the quality assurance and reliability testing (qart) lab at cern

CMS Upgrade Meeting, A. Honma 1

The Quality Assurance and Reliability Testing (QART) Lab at

CERNA. Honma, CERN PH/DT

26 April 2010

Purpose of Lab Lab site Personnel and EquipmentActivities The DSF and Bonding Lab Conclusions

Outline


Purpose of Lab• Was created from the White Paper initiative of the DG in 2007, R&D for

LHC upgrades

• Part of WP6: Interconnect Technology and QA (for LHC silicon detector upgrades)

• Located in the PH Departmental Silicon Facility (DSF) in Bldg 186

• Common QA lessons learned from LHC silicon detector construction should be documented. Avoid mistakes in the LHC detector upgrades and provide infrastructure and expertise to apply QA and reliability testing for the upgrade R&D and construction phases.

• QA ⇒ Planning and procedures common to ANY project. Broader scope for lab: any LHC detector, non-LHC detectors, other CERN projects

• Reliability Testing has become essential owing to lack of accessibility and long expected life times of detectors and electronics

26 April 2010

CERN DSF QART and

Bonding Lab

CMS Upgrade Meeting, A. Honma 326 April 2010

CERN DSF QART and

Bonding Lab Lab SiteCERN DSF QART and

Bonding Lab

Location of QART lab is inside B186-R (ground floor) in the Departmental Silicon Facility

B186

CMS Tracker Integration Facility

Departmental Silicon Facility

Bldg 186

High Bay Hall

QART Lab

CMS Preshower Final Assembly


QART Website: http://bondlab-qa.web.cern.ch/bondlab-qa/QA.html

Personnel (2.5 FTE):• 1 proj. assoc. (F. Manolescu) – 100%• 1 fellow (A. Drozd) – 100%

Equipment:

• Climatic chamber (large volume, fast temp. cycling with humidity control)• Thermal cycling chamber (small volume, med. speed, no humidity control) • Vibration tester (mono-axial shaker can deliver 10G’s to 10Kg payload)• Infra-red thermal imaging video camera• High magnification stereo-microscope on probe station with video camera• Small aperture permanent magnet with B=0.7T for high mag field studies• Die shear tester / bond wire pull tester

26 April 2010

CERN DSF QART and

Bonding LabPersonnel and EquipmentCERN DSF

QART and Bonding Lab

• 1 physicist (A. Honma) – 30%• 1 technician (I. McGill) – 20%

http://bondlab-qa.web.cern.ch/bondlab-qa/QA.html


+60°C

-30°C

+20°C

65 min

TOTEM hybrid thermal cycle

26 April 2010

CERN DSF QART and

Bonding LabEquipment: Climatic Chambers

CERN DSF QART and

Bonding Lab

Climatic ChamberTemp range: -70°C to +180°CHum range: 10% to 95%RHHeating speed: 15°C/minCooling speed: 11°C/min

Thermal Cycling ChamberTemp range: -40°C to +180°CHeating speed: 5°C/minCooling speed: 6°C/min

Tests:•Thermal cycling•Accelerated lifetime•Humidity tolerance•Cold tolerance•Stress screening•Environment simulation


CERN DSF QART and

Bonding LabEquipment: Vibration TesterCERN DSF


Mono-axial shaker with control system and analysis tools for Random, Sine, Shock, and Recorded vibration inputs. Can perform:• Destructive testing• Stress screening• Modal analysis• Playback of transport and handling vibrations

and shocks• 30cm x 30cm head expander allows testing of

large objects (ex.: CMS silicon tracker module)

Accelerometer on silicon sensor

Acceleration frequency spectrum


CERN DSF QART and

Bonding LabEquipment: IR Video CameraCERN DSF


High sensitivity (0.1°K) thermal imaging IR video camera. Expected uses:• Identifying hot spots on silicon sensors, thermal run-away conditions(?), …• Heat flow study on front-end PCBs and detector modules• Many other possible uses …

Example #2: Malfunctioning heating loop was easily located on one of CMS Tracker Endcap panels.

Example #1: Motherboard of a PC. Frame capture from the video output.

4: Hottest point in frame

1: and 2: User selectable measurement points (3 max)

Temperaturemeasuremen

ts


CERN DSF QART and

Bonding Lab

Equipment: High Magnification Zoom Stereo-microscope

CERN DSF QART and

Bonding Lab

• High magnification (up to 320x) needed for silicon sensors (pixel or strips) and for (bare) read-out chips.• Stereo needed for 3-D structure identification.• Video camera useful if object’s visual aspect has time dependence and for documentation.• Possibility to probe the observed object.

Example: Poor wire bonding quality can often be spotted from surface details and form of welded bond “foot”. Below: right-most bond foot is heavily over-deformed (flattened).

50μm

acceptable marginal rejected

Leica MZ16


CERN DSF QART and

Bonding LabEquipment: High Field MagnetCERN DSF


Motivation: CDF silicon strip detector had broken bond wires from vibration owing to AC current at resonant frequency of wires (10-30KHz) in high B field (1.4T).

0.7 T dipole field using neodymium magnets.Plan to get a small electromagnet with up to 2T

Resonant oscillation on bond wire of 3.5mm length found at 6.8KHz.

Both ATLAS and CMS have determined the risk of existing bonds to be minimal but have taken precautions to avoid fixed frequency triggers.

ATLAS has published an analysis for at-risk bonds in ATLAS silicon detectors. But no known systematic study of effects of wire loop properties and bonding quality on breakage risk. Try to quantify more generally these risks.

In agreement with FEA calculations


Activities, Past/PlannedAll equipment is ready for use by the user community. Although priority is given to the LHC experiments silicon detector upgrade projects, other upgrade projects, other experiments, and other CERN projects can use the lab. Examples of tests done or planned:• Thermal cycling done on front-end electronics (CMS, TOTEM, ALICE),

sensors/chips (Medipix), standard PCBs (LHC quench protection system, CMS Preshower), small mechanical structures. Tests can be passive or active (users provide control and powering electronics).

• Accelerated aging (timed heat soak) performed for corrosion (with humidity), metal migration (bond wire pads), oxidation.

• The IR video camera used for hot spot detection on silicon sensors.• We plan to do transport and handling vibration damage studies for

silicon detector modules and components. This will include real recordings of transport examples (plane, truck, train) for playback.

• Continue wire vibration damage studies in magnetic field.

26 April 2010

CERN DSF QART and

Bonding Lab

The Departmental Silicon Facility (DSF)

The QART lab shares clean room space and personnel with the bond lab. The QART lab also uses space in the non-clean DSF areas.

26 April 2010 CMS Upgrade Meeting, A. Honma 11

CERN DSF QART and

Bonding Lab

Bond and QART LabATLAS RD50

Technical Rooms and Airlocks

Non-Clean Areas

Departmental Silicon Facility (2010)

RD50

ALICE

LHCb and Medipix

DSF Clean Room (~270m2 usable)

LHCb CMS

~30m

~85m

~65m

Access Way

PEG

PE

PG

PEG

PE

PEG

PEGPEG

P

PPE

P

P=power, E=Ethernet, G=gas lines (N2)

Clean room boundary


The Bonding LabThe Bonding Lab is a CERN shared facility which is dedicated to:•Ultrasonic wedge wire bonding with aluminium wire.•Pull testing of wires (destructive and non-destructive).•Die attach (chip and small detector gluing).•Encapsulation of wire bonds (new).

26 April 2010

CERN DSF QART and

Bonding Lab

2 Delvotec 6400 ultrasonic wedge wire bonding machines

IJ Fisnar 7300-LF Glue (Encapsulation) dispenser

Cammax DB600 die bonder with heated chuck

Dage 4000 bond wire pull tester and die shear tester

CERN Bond lab did about 20% of CMS Tracker bonding +

100% of Preshower. Now doing sensor, chip and radmon

R&D for CMS.


Conclusions• Quality Assurance and Reliability Testing (QART) Lab is now equipped

with all foreseen major test apparatus.• Lab personnel are trained or in training for test equipment. We are able

to provide test services (for smaller jobs) or advice and assistance (for larger jobs) to the LHC experiments upgrade projects.

• We have a resource library and experience concerning quality assurance for detector projects. We are always interested in learning from others experience as concerns quality issues.

• Reliability testing is a critical step in assuring that the components and the systems that cannot be easily repaired or replaced will be able to function over the required lifetime.

• Please feel free to contact us for questions, discussions, planning and requests for QA, reliability testing, equipment usage, wire bonding and chip gluing.

26 April 2010

CERN DSF QART and

Bonding Lab



the quality assurance and reliability testing (qart) lab at cern

Documents

equipmentcern dsf qart

honma3cern dsf qart

honma4cern dsf qart

honma5cern dsf qart

honma6cern dsf qart

honma2cern dsf qart

cms upgrade meeting

reliability testing