Temperature Sensor Array Using flexible Substrate

9533701 陳俊廷

Outline

Abstract Introduction Design Fabrication Results Conclusions

Abstract

Temperature sensor array based on MEMS technology

Temperature sensor array is composed of 256(16×16) sensors inside a 28×20mm2 area

Polyimide (PI) thin film (35μm) with a copper layer (40μm) on one side as the starting material

Doubled-sided fabrication process is applied to create the sensing elements and interconnects for scanning circuitry

Measuring the resistance of each element in the temperature sensing array

Introduction

Research on artificial skin for robots has been popular, that should be highly arrayed in a requested area on a flexible substrate

Higher density on a flexible copper-polyimide substrate

Temperature sensing element is a platinum resistor

The temperature variation is detected by measuring the resistance change of the resistor due to temperature variation

Design

Design

The resistance is proportional to length and inversely proportional to cross-sectional area

The platinum layer is designed to be long and narrow ；the copper is relatively wide, in order to ensure that the resistance change is caused by the meandering platinum patterns

Copper layer was designed to be 10 times larger than platinum

The resistivity is 10.6μΩ-cm for platinum and 1.68μΩ-cm for copper

A

L

Design

pt

cu

pt

cu

cu

pt

cu

pt

H

H

W

W

L

L

cu

pt

Fabrication

Fabrication

Results

A thermocouple is used for measuring the accurate ambient temperature

α is the TCR of platinum T0 is the ambient

temperature

))(1)(()( 00 TTTRTR

Conclusions

A 16×16 temperature sensor array in a 28×20mm2 area is fabricated on a flexible copper-PI substrate using MEMS fabrication technology

The dimensions of the copper and the platinum patterns are carefully designed to ensure the temperature dependent resistance of the copper layer is negligible during the temperature measurement