tg4011ag_final_7115_100929[1]
TRANSCRIPT
© Panasonic System Networks Co., Ltd. 2010 Unauthorized copying and distribution is a violation of law.
ORDER NO. KM41009270CE
Telephone EquipmentModel No. KX-TG4011AGT
KX-TG4012AGTKX-TG4013AGTKX-TGA403AGT
Expandable Digital Cordless PhoneT: Black Metallic Version(for Argentina)
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
TABLE OF CONTENTSPAGE PAGE
1 Safety Precautions----------------------------------------------- 41.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 42.1. Battery Caution--------------------------------------------- 42.2. About Lead Free Solder (PbF: Pb free)-------------- 42.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 64 Technical Descriptions ----------------------------------------- 7
4.1. US-DECT Description ------------------------------------ 74.2. Block Diagram (Base Unit_Main)---------------------- 94.3. Block Diagram (Base Unit_RF Part) -----------------104.4. Circuit Operation (Base Unit) --------------------------114.5. Block Diagram (Handset)-------------------------------184.6. Block Diagram (Handset_RF Part)-------------------194.7. Circuit Operation (Handset)----------------------------204.8. Circuit Operation (Charger Unit) ----------------------224.9. Signal Route -----------------------------------------------23
5 Location of Controls and Components ------------------246 Installation Instructions ---------------------------------------247 Operating Instructions-----------------------------------------248 Test Mode ----------------------------------------------------------25
8.1. Engineering Mode----------------------------------------259 Service Mode -----------------------------------------------------29
9.1. How to Clear User Setting (Handset Only)---------2910 Troubleshooting Guide ----------------------------------------30
10.1. Troubleshooting Flowchart -----------------------------3011 Disassembly and Assembly Instructions ---------------41
11.1. Disassembly Instructions -------------------------------4111.2. How to Replace the Handset LCD -------------------44
12 Measurements and Adjustments---------------------------4512.1. Equipment Required-------------------------------------4512.2. The Setting Method of JIG -----------------------------4512.3. Adjustment Standard (Base Unit)---------------------4912.4. Adjustment Standard (Charger Unit)-----------------5012.5. Adjustment Standard (Handset) ----------------------5112.6. Things to Do after Replacing IC or X'tal ------------5212.7. Frequency Table ------------------------------------------54
13 Miscellaneous ----------------------------------------------------5513.1. How to Replace the Flat Package IC----------------5513.2. How to Replace the Shield Case ---------------------5713.3. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------5913.4. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------6114 Schematic Diagram ---------------------------------------------62
14.1. For Schematic Diagram---------------------------------6214.2. Schematic Diagram (Base Unit_Main) --------------6414.3. Schematic Diagram (Handset_Main) ----------------6614.4. Schematic Diagram (Charger Unit) -----------------68
15 Printed Circuit Board-------------------------------------------6915.1. Circuit Board (Base Unit_Main) -----------------------6915.2. Circuit Board (Handset_Main)-------------------------7115.3. Circuit Board (Charger Unit) ---------------------------73
16 Exploded View and Replacement Parts List -----------7416.1. Cabinet and Electrical Parts (Base Unit) -----------7416.2. Cabinet and Electrical Parts (Handset) -------------7516.3. Cabinet and Electrical Parts (Charger Unit) -------7616.4. Accessories ------------------------------------------------77
16.5. Replacement Parts List--------------------------------- 78
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
1 Safety Precautions1.1. For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as toprevent fires, injury or electric shock, which can be caused by improper repair work.1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.When repairing, the following precautions will help prevent recurring malfunctions.1. Cover plastic parts boxes with aluminum foil.2. Ground the soldering irons.3. Use a conductive mat on worktable.4. Do not grasp IC or LSI pins with bare fingers.
2 Warning2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.2. Replace only with the same or equivalent type recommended by the manufacturer.3. Dispose of used batteries according to the manufacture’s Instructions.
2.2. About Lead Free Solder (PbF: Pb free)Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder thatcontains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairwork we suggest using the same type of solder.
Caution• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
2.2.1. Suggested PbF SolderThere are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check themanufacturer's specific instructions for the melting points of their products and any precautions for using their product with othermaterials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3. Discarding of P. C. BoardWhen discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
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3 Specifications
Note:• Design and specifications are subject to change without notice.
Note for Service:• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.• Analog telephone connection: Telephone Line
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4 Technical Descriptions4.1. US-DECT DescriptionThe frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is samefrequency. Refer to Frequency Table (P.54).
4.1.1. TDD Frame Format
4.1.2. TDMA systemThis system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummybearer use.In 1 slot 417 µs, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic BearerA link is established between base unit and handset.The state where duplex communication is performed.Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy BearerBase unit sends Dummy-data to the all stand-by state handsets.Handsets receive that data for synchronization and monitoring request from the base unit.Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:(*1) It is a feature under FCC 15 regulation and for interference avoidance.In the case of checking RF parts, it is better in least interference condition.
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4.1.3. Signal Flowchart in the Radio PartsReception
A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in one antenna.BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
TransmissionA voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base unit RF, RF signal is received in two antennas. BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signalfrom RX signal in the selected antenna, and demodulates it to digital data "RXDATA".BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
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4.2. Block Diagram (Base Unit_Main)
SW
1
KX
-TG
4011
/401
2/40
13 B
LOC
K D
IAG
RA
M (
Bas
e U
nit_
Mai
n)
D10
1
CH
AR
GE
_CO
NT
AC
T
+ -
X50
113
.824
MH
z
AN
T2
AN
T1
TE
L JA
CK
L1T
L1R
DC
P
DC
M
DC
JA
CK
RLY
SID
E T
ON
EC
IRC
UIT
Q16
1
Q14
1
BE
LLD
ET
EC
TH
OO
K
BE
LL
Q11
1
LIN
LOU
T
RF
_PA
RT
HS
MIP
HS
MIN
IC50
1B
BIC
INU
SE
DE
TE
CT
2IN
US
ED
ET
EC
T 1
RE
CE
IVE
AM
P
DC
IN 1
DC
IN 2
IC30
2
VC
CP
AV
BA
T_A
PU
VB
AT
VC
C_F
EV
CC
_IF
VC
C_V
CO
PD
N D
ET
3.0V
DO
UB
OU
T
SCL, SDAWP
IC61
1
EE
PR
OM
ME
MO
RY
R15
1,R
152
R13
1, R
133
Q17
1
VB
AT
KEY 1
KEY C
3.0
VR
EG
ULA
TOR
IC33
1
RE
SE
T IC
STM/CKM
R37
1R
372
VCCA
VC
C
AN
T2
AN
T1
RX
p
RX
n
RX
ON
TX
p
TX
n
TX
ON
RE
SE
TR
ST
N
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4.3. Block Diagram (Base Unit_RF Part)
KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_RF Part)
DA801
ANT2
ANT1
TXON
RXON
RXp
RXn
ANT2
ANT1
TXp
TXn
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4.4. Circuit Operation (Base Unit)General Description:
(BBIC, EERROM) is a digital speech/signal processing system that implements all the functions of speech compression andmemory management required in a digital telephone.The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functionsas follows.
4.4.1. BBIC (Base Band IC: IC501)• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to theTelephone line, etc. They are determined by the signal path route operation of voice signal.
• Block Interface CircuitRF part, Key scan, Telephone line.
4.4.2. EEPROM (IC611)Following information data is stored.
• Settingsex: message numbers, ID code, Flash Time, Tone/Pulse
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4.4.3. Power Supply Circuit/Reset CircuitThe power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part isinsulated from VBAT by Doubler of BBIC.Circuit Operation:
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4.4.3.1. Charge CircuitThe voltage from the AC adaptor is supplied to the charge circuits.
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4.4.4. Telephone Line InterfaceTelephone Line Interface Circuit:Function
• Bell signal detection• ON/OFF hook and pulse dial circuit• Side tone circuit
Bell signal detection and OFF HOOK circuit:In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:T → L101 → R111 → C111 → Q111 → BBIC pin 5 [BELL]When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow throughthe circuit). Following signal flow is the DC current flow.T → L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R
ON HOOK Circuit:Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-hook condition.
Pulse Dial Circuit:Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 iscanceled by the canceller circuit of BBIC.
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4.4.5. Parallel Connection Detect Circuit/Auto Disconnect CircuitFunction:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have acircuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephoneconnected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:Parallel connection detection when on hook:When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is 0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined bydetecting the voltage changes.If the Auto disconnect function is ON and statuses are Hold, BBIC disconnects the line after detecting parallel connection is offhook.
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4.4.6. Calling Line Identification (Caller ID)Function:
Caller IDThe caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone companyto utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has beenentered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between thefirst and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types ofthe message format which can be received: i.e. the single message format and plural message format. The plural messageformat allows to transmit the name and data code information in addition to the time and telephone number data.*: Also the telephone exchange service provides other formats.
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Call Waiting Caller IDCalling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,to receive information about a calling party on a waited call. The transmission of the calling information takes place almostimmediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the newcall.
Function:The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data andMARK data pass the following route.Telephone Line → P101 → L101, L102 → C121, C122 → R121, R122 → IC501 (25, 24).If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and theinformation for the second and subsequent callers is not displayed on the portable handset display.
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4.5. Block Diagram (Handset)
IC1
IC3
MICp
AVD
LD0_CTRL
MICn
LSRpLSRn
BELL_LED
PAOUTpPAOUTnCKM//STMCKM/STM
BBIC
RESET
CHG_CTL
CHG_DET
WP
, CLK
, DA
TA
P3_
3~P
3_7
P1_
1~P
1_4
CHARGEQ4 D7
MIC
Receiver
LED
3V
Monitor SP
LCD KEYS
IC801
RF PART
ANT1X110.368 MHzEEPROM
3V
BATTERY
(BELL)
BATTERY
3V
BATTERY
3V
KX-TGA403 BLOCK DIAGRAM (Handset)
KEY_LED
Q7
LED
(KEY)
TXn
Power_adj
TXp
VDD_PADRV
PSEL
PON
TXONRXON
RF_RXnRF_RXp
CP_VOUT2
BATTERY
VDDPA
1.8V
VDD2VDD1
3V
Q2
1.8V
C144
D1
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4.6. Block Diagram (Handset_RF Part)
KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)
DA801
TXON
RXON
ANT
RF_RXn
RF_RXp
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4.7. Circuit Operation (Handset)4.7.1. OutlineHandset consists of the following ICs as shown in Block Diagram (Handset) (P.18).
• DECT BBIC (Base Band IC): IC1- All data signals (forming/analyzing ACK or CMD signal)- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)- PLL Oscillator- Detector- Compress/Expander- Reception
• RF Power Amp: IC801- Amplifier for transmission
• EEPROM: IC3- Temporary operating parameters (for RF, etc.)
4.7.2. Power Supply Circuit/Reset CircuitCircuit Operation:
When power on the Handset, the voltage is as follows;BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → Q2 (1.8 V), IC1-43pin (2.5V)The Reset signal generates IC1 (61 pin) and 1.8 V.
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4.7.3. Charge CircuitCircuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;DC+(6.5 V) → F301 → R371 → R372 →CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery... BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)In this way, the BBIC on Handset detects the fact that the battery is charged.The charge current is controlled by switching Q9 of Handset.Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).
4.7.4. Battery Low/Power Down DetectorCircuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.The detected voltage is as follows;
• Battery LowBattery voltage: V(Batt) 2.25 V ± 50 mVThe BBIC detects this level and " " starts flashing.
• Power DownBattery voltage: V(Batt) 2.0 V ± 50 mVThe BBIC detects this level and power down.
4.7.5. SpeakerphoneThe hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
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4.8. Circuit Operation (Charger Unit)Charge control is executed at handset side so that the operation when using charger is also controlled by handset.Refer to Circuit Operation (Handset) (P.20)
The route for this is as follows: DC+pin of J1(+) → F1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of J1(-).
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4.9. Signal Route
RF part signal route
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5 Location of Controls and ComponentsRefer to the Operating Instructions.
Note:You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation InstructionsRefer to the Operating Instructions.
Note:You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
7 Operating InstructionsRefer to the Operating Instructions.
Note:You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
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8 Test Mode8.1. Engineering Mode8.1.1. Base Unit
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Frequently Used Items (Base Unit)ex.)
Note:(*1) When you enter the address or New Data, please refer to the table below.
Items Address Default Data New Data RemarksFrequency 00 07 / 00 08 00/01 - - Use these items in a READ-ONLY mode to
confirm the contents. Careless rewriting maycause serious damage to the computer system.
ID 00 02 ~ 00 06 Given value - -
Desired Number (hex) Input Keys Desired Number (hex) Input Keys0 0 A [Flash] + 01 1 B [Flash] + 1. . C [Flash] + 2. . D [Flash] + 3. . E [Flash] + 49 9 F [Flash] + 5
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8.1.2. Handset
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Frequently Used Items (Handset)ex.)
Note:(*1) When you enter the address or New Data, please refer to the table below.
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to thehandset.
Items Address Default Data New Data Possible AdjustedValue MAX (hex)
Possible AdjustedValue MIN (hex)
Remarks
Battery Low 00 11 / 00 12 00 / 00 - - -(*2)Frequency 00 07 / 00 08 00 / 01 - - -
ID 00 02 ~ 00 06 Given value - - -
Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys0 0 A [Flash] + 01 1 B [Flash] + 1. . C [Flash] + 2. . D [Flash] + 3. . E [Flash] + 49 9 F [Flash] + 5
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9 Service Mode9.1. How to Clear User Setting (Handset Only)
Handset
Press , , , simultaneously until a beep sound is heard. Then single handset is initialized.(The contents of user setting are reset to factory default)*Usage time is not cleared.
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10 Troubleshooting Guide10.1. Troubleshooting Flowchart
Cross Reference:Check Power (P.31)Check Battery Charge (P.32)Check Link (P.33)Check the RF part (P.35)Check Handset Transmission (P.40)Check Handset Reception (P.40)Check Caller ID (P.40)
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10.1.1. Check Power10.1.1.1. Base Unit
Cross Reference:Power Supply Circuit/Reset Circuit (P.12)
Note: BBIC is IC501.(*1) Refer to Specifications (P.6) for part number andsupply voltage of AC adaptor.(*2) Refer to Circuit Board (Base Unit_Main) (P.69).
10.1.1.2. Handset
Cross Reference:Power Supply Circuit/Reset Circuit (P.20)
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10.1.2. Check Battery Charge10.1.2.1. Base Unit
Cross Reference:Charge Circuit (P.13)
10.1.2.2. Handset
Cross Reference:Check Power (P.31)Charge Circuit (P.21)
10.1.2.3. Charger Unit
Cross Reference:Charge Circuit (P.21)
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10.1.3. Check Link10.1.3.1. Base Unit
Cross Reference:Power Supply Circuit/Reset Circuit (P.12)Check the RF part (P.35)
Note:*1 How to adjust +3.0V:Execute the command "VDA"Refer to Things to Do after Replacing IC or X'tal (P.52) for Base Unit.*2 How to adjust the frequency of X501:To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).To adjust frequency, send command “SFR “ until the frequency counter becomes13.824 MHZ±55HZ.
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10.1.3.2. Handset
Cross Reference:Power Supply Circuit/Reset Circuit (P.20)Check the RF part (P.35)
Note:*1 How to adjust the frequency of X1:To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-46pin).To adjust frequency, send command “SFR “ until the frequency counter becomes10.368 MHz±55HZ.Refer to Things to Do after Replacing IC or X'tal (P.53) for Handset.
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10.1.4. Check the RF part10.1.4.1. Finding out the Defective part
After All the Checkings or Repairing1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
Note:(*1) HS: Handset(*2) BU: Base Unit
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10.1.4.2. RF Check FlowchartEach item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.37).Please refer to the each item.
Note:(*1) Refer to Check Link (P.33).
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10.1.4.3. Check Table for RF part
Note:(*1) Adjustment Standard (Base Unit) (P.49)(*2) Adjustment Standard (Handset) (P.51)
No. Item BU (Base Unit) Check HS (Handset) Check1 Link Confirmation Normal
HS, BU Mode [Normal Mode]
1. Register Regular HS to BU (to be checked).
2. Press [Talk] key of the Regular HS to establish link.
1. Register HS (to be checked) to Regular BU.
2. Press [Talk] key of the HS to establish link.
2 X'tal Frequency confirmation
HS, BU Mode: [Adjustment]
Check X'tal Frequency.(13.824000 MHz ±100 Hz)
Check X'tal Frequency.(10.368000 MHz ±100 Hz)
3 TX confirmation
Regular HS (BU) Mode:[Test RX Mode]
BU (HS) Mode:[Test TX_Burst Mode]
1. Place Regular HS 15 cm away from a checked BU.
2. Confirm "TXDATA" waveform of BU (*1) and “RXDATA“ waveform of Regular HS by Digital Oscilloscope.
1. Place Regular BU 15 cm away from a checked HS.
2. Confirm "TXDATA" waveform of HS (*2) and "RXDATA" waveform of Regular BU by Digital Oscilloscope.
4 RX confirmation
Regular HS (BU) Mode:[Test TX_Burst Mode]
BU (HS) Mode:[Test RX Mode]
1. Place Regular HS 15 cm away from a checked BU.
2. Confirm "RXDATA" waveform of BU (*1) and “TXDATA“ waveform of Regular HS by Digital Oscilloscope.
1. Place Regular BU 15 cm away from a checked HS.
2. Confirm "RXDATA" waveform of HS (*2) and "TXDATA" waveform of Regular BU by Digital Oscilloscope.
5 Range Confirmation Normal
HS, BU Mode: [Normal Mode]
1. Register Regular HS to BU (to be checked).
2. Press [Talk] key of the Regular HS to establish link.
3. Compare the range of the BU (being checked) with that of the Regular BU.
1. Register HS (to be checked) to Regular BU.
2. Press [Talk] key of the HS to establish link.3. Compare the range of the HS (being
checked) with that of the Regular HS.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
10.1.4.4. TEST RANGE CheckCircuit block which range is defective can be found by the following check.
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
Note:(*1) Refer to Commands (Base Unit) (P.48).
Item BU (Base Unit) Check HS (Handset) CheckRange Confirmation TX TEST(TX Power check)
HS, BU settingChecked unit: Low TX power (*1)Regular unit: High TX power (*1)
1. Register Regular HS to BU (to be checked).
2. Set TX Power of the BU and the Regular HS according to CHART1.
3. At distance of about 20m between HS and BU,Link OK = TX Power of the BU is OK.No Link = TX Power of the BU is NG.
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the HS and the Regular BU according to CHART1.
3. At distance of about 20m between HS and BU,Link OK = TX Power of the HS is OK.No Link = TX Power of the HS is NG.
Range Confirmation RX TEST(RX sensitivity check)
HS, BU settingChecked unit: High TX power (*1)Regular unit: Low TX power (*1)
1. Register Regular HS to BU (to be checked).
2. Set TX Power of the BU and the Regular HS according to CHART1.
3. At distance of about 20m between HS and BU,Link OK= RX Sensitivity of the BU is OK.No Link = RX Sensitivity of the BU is NG.
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the Checking HS and the Reg-ular BU according to CHART1.
3. At distance of about 20m between HS and BU,Link OK= RX Sensitivity of the HS is OK.No Link = RX Sensitivity of the HS is NG
BU (to be checked) Regular_HSTX Power TX Power
BU (Base Unit) TX Power Check Low HighBU (Base Unit) RX Sensitivity Check High Low
HS (to be checked) Regular_BUTX Power TX Power
HS (Handset) TX Power Check Low HighHS (Handset) RX Sensitivity Check High Low
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
10.1.5. Registering a Handset to the Base Unit
10.1.6. Deregistering a Handset
10.1.7. Deregistering All Handsets by the Base Unit
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
10.1.8. Check Handset Transmission
Cross Reference:Signal Route (P.23)
10.1.9. Check Handset Reception
Cross Reference:Signal Route (P.23)
Note:When checking the RF part, Refer to Check the RF part(P.35).
10.1.10. Check Caller ID
Cross Reference:Telephone Line Interface (P.14)Calling Line Identification (Caller ID) (P.16)
Note:• Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.• It is also recommended to confirm that the customer is really
a subscriber of the service.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
11 Disassembly and Assembly Instructions11.1. Disassembly Instructions11.1.1. Base Unit
42
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
11.1.2. Handset
43
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
11.1.3. Charger Unit
44
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
11.2. How to Replace the Handset LCDNote:
The illustrations are simplified in this page.They may differ from the actual product.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12 Measurements and AdjustmentsThis chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in Troubleshooting Guide (P.30)
12.1. Equipment Required• Digital multi-meter (DMM): it must be able to measure voltage and current.• Oscilloscope.• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)
Hewlett Packard, 53131A is recommended.• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG
<Preparation>• Serial JIG cable: PQZZ1CD300E*• PC which runs in DOS mode• Batch file CD-ROM for setting: PNZZTG4011AG
Note:*: If you have the JIG Cable for TCD500 series(PQZZ1CD505E), change the following values ofresistance. Then you can use it as a JIG Cable for bothTCD300 and TCD500 series. (It is an upper compatible JIGCable.)
12.2.1. Connections (Base Unit) Connect the AC adaptor. Connect the JIG Cable GND (black). Connect the JIG Cable RX (red) and TX (yellow).
Note:*: COM port names may vary depending on what your PC calls it.
Resistor Old value (kΩ) New value (kΩ)R2 22 3.3R3 22 3.3R4 22 4.7R7 4.7 10
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12.2.2. Connections (Handset) Connect the DC Power or Battery to BATT+ and BATT-. Connect the JIG cable GND (black) to GND. Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
Note:*: COM port names may vary depending on what your PC calls it.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12.2.3. How to install Batch file into P.C.
Note:• “*****” varies depending on the country or models.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12.2.4. Commands (Base Unit)See the table below for frequently used commands.
12.2.5. Commands (Handset)See the table below for frequently used commands.
Command name Function Examplerdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.readid Read ID (RFPI) Type “readid”, and the registered ID is read out.writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.hookoff Off-hook mode on Base Type “hookoff”.hookon On-hook mode on Base Type “hookon”.RdEeprom Read EEPROM Type “RdEeprom 03 e2 04”, and the data from address
“03 e2” to “03 e4” is read out*This command gets 4 byte "WW", "XX", "YY", "ZZ".*Please NEVER forget these 4 byte data!
sendchar epw Write EEPROM Type”sendchar epw 03 e2 04 FF FF FF FF”sendchar RST Reset baseset Type “sendchar RST”getchk Read checksum Type “getchk”.sendchar epw Write EEPROM Type “sendchar epw 03 e2 04 WW XX YY ZZ”
*"WW", "XX", "YY", "ZZ" is 4 byte data that already read from same address.
getchk Write the data of EEPROM Type ”reeprom 01 23 45”.”01 23” is address and “45”is data to be written.
Command name Function Examplerdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.readid Read ID (RFPI) Type “readid”, and the registered ID is read out.writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.hookoff Off-hook mode on Base Type “hookoff”.hookon On-hook mode on Base Type “hookon”.getchk Read checksum Type “getchk”.wreeprom Write the data of EEPROM Type “wreeprom 01 23 45”. “01 23” is address and “45”
is data to be written.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12.3. Adjustment Standard (Base Unit)When connecting the simulator equipment for checking, please refer to below.
12.3.1. Bottom View
Note:(*1) is referred to No.2 of Check Check Table for RF part (P.37)(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)
CL2
C47
7C
478
SP
PS
PN
C53
0
C32
1
DC
DC
_OU
T
C32
2
C47
6F
CT
RS
TN
ST
M/C
KM
/P15
C34
3
C51
1
C51
0
C16
5C
163
C35
1
CH
AR
GE
+C
HA
RG
E- C
514
C18
1
C17
1
C12
1 C12
2
C15
2
C12
5
C11
2C
352
AN
T2
CL1
R50
2
RT
CK
R32
2
R32
1
R30
2
R60
5R
606
R61
2
R33
5R
602
R60
3
R11
2
R17
8V
CC
AV
RE
F
R16
6
R16
4R
161
R13
6V
DD
C
R15
1
R15
2
R11
5
R12
1
L371
L1T
L1R
L476 L4
74
L372
L362
IC60
1IC
302
IC61
1
RA
151
RA
504
D36
1
D47
3D
472
D15
3D13
3
D36
3
Q16
1
Q60
1
C142
C513
C167
C512
C186
C184
C601C479
C307
C301
C332
C521
C133
C123C472
C473
C475
C120C124
C151C525
C524
C611
C115
C168
C126
C66
1
R165
F301DC
PD
CM
R512
R507
R307
R607
R601
R304R305R301
R505
R506
R334
R604
R181
R162
R503
R167
R163
R122
L361
RA502
D142
D143
CH
G+
2C
HG
-2
B
+6.
5V
RT
CK
E4
4
3
58 1
+3.
0V
VB
AT
TM
S
TC
K
TD
I
TD
O
VB
G
GN
DU
TX
UR
X
3.0A
AN
T1
PN
LB17
12Z
PbF
CH
G
SP
DC
RE
DR
ED
RE
D
WH
TB
LK
BLK
YLW
GR
N
Spe
ctru
m A
naly
zer
Fre
quen
cy C
ount
er (
*1)
DC
6.5V
Osc
illos
cope
(*2
)
* S
end
com
man
d "S
FR
", th
en th
e fr
eque
ncy
outp
ut o
n th
is T
P.
* S
tart
Mon
itor
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12.4. Adjustment Standard (Charger Unit)When connecting the simulator equipment for checking, please refer to below.
12.4.1. Bottom View
TP
4
TP
3
1
2
J1
A
F1Pb
FP
NLP
1029YA
PQ
UP
11532Y
Charge-
Charge+
12 /2 W
DigitalVolt Meter
DC POWERDC 6.5 V
TP
3
TP
4 (GN
D)
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12.5. Adjustment Standard (Handset)When connecting the simulator equipment for checking, please refer to below.
12.5.1. Component View
Note:(*1) is referred to No.2 of Check Check Table for RF part (P.37)(*2) is referred to Power Supply Circuit/Reset Circuit (P.20)
A
PbF
C44
C880
C811
C813
C72
C203
C105
C206
C201
C175 C70C152
C71
C200
C107
C106
C103
C104
C73
C864C863C814
C834
C802
C804
C43
C837
C48 C40C54
C52C53
C51
C55
C39 C30
C10
C400
C340
C341
C342
C332
C331
C147
C113C5
JTAGSTM
URXUTX
CHG(+)
MIC+ MIC-
CHG(-)
BATT-BATT+
BAT
MIC-
RCV-
E
1 4
8 5
MIC+
RCV+
R578
R50R53R236
R54
R231
R801
R802
R805 R880
R808
R66R63
R225
R405
R203
R807
R27R400R402
R248
R249
21
1
R23R37R36
R20CLK
1.8V
R7R30
F1
R2
R332
R331
R330
R3R8
R4
L802
IC3
TP_ANT1
RA800
RA4
RA40CP3.0V
CP4.0V
D22D21
D13
RED
BLK
RED
BLK
D14
D400
D7
D3 D4
Q401
POWER
Q400
Q11
Q12
GND
C580
C187
C186
C204
C827
C881
C819
C45
C46
C825
C809
C810 C
861
C808
C812
C806
C138
C139
C803
C805
C47
C822
C826
C820
C860
C182
C49
C50
C188
C12
C13
C11
C96C
18
C17
C97
C38
C35
C121
C150
C1
C2
C172
C75
C74
C3
X1
MIC
R232
R55
SP
EA
KE
R
R233
R806
R64
R28
R403R
404
R406
R407
R401
R215
R45
R74
R31
R6
R73
L801
L803
L46L47
IC801
IC1
RA
32
RA
1
RA
61
RA
31R
A30
DA
801
D1
Q880
Q2
Q10
Q7
Q4
Q9
RECEIVER
PNLB1734YKX-TGA650XXKX-TGA651XXKX-TGA250XXKX-TGA251XXKX-TGA403XX
TGA250XXTGA251XXTGA403XX
TGA650XXTGA651XX
AF
Gen
erat
or
DC
6.5
V
DC
Pow
er2.
30~
2.60
V
DC
PO
WE
R2.
00~
2.25
V
GN
DG
ND
Dig
ital
Vol
t Met
er
CLK
Fre
quen
cyC
ount
er (
*1)
2.7
VZ
ener
+
+
PC
UR
XTXRX
GND
100
GN
D
GN
D
AN
TDE
CT
Tes
ter
CM
D60
(at b
atte
ry lo
w)
Pow
er K
ey
56
1
56
8 1 F
22pF
Cur
rent
Pro
beO
scill
osco
pe (
*2)
1.8V
CP 3.0V
CP 4.0V
AF
Vol
t Met
er
Osc
illos
cope15
0
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12.6. Things to Do after Replacing IC or X'talIf repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustmentdata, etc. in memory.The set doesn't operate if it is not executed.
12.6.1. How to download the data12.6.1.1. Base UnitFirst, operate the PC setting according to The Setting Method of JIG(P.45).Then download the appropriate data according to the following procedures.
Note:(*1) XXX_YYY: revision number“XXX”, “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The SettingMethod of JIG (P.45).
Items How to download/Required adjustmentEEPROM (IC611) Adjusted parameter data is stored in memory.
(country version batch file, default batch file,etc.)
1) Change the address “0001” of EEPROM to “55” to downloadthe data.2) Default batch file: Execute the command “default.bat”.3) Country version batch file: Execute the command“TG4011USAGrevXXX_YYY.bat”. (*1)4) Clock adjustment
X'tal (X1) System clock Clock adjustment data is in EEPROM, adjust the data againafter replacing it.1) Apply 6.5V between DCP ad DCM with DC power.2) Input Command " sendchar sfr", then you can confirm thecurrent value.3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the fre-quency of CLK executing the command "sendchar sfr xx xx(where xx is the value)" so that the reading of the frequencycounter is 13.824000 MHz ± 15 Hz.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12.6.1.2. HandsetFirst, operate the PC setting according to The Setting Method of JIG(P.45).Then download the appropriate data according to the following procedures.
Note:(*2) XXX_YYY: revision number“XXX” and “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The SettingMethod of JIG (P.45).
Items How to download/Required adjustmentEEPROM (IC3) Adjusted parameter data is
stored in memory.(country version batch file,default batch file, etc.)
1) Default batch file: Execute the command “default.bat”.2) Default batch file (remaining): Execute the command “TGA402USDEFrevXXX_YYY.bat”. (*2)3) Country version batch file: Execute the command “TGA402USAGrevXXX_YYY.bat”. (*2)4) Clock adjustment5) 2.35 V setting and battery low detection
Battery Monitor Check - 1) Apply 2.25 V between BATT+ and BATT-.2) Execute the command sendchar PAD sendchar LED 0 sendchar CRX 0 1 sendchar AD1 It assumes that the return value is XX. a) 6c XX 71: No need to adjust b) XX: 6A ~ 6B: Need to adjust XX: 72 ~ 74: Need to adjust Write AD value of 2.25 V to EEPROM. ex) read data: XX = 6A, write data:YY = 6A read data: XX =73, write data: YY = 73 EEPROM = 0009 (Low Voltage) write “YY“ Execute the command “wreeprom 00 09 01 YY“. EEPROM = 000A (No Voltage) write “YY - 1D“ Execute the command “xwreeprom 00 0A 01 ZZ“. Note: No Voltage writing data limit is “00“. c) XX: 00 ~ 69: Reject XX: 75 ~ FF: Reject
Battery Low Confirmation - 1) Apply 2.40 V between BATT+ and BATT-.2) Confirm that there is no flashing of Battery lcon.3) Apply 2.25 V ± 0.08 V between BATT+ and BATT-.4)Confirm that there is flashing of Battery lcon.
Battery Clock Adjustment (X1)
CLK 1) Apply 2.6 V between BATT+ and BATT- with DC power.2) Input Command “sendchar sfr“, then you can confirm the current value.3) Check X’tal Frequency. (10.368 MHz ± 100 Hz).4) If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK exe-cute in the command “sendchar sfr xx xx (where xx is the value)“ so that the readingof the frequency counter is 10.368000 MHz ± 5 Hz.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
12.7. Frequency Table
CH Ch (hex) Frequency (MHz)0 00 1928.4481 01 1926.7202 02 1924.9923 03 1923.2644 04 1921.5365 05 1919.8086 06 1918.0807 07 1916.3528 08 1914.6249 09 1912.896
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
13 Miscellaneous13.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), asoldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.1.1. Preparation• PbF (: Pb free) Solder• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone withless experience could overheat and damage the PCB foil.
• FluxRecommended Flux: Specific Gravity → 0.82.Type → RMA (lower residue, non-cleaning type)Note: See About Lead Free Solder (PbF: Pb free) (P.4)
13.1.2. How to Remove the IC1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder isleft at the joint on the board, the new IC will not be attached properly.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
13.1.3. How to Install the IC1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.1.4. How to Remove a Solder Bridge1. Lightly resolder the bridged portion.2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
13.2. How to Replace the Shield Case13.2.1. Preparation
• PbF (: Pb free) Solder• Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)Note:We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.
• Hot Air Desoldering ToolTemperature: 608°F ± 68°F (320°C ± 20°C)
13.2.2. Caution• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.2.3. How to Remove the Shield CaseNote:
If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
1. Cut the case along perforation.
2. Remove the cut part.
3. Cut the four corners along perforation.
4. Remove the reminds by melting solder.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
13.2.4. How to Install the Shield CaseNote:
• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.• Shield case’s No. : PNMC1013Z
1. Put the shield case.
2. Solder the surroundings.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
13.3. How to Replace the LLP (Leadless Leadframe Package) ICNote:
This description is only applied on the model with Shield case.
13.3.1. Preparation• PbF (: Pb free) Solder• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)Note:We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.
• Hot Air Desoldering ToolTemperature: 608 °F ± 68 °F (320 °C ± 20 °C)
13.3.2. Caution• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.3.3. How to Remove the IC1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely.Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through theP.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
13.3.4. How to Install the IC1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.
2. Place the solder a little on the land where IC pins are to be attached, then place the IC.Note:
• When placing the IC, the positioning should be done very carefully.
3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.Note:
• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.
4. After soldering, confirm there are no short and open circuits with visual inspection.
13.3.5. How to Remove a Solder BridgeWhen a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
13.4. Terminal Guide of the ICs, Transistors and Diodes13.4.1. Base Unit
13.4.2. Handset
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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
14 Schematic Diagram14.1. For Schematic Diagram14.1.1. Base Unit (Schematic Diagram (Base Unit_Main))14.1.1.1. Acoustic Testing ModeNotes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Schematic Diagram (Handset_Main))Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.3. Charger Unit (Schematic Diagram (Charger Unit))Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
63
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
Memo
64
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
14.2. Schematic Diagram (Base Unit_Main)
NC: No Components
KEYIN2KEYIN3
KEYS_DKEYS_E
KEYIN1
KEYS_C
MSG_LED
ANS_LED
UT
X
UR
X
JTA
G_T
DO
JTA
G_T
CK
JTA
G_T
MS
JTA
G_T
DI
JTAG_RTCK
JTA
G_R
TC
K
JTAG_TCK
JTAG_TDOJTAG_TDI
JTAG_TMS
VBAT
UT
X
UR
XGN
D
*WBX01
AP1
NC
PARALLEL WIRE
2APVCCMSG_LEDANS_LED
NCKEYIN1KEYIN2KEYIN3
KEYS_CKEYS_DKEYS_E
*SW112
RA501 33
1
2
3
45
6
7
8
RA50210k
1 2 3 45
678
C516 0.1u
C51
5
K1u
VBAT
VDDC
C517 0.1u
C518 0.1u
+3.0V
C65
1N
CC
652
NC
C65
5N
CC
656
NC
C65
8N
CC
659
NC
*C661
NC
RSTN
VBAT
DA801
1
23
TXn
RXON
RXp
RXn
GND
R806
470GND
TXON
R807470
TXp
GND
GND
GND
DA8021
23
ANT2
ANT1
R89
2
470
GND
GND
R89
1
470
ANT2
GND
GND
ANT1
GND
GNDANT2
TXON
RXONRXn
ANT1
TXpTXn
RXp
GND
STM/CKM/P15
GNDGND
GNDGND
CL1
CL2
*Q651NC
1B1
2E
3B2
5C1
4C2
C893
3p
GND
GNDGNDGND
TD
I
TM
S
TC
K
TD
O
C895
1.2pC8962.2p
C8592.2p
C8052.7p
C8062.7p
C8201.5p
C86
3
1.5p
R50
233
RT
CK
C66
0N
C
C8102.4p
C81
3
2p
L809
7.5n
C8915p
C8925p
C81110p
C826
10p
C82210p
C82510p
C65
3N
CC
654
NC
C812
0.9p
C82710p
GNDC894
2.2p
*R651 NC*R652 NC
*R50
7
1k
+3.0V
*R51
2
NC
45TXp46RXp47RXn48GND_RF49TRSW_p50ANT_n51ATST_n52ATST_p53TEST54RSTN55NC56VCC_VCO57GPIO[27]58VDDUSB59DM_USB/GPI2860DP_USB/GPI2961VDDC162JTAG_TDO63JTAG_TDI64JTAG_TCK65JTAG_TMS66JTAG_RTCK
FCT
TO RF BLOCK
W 0.2mmL mm1st layer
W 0.2mmL 10.0mm1st layer
W 0.15mmL 20mm3rd layer
W 0.15mmL 20mm3rd layer
W 0.2mmL 10mm1st layer
W 0.2mmL 10mm1st layer
W 0.2mmL mm1st layer
10
1
W 0.15mmL 5.0mm1st layer
W 0.15mmL 5.0mm1st layer
*IC501
(1)(2)(3)(4)
(5)
(6)
* Start Monitor* When "SFR" command is executed, 13.824MHz frequency will be output.
65
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
KX-TG4011/4012/4013AG SCHEMATIC DIAGRAM (Base Unit_Main)
NC: No Components
EE
P_S
CL
EE
P_S
DA
EE
P_W
P
HOOK
EE
P_W
P
UTXURX
HOOK
BELL
MS
G_L
ED
AN
S_L
ED
BELLKEYS_EKEYS_DKEYS_C
KE
YIN
1K
EY
IN2
KE
YIN
3
SP
I_D
IS
PI_
DO
SP
I_C
LK
SP
I_C
S
EE
P_S
CL
EE
P_S
DA
FLA
SH
_RS
T
SP
I_D
IS
PI_
DO
SP
I_C
LK
SP
I_C
S
FLA
SH
_RS
T
PDN_DET
PDN_DET
+6.5V
C51
90.
1u
VBAT
R61
2
10k
C50
7K
2.2u
RA50468
1
23
4
C51
20.
1u
C51
40.
1u
C51
0K
1u
C51
3K
2.2u
VDDC
C506
1u
R50
110
L102
33u
C165NC
C184
K1.0u
L101
33u
R16
6N
C
C102 680p
C13
2
K0.
01u
R16
727
R16
2
27k
R14
4N
C
SA
103
NC
21
C101 680p
R141
100kC163 NC
D101
4
3
1
2
C18
6
10p
Q142
BC
E
R164
2.7k
D14
2
NC
25V
A
K
Q141
BEC
L1R
R16
3
12
C16
8N
C
R13
110
M
SA
101
270V
21
R14
52.
2k
R161
100k
L1T
R16
527
k
D14
3
C14
2K
0.01
u
R14
2
2.7k
R13
333
0k
Q143
NC
R17
81k
C18
1
NC
C18
5
NC
C13
3N
CC
151
10p
C5010.1u
+3.0V
C52
0
0.1u
VCCA
R121 390k C121 680p
C122 680pR122 390k
R115
NC
C115
NC
C120
1000pC
172
NC
VC
CA
C50
810
p
R509 NC
+3.0VVDDC
C47
810
pSPP
SPN
*D47
3N
CA
K
C47
710
p
*D47
2N
CA
K
C11
10.
047u
R11
3
10k
C11
20.
047u
Q111
BC
E
R11
110
0k
D11
3A
K
R11
210
0k
C11
3
K0.
68u
R11
4
47k
+3.0V
F3013.0A DCP
DCM
C30
1
NC
4VOUT2
1ADJ
3INPUT
2 VOUT1
*C30
6
NC
R32
2
F10
0
R32
1
F14
0
*D36
1
NC
A
K
CHARGE-
CHARGE+
C611 0.1u
+3.0V
RA1511k
1
2 3
4
R151
100k
R15
247
0k
C15
20.
01u
C12
4N
C
C12
310
p
GND
GAP
R37
1
5.6
R37
2
5.6
C34
20.
1u
R50
52.
2k
R50
6N
C
VREF
VBG
+6.5V
DCDC_IC
NC1 ON/*OFF
2VSS
3 VOUT
5
VIN
4
EXT
C30
4N
C
L301
NC
Q301 NC
R30
4
NC
R30
5
NC
C30
5N
C
+6.5V
JJ301 NC
C30
3
NC
VBAT
+3.0V
R30
7
NC
R605 3.3kR606 3.3k
R30
2N
C
R30
1N
C
P101 22
DCDC_OUT
64K EEPROM1
A02
A13
A24
GND5
SDA
6SCL
7WP
8VCC
R136NC
CHG+2
CHG-2*D36
3
NC
A
K
GND
C32
11u
Q161
BC
E
C50210u
C505
10u
C51
110
u
C34
133
0u
ZA1
1 2
6
79
11
3 4 5
810
12
C47
2N
C
C47
5N
C
C47
3N
C
C53
010
p
C30
7
NC
C52
210
p
C34
310
p
C52
3N
C
C524 NC
C52
5N
C
R17
6
100
R172 100k
C175 1000p
R160
910
C17
80.
022u
C16
110
u
C17
610
u
C173
K0.22u
R17
7
NC
Q171BC
E
R17
1
22
C174 NC
R17
5
560 C
164
NC
R181
0
C17
1
0.02
2u
C16
710
00p
Q601NC
BE
C
*C601 NC
*R60
1
NC
+3.0V
*R60
4
NC
R603
NC
R602
NC
R50
3N
C
NC1 *CE2 SO
6SCK
7*HOLD3 *WP
8VDD
4 VSS 5SI
C30
8N
CC
302
10p
C47
610
p
C47
910
p
C32
210
p
C12
5
NC
C12
6
10p
*C35
2
0.1u
*C35
1
1u
C50
912
p VDDC
D13
3A
K
D15
3N
CA
K
X501
13.824M
*L361
220nH
*L371
220nH
L362
NC
L372
NC
*L47
6N
C
L474
NC
+6.5VVBAT
C50
3
10u
+3.0V
C504 1uC521 1u
C33
1
NC
C33
2
NC
NC2VIN1 VOUT3NC
4VSS
R335
0
+3.0V
*R60
7
NC
R33
3
NC
D33
1
NC
*R33
2
NC
*R33
1
NC
R33
4
47k
1GPIO[20]
2GPIO[21]
23M
IP
3GPIO[22]
4GPIO[23]
5GPIO[24]
6GPIO[25]
7GPIO[26]
8VDDC2
24H
SM
IN
25H
SM
IP
26M
PW
R
27H
SS
PO
UT
P
28LO
UT
29S
PO
UT
N
30V
CC
PA
81G
PIO
[13]
82G
PIO
[14]
83G
PIO
[15]
84G
PIO
[16]
85G
PIO
[17]
86V
DD
IO2
87G
PIO
[18]
88G
PIO
[19]
89
GND9
COREOUT
10VBAT
11DOUBCAPN1
12DOUBCAPN
13DOUBCAPP
14DOUBCAPP1
15DOUBOUT
16DCIN0/LIN0
17DCIN1
18DCIN2
19DCIN3/LIN1
20VREF
21VCCA
22MIN
31S
PO
UT
P
32P
WM
1
33P
WM
0
34D
CIN
S
35X
OU
T
36X
IN
37V
BA
T_A
PU
38V
DD
_AP
U
39V
CC
_IF
40V
DD
_IF
41V
CC
_FE
42A
NT
43T
RS
W_n
44T
Xn
67G
PIO
[0]/S
CL_
IIC68
GP
IO[1
]/SD
A_I
IC69
GP
IO[2
]70
GP
IO[3
]71
GP
IO[4
]72
GP
IO[5
]73
GP
IO[6
]74
GP
IO[7
]75
GP
IO[8
]76
VD
DIO
177
GP
IO[9
]78
GP
IO[1
0]79
GP
IO[1
1]80
GP
IO[1
2]
L501100n
REFERENCE
7XX : FOR DK
3XX : POWER, CHARGE
5XX : BBIC6XX : FLASH, EEPROM, KEY, LCD
4XX : MIC, SP
1XX : TEL LINE
8XX : RF
DC/DC CONVERTOR
(YELLOW)
(GREEN)
IC302
IC301
IC611
*IC601
*IC331
*IC501
(1)(2)(3)(4)
(5)
(6)
1.2V
3.0V
3.0V
Rx Tx
Caller ID
Bell
!
66
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
14.3. Schematic Diagram (Handset_Main)
BATT+
BATT-
0.1R45
BATTERY
+1.8V
GND
1kR66
C45K0.1u
C121NC
+1.8V
GND
1uC4
7
GND
GND GNDGND
GND
GND
GND
GNDGND
GND
GND
C44K0.1u
GND
1.2kR7
100
R8
CP+4.0V
+1.8V
k0.1
uC
40
RF_RXp
PONPSEL
VDD_PADRV
TXpTXn
TXON
RXONRF_RXn
CP+3.0V
0R215
Q7
Q2
Q4
BATTERY
1uC50
1uC49
CP+4.0V
SO
FT
_C
12
SO
FT
_B
12
SO
FT
_A
12
SH
AR
P
12
AS
T
12
GND
8
12
TA
LK
12
4
12
7
12
3
12
9
12
1
12
6
12
2
12
0
12
5
12
S11 2
100
R63
F56
kR
203
10k
R64
BATTERY
GND
NCR2
C43
10p
C46
10p
NC
C39
GND
CP+3.0V
Q9
10R20
NCR6
*LE
D3
*LE
D2
*LE
D1
*LED12
D11MR330
1uC332
Q11
Q12
GND
GND
27kR332
BATTERY
27kR331
GND
GND
1kRA
1
1 2 3 45678
GND
K10uC53
K10uC52
D10pC54
GNDD10pC55
K1uC51
820R27
K10
u
C12
C17
D10p
K0.
1uC
11
K0.
1uC
13
3.3kRA4
VREFmC18D10p
D10
pC
96
820R28
D10
pC
97
VREFm
NCC4
8
GND
0R225
K2.2uC10
6.3V330u
CP2C2
GND
RE2RF-SHIELD
12
3
45
6
GND
UTXURXGND
JTAG
BAT
CP4.0VCP3.0V
POWER
CKM
1.8V
CHG(+)
CHG(-)
STM
NC
C3
NC
C15
0
220RA61
1
2 3
4
6.3V330u
C1CP1
1uC331
C18
2
3p
*R2480
GND
NCR4
GND
NC
R400
GNDGND
NCC400
NC
D400
NC
R40
5
Q400NC
GND
Q401NC
+1.8V
NCR401
NCR404
NC
R40
2
NCR403
NCR406
NC
R407
LEF
T12
DO
WN
12
RIG
HT
12
UP
12
R
12S
P
12
L47
L46
330*RA30
12345 6 7 8
1.5k
R30
1k
R3
*LE
D22
*LE
D23
1kR23
100R31C
147
NC
120*RA32
12345 6 7 8
Power_adj
330*RA31
1 234
K1u
C5
D7
NCC340
J39pC341
NCC342
GND GND GND
NC
C38
NC
*C13
8
NC
*C13
9
*LE
D5
*LE
D7
*LE
D4
*LE
D6
*LE
D8
*LE
D9
*X1
10.368M13
2
*LE
D21
NC
NC
NC
NC*R249
1V
SS
_LN
A1
2R
F_R
Xp
21CIDINp/VREFp
3R
F_R
Xn
4V
SS
_LN
A2
5R
FP
16
RF
P0
7R
EF
_RE
S8
AV
S_X
TA
L
22RINGp/P3_7
23RINGn/P3_6
24RINGOUT/RINGING/P3_5
25PARADET/P3_4
26ADC0/P3_3
27ADC1/INT0/P1_0
28NTC/ADC2
41C
P_C
2y
42C
P_V
OU
T1/
LED
1
43C
P_V
OU
T2/
LED
2
44P
ON
/P1_
6
45V
DD
1
46P
2_7/
BX
TA
L
81
GND
9X
TA
L210
XT
AL1
11A
VD
_XT
AL
12R
F_S
UP
PLY
113
LDO
_CT
RL
14A
VD
15LS
Rn
16LS
Rp
17V
RE
Fm
18M
ICh
19C
IDO
UT/
MIC
n20
CID
INn/
MIC
p
29SOCp
30SOCn
31CHARGE_CTRL
32P1_7/CHARGE
33PAOUTp/P3_1
34VDDPA
35PAOUTn/P3_0
36VBAT1
37CP_C1x
38CP_C2x
39CP_C1y
40VBAT2
47P
1_5/
INT
5/R
DI/V
DD
E
48P
1_4/
INT
4/T
DO
D
49P
1_3/
INT
3/S
IO
50P
1_2/
INT
2/S
K
51P
1_1/
INT
1/LE
52P
2_6/
WT
F_I
N
53P
0_7/
SP
I_D
I
54P
0_6/
SP
I_D
O
55P
0_5/
SP
I_C
LK
56P
0_4/
SP
I_E
N
57P
0_3/
SC
L2
58P
0_2/
SD
A2
59P
0_1/
UR
X
60P
0_0/
UT
X
61 RSTn62 JTAG63 P2_5/PCM_FSC/SF64 P2_4/SCL1/PCM_DO/DP365 P2_3/SDA1/PCM_DI/DP266 P2_2/PCM_CLK/CLK10067 P2_1/ECZ2/PWM1/LED468 P2_0/ECZ1/PWM0/LED369 VDD270 LDORF_CTRL71 RF_SUPPLY272 RFP0n73 RFP4
76 VSS_PADR1
79 VSS_PADR2
77 RF_TXp
80 RFP2
75 VDD_PADR
78 RF_TXn
74 RFP3
F1
5.6n
J56pC35
LDO
_CT
RL
COL0
CHARGE_CTRLCHARGE
UTX
COL0COL1COL2COL3COL4
RO
W3
RO
W2
RO
W1
CH
AR
GE
CH
AR
GE
_CT
RL
COL4
KE
Y_L
ED
BELL_LED_AURX
LDO
_CT
RL
LCD_RESET
LCD
_CD
LCD
_SC
LLC
D_S
DA
JTAG
SO
Cp
LCD_CSB
RO
W0
SO
Cn
BE
LL_L
ED
_A
CO
L5
COL1
COL2
COL5
RO
W0
COL3
RO
W1
RO
W3
RO
W2
SOCpSOCn
KE
Y_L
ED
CHARGETerminal
BATTERY
BELL LED(Amber)
TO RF BLOCK
[RU][EX /FX]
To PA
(MAX500mA)
KEY B/L LCD B/L
*IC1
(1)(2)(3)
(4)
(6)(5)
(8)
(9)(10)
(11)(12)
(13)(14)
(15)
(7)
Charge Current
3.0V 4.0V
1.8V
0.75V
0V
250mVp-p
TX _RF
RX _RF
NC: No Components
67
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
BATTERY
GND
GND
GND
CP+3.0V
CP+3.0V
K1uC188
NC
C70
GND
D21
D22
NC
C71
GNDD10pC113
D3NC
GND
D4NC
GND
GND
NC
C72
GND
NC
C73
GND
3.3n
C81
4
220
R806
GND TXp
47R805GND
GND
VDD_PADRV
TXON
GND GND
100n
C80
8
GND
PON
GND
BATTERY
GND
1PSET 2VCCS 3
PI 4PIX7 PSEL
8 POX
9 PO
10 VCC
11
GND
5PRAMP6 PAON
GNDTXn
PSEL
GND
GND
GNDGNDGND
RF_RXp
RXON
GND
GNDGND
RF_RXn
220
R807
NC
C83
7GND
VS
SC
N5
10
GN
DC
N5
1
RE
SE
TB
CN
54
V0
CN
511
VD
DC
N5
8
SC
LKC
N5
6
LCD
_CS
BC
N5
3
A0
CN
55
OP
T_P
WR
CN
52
VD
DA
CN
59
SID
CN
57
GN
DC
N5
12
k1000pC152
DA8011
23
27n
L801
AP1MIC1
2
TP_ANT1
3p
C86
1
C82
0
NC
100p
*C10
33.
3k*R
53
NC
*C10
6
10k
*R54
GND
100p
*C10
5
GND
GND470
*R51
GND GNDGND GND
NC
*C187
NC
*C186
1kR55
10k
*R50
NC
*C17
5
NC
*R57
8
GND
GND
GND
3.6n
L802
3.6n
L803
3.3p
C80
6
1.6p
C81
01.
6p
C81
3
3.3p
C80
5
GND
NC
R80
8
VREFm
C74D10pC75
D10pVREFm
82R73
82R74
D13
D14
10kRA40
1 2 3 45678
K0.1uC172
RCV+
RCV-
MIC-
MIC+
1*C
200
1*C
201
1*C
203
820k
*R23
143
0k*R
232
0.1*C204
NC
*R233
1kRA800
12 3
4
NC
*R23
6
NC*C20
6
CN51
13C
AP
1+CN
5114
VS
SCN
5115
/RE
S
CN51
7V
0
CN51
9V
OU
T
CN51
4S
ICN
515
SC
L
CN51
10C
AP
2-
CN51
8V
R
CN51
3/C
S
CN51
11C
AP
2+
CN51
1G
ND
CN51
16G
ND
CN51
12C
AP
1-
CN51
2R
S
CN51
6V
DD
Q880NC
GND
GND GND
Power_adj
NC
C88
1
NC
R88
0
2p
C80
4
2p
C80
2
1.5p
C803
GNDGND
GNDGND
RECEIVER
1 +
2 -
SP-PHONE_SPEAKER
1+
2-
J33p
*C10
7
10p
C80
9
10p
C81
1
10p
C812
10p
C81
9
10p
C82
2
10p
C82
5
10p
C827
10p
C86
0N
CC
863
NC
C86
4
NC
C88
0
10p
*C10
4
NC
*C58
0
1k*R
52
Q10NC
NCR36
NCC30 NC
R37
BATTERY
GND
1.2k
*R80
1
100
*R80
2
1p*C834
1A0
2A1
3A2
4GND
5SDA
6SCL
7WP
8VCC
4p
*C826
LCD_SDALCD_SCLLCD_CDLCD_RESETLCD_CSB
LSRp
LSRn
MICp
MICn
to LCD UNIT (Monochrome 1.8inc FullDot/for TGA651)
LSRp
LSRn
LSRp
Pre-matching
W 0.15mmL 3.0mm x21st layer
W 0.15mmL 20+/-2mm3rd layer
W 0.15mmL 20+/-1mm3rd layer
Balun
BPF W 0.15mmL 5.0mm1st layer
W 0.15mmL 5.0mm1st layer
W 0.15mmL 20+/-2mm3rd layer
W 0.125mmL 7.6mmGap 0.125mm1st layer
to LCD UNIT (Monochrome 1.4inc 3Line/for TGA250)
R801:220kR808:NC
*IC3
IC801
(1)(2)(3)
(4)
(6)(5)
(8)
(9)(10)
(11)(12)
(13)(14)
(15)
(7)
KX-TGA403 SCHEMATIC DIAGRAM (Handset_Main)
RX_RF
TX_RF
TX _AF
RX-AF (Handset)
Sp-phone RX/Beep
68
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
14.4. Schematic Diagram (Charger Unit)
J1
2
1
TP3
G
TP2
TP1
TP4
R1 12F1
SCHEMATIC DIAGRAM (Charger Unit)
!
69
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
15 Printed Circuit Board15.1. Circuit Board (Base Unit_Main)15.1.1. Component View
CL2
C477
C478
SP
PS
PN
C530
C321
DC
DC
_OU
T
C322
C476
FC
T
RS
TN
ST
M/C
KM
/P15
C343
C511
C510
C165
C163
C351
CH
AR
GE
+C
HA
RG
E-C
514C
181
C171
C121C
122
C152
C125
C112
C352
AN
T2
CL1
R502
RT
CK
R322
R321
R302
R605
R606
R612
R335
R602
R603
R112
R178
VC
CA
VR
EF
R166
R164
R161
R136
VD
DC
R151
R152
R115
R121
L371
L1TL1R
L476
L474
L372
L362
IC601
IC302
IC611
RA
151
RA
504
D361
D473
D472
D153 D
133
D363
Q161
Q601
C142
C513
C167
C512
C186
C184
C601C479
C307
C301
C332
C521
C133
C123C472
C473
C475
C120C124
C151C525
C524
C611
C115
C168
C126
C661
R165
F301 DC
PD
CM
R512
R507
R307
R607
R601
R304 R305R301
R505
R506
R334
R604
R181
R162
R503
R167
R163
R122
L361
RA502
D142
D143
CH
G+
2C
HG
-2
KX-TG4011/4012/4013 CIRCUIT BOARD (Base Unit_Main (Component View))
B
+6.5V
RT
CK
E4
4
3
581
+3.0V
VB
AT
TM
S
TC
K
TD
I
TD
O
VB
G
GN
DU
TX
UR
X
3.0A
AN
T1
PN
LB1712Z
PbF
CH
G
SP
DC
RE
DR
ED
RE
D
WH
TB
LK
BLK
YLW
GR
N
GND
URX
VDDC
+3.0V
for JIG UTX
STM/CKM
VBAT
70
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
15.1.2. Bottom View
KX-TG4011/4012/4013 CIRCUIT BOARD (Base Unit_Main (Bottom View))
KX
-TG
65X
X/7
5XX
/40X
X
CH
G
SP
AN
T1
AN
T2
1 1
WB
X01
B
TE
LD
C
RE
DR
ED
RE
D
WH
TB
LK
BLK
E
YLW
GR
N PN
LB17
12ZP
bF
C17
8C
175
C11
1
C34
1
JJ30
1
C30
8C
517
C82
6C
863
C82
7
C82
2C
892
C30
2
C89
4
C33
1
C52
3
C50
2
C50
1
C50
7C
522
C80
6
C813
C810
C50
4
C52
0
R11
4R
372
R17
2R
177
R33
2
KE
YS
_E
110
KE
YS
_D KE
YS
_CKE
YIN
3
KE
YIN
2
KE
YIN
1 NCA
NS
_LE
D
MS
G_L
ED
2AP
VC
C
ZA
1R
331
IC50
1
IC33
1S
W1
Q14
1Q
143
Q11
1Q
651
C176
C113
C174
C161
C164
C173
C509C508
C812
C306
C515
C304
C519
C305
C303
C518
C516
C805
C859
C896
C342
C503
C660
C659
C658
C656
C655
C654
C653
C652
C651
C172
C506
C505C185
X501
R160
R111
R113
R175 R176
R171
R509R806R891
R144
R142
R892
R807
R333
R652
R651
R501
R371
L102
L101
L809
L301
IC301
SA101
SA103
C893
RA501
D101
D113
D331
Q171
Q142
Q301
C10
1
C10
2
C82
5 C89
1
C13
2
C82
0
C81
1
C89
5
P10
1
HA
K_C
L1
R14
1
R13
3 R14
5
R13
1D
A80
1
DA
802
71
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
15.2. Circuit Board (Handset_Main)15.2.1. Component View
KX-TGA403 CIRCUIT BOARD (Handset_Main (Component View))
A
PbF
C44
C880
C811
C813
C72
C203
C105
C206
C201
C175 C70C152
C71
C200
C107
C106
C103
C104
C73
C864C863C814
C834
C802
C804
C43
C837
C48 C40C54
C52C53
C51
C55
C39 C30
C10
C400
C340
C341
C342
C332
C331
C147
C113C5
JTAGSTM
URXUTX
CHG(+)
MIC+ MIC-
CHG(-)
BATT-BATT+
BAT
MIC-
RCV-
E
1 4
8 5
MIC+
RCV+
R578
R50R53R236
R54
R231
R801
R802
R805 R880
R808
R66R63
R225
R405
R203
R807
R27R400R402
R248
R249
21
1
R23R37R36
R20CLK
1.8V
R7R30
F1
R2
R332
R331
R330
R3R8
R4
L802
IC3
TP_ANT1
RA800
RA4
RA40
CP3.0V
CP4.0V
D22D21
D13
RED
BLK
RED
BLK
D14
D400
D7
D3 D4
Q401
POWER
Q400
Q11
Q12
GND
C580
C187
C186
C204
C827
C881
C819
C45
C46
C825
C809
C810 C
861
C808
C812
C806
C138
C139
C803
C805
C47
C822
C826
C820
C860
C182
C49
C50
C188
C12
C13
C11
C96C
18
C17
C97
C38
C35
C121
C150
C1
C2
C172
C75
C74
C3
X1
MIC
R232
R55
SP
EA
KE
R
R233
R806
R64
R28
R403R
404
R406
R407
R401
R215
R45
R74
R31
R6
R73
L801
L803
L46L47
IC801
IC1
RA
32
RA
1
RA
61
RA
31R
A30
DA
801
D1
Q880
Q2
Q10
Q7
Q4
Q9
RECEIVER
PNLB1734YKX-TGA650XXKX-TGA651XXKX-TGA250XXKX-TGA251XXKX-TGA403XX
TGA250XXTGA251XXTGA403XX
TGA650XXTGA651XX
RCV-
RCV+
SP+
SP-
X_CLK(10.368MHZ)
GNDBATBATT-
UTXURX
JIGBATT+
CHG (+) CHG (-)
72
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
15.2.2. Bottom View
KX-TGA403 CIRCUIT BOARD (Handset_Main (Bottom View))
1 2
PbF
PNLB1734Y
12 1
3
SP RDOWN
LEFT
SOFT_A SOFT_B
R52
R51
TGA250XXTGA251XXTGA403XX
TGA650XXTGA651XX
KX-TGA650XXKX-TGA651XXKX-TGA250XXKX-TGA251XXKX-TGA403XX
CN51
CN5
SOFT_C
RIGHT
TALKUP
S1
4 5 6
7
MIC
8 9
LED
4LE
D7
LED12
LED
21
LED
22
LED
23
LED
1
LED
2
LED
3
LED8 LED6
LED
9LE
D5
0 #
A
73
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
15.3. Circuit Board (Charger Unit)15.3.1. Component View
15.3.2. Bottom View
J1R1
A
PQ
UP
11532YPb
F
PN
LP1029Y
ACIRCUIT BOARD (Charger unit (Component View))
TP
4
TP
3
1
2
J1
A
F1Pb
FP
NLP
1029YA
PQ
UP
11532Y
CIRCUIT BOARD (Charger unit (Bottom View))
TP4 (GND)
TP3
74
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
16 Exploded View and Replacement Parts List16.1. Cabinet and Electrical Parts (Base Unit)
Note:(*1) The SPACERs (No.7) are cut from the excess parts of SPACER (No.108) of Cabinet and Electrical Parts (Handset)(P.75).
13
4
2
7(*1)
7(*1)
6
5
6
PCB1
8
9 A
Ref.No. Figure
A2.6 8 mm
75
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
16.2. Cabinet and Electrical Parts (Handset)
Note:(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.44).(*2) The rechargeable Ni-MH battery HHR-4DPA or HHR-4MRT is available through sales route of Panasonic.(*3) Attach the SPACER (No. 119) to the exact location described above.
102103
104 E103
E105
E102
E101(*1)
111
115116
105106
110
113
B
(*2)
118 120
119 (*3)
101109
E104
112
E106
B
E107
MIC100
PCB100
108
B117
114
107
Spacer (No.119)
Battery cover
Put it in the center.
Stick it betweenribs.
Ref.No.
2 8 mmB
Figure
76
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
16.3. Cabinet and Electrical Parts (Charger Unit)
B
200
200-1
200-3
200-4
200-2
B
PCB200
Ref.No.
B
Figure
77
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
16.4. AccessoriesA2A1
78
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
16.5. Replacement Parts List1. RTL (Retention Time Limited)
Note:The “RTL” marking indicates that its Retention Time isLimited.When production is discontinued, this item willcontinue to be available only for a specific period oftime.This period of time depends on the type of item, andthe local laws governing parts and product retention.At the end of this period, the item will no longer beavailable.
2. Important safety noticeComponents identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufacture's parts.
3. The S mark means the part is one of some identical parts. For that reason, it may be different from the installed part.
4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics.
5. RESISTORS & CAPACITORSUnless otherwise specified;All resistors are in ohms (Ω) k=1000Ω, M=1000kΩAll capacitors are in MICRO FARADS (µF) p=µµF*Type & Wattage of Resistor
16.5.1. Base Unit16.5.1.1. Cabinet and Electrical Parts
16.5.1.2. Main P.C. Board PartsNote:
(*1) When replacing IC611 or X501, make the adjustmentusing PNZZTG4011AG Refer to How to download thedata (P.52) of Things to Do after Replacing IC or X'tal.
Safety Ref. No.
Part No. Part Name & Description Remarks
1 PNKM1129T3 CABINET BODY PS-HB
2 PNBC1303Z2 BUTTON, LOCATOR ABS-HB
3 K2ECYZ000001 JACK, DC
4 PQJJ1T039S JACK, MODULAR
5 PNJT1046Z CHARGE TERMINAL
6 PNLA1030Z ANTENNA
7 PNYE1027Z SPACER, ANTENNA
8 PNKF1097Z1 CABINET COVER PS-HB
9 PQHA10023Z RUBBER PARTS,FOOT CUSH-ION
Safety Ref. No.
Part No. Part Name & Description Remarks
PCB1 PNWPG4011AGH MAIN P.C.BOARD ASS'Y(RTL)
(ICs)
IC302 C0CBAYG00016 IC S
IC501 C2HBCY000064 IC(BBIC)
IC611 PNWIG4011AGH IC(EEPROM)(*1)
(TRANSISTORS)
Q111 2SC6054JSL TRANSISTOR(SI)
Q141 B1ACGP000008 TRANSISTOR(SI)
Q142 PQVTBF822T7 TRANSISTOR(SI)
Q161 2SD0874AS TRANSISTOR(SI)
Q171 2SC6054JSL TRANSISTOR(SI)
(DIODES)
D101 PQVDMD5S DIODE(SI)
D113 MA111 DIODE(SI) S
D133 MA111 DIODE(SI) S
D143 MANV250GEL DIODE(SI)
DA801 B0DDCD000001 DIODE(SI)
DA802 B0DDCD000001 DIODE(SI)
(COILS)
L101 PQLQXF330K COIL S
L102 PQLQXF330K COIL S
L361 G1CR22J00006 COIL
L371 G1CR22J00006 COIL
L501 G1CR10J00010 COIL
L809 G1C7N5JA0044 COIL
(RESISTOR ARRAYS)
RA151 D1H410220001 RESISTOR ARRAY
RA501 EXB28V330 RESISTOR ARRAY
RA502 EXB28V103 RESISTOR ARRAY
RA504 D1H468020001 RESISTOR ARRAY
(VARISTOR)
SA101 J0LF00000048 VARISTOR (SURGEABSORBER)
(RESISTORS)
R111 PQ4R10XJ104 100k S
R112 PQ4R10XJ104 100k S
R113 ERJ3GEYJ103 10k S
R114 ERJ3GEYJ473 47k S
R121 ERJ3GEYJ394 390k S
R122 ERJ3GEYJ394 390k S
R131 PQ4R18XJ106 10M S
R133 ERJ3GEYJ334 330k S
R141 ERJ3GEYJ104 100k S
R142 PQ4R18XJ272 2.7k S
R145 ERJ2GEJ222 2.2k S
R151 ERJ2GEJ104 100k S
R152 ERJ2GEJ474X 470k S
R160 ERJ3GEYJ911 910 S
R161 ERJ3GEYJ104 100k S
R162 ERJ3GEYJ273 27k S
R163 ERJ12YJ120 12
R164 ERJ3GEYJ272 2.7k S
R165 ERJ3GEYJ273 27k S
R167 ERJ12YJ270 27
R171 ERJ2GEJ220 22 S
R172 ERJ2GEJ104 100k S
R175 ERJ2GEJ561 560 S
R176 ERJ2GEJ101 100 S
R178 ERJ2GEJ102 1k S
R181 ERJ2GE0R00 0 S
R321 ERJ2RKF1400 140
R322 ERJ2RKF1000 100
R334 ERJ2GEJ473 47k S
R335 ERJ2GE0R00 0 S
R371 ERJ1TYJ5R6U 5.6
79
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
16.5.2. Handset16.5.2.1. Cabinet and Electrical Parts
16.5.2.2. Main P.C. Board PartsNote:
(*1) Reconfirm the model No. written on the handset's nameplate when replacing PCB100. Because the model No. ofthe optional handset may differ from the included handset.(*2) When replacing IC3 or X1, make the adjustmentusing PNZZTG4011AG. Refer to Handset (P.53) of Thingsto Do after Replacing IC or X'tal.(*3) When replacing the handset LCD, See How to Replace the Handset LCD (P.44).(*4) When removing E106, use special tools (ex. Hot airdisordering tool).
R372 ERJ1TYJ5R6U 5.6
R501 ERJ3GEYJ100 10 S
R502 ERJ2GEJ330 33 S
R505 ERJ2GEJ222 2.2k S
R507 ERJ2GEJ102 1k S
R605 ERJ2GEJ332 3.3k S
R606 ERJ2GEJ332 3.3k S
R612 ERJ2GEJ103 10k S
R806 ERJ2GEJ471 470 S
R807 ERJ2GEJ471 470 S
R891 ERJ2GEJ471 470 S
R892 ERJ2GEJ471 470 S
(CAPACITORS)
C101 F1K2H681A008 680p
C102 F1K2H681A008 680p
C111 F1J2A473A024 0.047
C112 F1J2A473A024 0.047
C113 PQCUV1A684KB 0.68
C120 ECUE1H102KBQ 0.001
C121 F1K2H681A008 680p
C122 F1K2H681A008 680p
C123 ECUE1H100DCQ 10p
C126 ECUE1H100DCQ 10p
C132 ECUV1H103KBV 0.01
C142 ECUV1H103KBV 0.01
C151 ECUE1H100DCQ 10p
C152 ECUE1C103KBQ 0.01
C161 F2G1H1000009 10
C167 ECUV1H102KBV 0.001
C171 ECUV1C223KBV 0.022
C173 ECUV1A224KBV 0.22
C175 ECUE1H102KBQ 0.001
C176 PQCUV0J106KB 10
C178 ECUE1C223KBQ 0.022
C184 ECUV1A105KBV 1
C186 ECUE1H100DCQ 10p
C302 ECUE1H100DCQ 10p
C321 ECUV1A105KBV 1
C322 ECUE1H100DCQ 10p
C341 F2A1A3310040 330
C342 ECUV1C104KBV 0.1
C343 ECUE1H100DCQ 10p
C351 ECUV1C105KBV 1
C352 ECUV1C104KBV 0.1
C476 ECUE1H100DCQ 10p
C477 ECUE1H100DCQ 10p
C478 ECUE1H100DCQ 10p
C479 ECUE1H100DCQ 10p
C501 ECUE1A104KBQ 0.1
C502 ECJ1VB0G106M 10
C503 ECJ1VB0G106M 10
C504 ECUE0J105KBQ 1
C505 ECJ1VB0G106M 10
C506 ECUV1A105KBV 1
C507 ECUV1A225KB 2.2
C508 ECUE1H100DCQ 10p
C509 ECUE1H120JCQ 12p
C510 ECUV1A105KBV 1
C511 ECJ1VB0G106M 10
C512 ECUE1A104KBQ 0.1
C513 ECUV1A225KB 2.2
C514 ECUE1A104KBQ 0.1
C515 ECUV1A105KBV 1
C516 ECUE1A104KBQ 0.1
C517 ECUE1A104KBQ 0.1
C518 ECUE1A104KBQ 0.1
C519 ECUE1A104KBQ 0.1
C520 ECUE1A104KBQ 0.1
C521 ECUE0J105KBQ 1
C522 ECUE1H100DCQ 10p
C530 ECUE1H100DCQ 10p
C611 ECUE1A104KBQ 0.1
C805 F1G1H2R7A480 2.7p
Safety Ref. No.
Part No. Part Name & Description Remarks
C806 F1G1H2R7A480 2.7p
C810 F1G1H2R4A480 2.4p
C811 F1G1H100A723 10p
C812 F1G1HR90A480 0.9p
C813 F1G1H2R0A480 2p
C820 F1G1H1R5A480 1.5p
C822 F1G1H100A723 10p
C825 F1G1H100A723 10p
C826 F1G1H100A723 10p
C827 F1G1H100A723 10p
C859 F1G1H2R2A480 2.2p
C863 F1G1H1R5A480 1.5p
C891 F1G1H5R0A480 5p
C892 F1G1H5R0A480 5p
C893 F1G1H3R0A480 3p
C894 F1G1H2R2A480 2.2p
C895 F1G1H1R2A480 1.2p
C896 F1G1H2R2A480 2.2p
(OTHERS)
P101 D4DAY220A022 THERMISTOR (POSISTOR) S
SW1 K0H1BA000259 SPECIAL SWITCH
F301 K5H302Y00003 FUSE S
X501 H0J138500011 CRYSTAL OSCILLATOR (*1)
Safety Ref. No.
Part No. Part Name & Description Remarks
101 PNGP1087Y5 PANEL, LCD PMMA-HB
102 PNYE1026Z TAPE, DOUBLESIDED
103 PNKM1123Y6 CABINET BODY PS-HB
104 PNHS1072Z SPACER, RECEIVER NET
105 PQHS10467Z COVER, SPEAKER NET
106 L0AD02A00043 RECEIVER
107 PQHG10729Z RUBBER PARTS, RECEIVER
108 PNYE1027Z SPACER, CUSHION LCD
109 PNBC1003Y3 BUTTON, VOLUME KEY ABS-HB
110 PNJK1071V KEYBOARD SWITCH
111 PNHX1165Z COVER, LCD SHEET
112 PNJT1027Z CHARGE TERMINAL (L)
113 PNJT1026Z CHARGE TERMINAL (R)
114 PQHR11315Z GUIDE, SPEAKER ABS-HB
115 L0AA02A00095 SPEAKER
116 PQHS10784Y SPACER, SPEAKER NET
117 PQJC10056W BATTERY TERMINAL
118 PNKF1093Z1 CABINET COVER ABS-HB
119 PNHS1079Z SPACER, BATTERY
120 PNKK1038Y1 LID, BATTERY ABS-HB
Safety Ref. No.
Part No. Part Name & Description Remarks
PCB100 PNWPGA403AGR MAIN P.C.BOARD ASS'Y(RTL) (*1)
(ICs)
IC1 C1CB00003361 IC (BBIC (FLASH))
Safety Ref. No.
Part No. Part Name & Description Remarks
80
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
IC3 PNWIGA403AGR IC (EEPROM) (*2)
IC801 C1CB00001842 IC
(TRANSISTORS)
Q2 B1ADGE000004 TRANSISTOR(SI)
Q4 B1ADGE000004 TRANSISTOR(SI)
Q7 UN9219J TRANSISTOR(SI) S
Q9 2SC6054JSL TRANSISTOR(SI)
Q11 B1ADCF000161 TRANSISTOR(SI)
Q12 B1ADCF000161 TRANSISTOR(SI)
(DIODES)
D1 MA2YD2120L DIODE(SI)
D7 MA2ZD0200L DIODE(SI)
D13 MA8043M DIODE(SI) S
D14 MA8043M DIODE(SI) S
D21 MA8043M DIODE(SI) S
D22 MA8043M DIODE(SI) S
DA801 B0DDCD000001 DIODE(SI)
(LEDS)
LED4 B3ACB0000190 LED
LED5 B3ACB0000190 LED
LED6 B3ACB0000190 LED
LED7 B3ACB0000190 LED
LED8 B3ACB0000190 LED
LED9 B3ACB0000190 LED
LED21 B3ACB0000216 LED
LED22 B3ACB0000216 LED
LED23 B3ACB0000216 LED
(COILS)
F1 PQLQR2M5N6K COIL S
L801 G1C27NJ00010 COIL
L802 G1C3N6ZA0063 COIL
L803 G1C3N6ZA0063 COIL
(RESISTOR ARRAYS)
RA1 D1H810240004 RESISTOR ARRAY S
RA4 D1H433220001 RESISTOR ARRAY
RA30 D1H83314A013 RESISTOR ARRAY S
RA31 D1H433120001 RESISTOR ARRAY
RA32 EXB28V121JX RESISTOR ARRAY
RA40 EXB28V103 RESISTOR ARRAY
RA61 D1H422120001 RESISTOR ARRAY
RA800 D1H410220001 RESISTOR ARRAY
(IC FILTERS)
L46 J0JDC0000045 IC FILTER
L47 J0JDC0000045 IC FILTER
(RESISTORS)
R3 ERJ2GEJ102 1k S
R7 ERJ2GEJ122 1.2k S
R8 ERJ2GEJ101 100 S
R20 ERJ2GEJ100 10 S
R23 ERJ2GEJ102 1k S
R27 ERJ2GEJ821 820 S
R28 ERJ2GEJ821 820 S
R30 ERJ3GEYJ152 1.5k S
R31 ERJ2GEJ101 100 S
R45 ERJ6RSJR10V 0.1
R50 ERJ2GEJ103 10k S
R51 ERJ2GEJ471 470 S
R52 ERJ2GEJ102 1k S
R53 ERJ2GEJ332 3.3k S
R54 ERJ2GEJ103 10k S
R55 ERJ2GEJ102 1k S
R63 ERJ2GEJ101 100 S
R64 ERJ2GEJ103 10k S
R66 ERJ2GEJ102 1k S
R73 ERJ2GEJ820 82 S
R74 ERJ2GEJ820 82 S
R203 D0GA563ZA006 56k
R215 ERJ2GE0R00 0 S
R225 ERJ2GE0R00 0 S
R231 ERJ2GEJ824 820k S
R232 ERJ2GEJ434X 430k S
R248 ERJ2GE0R00 0 S
R330 ERJ2GEJ105X 1M S
Safety Ref. No.
Part No. Part Name & Description Remarks
R331 ERJ2GEJ273X 27k S
R332 ERJ2GEJ273X 27k S
R801 ERJ2GEJ122 1.2k S
R802 ERJ2GEJ101 100 S
R805 ERJ2GEJ470 47 S
R806 ERJ2GEJ221 220 S
R807 ERJ2GEJ221 220 S
(CAPACITORS)
C1 F2A0J3310067 330
C2 F2A0J3310067 330
C5 ECUV1A105KBV 1
C10 ECUV1A225KB 2.2
C11 ECUE1A104KBQ 0.1
C12 PQCUV0J106KB 10
C13 ECUE1A104KBQ 0.1
C17 ECUE1H100DCQ 10p
C18 ECUE1H100DCQ 10p
C35 ECUE1H560JCQ 56p
C40 ECUE1A104KBQ 0.1
C43 ECUE1H100DCQ 10p
C44 ECUE1A104KBQ 0.1
C45 ECUE1A104KBQ 0.1
C46 ECUE1H100DCQ 10p
C47 ECUV1A105KBV 1
C49 ECUV1A105KBV 1
C50 ECUV1A105KBV 1
C51 ECUV1A105KBV 1
C52 PQCUV0J106KB 10
C53 PQCUV0J106KB 10
C54 ECUE1H100DCQ 10p
C55 ECUE1H100DCQ 10p
C72 ECUE1H100DCQ 10p
C73 ECUE1H100DCQ 10p
C74 ECUE1H100DCQ 10p
C75 ECUE1H100DCQ 10p
C96 ECUE1H100DCQ 10p
C97 ECUE1H100DCQ 10p
C103 ECUE1H101JCQ 100p
C104 F1G1H100A723 10p
C105 ECUE1H101JCQ 100p
C107 ECUE1H330JCQ 33p S
C113 ECUE1H100DCQ 10p
C152 ECUE1H102KBQ 0.001
C172 ECUE1A104KBQ 0.1
C182 F1G1H3R0A480 3p
C188 ECUE0J105KBQ 1
C200 ECUV1C105KBV 1
C201 ECUV1C105KBV 1
C203 ECUV1C105KBV 1
C204 ECUV1C104KBV 0.1
C331 ECUE0J105KBQ 1
C332 ECUE0J105KBQ 1
C341 ECUE1H390JCQ 39p
C802 F1G1H2R0A480 2.0p
C803 F1G1H1R5A480 1.5p
C804 F1G1H2R0A480 2.0p
C805 F1G1H3R3A480 3.3p
C806 F1G1H3R3A480 3.3p
C808 ECUE1A104KBQ 0.1
C809 F1G1H100A723 10p
C810 F1G1H1R6A480 1.6p
C811 F1G1H100A723 10p
C812 F1G1H100A723 10p
C813 F1G1H1R6A480 1.6p
C814 ECUE1H332KBQ 0.0033
C819 F1G1H100A723 10p
C822 F1G1H100A723 10p
C825 F1G1H100A723 10p
C826 F1G1H4R0A480 4p
C827 F1G1H100A723 10p
C834 F1G1H1R0A480 1p
C860 F1G1H100A723 10p
C861 F1G1H3R0A480 3p
Safety Ref. No.
Part No. Part Name & Description Remarks
81
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
16.5.3. Charger Unit16.5.3.1. Cabinet and Electrical Parts
16.5.3.2. Main P.C. Board Parts
16.5.4. AccessoriesNote:
You can download and refer to the Operating Instructions(Instruction book) on TSN Server.
16.5.5. Screws
16.5.6. Fixtures and ToolsNote:
(*1) See Equipment Required (P.45), and The SettingMethod of JIG (P.45)(*2) When replacing the Handset LCD, See How toReplace the Handset LCD (P.44)
T.IKXTG4011AGTKXTG4012AGTKXTG4013AGTKXTGA403AGT
(OTHERS)
MIC100 L0CBAY000032 MICROPHONE
E101 L5DYBYY00012 LIQUID CRYSTAL DISPLAY(*3)
E102 PNHR1247Z TRANSPARENT PLATE, LCD PMMA-HB
E103 PNHR1246Z GUIDE, LCD ABS-HB
E104 PNHX1254Z COVER, LCD
E105 PNLA1020Z ANTENNA
E106 PNMC1013Z CASE,MAGNETIC SHIELD(*4)
E107 PNVE1002Z BATTERY TERMINAL
X1 H0J103500033 CRYSTAL OSCILLATOR (*2)
Safety Ref. No.
Part No. Part Name & Description Remarks
200 PNLC1010ZT CHARGER UNIT ASS'Ywithout NAME PLATE(RTL)(for KX-TG4012LAT)(for KX-TG4013LAT)
200-1 PNKM1131Y2 CABINET BODY PS-HB
200-2 PNJT1010Z CHARGE TERMINAL
200-3 PNKF1098Z1 CABINET COVER PS-HB
200-4 PQHA10023Z RUBBER PARTS, FOOTCUSHION
Safety Ref. No.
Part No. Part Name & Description Remarks
PCB200 PNWPTGA641CH MAIN P.C.BOARD ASS'Y(RTL)
(JACK)
J1 K2ECYB000001 JACK S
(RESISTOR)
R1 ERG2SJ120 12
(FUSE)
F1 K5H302Y00003 FUSE
Safety Ref. No.
Part No. Part Name & Description Remarks
A1 PQLV219AGY AC ADAPTOR
A2 PQJA10075Z CORD, TELEPHONE
Safety Ref. No.
Part No. Part Name & Description Remarks
A XTB26+8GFJ TAPPING SCREW
B XTB2+8GFJ TAPPING SCREW
Safety Ref. No.
Part No. Part Name & Description Remarks
Safety Ref. No.
Part No. Part Name & Description Remarks
PQZZ1CD300E JIG CABLE (*1)
PNZZTG4011AG BATCH FILE CD-ROM (*1)
PQZZ430PIR TIP OF SOLDERING IRON (*2)
PQZZ430PRB RUBBER OF SOLDERING IRON (*2)