Therm-Jett Action?

Cools the targeted PCBs 20-30oC better than the conventional system. As the result, it effectively more than double the existing system power dissipation.

Status?

• Technology proven.

• Patents Pending

• Proof of Concept Chassis design in place

• Technology available today for licensing or joint development

Implication?

Extends the air cooling capability for

• Telecomm,

• High Performance Computing,

• Military Electronics

• Embedded Computing

Therm-Jett – delivering high capacity cooling by flow impingement without compressed air or changes to chassis’overall architecture.

Page 7: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™- Tested

Experimental Setup - an off-the-shelf PCI

system with Therm-Jett cooling system

ATS Therm-Jett – a jet impingement cooling system

Impingement

Plate

Board

Inlet

Page 8: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™ - Tested

• The data from graph shows a significant decrease in ∆ ∆ ∆ ∆T (TComponent – Tambient = 8 to 20oC) for

impingement compared to conventional flow.

Experimental data for 15 locations on a simulated board for conventional and impingement cooling

• By optimizing the shape of the impingement duct, we expect to double the cooling capacity

of an ATCA/PICMG chassis compared to conventional cooling method.

Conventional cooling

05

10152025303540455055606570

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

T .C #

∆∆ ∆∆T

[ °° °°

c]

ATS Impingement

Conventional systemDT > 8oC

DT > 20oC

Page 9: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™- Experimental Verification

Deployment of Therm-Jett in an ATCA Chassis

Page 10: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™- Experimental Verification

Deployment in ATCA Chassis

Plenum entrance for Therm-Jett ™Side view of the

experimental plenum of the Therm-Jett™

Fan tray area

Page 11: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™- Experimental Verification

Deployment in ATCA Chassis

Perforation pattern in Therm-Jett™impingement cooling system

Therm-Jett™ experimental plenum for ATCA deployment

Page 12: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™- Experimental Verification

Insertion of the Therm-Jett™ plenum in an ATCA syste m

Page 13: Therm-Jett - v4 - ss

Patent PendingAdvanced Thermal Solutions, Inc. Proprietary, for Internal Use Only

Therm-Jett™ - PartnershipA Paradigm Shift in Electronics Cooling

Product licensing

Joint product development

and marketing

-- -- - -- - - -

- - - -

Therm-Jett™ a unique patent pending technology to advance air cooling of electronics