themis instrument thermal peer review 1 ucb, february 26, 2004 themis t ime h istory of e vents and...
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THEMIS Instrument Thermal Peer Review 1 UCB, February 26, 2004
THEMISTIME HISTORY OF EVENTS AND MACROSCALE INTERACTIONS DURING SUBSTORMS
RESOLVING THE MYSTERY OF WHERE, WHEN AND HOW AURORAL ERUPTIONS START
THEMIS Instrument CDR Peer Review – Thermal MaterialTHEMIS Instrument CDR Peer Review – Thermal MaterialApril 19 - 20, 2004April 19 - 20, 2004University of California, BerkeleyUniversity of California, Berkeley
THEMIS Instrument Thermal Peer Review 2 UCB, February 26, 2004
UCB Thermal Peer Review
THEMIS Instrument CDR - Thermal
Christopher Smith
Thermal Engineer
510-642-2461
THEMIS Instrument Thermal Peer Review 3 UCB, February 26, 2004
Launch
Probe Carrier Assembly (PCA) on Delta 3rd StageProbe Carrier Assembly (PCA) on Delta 3rd Stage
• Five Identical probes launched on a Delta II
• Coordinated but independent probe release
ADAMS Dispense Model Dynamic Simulation Image
ADAMS Dispense Model Dynamic Simulation Image
• Must design for any launch date
• Must design for all solar aspect angles
THEMIS Instrument Thermal Peer Review 4 UCB, February 26, 2004
Probe Design
• Simple Single string design
• Power positive most attitudes with instruments off (launch, safe hold modes)
• Top to sun is slightly power negative
• Passive thermal design tolerant of longest shadows (3 hours)
• Passive spin stability achieved in all nominal and off-nominal conditions
• Monoprop blow down RCS (propulsion) system is self balancing on orbit
THEMIS Instrument Thermal Peer Review 5 UCB, February 26, 2004
THEMIS Instruments
Eight Deployed Instruments
• Two 5m spin axis booms (AXB)
• Four 20m spin plane wire booms (SPB)
• One 1m spin plane boom (SCM)
• One 2m spin plane boom (FGM)
Two Fixed Instruments
• Corner panel mounted SST
• ESA mounted to the IDPU which mounts to bottom deck
THEMIS Instrument Thermal Peer Review 6 UCB, February 26, 2004
Mission Orbits
Probe Orbital Period Orbit Geometry Prior to First Year Tail Season
1 4 d 1.500 x 31.645 Re at 7.0°
2 2 d 1.168 x 19.770 Re at 7.0°
3 1 d 1.200 x 12.019 Re at 9.0°
4 1 d 1.200 x 12.019 Re at 9.0°
5 4 / 5 d 1.350 x 10.042 Re at 9.0°
• Synchronized orbits align in the geotail over North America in winter
• Phase into a long eclipse season approximately 30 days long
• Maximum eclipse < 180 min
THEMIS Instrument Thermal Peer Review 7 UCB, February 26, 2004
Thermal Responsibilities
•Probe Bus and Probe Carrier Assembly thermal design / analysis
- Swales Aerospace
•Instrument thermal design / analysis
- UC Berkeley
•RCS thermal design / analysis
- RCS Contractor
•Integrated Probe Bus and Instrument thermal analysis
- Swales Aerospace
•Integrated Probe Carrier Assembly thermal analysis
- Swales Aerospace
•Instrument and Instrument Suite level thermal testing
- UC Berkeley
•Probe level thermal testing
- Swales Aerospace
THEMIS Instrument Thermal Peer Review 8 UCB, February 26, 2004
Instrument Introduction
• Radial EFI (Electric Field Instrument) or SPB (Spin Plane Boom) deploys EFI sensor and preamp on a wire
• Axial EFI or AXB (AXial Boom) deploys an EFI sensor and preamp on a coiled rigid stacer
• SST - Ion and electron Solid State Telescope
• ESA - ion and electron ElectroStatic Analyzer
• IDPU - Instrument Data Processing Unit
• FGM - FluxGate Magnetometer
• SCM - Search Coil Magnetometer
THEMIS Instrument Thermal Peer Review 9 UCB, February 26, 2004
Design Approach
• THEMIS will use passive thermal control techniques
• Heat dissipating boxes are coupled radiatively and/or conductively to the spacecraft
• Components mounted on the exterior of the spacecraft are isolated and/or use low e finishes or blankets to minimize bus heat loss
– SST emittance tailored to meet ideal science requirements
• Internal box finishes chosen to assist heat transfer between probe top and bottom deck for top deck to sun case
• Heaters designed for 50% or below duty cycle in coldest case
THEMIS Instrument Thermal Peer Review 10 UCB, February 26, 2004
Interfaces
Interface Material
SST to Probe ULTEM Isolators
SPB to Probe ULTEM Isolators
IDPU to Probe ULTEM Isolators
ESA to IDPU Bare Bolted
FGM to boom G10 Isolators
SCM to boom PEEK structure
AXB Tube to top deck ULTEM Isolators
AXB Tube to bottom deck Bare bolted
AXB to AXB Tube Bare bolted
Boom to Probe ULTEM isolators
Boom Release Towers to Probe
ULTEM isolators
THEMIS Instrument Thermal Peer Review 11 UCB, February 26, 2004
Design Margins
•Thermal Analysis results must be 5 degrees inside limits
•Acceptance tests will be 10 degrees outside of predictions
•Qualification tests will be 10 degrees outside of limits
•Heater duty cycle will be 50% or less in coldest case
Max Predict
Op
Lim
it s
Min Predict
>5°C
>5°C
10°C
10°C
10°C
10°C
Qu
alif
ica
ti on
Ac c
ep
t an
c e
THEMIS Instrument Thermal Peer Review 12 UCB, February 26, 2004
MRD REQUIREMENT THERMAL DESIGN
M-26. THEMIS shall survive and performed as designed under worst-case thermal conditions
Compliance. Worst-case hot and cold conditions used in thermal analysis and design.
IN-1. The Instrument Payload shall be designed for at least a two-year lifetime
Compliance. 2-year EOL numbers used in thermal analysis and design.
IN-2. The Instrument Payload shall be designed for a total dose environment of 33 krad/year
Compliance. Radiation environment considered in thermal design.
IN-20, -21, -22. The Instrument Payload shall be compatible per (all) ICDs
Compliance. Thermal limits and interface requirements documented in ICDs…
IN-16 The Instrument Payload shall comply with the Magnetics Cleanliness standard described in the THEMIS Magnetics Cleanliness Plan
Compliance. THM-SYS-002 Magnetics Contamination Control Plan. Heaters will be magnetically clean, power/return wires will be twisted.
IN-17 The Instrument Payload shall comply with the THEMIS Electrostatic Cleanliness Plan
Compliance. THM-SYS-003 Electrostatic Cleanliness Plan signed off. Thermal blankets and all other exposed surfaces will be sufficiently conductive and have sufficiently dense grounding networks.
IN-18 The Instrument Payload shall comply with the THEMIS Contamination Control Plan
Compliance. THM-SYS-004 Contamination Control Plan signed off. Thermal blankets will be baked out.
Thermal Requirements
THEMIS Instrument Thermal Peer Review 13 UCB, February 26, 2004
Analysis Tools
Geometry Model • Thermal Desktop
4.5 / AutoCAD 2000– Same version as
Swales counterpart
Equation Solver • SINDA/FLUINT 4.5
– Same version as Swales counterpart
Simplified Node Analysis• Excel Spreadsheet
THEMIS Instrument Thermal Peer Review 14 UCB, February 26, 2004
Thermal Desktop Models
• UCB node, variable, Thermophysical and optical properties all uniquely named to prevent collisions
• Model definition files transferred to Swales for integration into probe model
THEMIS Instrument Thermal Peer Review 15 UCB, February 26, 2004
Spacecraft Environment
•Solar Flux varies from a high of 1425 W/m2 to a low of 1287 W/m2
•Earth IR varies from a high of 261 W/m2 to a low of 209 W/m2
•Earth Albedo varies from a high of 0.35 to a low of 0.16
THEMIS Instrument Thermal Peer Review 16 UCB, February 26, 2004
Conductors
• A single conductance value or a conductance range is determined through analysis.
• If a range is determined, (mostly for contact cases) this is used for hot and cold cases
• If a single conductance value was determined than it is multiplied by 1.5 and 0.5 to determine the high and low values to use
• Whether to use the high or low conductance is determined by the model and the case, though it is usually the max estimate
THEMIS Instrument Thermal Peer Review 17 UCB, February 26, 2004
Example Conductors
THEMIS Instrument Thermal Peer Review 18 UCB, February 26, 2004
Isolated Joint Conductance
THEMIS Instrument Thermal Peer Review 19 UCB, February 26, 2004
EOL and BOL Values
THEMIS Instrument Thermal Peer Review 20 UCB, February 26, 2004
AO Effects
• Minimum height at perigee = 1.108 Re = 700 km altitude, AO evaluation continuing but expected to be small for ITO-FEP-Ag
• All final material properties will be submitted to GSFC thermal coatings group for approval
THEMIS Instrument Thermal Peer Review 21 UCB, February 26, 2004
• Nodal capacitance is adjusted to match current best estimate of mass
• Blanket effective emittance• SPB Cold case uses 0.05, Hot case uses 0.01
• SCM and FGM, Cold case uses 0.1, Hot case uses 0.03
Thermophysical Properties
THEMIS Instrument Thermal Peer Review 22 UCB, February 26, 2004
Limit Categories
• Science Operation Limit– Limits placed on an operating instrument– Specifies the range of temperatures the instrument will be calibrated to
• Eclipse Operation Limit– Limits placed on an operating instrument– May represent a wider (cooler) range that is acceptable to components– Temperatures beyond Science Op Limit need not be calibrated to
• Survival Limit– Limits placed on a non operating instrument
• Pre-Deployment Limit– Limits placed on a mechanical system before it is actuated
• Deployment Limit– Limits placed on a mechanical system at the time of actuation
• Post-Deployment Limit– Limits placed on a mechanical system after it has executed its one-time
deployment
THEMIS Instrument Thermal Peer Review 23 UCB, February 26, 2004
Science vs. Eclipse Limits
• Science will not be collected during the deepest eclipses
• Science cases currently cut off at 100 min eclipse
THEMIS Instrument Thermal Peer Review 24 UCB, February 26, 2004
Limits
THEMIS Instrument Thermal Peer Review 25 UCB, February 26, 2004
Boundary Condition Case Sets
• Instrument thermal models coupled to the deck temperature boundary conditions provided by Swales
THEMIS Instrument Thermal Peer Review 26 UCB, February 26, 2004
Swales P1 Orbit Cold Case
Longest eclipse occurs in P1 orbit
Top tilted toward the sun 13 Degrees
BOL Optical Properties
Solar Flux = 1287 W/m2
Earth IR = 209 W/m2
Blanket e* = .05
Dissipation 24 W
THEMIS Instrument Thermal Peer Review 27 UCB, February 26, 2004
Swales P4 Orbit Hot Case
No eclipse in the P4 orbit
Top tilted away from the sun 13 Degrees
EOL Optical Properties
Solar Flux = 1425 W/m2
Earth IR = 265 W/m2
Earth Albedo = 0.35
Blanket e* = .01
Dissipation 27.4 W
Transmitter on for 30 min at perigee
THEMIS Instrument Thermal Peer Review 28 UCB, February 26, 2004
Summary of Swales Case Sets
THEMIS Instrument Thermal Peer Review 29 UCB, February 26, 2004
Boundary Temperature Inputs
THEMIS Instrument Thermal Peer Review 30 UCB, February 26, 2004
General UCB Case Sets
• “CBE” is current best estimate
• Actual Case sets differ by instrument any modifications and additional case sets will be discussed in the instrument section
THEMIS Instrument Thermal Peer Review 31 UCB, February 26, 2004
EFI Axial Booms
Thermal
Christopher Smith
Thermal Engineer
510-642-2461
THEMIS Instrument Thermal Peer Review 32 UCB, February 26, 2004
Axial Boom Stowed
Axial Boom (AXB)
• Two units mount inside a carbon fiber tube centrally mounted on the probe
• Tube attached to the top deck through an aluminum flange that is bare bolted
• Bare bolted to lower deck
• Two stacers, one from each unit, deploy out the tube ends
AXB Mounting
Tube
Single AXB unit
THEMIS Instrument Thermal Peer Review 33 UCB, February 26, 2004
AXB / Map
80% Alum Foil Tape
20% Bare Carbon Fiber
Bare Carbon Fiber
Alodined Aluminum
VDA Tape
THEMIS Instrument Thermal Peer Review 34 UCB, February 26, 2004
AXB Model Inputs
• Optical materials– Aluminum Foil Tape– Bare Carbon Fiber– Alodined Aluminum
• Thermophysical materials– Aluminum, 6061– K13D2U Carbon Fiber– T300 Carbon Fiber
• Heaters– None used at this time, though we are prepared to supply deployment heaters
if needed
• Conductors– Bare bolted top flange to deck: 0.612 W/C inc. bolts, flange, and adhesive– Bare bolted bottom flange to deck: 3.3 W/C each, 20 W/C total– Bare bolted AXB to Tube mount: 0.79 W/C each, 0.476 total
• Power Dissipation– 0 Watts
AXB Mounting Tab
THEMIS Instrument Thermal Peer Review 35 UCB, February 26, 2004
AXB Case sets
• Bottom to sun a cold case boundary condition has no eclipse
• All above cases run separately with stowed boom and deployed boom
THEMIS Instrument Thermal Peer Review 36 UCB, February 26, 2004
AXB Mechanical Unit Standard Plots - Deployed
-60
-40
-20
0
20
40
60
50K 100K 150K 200K 250K 300K
AXB Mechanical Unit, Deployed, Standard Case Set - Foil and Bare Carbon Fiber Mix (04/10/04)SAA 103 Hot - SAA 90 Cold - SAA 77 Cold - SAA 77 Cold Low Power
Te
mp
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ture
Time
BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB BOT DECK TOP DECK TUBE TOP
TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB
BOTTOM AXB BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB
THEMIS Instrument Thermal Peer Review 37 UCB, February 26, 2004
AXB Mechanical Unit Sunline Plots - Deployed
-60
-40
-20
0
20
40
60
80
100
40K 50K 60K 70K 80K 90K 100K 110K
AXB Mechanical Unit, Deployed, TBSun Case Set - Foil and Bare Carbon Fiber (04/10/04)SAA 0 Hot - SAA 180 Cold
Tem
pera
ture
Time
BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB
BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB
THEMIS Instrument Thermal Peer Review 38 UCB, February 26, 2004
AXB Mechanical Unit Standard Plots - Stowed
-60
-40
-20
0
20
40
60
80
50K 100K 150K 200K 250K 300K
AXB Mechanical Unit, Stowed, Standard Case Set - Foil and Bare Carbon Fiber Mix (04/10/04)SAA 103 Hot - SAA 90 Cold - SAA 77 Cold - SAA 77 Cold Low Power
Te
mp
era
ture
Time
BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB BOT DECK TOP DECK TUBE TOP
TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB
BOTTOM AXB BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB
THEMIS Instrument Thermal Peer Review 39 UCB, February 26, 2004
AXB Mechanical Unit Sunline Plots - Stowed
-60
-40
-20
0
20
40
60
80
100
40K 50K 60K 70K 80K 90K 100K 110K
AXB Mechanical Unit, Stowed, TBSun Case Set - Foil and Bare Carbon Fiber (04/10/04)SAA 0 Hot - SAA 180 Cold
Tem
pera
ture
Time
BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB
BOT DECK TOP DECK TUBE TOP TUBE MIDDLE TUBE BOTTOM TOP AXB BOTTOM AXB
THEMIS Instrument Thermal Peer Review 40 UCB, February 26, 2004
AXB Results Table
THEMIS Instrument Thermal Peer Review 41 UCB, February 26, 2004
AXB Mounting Tube Modifications
• Spacecraft was consuming too much power in the coldest, but nominal, science case ~2.2 W
• To help mitigate this issue two modifications are being considered for the AXB Mounting tube
• Tube construction switched from all T300 ( 5 W/mK) fiber to 4 plys K13D2U (500 W/mK) + 2 plys T300
• Tube exterior changed from blanket to a mix of Foil tape and bare carbon
• Current results show the AXB unit getting too hot and we are currently exploring options to cool it down
• Increase isolation between AXBs and tube
• Isolate tube flange from top deck
• At worst, cool the tube down by reducing the percentage of foil tape
• When the design is complete it will be within limits though new temperatures may require the thermal vac hot deploy test be repeated at a new higher temperature
THEMIS Instrument Thermal Peer Review 42 UCB, February 26, 2004
AXB Temp Map for Hottest Case
THEMIS Instrument Thermal Peer Review 43 UCB, February 26, 2004
AXB Temp Map for Coldest Case
THEMIS Instrument Thermal Peer Review 44 UCB, February 26, 2004
Axial Boom Deployed
AXB “can”
AXB PreAmp
Exposed Bit After Deploy
THEMIS Instrument Thermal Peer Review 45 UCB, February 26, 2004
AXB Geometry Model
Deployed Stacer Model
THEMIS Instrument Thermal Peer Review 46 UCB, February 26, 2004
AXB Deployed Elements / Map
DAG 154Alodined AluminumDAG 213
Bronze
THEMIS Instrument Thermal Peer Review 47 UCB, February 26, 2004
AXB Model Inputs
• Optical materials– Acheson Coloids DAG 213 (2 part)– Acheson Coloids DAG 154– Alodined Aluminum– Bronze
• Thermophysical materials– Aluminum, 6061– Bronze– Elgiloy– PEEK
• Heaters– None
• Conductors– Main Stacer to Tip Piece, 1 rivet and circumferential contact, .3 < G <.9 W/C– Tip Piece To Bronze DDAD Lock, Large threaded interface, 10 W/C– DDAD Lock to PreAmp, large threaded bolt 3.57 W/C– PreAmp to Mini Stacer, 1 rivet and circumferential contact .3< G <.8 W/C– Mini Stacer to Can, 1 rivet, 0.3 W/C
• Power Dissipation– 0.07 Watts Nominal at Preamp
AXB Preamp
THEMIS Instrument Thermal Peer Review 48 UCB, February 26, 2004
AXB Deployed Elements Case Sets
• Top and Bottom to sun cases after deployment are limited to no less than 11 degrees off the sun line
• The Model for the Top and Bottom to Sun cases goes through a 180 min eclipse. A 100 min eclipse is the actual limit and is shown in plots
THEMIS Instrument Thermal Peer Review 49 UCB, February 26, 2004
AXB Boom Elements Standard Plots - Deployed
-150
-100
-50
0
50
50K 100K 150K 200K 250K 300K
AXB Boom Elements, Deployed, Standard Case Set (04/10/04)SAA 103 Hot - SAA 90 Cold - SAA 77 Cold - SAA 77 Cold Low Power
Tem
pera
ture
Time
AXBROD.T14 AXBCAN.T6 AXBDDAD.T6 AXBPAMP.T10 AXBSTACR.T28 AXBTIP.T7 AXBROD.T14 AXBCAN.T6 AXBDDAD.T6
AXBPAMP.T10 AXBSTACR.T28 AXBTIP.T7 AXBPAMP.Q10 AXBROD.T14 AXBCAN.T6 AXBDDAD.T6 AXBPAMP.T10 AXBSTACR.T28
AXBTIP.T7 AXBROD.T14 AXBCAN.T6 AXBDDAD.T6 AXBPAMP.T10 AXBSTACR.T28 AXBTIP.T7
THEMIS Instrument Thermal Peer Review 50 UCB, February 26, 2004
AXB Boom Elements Sunline Plots - Deployed
-180
-160
-140
-120
-100
-80
-60
-40
-20
20K 30K 40K 50K 60K 70K 80K 90K 100K 110K 120K 130K
AXB Boom Elements, Deployed, TBSun Case Set (04/10/04)SAA 11 Cold - SAA 169 Cold
Tem
pera
ture
Time
AXBROD.T14 AXBCAN.T6 AXBDDAD.T6 AXBPAMP.T10 AXBSTACR.T28 AXBTIP.T7
AXBROD.T14 AXBCAN.T6 AXBDDAD.T6 AXBPAMP.T10 AXBSTACR.T28 AXBTIP.T7
THEMIS Instrument Thermal Peer Review 51 UCB, February 26, 2004
AXB Preamp Results Table
• Science operation limited to a 36 min eclipse
• Current predicts show Preamp falling below the limit on the TO99 can.
THEMIS Instrument Thermal Peer Review 52 UCB, February 26, 2004
AXB Preamp Qualification
• AXB Preamp model is currently a simple lump with the proper radiative surfaces
• Thermal isolation of the TO-99 from the outer shell is complicated and difficult to reliably model
• Thermal Vacuum test planned determine the thermal isolation of the TO-99 from the preamp outer surface (April 12th – April 23rd)
• This thermal isolation determined by test will be input into the thermal model to determine a reliable qualification temperature, still likely to be under the current qualified temp of –65
THEMIS Instrument Thermal Peer Review 53 UCB, February 26, 2004
AXB Preamp Models
THEMIS Instrument Thermal Peer Review 54 UCB, February 26, 2004
EFI Spin Plane Booms
Thermal
Christopher Smith
Thermal Engineer
510-642-2461
THEMIS Instrument Thermal Peer Review 55 UCB, February 26, 2004
SPB
• 4 separate units mounted to the bottom deck
• Snout pokes out the solar panel
• Sphere and Preamp deploy out the snout on a wire (Half Sphere shown in picture)
• Sphere and preamp separate as rotation unwinds a thin wire from a spring loaded wheel
THEMIS Instrument Thermal Peer Review 56 UCB, February 26, 2004
SPB / Map
AZ 2000 IECW Inorganic White Paint
MLI
Alodined Aluminum
THEMIS Instrument Thermal Peer Review 57 UCB, February 26, 2004
SPB Model Inputs
• Optical materials– Germanium Black Kapton (Sheldahl 275XC Black Kapton)– Alodined Aluminum– AZ 2000 IECW Inorganic White Paint– Blanket: .01 < < .05
• Thermophysical materials– Aluminum, 6061– ULTEM
• Heaters– None used at this time, though we are prepared to supply deployment heaters
if needed
• Conductors– 1/8” Ultem isolators for top deck: 0.01 W/C each, 0.04 W/C total
• Power Dissipation– 0 Watts
THEMIS Instrument Thermal Peer Review 58 UCB, February 26, 2004
SPB Case Sets
THEMIS Instrument Thermal Peer Review 59 UCB, February 26, 2004
SPB Mechanical Unit Standard Plots
-40
-30
-20
-10
0
10
20
30
40
50K 100K 150K 200K 250K 300K
SPB - Alodine w/ AZ 2000 IECW (04/12/04)SAA 103 Hot - SAA 90 Cold - SAA 77 Cold - SAA 77 Cold Low Power
Te
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Time
TOP HAT TOP HAT TOP REAR PANEL BOTTOM REAR PANEL BOTDECK
TOP HAT TOP HAT TOP REAR PANEL BOTTOM REAR PANEL BOTDECK
TOP HAT TOP HAT TOP REAR PANEL BOTTOM REAR PANEL BOTDECK
TOP HAT TOP HAT TOP REAR PANEL BOTTOM REAR PANEL BOTDECK
THEMIS Instrument Thermal Peer Review 60 UCB, February 26, 2004
SPB Mechanical Unit Sunline Plots
15
20
25
30
35
40
45
20000 25000 30000 35000 40000 45000 50000 55000 60000 65000
SPB - Alodine w/ AZ 2000 IECW (04/12/04)SAA 0 Hot - SAA 180 Hot
Te
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Time
TOP HAT TOP HAT TOP REAR PANEL BOTTOM REAR PANEL BOTDECK
TOP HAT TOP HAT TOP REAR PANEL BOTTOM REAR PANEL BOTDECK
THEMIS Instrument Thermal Peer Review 61 UCB, February 26, 2004
SPB Results Table
THEMIS Instrument Thermal Peer Review 62 UCB, February 26, 2004
SPB Heat Map for Coldest Case
THEMIS Instrument Thermal Peer Review 63 UCB, February 26, 2004
SPB Heat Map for Hottest Case
THEMIS Instrument Thermal Peer Review 64 UCB, February 26, 2004
SPB Deployed Elements
• Preamp and sphere are connected by a thin wire
• Preamp is connected to SPB deployment unit by another wire
• Preamp is nearly identical to Axial version
• Sphere is only a mechanical element
Titanium Nitride
DAG 213
THEMIS Instrument Thermal Peer Review 65 UCB, February 26, 2004
Preamp and Sphere Analysis
THEMIS Instrument Thermal Peer Review 66 UCB, February 26, 2004
SPB Sphere and Preamp Model
• Nodes 3 and 4 are for the sphere hot and cold cases
• Nodes 5 and 6 are for the preamp hot and cold cases
• As with the axial preamp the SPB preamp falls below its limit by a bit. Qualification plan is in the works
THEMIS Instrument Thermal Peer Review 67 UCB, February 26, 2004
SPB Sphere and Preamp Plot
THEMIS Instrument Thermal Peer Review 68 UCB, February 26, 2004
Flux Gate Magnetometer and Boom
Thermal
Christopher Smith
Thermal Engineer
510-642-2461
THEMIS Instrument Thermal Peer Review 69 UCB, February 26, 2004
FGM
• Two carbon fiber tubes joined by an elbow hinge
• Frangibolt release on the base hinge
• Elbow hinge is capture only, no release
THEMIS Instrument Thermal Peer Review 70 UCB, February 26, 2004
FGM Geometry Model
FGM Model
Deployed
Stowed
THEMIS Instrument Thermal Peer Review 71 UCB, February 26, 2004
FGM / Map
MLI30% AZ2000IECW White Paint
70% VDA Tape
= 0.5 to 0.9
AZ2000IECW White Paint
Alodined Aluminum on Undersides
THEMIS Instrument Thermal Peer Review 72 UCB, February 26, 2004
FGM Model Inputs
• Optical materials– MLI– Vapor Deposited Aluminum Tape– AZ 2000 IECW White Paint– Alodined Aluminum
• Thermophysical materials– Aluminum, 6061– M55J– ULTEM– Dexter Hysol 9349
• Heaters– None in current model though provisions have been made for deployment heaters if needed and it
looks like we will need them.
• Conductors– Deck Hinge ULTEM isolators, 0.0078 < G < .0133 W/C each– Conductance through deck hinge, 0< G <.02 W/C– Conductance through adhesive to boom tube, 6.6 W/C– Conductance through adhesive at elbow hinge, 4.9 W/C– Conductance through elbow hinge, 0< G < 0.04 W/C– Conductance through adhesive to Sensor, 3.3 W/C– G10 Isolation mounts at FGM sensor, 0.01 W/C– Elbow Latch Tower ULTEM isolators, 0.0078 < G < .0133 W/C each
• Power Dissipation– 0 Watts Nominal
Elbow Hinge
THEMIS Instrument Thermal Peer Review 73 UCB, February 26, 2004
FGM Case Sets
• Identical case sets to the SCM
* UCB model eclipse time, boundary conditions do not yet include eclipse
THEMIS Instrument Thermal Peer Review 74 UCB, February 26, 2004
FGM Deployed – Nominal Plot
-100
-80
-60
-40
-20
0
20
50K 100K 150K 200K 250K 300K
FGM - 30% AZ 2000 70% VDA (04/14/04)SAA 103 Hot - SAA 90 Cold - SAA 77 Cold - SAA 77 Cold Low Power
Te
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Time
INNER BOOM OUTER BOOM DECK HINGE ELBOW HINGE SENSOR TOPDECK INNER BOOM OUTER BOOM
DECK HINGE ELBOW HINGE SENSOR TOPDECK INNER BOOM OUTER BOOM DECK HINGE ELBOW HINGE
SENSOR TOPDECK INNER BOOM OUTER BOOM DECK HINGE ELBOW HINGE SENSOR TOPDECK
THEMIS Instrument Thermal Peer Review 75 UCB, February 26, 2004
FGM Deployed – Top and Bottom to Sun Plot
-80
-60
-40
-20
0
20
40
60
80
100
40K 50K 60K 70K 80K 90K 100K 110K
FGM - 30% AZ 2000 70% VDA (04/14/04)SAA 0 Hot - SAA 180 Cold
Te
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Time
TOPDECK INNER BOOM OUTER BOOM DECK HINGE ELBOW HINGE SENSOR
TOPDECK INNER BOOM OUTER BOOM DECK HINGE ELBOW HINGE SENSOR
THEMIS Instrument Thermal Peer Review 76 UCB, February 26, 2004
FGM Stowed – Nominal Plots
-100
-80
-60
-40
-20
0
20
40
60
80
100
20K 40K 60K 80K 100K 120K 140K 160K 180K 200K
FGM Stowed - 30% AZ 2000 70% VDA (04/14/04)SAA 103 Hot - SAA 77 Cold - SAA 0 Hot - SAA 180 Cold
Te
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Time
TOPDECK INNER BOOM OUTER BOOM DECK HINGE ELBOW HINGE SENSOR TOPDECK
INNER BOOM OUTER BOOM DECK HINGE ELBOW HINGE SENSOR TOPDECK INNER BOOM
OUTER BOOM DECK HINGE ELBOW HINGE SENSOR TOPDECK INNER BOOM OUTER BOOM
DECK HINGE ELBOW HINGE SENSOR FGM FRANGIBOLT SCM FRANGIBOLT
THEMIS Instrument Thermal Peer Review 77 UCB, February 26, 2004
FGM Results Table
THEMIS Instrument Thermal Peer Review 78 UCB, February 26, 2004
FGM DeployedColdest Heat Map
THEMIS Instrument Thermal Peer Review 79 UCB, February 26, 2004
FGM DeployedHot Temperature Map
THEMIS Instrument Thermal Peer Review 80 UCB, February 26, 2004
FGM StowedColdest Temperature Map
THEMIS Instrument Thermal Peer Review 81 UCB, February 26, 2004
FGM StowedHottest Temperature Map
THEMIS Instrument Thermal Peer Review 82 UCB, February 26, 2004
Search Coil Magnetometer and Boom
Thermal
Christopher Smith
Thermal Engineer
510-642-2461
THEMIS Instrument Thermal Peer Review 83 UCB, February 26, 2004
SCM Model
• Carbon Fiber boom mounted on the top deck
• Frangibolt activated deployment
• Sensor mounted in PEEK structure
THEMIS Instrument Thermal Peer Review 84 UCB, February 26, 2004
SCM Geometry Model
SCM Model
Deployed
Stowed
THEMIS Instrument Thermal Peer Review 85 UCB, February 26, 2004
SCM / Map
MLI
30% AZ2000IECW White Paint
70% VDA Tape
= 0.5 to 0.9
AZ2000IECW White Paint
Alodined Aluminum on Undersides
THEMIS Instrument Thermal Peer Review 86 UCB, February 26, 2004
SCM Model Inputs
• Optical materials– MLI– Vapor Deposited Aluminum Tape– AZ 2000 IECW White Paint– Alodined Aluminum
• Thermophysical materials– Aluminum, 6061– M55J– ULTEM– Dexter Hysol 9349
• Heaters– None in current model though provisions have been made for deployment heaters if needed and
it looks like we will need them.
• Conductors– Deck Hinge ULTEM isolators, 0.0078 < G < .0133 W/C each– Conductance through deck hinge, 0< G <.02 W/C– Conductance through adhesive to boom tube, 6.6 W/C– Conductance through adhesive to Sensor, 3.3 W/C– PEEK isolation of SCM sensor, 0.01 W/C– Release Tower ULTEM isolators, 0.0078 < G < .0133 W/C each
• Power Dissipation– 0 Watts Nominal
Deck Hinge
THEMIS Instrument Thermal Peer Review 87 UCB, February 26, 2004
SCM Case Sets
THEMIS Instrument Thermal Peer Review 88 UCB, February 26, 2004
SCM Deployed – Nominal Plot
Deployed SCM Plot, Nominal Case Sets
-80
-70
-60
-50
-40
-30
-20
-10
0
10
20
30
50K 100K 150K 200K 250K 300K
SCM - 30% AZ 2000 70% VDA (04/14/04)SAA 103 Hot - SAA 90 Cold - SAA 77 Cold - SAA 77 Cold Low Power
Te
mp
era
ture
Time
BOOM INNER BOOM OUTER SENSOR DECK HINGE TOPDECK BOOM INNER BOOM OUTER SENSOR DECK HINGE TOPDECK
BOOM INNER BOOM OUTER SENSOR DECK HINGE TOPDECK BOOM INNER BOOM OUTER SENSOR DECK HINGE TOPDECK
THEMIS Instrument Thermal Peer Review 89 UCB, February 26, 2004
SCM Deployed – Top and Bottom to Sun Plot
Deployed SCM Plot, Top and Bottom to Sun
-80
-60
-40
-20
0
20
40
60
80
100
40K 50K 60K 70K 80K 90K 100K 110K
SCM - 30% AZ 2000 70% VDA (04/12/04)SAA 0 Hot - SAA 180 Cold
Tem
pera
ture
Time
BOOM INNER BOOM OUTER SENSOR DECK HINGE TOPDECK BOOM INNER BOOM OUTER SENSOR DECK HINGE TOPDECK
THEMIS Instrument Thermal Peer Review 90 UCB, February 26, 2004
SCM Stowed – Nominal Plots
-100
-80
-60
-40
-20
0
20
40
60
80
100
20K 40K 60K 80K 100K 120K 140K 160K 180K 200K
SCM Stowed - 30% AZ 2000 70% VDA (04/14/04)SAA 103 Hot - SAA 77 Cold Low Power - SAA 0 Hot - SAA 180 Cold
Te
mp
era
ture
Time
BOOM INNER BOOM OUTER SENSOR DECK HINGE TOPDECK BOOM INNER BOOM OUTER SENSOR
DECK HINGE TOPDECK BOOM INNER BOOM OUTER SENSOR DECK HINGE TOPDECK BOOM INNER
BOOM OUTER SENSOR DECK HINGE TOPDECK FGM FRANGIBOLT SCM FRANGIBOLT
THEMIS Instrument Thermal Peer Review 91 UCB, February 26, 2004
SCM PlotCross Tube Temp Differentials
Cross-Tube Temperature Differentials
THEMIS Instrument Thermal Peer Review 92 UCB, February 26, 2004
SCM Plot Axial Temperature Differentials
Axial Temperature Differentials
THEMIS Instrument Thermal Peer Review 93 UCB, February 26, 2004
SCM Results Table
THEMIS Instrument Thermal Peer Review 94 UCB, February 26, 2004
SCM DeployedColdest Heat Map
THEMIS Instrument Thermal Peer Review 95 UCB, February 26, 2004
SCM DeployedHot Temperature Map
THEMIS Instrument Thermal Peer Review 96 UCB, February 26, 2004
SCM StowedColdest Temperature Map
THEMIS Instrument Thermal Peer Review 97 UCB, February 26, 2004
SCM StowedHottest Temperature Map
THEMIS Instrument Thermal Peer Review 98 UCB, February 26, 2004
Solid State Telescope
Thermal
Christopher Smith
Thermal Engineer
510-642-2461
THEMIS Instrument Thermal Peer Review 99 UCB, February 26, 2004
SST
• Mounts directly to the corner panel on three 1/8 inch isolators
• Has four open apertures that are sometimes obscured by attenuators
• Must operate at 10 Deg C or less
THEMIS Instrument Thermal Peer Review 100 UCB, February 26, 2004
SST Geometry Model
Alodined
Aluminum
AZ 2000 IECW
Ebanol
Black Body /
Alodined Aluminum
THEMIS Instrument Thermal Peer Review 101 UCB, February 26, 2004
SST Model Inputs
• Optical materials– Ebanol– AZ 2000 IECW White Paint– Alodined Aluminum
• Thermophysical materials– Aluminum, 6061– ULTEM
• Heaters– Two 5 watt heaters per sensor head controlled by redundant thermostats– Set points –50 and -42
• Conductors– 3 ULTEM isolators to corner panel, 0.0078 < G < .0133 W/C each
• Power Dissipation– 0.135 W Watts Nominal per Sensor
THEMIS Instrument Thermal Peer Review 102 UCB, February 26, 2004
SST Case Sets
THEMIS Instrument Thermal Peer Review 103 UCB, February 26, 2004
SST – Nominal Plots
-70
-60
-50
-40
-30
-20
-10
0
10
20
30
40
0 50K 100K 150K 200K 250K 300K
SST - Alodine and AZ 2000 IECW White Paint, 10 W Heater (04/12/04)SAA 103 Hot Aperture Closed - SAA 103 Hot - SAA 90 Cold - SAA 77 Cold - SAA 77 Cold Low Power
Te
mp
era
ture
Time
SST1 TOP SST1 COLLIMATOR SST 1 INTERNAL CORNER PANEL SST2 INTERNAL SST1 HEATER SST2 HEATER SST1 TOP
SST1 COLLIMATOR SST1 INTERNAL CORNER PANEL SST2 INTERNAL SST1 HEATER SST2 HEATER SST1 TOP SST1 COLLIMATOR
SST1 INTERNAL CORNER PANEL SST2 INTERNAL SST1 TOP SST1 COLLIMATOR SST1 INTERNAL CORNER PANEL SST2 INTERNAL
SST1 TOP SST1 COLLIMATOR SST1 INTERNAL CORNER PANEL SST2 INTERNAL
THEMIS Instrument Thermal Peer Review 104 UCB, February 26, 2004
SST – Top and Bottom to Sun Plots
-80
-70
-60
-50
-40
-30
-20
-10
0
10
20K 30K 40K 50K 60K 70K 80K 90K 100K 110K 120K 130K
SST - Alodine and AZ 2000 IECW White Paint, 10 W Heater (04/12/04)SAA 0 Cold - SAA 180 Cold
Te
mp
era
ture
Time
SST1 TOP SST1 COLLIMATOR SST1 INTERNAL CORNER PANEL SST2 INTERNAL SST1 HEATER
SST2 HEATER SST1 TOP SST1 COLLIMATOR SST1 INTERNAL CORNER PANEL SST2 INTERNAL
THEMIS Instrument Thermal Peer Review 105 UCB, February 26, 2004
SST Results Table
THEMIS Instrument Thermal Peer Review 106 UCB, February 26, 2004
SST – Coldest Heat Map
THEMIS Instrument Thermal Peer Review 107 UCB, February 26, 2004
SST Hottest Heat Map
THEMIS Instrument Thermal Peer Review 108 UCB, February 26, 2004
ESA – IDPU – SCM Preamp
Thermal
Christopher Smith
Thermal Engineer
510-642-2461
THEMIS Instrument Thermal Peer Review 109 UCB, February 26, 2004
ESA – IDPU – SCM Preamp
ESA
IDPU
SCM Preamp (Mounted on Back)
ESA Support Bracket
• ESA and IDPU mounted together to conserve shielding / weight
• SCM Preamp mounted to IDPU to share heat
THEMIS Instrument Thermal Peer Review 110 UCB, February 26, 2004
ESA-IDPU / Map
Alodined Aluminum
Black Anodized Aluminum
THEMIS Instrument Thermal Peer Review 111 UCB, February 26, 2004
ESA-IDPU Model Inputs
• Optical materials– Black Anodized Aluminum– Alodined Aluminum
• Thermophysical materials– Aluminum, 6061– ULTEM
• Heaters– Survival Heater
• Conductors– IDPU, 6 ULTEM isolators to bottom deck, 0.0078 < G < .0133 W/C each– Bare Bolted ESA to IDPU,9.8 W/C– ESA Brace to bottom deck, 2 ULTEM isolators, 0.0078 < G < .0133 W/C each– Bare bolted SCM Preamp to IDPU, 5.6 W/C
ESA Brace
THEMIS Instrument Thermal Peer Review 112 UCB, February 26, 2004
ESA-IDPU Model Inputs - Power
Power Dissipation
THM-SYS-009 Rev O, Apr 04
THEMIS Instrument Thermal Peer Review 113 UCB, February 26, 2004
ESA-IDPU Case Sets
THEMIS Instrument Thermal Peer Review 114 UCB, February 26, 2004
ESA-IDPU – Nominal Plots
-40
-30
-20
-10
0
10
20
30
40
50K 100K 150K 200K 250K 300K
IDPU-ESA-SCMPreAmp Alodined / Black Anodized Aluminum (04/12/04)SAA 103 Hot - SAA 90 Cold - SAA 77 Cold - SAA 77 Cold Low Power
Te
mp
era
ture
Time
BOT DECK ESA INTERNAL ESA CYLINDER IDPU BASE IDPU INTERNAL SCMAMP INTERNAL
BOT DECK ESA INTERNAL ESA CYLINDER IDPU BASE IDPU INTERNAL SCMAMP INTERNAL
BOT DECK ESA INTERNAL ESA CYLINDER IDPU BASE IDPU INTERNAL SCMAMP INTERNAL
BOT DECK ESA INTERNAL ESA CYLINDER IDPU BASE IDPU INTERNAL SCMAMP INTERNAL
THEMIS Instrument Thermal Peer Review 115 UCB, February 26, 2004
ESA-IDPU – Top and Bottom to Sun Plots
5
10
15
20
25
30
35
40
45
35000 40000 45000 50000 55000 60000 65000 70000 75000 80000 85000 90000 95000
IDPU-ESA-SCMPreAmp Alodined / Black Anodized Aluminum (04/12/04)SAA 0 Hot - SAA 180 Hot
Te
mp
era
ture
Time
BOT DECK ESA INTERNAL ESA CYLINDER IDPU BASE IDPU INTERNAL SCMAMP INTERNAL
BOT DECK ESA INTERNAL ESA CYLINDER IDPU BASE IDPU INTERNAL SCMAMP INTERNAL
THEMIS Instrument Thermal Peer Review 116 UCB, February 26, 2004
ESA-IDPU Results Table
THEMIS Instrument Thermal Peer Review 117 UCB, February 26, 2004
ESA-IDPU Coldest Temperature map
THEMIS Instrument Thermal Peer Review 118 UCB, February 26, 2004
EAS-IDPU Hottest Temperature Map