tap chi dien tu 2014

electronicproducts.comA Hearst Business Publication

JANUARY 2014

Touch panel design trade-offs ............................................. p18Controlling power factor correction ................................. p20 Product Tends: Applications in mil-aero ......................... p34

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Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)—Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553. Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the authorization, recommendation or specification of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any sub-scription on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness.

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4 Contents

JANUARY 2014 • electronicproducts.com • ELECTRONIC PRODUCTS

4 4

Features

18 Displays:Touch panel design trade-offs

20 Energy Saving Initiative:Better get that power factor corrected!

Vol. 56, No.8 January 2014

38th Annual Product of the Year Awards• Advanced Linear Devices • Linear Technology• Analog Devices, Inc. • Microchip Technology Inc.• AVX • PNI Sensor Corporation• Broadcom • STMicroelectronics• Coilcra� , Inc • Tektronix• Coto Technology Inc. • Texas Instruments• Cree, Inc. • Transphorm• EMCO High Voltage Corp. page 24

Touch Points6 Viewpoint: A bold step for engineering

8 The Story Behind the Story: Judging the 38th Annual Product of the Year entries

11 Outlook (Technology News):

■ Researchers move closer to energizing nanonetworks

■ The Advanced Automotive Battery Conference charges into Atlanta

■ DesignCon starts January 28 in Santa Clara

32 What’s Inside: Apple iPhone 5S A1533

34 Product Trends: Military-aerospace products

39 Product Update: Connectors & Sockets

New Products41 Power Sources 44 Optoelectronics

43 Components & Subassemblies 45 Packaging &

Interconnections

18

11

Only OnlineElectronicProducts.com

Education Center:• LOGi family of FPGA boards made to inter-face with Raspberry Pi, Beaglebone Black, and Arduino Due.

• Why circuit protection actually matters to space exploration

Introducing Electronic Products’

InauguralInspiration Awards

For the � rst time ever, Electronic Prod-ucts will present 10 recipients with a new category of accolade — the Inspiration Award. Recognition is based on the technologies these individ-

uals produced during the previous year, which were covered by the editors of ElectronicProducts.com and proved popular with our online audience based on a variety of measurement tools. We are excited to honor this group of engineers, researchers, and developers with this eye-catching new trophy. To see who won, and to learn about the technologies, go to ElectronicProducts.com

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JANUARY 2014 • electronicproducts.com • ElEctRoNic PRodUcts

6 Viewpoint

A bold step for engineeringHow mil/aero technology is leading the engineering charge

“To boldly go where no man has gone before” is no longer just a pop culture reference, especially when considering the actual advancements being made

in military and aerospace engineering.Google recently completed the acquisition of Waltham,

MA-based Boston Dynamics, an engineering company that has designed mobile research robots for the Pentagon.

With designed robots that can act autonomously and walk over tough terrain — such as BigDog, Cheetah, and WildCat - Boston Dynamics has expanded its collection to now include Atlas, humanoid robots that are intended to serve in harsh conditions, such as up hills and snow, and which are capable of performing in natural disasters. Boston Dynamics is also supplying DARPA (Defense Advancement Research Projects Agency) with the set of robots to participate in the DARPA Robotics Challenge, a two-year contest with a $2 million prize.

Not to be outdone, NASA recently unveiled Valkyrie, a six-foot two-inch next-generation humanoid robot capable of performing tasks such as walking over uneven terrain, climb-ing a ladder, using tools, and driving. Part of NASA’s stated mission to reach Mars, and designed to operate in the same spaces that a person would, the robot has a head that can tilt and swivel, and a waist that can rotate, as well as detachable legs and arms and hands that each feature three fingers and a thumb.

Likewise, NASA also made news last month by releasing a low-resolution video featuring a view from its Juno spacecraft as it flew past Earth, gathering speed for a rendezvous with Ju-piter in 2016. The result — courtesy of a special camera sensor on Juno optimized to track faint stars — gave a compelling view of the Earth and moon system.

“If Captain Kirk of the USS Enterprise said, ‘Take us home, Scotty,’ this is what the crew would see,” said Scott Bolton, Juno principal investigator at the Southwest Research Institute, San Antonio. “In the movie, you ride aboard Juno as it approaches Earth and then soars off into the blackness of space. No previ-ous view of our world has ever captured the heavenly waltz of Earth and moon.”

Barriers are being broken in aeronautics here on Earth as well. Two U.S. aeronautics companies are starting to develop a high-speed vertical takeoff-and-landing (VTOL) aircraft with

the hover capability of a helicopter that can also fly nearly 50% faster than the Boeing V-22 Osprey tiltrotor aircraft.

Sikorsky Aircraft Corp., based in Stratford, CT, and Aurora Flight Sciences in Manassas, VA, have won contracts for the initial phase of the Vertical Take-Off and Landing Experimental Plane (VTOL X-Plane) project of DARPA.

So what does this all mean?What this means is that with great power comes great responsi-bility. For instance, online retail giant Amazon CEO Jeff Bezos unveiled an unmanned “octocopter” that, theoretically, could deliver small packages to customers’ doorstep — a service he dubbed PrimeAir.

As of now, however, such unmanned aerial-filming con-traptions are effectively banned in the United States along with virtu-ally all other commer-cial uses of unmanned aircraft, or drones. The main reason is that the U.S. government has stalled in its efforts to regulate and manage the use of drones.

That hasn’t stopped some drones from taking flight, such as a small

helicopter drone that flew high above buildings on the East Side of Manhattan and crash landed just feet away from a business-man during the Monday evening rush hour. The drone was small but the FAA says it should not have been flying hundreds of feet above a crowded Manhattan sidewalk.

What it also means is that other nations are possibly passing us in the space race, as China just last month announced that it had successfully carried out the world’s first soft landing of a space probe on the moon in nearly four decades, state media said, the next stage in an ambitious space program that aims to eventually put a Chinese astronaut on the moon.

In the end, these ambitions — and realities – I believe, should inspire but also provide sobering thoughts.

There is a saying that if you do not know which way you are going, any direction will do.

Let’s hope that in this age of advancement, we not only know which direction we are going, but that we continue to go there boldly.

Be sure to check out our Product Trends section on mil/aero product trends on pages 34 and 36.

John Filippelli Managing Editor

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8 Story Behind the Story


A look at the making of POY award winnersElectronic PRODUCTS

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Editor Richard Comerford516-227-1433 • [email protected]

Editor Lauren Leetun516-455-8602 • [email protected]

Contributing Editors Michael Kawa Steve Evanczuk

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Once again, we here at Electronic Products set out to find new products that are worthy of the title Product of the Year, and once again, we were not disappointed!

Now in its 38th year, Electronic Products’ 2013 Product of the Year competi-tion challenges our suppliers for outstanding advancements in product development.

� e Electronic Products editorial team – Paul O’Shea, Senior Editor; Richard Comer-ford, Editor; and Jim Harrison, Technical Editor – spent the last few months of 2013 reviewing, researching, and debating the merits of over 250 product entries, using a very speci� c and strict set of judging criteria. � at criteria included whether a product present-ed a signi� cant advancement in a technology or its application, featured ground-breaking innovation, and whether it o� ered a substantial achievement in price/performance.

� e 2013 winners — 15 in all — re� ect a diverse grouping of products that now share a common bond: Each has now earned the title of a Product of the Year.

Powered up� e editors found that in terms of product power consumption, less is de� nitely more.

“We saw a great amount of semiconductor technology that will enable more e� cient, faster, lower-power devices we desperately need,” said Paul O’Shea.

According to O’Shea, winners that most re� ect this trend is the Cree CCS050M12CM2 silicon carbide (SiC) six-pack module, which is the industry’s � rst all sic three-phase pow-er module in an industry-standard 45-mm package.

“When replacing a silicon module with equivalent ratings, this six-pack module can reduce power losses by 75%, which leads to an immediate 70% reduction in the size of the heat sink or a 50% increase in power density. � is now makes silicon carbide accessible —in terms of price — to more designs,” he said.

Likewise, Transphorm earned its recognition by establishing the � rst quali� ed 600-V device platform with its TPH3006PS GaN HEMT. � e GaN transistor combines low switching and conduction losses, o� ering reduced energy loss of 50% compared to con-ventional silicon-based power conversion designs.

“� e common thread that ran throughout the products was power e� ciency, from small devices like Microchip's gesture-sensing IC to Tektronix’s power analyzer,” said Richard Comerford.

Sensor-y overloadSensors, in portable devices from smartphones to medical equipment, were widely evident among this year’s Product of the Year candidates. But making them work together is espeicially important; hence the SENtral sensor-fusion coprocessor from PNI Sensor Corp. received recognition. It’s “a highly e� ective way to pull in data from complex motion sensors — gyroscopes, accelerometers, and magnetic sensors like those found in mobile and wearable devices,” noted Jim Harrison. � e device o� oads complex signal processing from a main CPU and does so while consuming about 1% of the power a standard CPU would need to perform the task.

And that’s just a sampling; there’s Coilcra� ’s LPD5030V miniature high-isolation trans-former, Linear Technology’s LTC2378-20 20-bit low-power A/D converter, Broadcom’s BCM43341 single-chip quad-radio device, and seven others just as important that we can’t cram into this space. So turn to our special Product of the Year section on pages 24 to 31.

John FilippelliManaging Editor

Judging the 38th Annual Product of the Year entries

Richard Comerford Jim HarrisonPaul O’Shea

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Outlook 11Innovations impacting products, technology, and applications

ELECTRONIC PRODUCTS • electronicproducts.com • JANUARY 2014

Researchers move closer to energizing nanonetworksAt the Georgia Institute of Technology, investigation of energy harvesting is paving the path to self-powered nets

Researchers at Georgia Institute of Technology are rapidly developing essential elements for a network of independent machines with nanometric dimensions.

Th ese machines could be the basis for new medical treatments, advanced system maintenance, and remote manufacturing. A recent project involving power generation seems to off er solutions to a fundamental challenge.

Zhong Lin Wang, a Regents professor in Georgia Tech’s School of Materials Science and Engineering, leads a group of researchers developing a family of power generators that take advantage of the triboelectric eff ect to produce electricity in surprising amounts. “Th e fact that an electric charge can be produced through triboelectrifi cation is well known,” Wang notes. Anyone who has walked across a wool rug on a dry winter’s day and then touched another person, door knob, or other conductor to produce a static-electricity shock will agree. “What we have introduced is a gap separation technique that produces a voltage drop, which leads to a current fl ow in the external load, allowing the charge to be used. Th is generator can convert random mechanical energy from our environment into electric energy.”

In its simplest form, the researchers’ triboelectric generator uses two sheets of dissimilar materials, one an electron donor, the other an electron acceptor (Fig. 1). When the materials are in contact, electrons fl ow from one material to the other. If the sheets are then separated, one sheet holds an electrical charge isolated by the gap between them. If an electrical load is then connected to two electrodes placed at the outer edges of the two surfaces, a small current will fl ow to equalize the charges. By continuously repeating the process, an alternating current can be produced. In a variation of the technique, the materials produce current if they are rubbed together before being separated. Gen-erators producing direct current have also been built.

Most commonly, inexpensive fl exible polymers are used. However, it is possible to use a wide range of materials, including fabrics and even papers. Th e materials are inexpensive, and can include such sources as recycled drink bottles. Further, the gen-erators can be made from nearly-transparent polymers, .allow-ing their use in touch pads and screens.

Over time, Wang and his research team have increased the power output density of their triboelectric generator by a factor of 100,000 — reporting that a square meter of sin-

gle-layer material can now produce as much as 300 W. Applying micron-scale patterns to the polymer sheets increases the power output; the patterning eff ectively increases the contact area and thereby increases the eff ectiveness of the charge transfer. By using this patterning, the volume power density is able to reach more than 400 kW/m3 at an effi ciency of more than 50%, providing signifi cant power from a relatively small mass.

“Th is opens up a source of energy by harvesting power from activities of all kinds,” said Wang. Th e researchers have created a range of energy-gathering techniques from “power shirts” containing pockets of the generating material, to shoe inserts, whistles, foot pedals, fl oor mats, backpacks, and fl oats bobbing on ocean waves. Wang believes the discovery can provide a new way to not only power mobile devices such as sensors and smartphones, but also lead to a new type of self-powered sensor, allowing detection of vibrations, motion, water leaks, explosions — or even rain falling.

Th e research has been supported by the National Science Foundation; U.S. Department of Energy; MANA, part of the Na-tional Institute for Materials in Japan; Samsung in South Korea; and the Chinese Academy of Sciences. For further information, contact John Toon, [email protected], 404-894-6986.

Richard Comerford

Fig. 1: At top, when an electric donor (PET/PMMA) and recep-tor (Kapton) are separated, an induced charge is created. At bottom, a similar effect is seen when the materials are rubbed together; a working example of this latter type of generator is seen in the photo on the left. (Credit: Inertia Films.)

12 OutlookInnovations impacting products, technology, and applications

JANUARY 2014 • electronicproducts.com • ElEctRoNIc PRodUcts

The Advanced Automotive Battery Conference charges into AtlantaThe Advanced Automotive Batteries (AAB) Conference helps engineers keep pace with the technology and market development of advanced vehicles and the batteries that will power them. This year, it takes place at the Hyatt Regency in Atlanta, GA from Feb. 3 to 7. It offers a technical and business exchange between large energy-storage users and developers and includes four symposia, tutorials, exhibits, posters, and short presentations. Many of the carmakers' chief energy-stor-age technologists will chair a session, present, or attend AABC.

The conference technical sessions include:

LLIBTA symposium on large lithi-um-ion battery technology and applica-tion:

• Track A: Cell Materials and Chem-istry — An in-depth examination of the recent developments and future prospects of cell materials and chemistry in large li-ion batteries.

• Track B: Battery Engineering — An exploration of cell and pack engineering for various large-battery applications, li-

ion battery life requirements and challenges, and validation of bat-tery safety and abuse tolerance.

ECCAP symposium on large electrochemical (EC) capacitor technology and applications — A review of large EC capacitor technology, including advances in materials and cell design, pack engineering and performance in key applications.

ABBTAM symposium on ad-vanced automotive battery tech-nology, application and market — Dissects the vehicle and battery markets by segment and reviews the recent advances in automotive battery systems technology.

Tutorials on EC capacitors and li-ion cell and pack technology — Offers world-class tutorials on the fundamentals of EC capacitors and large li-ion battery technology.

Posters — Authors are encouraged to submit an abstract in order to apply for a poster that presents your latest R&D findings

Exhibits — Companies can show their wares in a booth. Exhibit hall hours are Tuesday (Feb. 4), 5:30 to 7 p.m.; Wednes-day (Feb. 5), noon to 8 p.m.; Thursday (Feb. 6), noon to 7 p.m.

For more information, e-mail [email protected], call 530-692-0140, or go to www.advancedautobat.com.

Paul O’Shea

DesignCon starts January 28 in Santa ClaraThe DesignCon conference in Santa Clara is for chip, board, and systems design engineers and focuses on signal integrity at all levels of electronic design: chip, package, board, and system. The conference part of the event will be oper-ating Tuesday, January 28, through Friday, January 31. There will be 100+ technical tutorials, panels, and case studies present-ed across 14 tracks.

On Tuesday, Prof. Dr. Hermann Eul, Vice President and General Manager of the Mobile & Communications Group at Intel, will give the keynote speech from 12:00 to 12:45 p.m.

The expo area will be open on Wednesday and Thursday, the 29th and

30th, from 12:30 to 6:00 pm. It will have over 150 exhibitors with the latest in high-speed serial design, signal integri-ty, and test & measurement. There will be free education and speed-training, panels, and product teardowns in the

Chiphead Theater, plus many in-booth trainings and vendor sessions. Free expo passes are available from the show web site (www.designcon.com).

Jim Harrison

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14 Engineering Distribution

JANUARY 2014 • electronicproducts.com • ELECTRONIC PRODUCTS Advertisement

Q What is LoW-DeNsity sLC NaND?

A Invented by Toshiba, SLC (Single Level Cell) NAND is the original NAND architecture. Its much higher endurance (vs. MLC) makes it ideally suited for a variety of consumer and industrial applications where longevity of supply is important. Low-density SLC refers to (<16-Gbit) SLC NAND flash memory. While many applications are moving to MLC, SLC is still around in a big way — even if it does fly under the radar when compared to the attention its MLC NAND counterparts receive. SLC is the only memory currently available which can provide high levels of endurance, long life cycles, high reliability and wide temperature ranges. Low-density SLC NAND is available in an asynchronous (or legacy) interface only, with an interface speed of up to 50 Mbytes/s. By way of comparison, high-density SLC and MLC NAND devices typically have the toggle-mode DDR interface, which supports an interface speed of up to 400 Mbytes. Available packages for low-density SLC NAND include TSOP and BGA. The BGA is available in a new, smaller 67-ball version — as well as the older 63-ball version. The most popular configurations are 3.3-V, x8 TSOPs and 1.8-V, x8 BGAs.

Q Where CaN LoW-DeNsity sLC NaND be fouND?

A SLC has a relatively small market share in terms of total NAND bits, but it runs a lot of things that people take for granted — it has a substantial impact. It is found in a lot of places that people don’t necessarily know about, including TVs, ink-jet printers, digital cameras, set-top boxes, toys, exercise equipment, automation control, printers, teleconferencing equipment, POS terminals, and more. Parts with –40° to 85°C temperature range are especially popular for industrial and outdoor applications.

Q What fuNCtioN Does LoW-DeNsity sLC NaND perforM iN these proDuCts?

A It’s the ROM (read-only memory) for a lot of these products — used for boot up and small amounts of datalogging. People tend to take it for granted when they press a button on their printer and it boots up right away. SLC NAND makes it happen.

What is “the forgotten NAND”? In the overall scheme of NAND memory, low-density SLC NAND may have a small market share, but it plays an important role. While everyone is talking about high density flash and 3D NAND, low-density SLC is busy playing an important role in things we touch every day.Electronic Products’ Jim Harrison explores some frequently asked questions regarding low-density SLC NAND — and the role it plays in our everyday lives.

The Forgotten NAND: Low-Density SLC

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popular configurations are 3.3-V, x8 TSOPs and Q What Does the future hoLD for LoW-DeNsity sLC NaND?

A It will be around for quite some time, as there aren’t any good alternatives available at the moment. NOR flash is more suited to code-storage applications, and, for any given lithography process, the density of the NAND flash will always be higher than NOR flash which makes NAND a lower price per gigabyte option. For example, the highest-density NOR commercially available is 1 Gbit, while SLC NAND starts at 1 Gbit and goes up from there. In regard to MLC, although it offers high density and low cost per bit, it can’t compete when it comes to endurance, temperature range, and speed. Additionally, MLC NAND is not available in these low densities anymore.

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S L C N A N D – f o r I n d u s t r i a l a n d C o n s u m e r A p p l i c a t i o n sv

Engineering Distribution 15

ElEctronic Products • electronicproducts.com • JAnuArY 2014Advertisement

Q What other types of sLC NaND are avaiLabLe?

A SLC NAND is available for industrial temperature operation, and in both x8 and x16 bus widths.

Q What Does the future hoLD for sLC NaND?

A ECC requirements for SLC NAND have increased from 1 bit/512 bytes to 8 bits/512 bytes. Therefore, it is expected that SLC NAND flash with built-in error correction (ECC) hardware will become more popular. Toshiba offers the BENAND™ (1-bit ECC NAND) family to meet this need. BENAND™ is SLC NAND with embedded ECC, which removes the burden of ECC from the host processor. Currently, the lowest-density SLC NAND available is 512 Mbits. In the near future, the lowest density available will be 1 Gbit. With enough ECC, SLC NAND can still reach 100,000 write/erase cycles, but, with the minimum recommended ECC, reaching 60,000 write/erase cycles is more common.

Q What Does toshiba offer iN the Way of sLC?

A I recently talked with Brian Kumagai, director of NAND Flash Memory Products for Toshiba America Electronic Components, to find out more about what they are doing in this area. Toshiba has the full range of SLC NAND available - including the aforementioned BENAND family. According to Kumagai, “Toshiba developed NAND-type flash technology in 1984 and was the world leader in promoting its practical use. We continue to maintain our leadership position in high density, advanced processes, and mass-production technology. SLC chips can read and write large amounts of data at high speed, support high-write/erase-cycle endurance, and offer excellent reliability. Toshiba has developed SLC devices to meet the diverse needs of different embedded applications. Our lineup for SLC NAND ranges from mid-capacity models (those with a capacity of between 1 and 4 Gbits) to large-capacity models (those with a capacity of 8 Gbits or more). For these SLC NAND products, we provide support related to driver software, and technical assistance for developing NAND flash products.”

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91313_Toshiba_EP_Jan 2014_4.125x8.625.indd 1 12/13/13 2:02 PM

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16 Engineering Distribution


IN PARTNERSHIP WITH

Computing Touch Lighting RFID & NFC

Technologies to Watch in 2014 on Mouser’ssite.

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Handicapping 2014 Tech Trends

Like horse racing enthusiasts engaged in serious study of the Daily Racing Form, in January engineers, compo-nent buyers, and sales execs pore over industry projec-

tions and market research studies in an attempt to identify this year’s technology winners and also-rans.

In terms of tech trends, the general consensus among those paid to gaze into a crystal ball puts the Internet of � ings, wearable connected devices and solid state lighting (SSL) in the winner’s circle. Here’s why: Driven by the convergence of increasingly connected devices, cloud computing and the introduction of big data analytics, the “In-ternet of � ings” is composed of identi� -able objects seamlessly integrated into the information network, including address-able sensors embedded in machines to allow them to connect and share informa-tion with people and other machines.

One characteristic shared by Internet of � ings applications is the ability to take real-time information, apply end-to-end analytics, and obtain a course of action. An example of how this works is data collected centrally from global production locations that can immediately be studied and responded to by product managers as these events are taking place.

As the Internet becomes an integrated part of our daily lives, the risks associated with being connected have become more apparent. Last year we discovered that information was not as secure from third-party entities — private and govern-mental — as we had assumed. According to Ericsson Con-sumerLab research, 56% of daily Internet users are concerned about privacy issues. However, only 4% said that they would actually use the Internet less.

To protect data, Internet sites are demanding more com-plex passwords. � is is leading to growing interest in biomet-ric alternatives. For example, Ericsson ConsumerLab found that 52% of smartphone users want to use their � ngerprints instead of passwords and 48% are interested in using eye-rec-ognition to unlock their screen. A total of 74% believe that biometric smartphones will become mainstream during 2014.

One candidate for the title of “top tech trend of 2014” involves wearable connected sensors, which allow people to track a variety of personal data — including heart rate, blood pressure and sleep quality — then analyze and share that information wirelessly. Wearables even provide the potential of using technology to “enhance” reality (e.g., Google Glass), ushering in a new era that some call the “quantified self,” whereby every aspect of a person’s life is captured and avail-able for dissemination. By 2017, 169.5 million wearable health and fitness devices will be on the market worldwide according to ABI Research, with about half of these devices designed for remote and home monitoring.

According to industry analysts, the LED lighting sector continues to works through recent over-capacity issues and will renew capital spending this year. Market research � rm Strategies Unlimited notes that the average cost per kilolumen has declined from $13 in 2011 to less than $3.65, but that packaged LED price declines have been partially o� set by sap-phire wafer cost reduction, yield improve-

ments and wafer size increases.Declining sapphire prices and the continued competitive-

ness of silicon carbide (SiC) have taken some wind out of the sails of GaN-on-silicon LED proponents. Lux Research sees SiC and sapphire continuing to dominate the LED market through the decade, bene� tting from continued technology improvements to boost throughput and cut costs.

For 2014, lighting manufacturers are looking to reduce part counts and are also turning to mid-power packaged LEDs for applications once thought reserved for advanced high-power products, opening up new market opportunities.

In summary, research � rms such as IC Insights have predicted that Internet-capable converging technologies and mobile electronic systems will keep demand for ICs strong through 2017. Total worldwide production value of electronic systems was projected to increase 4% last year to $1.41 trillion and climb to about $1.74 trillion in 2017, which represents a compound annual growth rate (CAGR) of 5% from $1.36 billion in 2012, according to IC Insights.

BY MURRAY SLOVICK

A consumer version of Google Glass is expected to be launched during the first calendar quarter.

Engineering Distribution 17

ELECTRONIC PRODUCTS • electronicproducts.com • JANUARY 2014

IN PARTNERSHIP WITH

Technologies to Watch in 2014

While 2013 saw some remarkable advances in MCU and wireless technologies that further enable the Internet of Things, 2014 will move

forward with the emergence of a more practical Internet of Useful Things. For some, this Internet of Useful Things promises a world where nearly every device continuously analyzes and transmits data about operational minutiae while winnowing non-useful details.

The trend toward a more useful world of connected devices hinges on a new class of smart sensors. Sensor in-tegration and sensor fusion will continue to be the watch words for these new sensor networks. In turn, more sophisticated sensor systems will rely on a new class of processors — blend-ing low power and high performance at a lower price point needed to enable widespread use. Expect more everyday devices to become intelligent and net-worked.

In 2014, portable and wearable computing promises to introduce major shifts in how humans interact with computing devices and infor-mation, dramatically reducing the gap between immediate information and the person for whom that information is the most useful.

Health and fitness buffs already wear monitors that record their heart rate and the distance they run, coupling that to a PC to analyze the results. Wearable wireless med-

ical devices include accelerometers to warn of falls, and insulin pumps and glucose monitors for diabetics. Each of these devices can connect to a smartphone via Bluetooth, and can issue an alert to their doctor by triggering a call over the cellular network.

Few industries have undergone such a rapid change in core technology and product o� erings as lighting. Fueled by rapid market acceptance, solid-state lighting manufacturers are translating innovative technologies such as more-e� cient silicon-carbide substrates into new classes of mainstream products that dramatically reduce the size and power con-sumption of more powerful LED driver ICs. For example,

LED headlamps are evolving beyond just a standard replacement for headlights in new vehicles. Increasingly, premium features such as side illumi-nation and cornering headlights are appear-ing, thanks to greater reliability, smaller size, and lower cost of brighter LEDs.

While enhanced hardware solutions continue to emerge for smart sensors, systems designers are looking to surround

users with a more natural environment that provides an immersive experience via interacting with IoT devices and the cloud. Ultimately, all these key technologies — the In-ternet of Useful Things, wearable computing, and LEDs — serve the purpose of bending technology to meet real needs as efficiently as possible. With the continued evolution of these key areas in 2014, the industry is moving rapidly toward that objective.

By Mouser Electronics, www.mouser.com

Wearable computing brings more immediacy to data and enables new applications such as evidence-based healthcare that draws on continuous collection of vital health statistics. (Source: Intel.)

/applications

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18 Displays

JAnuArY 2014 • electronicproducts.com • ElEctronic Products

Touch panel design trade-offs

BY TONY GRAY Director of Product Technology, Ocular, www.ocularlcd.com

As projected capacitive touch panels continue to expand product offerings in consumer and industrial markets, designers need to become familiar with the trade-offs

involved when designing-in a projected capacitive touch panel. A touch panel is not a simple commodity like a resistor or linear dropout regulator, but a complicated subassembly of an electric field generator with a highly sensitive antenna and high optical performance. To achieve optimum performance, designers must consider a number of factors early in the design phase.

“Designing Touch Sensors in 3D,” a previous article featured in Electronic Products, described the general operation of a touch panel and discussed some of the considerations that designers must take into account. However, there are even more details to be con-sidered, such as alternative materials that can be used for construct-ing a projected capacitive touch panel, the characteristics of those materials, and the functional trade-off s involved.

Most touch panel designs include a cover lens, typically with silkscreen that is used for logos, button labels, and voids for LEDs or photodetectors. Cover lenses can be made from a variety of ma-

terials including soda-lime glass, chemically strengthened soda-lime glass, super glass, or plastics like PMMA. When specifying a cover lens, potential characteristics that drive the material choice include hardness, impact strength and

safety. For example, soda-lime glass is fairly scratch resistant while PMMA is not. However, soda-lime glass can also be easily broken by a surface impact and may produce dangerous glass shards when it fails. PMMA, on the other hand, is extremely diffi cult to break with surface impact. Super glass is somewhere in the middle: It doesn’t scratch or break as easily as standard soda-lime glass, but when it does fail, it shatters.

Another consideration when choosing a cover lens material is the dielectric, which is very important to the touch panel designer. Th e touch panel’s electric fi eld has to propagate through the cover lens: the higher the dielectric, the better the propagation and the thinner the material can be. A good rule of thumb is that a plastic cover lens has to be about half the thickness of a glass cover lens to

achieve the same performance (see Fig. 1). Th e touch panel design can typically be adjusted to accommodate a specifi c thickness of material; however, the materials are not automatically interchange-able. A touch panel that has been designed for a 1.1-mm soda-lime cover lens cannot be replaced with a 1.1-mm plastic cover lens and provide the same performance. Th e touch panel design will need to be adjusted in some way to accommodate the material of choice. Th is could be as simple as turning up the gain of the touch panel controller, or it could be as complicated as changing the thicknesses of other layers in the touch panel itself, which would result in a redesign of the overall stack-up.

Cover lenses can also be enhanced with fi lms and/or coatings, including anti-glare (AG), anti-refl ective (AR), anti-smudge, etc. Some of these are thin fi lm layers that are applied to the top of the cover lens material while others are chemical etching processes. Each type of fi lm or coating has its benefi ts and drawbacks. A benefi t is the additional durability that coatings can provide for the touch panel. However, coatings may also reduce scratch resistance and some can be applied to glass while others can only be applied to plastic. Th e good news is that these fi lms and coatings are so thin that they do not alter the performance of the touch panel, so they can usually be added without any impact to the overall design.

Okaya introduces single color OLED displays

Consider a step up to color or away from VFD displays, OLED has faster response time, wider

viewing angle, uses less power, is thin, light weight & can be made sunlight readable.

Okaya introduces single color OLED displays Consider a step up to color or away from VFD displays, OLED has faster response time, wider viewing angle, uses less power, is thin, light weight & can be made sunlight readable. http://www.okaya.com/products/display/oled

www.okaya.com/products/display/oled

For optimum performance, consider several factors early in the design phase

Fig. 1: Th ickness comparison: Glass cover lens vs. plastic cover lens

Fig. 2: Bonding layers

Displays 19

18 Displays Displays 19

ElEctronic Products • electronicproducts.com • JAnuArY 2014

The next material to consider is the adhesive used within the layers of the touch panel. Depending on the touch panel design and whether or not the touch panel is being bonded to a TFT, the entire stack-up may include three separate adhesive layers (see Fig. 2). Each layer can be a wet or dry bond, and different bonding agents are typically used for each layer. A wet adhesive is a viscous liquid that has to be cured, usually with UV light. A dry bond is typically a sheet adhesive similar to double sided tape. The sheet adhesive may have a plastic base, typically PET, or it may just be a layer of adhesive which is commonly referred to as “no-base” adhesive.

One of the biggest concerns when choosing an adhesive is birefringence. When light passes through materials like PET, different wavelengths in the light are refracted at different angles. This refraction happens in all directions equally, so it’s not noticeable to the human eye. The issue arises when looking at the material through polarized sunglass-es, the light rays are aligned in one direction and a prism/rainbow effect occurs across the material. For outdoor applications where the use of polarized sunglasses is possible, PET-based adhesives should not be used in any of the internal bonding layers to eliminate birefringence.

Another factor to consider when discussing layer adhesives with the touch panel man-ufacturer is the temperature range of the adhesives being used. Some adhesives can stretch, which allows air bubbles to form if the temperature gets too high. This might not be an issue for the end application, but it could be a concern during manufacturing, especially if the different bonding layers are being built by different suppliers. One supplier may need a certain cure temperature for their adhesive that is too high for another adhesive layer.

In addition to material selection, there are also mechanical constraints that must be considered. The touch panel controller chip is sometimes on a flexible printed circuit, or FPC, that is at-tached directly to the touch panel. This is called a chip on flex (CoF) design (see Fig. 3). In other cases, typically on larger touch panels, the controller is on a separate PCB. The PCB has connectors that mate with FPCs connected to the touch panel. In either case, the placement, size and shape of the FPCs can be a critical factor in the me-chanical design of the TFT mounting and the enclosure. This is where a 3D model of the touch panel and controller can be invaluable. With a 3D model you can ensure that there is no interference with the FPCs, or you can use the model to design custom FPCs if needed. One caveat: FPCs are made from a base sheet material. The cost of the FPC is directly related to the number of FPCs that can be created on a single sheet; an FPC that includes bends or right angles is going to lower the number of FPCs per sheet and increase the cost.

Another factor to consider with FPCs is shielding. Most applications don’t need shield-ed FPCs, but some require shielded FPCs to keep EMI in the environment from affecting the touch panel, or to keep the EMI generated by the touch panel control signals from polluting the system. A shielded FPC is typically a two- or three-layer FPC with a ground plane on one side or on both sides of the signal layer. Shielded FPCs are much more expen-sive than single layer FPCs and should only be used when absolutely necessary.

Touch panel makers can help navigate designers through these various options, but only if they are provided with details about the application. The details required include:

• Maximum thickness for the touch panel assembly.• Are there any impact or safety requirements?• Is there a requirement for a cover glass coating (for example, anti-reflective, anti-glare)?• Is this an indoor or outdoor application? Can outdoors uses wear polarized sunglasses?• Are there additional bonding steps needed after the touch panel assembly is received? • Are there any mounting concerns or restricted areas for the FPCs?• Are there any special EMI concerns?

The answers to these questions will help touch panel vendors choose the right materials for the touch panel design and avoid costly design impacts that may occur down the road. ■

Fig. 3: Chip on Flex (CoF) design


an electronic products special series

20 Energy-Saving Initiative

Better get that power factor corrected!Smart meters can measure both kWh and more accurate kVAhBY RAMANAN NATARAJANProduct Marketing ManagerTexas Instruments, www.ti.com

Deployment of smart energy meters is in full swing worldwide. Tradi-tionally, consumers like me and

you pay only for the kWh we consumed for all the electrical equipment in our homes. However, for all equipment without power factor correction (PFC), the energy draw

from the electrical outlet is, in fact, much higher. It is more correctly represented by kVAh (kilovolt-amp-hour), which is not affected by the voltage-current phase differences. The cost of this incorrect measurement is graciously borne by our friendly neighborhood utility company.

Smart meters can measure both the kWh we consume and kVAh that the utility company actually delivers. Beware - these smart devices are in a

position to expose our bad consuming habits. We’d better get that power factor corrected quickly, lest the utility compa-nies decide to come at us with vengeance for their pound of fl esh.

One way to protect ourselves from this vengeance is using a power factor controller (PFC). One example of a number of ICs available for this task would be TI’s UCC28180 PFC controller.

Th ese controllers use a boost topology operating in continu-ous conduction mode (CCM), which lends itself to a wide range of power levels, from a few hundred watts to several kilowatts. Th is type of controller can be applied to a broad variety of equipment in home

and offi ce such as TVs, air conditioners, wide-area lighting, projectors, worksta-tions, and in industrial/IT infrastructure environments to such things as power supplies for process automation, pro-grammable logic controllers, datacenter servers, and cellular base stations.

Active and passive PFC Active PFC control uses switch mode power conversion, while passive PFC in-volves simply inserting good old induc-tors and capacitors, at the front end of electrical equipment. Although compo-nent count may be higher, there is huge savings in overall equipment cost, size, weight, and even manufacturing costs by moving from passive to active PFC.

A classic example is in a commercial multi-kW air-conditioner. In this in-stance, the size and weight of the passive PFC inductor is so huge, you have to bolt it to the chassis and add a wire harness to connect it to rest of the electron-ics driving the main compressors and motors. Adopting an active approach, using high-frequency switching, the size

and weight of the inductor shrinks and results in signifi cantly reduced magnetics

Fig. 2: Power factor and THD correction achieved using the UCC28180 PFC IC.Fig. 2: Power factor and THD correction achieved using the

Fig. 1: Smart meters measure both the kWh and kVAh.

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an electronic products special series

22 Energy-Saving Initiative

Powering your next design.Let us be your power expert. We understand that you don’t have the time to master every aspect of electronic design. As a leading manufacturer of power supplies we are here to collaborate with you to ensure your next project is a success.

Powering your next design.Powering your next design.

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cost. From a mechanical design per-spective, the inductor can easily mount directly onto the main electronics board, reducing special assembly costs.

Having the capability to program the exact switching frequency provides the flexibility to optimize the design for size, cost, efficiency, and specific choice of power switch (MOSFET, IGBT,

etc.). Many controllers can operate at a low switching frequency of 18 kHz, which facilitates using high-current IGBT power switches which deliver superior performance compared to power MOSFETs in the multi-kilowatt range. For new power devices such as SiC MOSFETs and GaN HEMTs that are on the horizon, the newest con-

trollers (see www.ti.com/ucc28180-ep) support switching frequencies as high as 250 kHz. This allows you to harness the promise of these wide band-gap power semiconductors which are able to achieve the 50+ W/in.3 and 98% efficiency for the holy grail of power conversion.

Total harmonic distortion Total harmonic distortion (THD) is a much desired performance metric these days. This parameter represents what fraction of the fundamental AC input line current harmonic is represented by all the rest of the harmonics combined. Measured as a percent of the fundamen-tal harmonic, the goal is to keep this metric as low as 5% to 10%, especially when the equipment is consuming significant power — 50% to 100% of nameplate power rating.

In equipment powered by a UPS, the PFC must extend down to as low as 10% to 20% of nameplate power rating. If the equipment tends to dwell at these load conditions for a prolonged period, the need for low THD at low power may be especially important. UPS face a difficult task in delivering a well regu-lated ac output under a light, high THD load. A classic example of this situation is a datacenter server power supply that may be idling at light-load conditions for several hours during the night.

With many analog PFC control-lers available in the industry today, low THD is achievable only when a strong current-sensing signal is supplied to this type of design. This implies using a high-value current measurement shunt resistor, especially at light loads. That higher-value resistor means more losses and lower efficiency. Using available continuous conduction mode PFC controllers, like the UCC28180, allows for a lower-value resistor. With these sorts of controllers, THD as low as 5% is achieved with shunt resistance that is 50% lower in value (see Fig. 2).

Now — go forth and get that “power factor” corrected! This information orig-inally appeared on the TI Power House blog (www.ti.com/powerhouse-ep). ■

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24 POY Special

• Advanced Linear Devices

• Analog Devices, Inc.

• AVX

• Broadcom

• Coilcraft, Inc

• Coto Technology Inc.

• Cree, Inc.

• EMCO High VoltageCorporation

• Linear Technology

• MicrochipTechnology Inc.

• PNI Sensor Corporation

• STMicroelectronics

• Tektronix

• Texas Instruments

• Transphorm

Analog front end is the tipping point for SDRFor over a decade, soft ware-defi ned radio (SDR) has been viewed as a potentially revolutionary means of communications. In principle, SDR would allow a single hardware design to support commu-nications across a variety of formats, protocols, and frequencies, including GSM, LTE, MIMO, and more. Indeed, many digital chips have been put forward to handle the logic functions of the SDR scheme. What’s been missing is an easy way to implement the necessary analog functionality… until last year.

Formally introduced by Analog Devices last October, the $175 70-MHz-to-6-GHz AD9361 RF Agile Transceiv-

er integrates an RF front end, fl exible mixed-signal baseband section, frequen-cy synthesizers, two analog-to-digital

38th Annual Product

of the Year Award

WINNERS

MOSFET array enables design of ultra-low supply voltagesTh e ALD210800 Precision N-channel MOSFET arrays from Advanced Linear Devices features zero-threshold voltage

that establishes a new industry benchmark for forward transconductance and output conductance. Designed with the compa-ny’s EPAD CMOS technology, the arrays allow circuit designers to build ultra-low supply voltages that were never before possible. Th e precision parameters of the device enable <100-mV min. operating voltage, <1-nA min. operating current, and <1-nW min. operating power. Th e device enables independent control of each device within a quad package. Th is innovative capability provides circuit designers with the capability to design next-generation energy harvesting sys-tems and low-power mobile devices.Advanced Linear Devices: www.aldinc.com

Simple contact provides an elegant solutionSoldering wires to connect something to a pc board may seem simple, until you think about manufacturing in quantity. Th en the cost of soldering and, if some rework is required, unsoldering quickly mounts up. Enter the single-position 9296 Series contact — an elegant alterna-tive to solder.

Th e stamped, dual-beam, boxed connector integrates key features that facilitate SMT pickup/placement, wire guidance and retention, and easy wire removal. In essence, it provides all the benefi ts of a full-function connector, without an unnecessary insulator, for a host of rugged wire-to-board appli-

converters, and two direct conversion receivers. With its high level of integra-tion, this highly programmable device simplifi es design and reduces bill-of-ma-terial cost, while at the same off ering the widest dynamic range available, with state-of-the-art noise fi gure and linearity. Th e extremely fl exible transceiver can be confi gured for experiments and evalua-tion of signals in FM and TV broadcast reception, prototyping a GSM base station with OpenBTS, developing GNU Radio GPS/WiFi/ISM, and more.Analog Devices: www.analog.com

RL-5480HC

Parts shipped from USA or Hong Kong. www.RencoUSA.comActual size.

When it comes to Inductors SMALLER IS BETTER

Design your products using the largest catalog in the inDustry. Visit www.rencousa.com/catalog-request to get your copy today.

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26 POY Special

Wirelsss combo chip includes 802.11, NFC, BLEBroadcom’s wireless combo chip, the BCM43341 four-function wireless IC provides the highest level of integra-tion available for a mobile or hand-held system. It includes a dual-band (2.4-GHz/5-GHz) IEEE 802.11 a/b/g and single-stream IEEE 802.11n, near-field communications (NFC), Bluetooth LE 4.0 (BLE), and an FM radio receiver.

It’s a chip that offers OEMs the ability to integrate Wi-Fi, Bluetooth LE, and near-field communications easily into a product — with FM radio also available. We think the possibilities are very, inter-esting, and not just for cell phones. You can now more easily have a portable med-

Miniature transformers offer 1,500-Vdc isolationThe Coilcraft LPD5030V SMT transform-er has two really outstanding features — 1,500-Vdc winding-to-winding isolation and, at just 5 x 5 x 3 mm, a much smaller size than any similar devices. The part is great for coupled-inductor applications

like SEPIC power converters and also for flyback-type power conversion.

The transformer is functional safety listed by UL, and it provides tight cou-pling, high inductance values from 4.7 to 220 µH, and DCR as low as 0.32 Ώ. Plus, you can get this part starting from only $0.75 ea/10,000.Coilcraft: www.coilcraft.com

A MEMS device breaks the reed-switch size barrierThe traditional, glass-encapsulated reed switch is widely used in the electronics industry, but unlike other electron-ic devices, it’s size isn’t continuing to

cations. Capable of accepting 12 to 20 AWG wires and rated (depending on AWG) for up to 20 A, the 9296 holds solid wires fast and stranded wire even faster. For rework, wires can be removed quickly by either simply twisting them out or, particularly in the case of strand-ed wire, using a removal tool to release some of the contact force.AVX: www.avx.com

ical unit with 5 GHz Wi-Fi sending data back to the main desk and to the cloud, near-field communications to scan an ID tag, and Bluetooth to wirelessly connect a measurement probe of some kind. What other applications? You tell me.Broadcom: www.broadcom.com

shrink dramatically: at a length of about 5 mm, it’s reached the practical limit at which it can continue to function. Enter the RedRock RS1-A-2515 MEM-based reed switch from Coto Technology. Its maximum dimensions of 2.18 x 1.10 x 1.10 mm give it a volume that is approxi-mately 8X less than the smallest available conventional reed switch.

The single-pole, single-throw switch is the first commercially available exam-ple of a magnetically-operated electro-mechanical switch built using high-as-pect-ratio MEMS (HARM) technology. Its combination of zero electrical power operation, very small size and high power switching capability is unique, and offers clear competitive advantages over technologies such as conventional reed switches, planar MEMS switches and active semiconductor switches using Hall or GMR technology. As such, it promises to make possible new types of medical, industrial, commercial, and consumer devices, to name just a few areas of po-tential application.Coto Technology: www.cotoelay.com

SiC 50-A module provides performance of 150-A silicon deviceThe Cree CCS050M12CM2 silicon carbide (SiC) six-pack module is the industry’s first all-SiC three-phase power module in an industry-standard 45-mm package. When replacing a silicon mod-

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Capacitor Solutions for Power Electronics

From an Antarctic –55 °C chill up to a 450 V electromotive

force and capacitance to 47,000 µF the MLP � atpack capacitor

delivers electrical energy for power holdup. The MLP is a high

performance aluminum electrolytic capacitor in a convenient

box shape that � ts the square holes of power electronics and

is easily stackable into high energy modules. The 20-MLP

module shown can deliver 600 joules of energy. The MLP’s

less than ½ inch height makes it great for tight pitch rack as-

semblies too.Full specs are at http://www.cde.com/ep3Full specs are at http://www.cde.com/ep3

Flatpack Blocks of Capacitance for Energy StorageFlatpack Blocks of Capacitance for Energy StorageTYPE MLP and MLS CAPACITORS

TYPE MLP and MLS CAPACITORS

DSCC DRAWINGS 05018, 05019

LOW PROFILE 1/2” HEIGHT

NEAR HERMETIC LONG-LIFE WELDED SEAL

MLP: 50 YEAR LIFE, MLS: 100 YEAR LIFE

MLP and MLS > 25 YEAR SHELF LIFE

WITHSTANDS > 80,000 FEET ALTITUDE

COLD TO –55 °C ≤ 250 V; –40 °C, 300–450 V

H i g h E n e r g y S t o r a g e f o r V o l t a g e H o l d U p


28 POY Special

IC creates an e-field to let electronic systems interpret gesturesWe’ve all gotten use to operating elec-tronics by touching screens, but touch is limited. Humans have a much greater

silent vocabulary, ranging from the simple “OK” gesture to the intricacies of sign language (of which there are at least 137 versions). Wouldn’t it be nice if our smartphones and tablets could recognize these gestures, and do our bidding at the snap of our fingers?

Last year, Microchip Technology in-troduced its patented GestIC technology to make this possible. The configurable MGC3130 is the world’s first electri-cal-field (e-field)-based 3D gesture controller and, unlike systems that use visual images to derive gesture infor-mation, requires little power to provide precise, fast, and robust hand-position tracking and free-space gesture recog-nition.Microchip Technology: www.microchip.com

Novel ultra-small HV dc/dc converter shrinks device heightThe AG Series ultraminiature dc/dc converter from EMCO High Voltage is a novel surface-mount design that recesses the power supply into a trench

in the host PCB, resulting in a compo-nent height profile of one eighth of an inch (0.128 in.). The low profile of the device, coupled with its unique ability to sit inside a circuit board rather than

A/D converter tops all for accuracy, speedThe LTC2378-20 from Linear Technol-ogy is a real 20-bit A/D converter, with industry-leading 0.5-ppm integral non-linearity. Yes, that’s in ppm — otherwise called 0.00005%. And, in an industry first, this exceptional linearity comes in a

SAR-type A/D with 1 Msample/s speeds. And yes, the INL spec is at full speed. This is a breakthrough device for many applications.

Worst-case INL is 2 ppm over the -40° to 85°C temperature range. The 16-lead DFN- or MSOP-packaged IC yields a 104-dB SNR and requires just 21 mW at 1 Msample/s and only 21 μW at 1 ksamples/s.

A number of medical and industrial

ule with equivalent ratings, this six-pack module can reduce power losses by 75%, which leads to an immediate 70% reduc-tion in the size of the heat sink or a 50% increase in power density. When compared to state-of-the-art silicon modules, the SiC 1.2-kV, 50-A modules deliver performance equivalent to silicon modules rated at 150 A. The switching of the SiC module allows significantly less derating than silicon IGBTs, which enables higher-frequency operation, both increasing fundamental output frequency and reducing passive component size in the motor drive. The SiC power module family can provide benefits to solar inverters, uninterruptible power supplies, and industrial power supplies.Cree: www.cree.com

on top, provides a versatile space-sav-ing solution to OEM systems designers in applications where every millimeter counts. This package can be mounted using the surface mount tabs or with swaged PC pins for through-hole appli-cations. The converter mitigates EMI/RFI by using a quasi-sine-wave oscilla-tor, a fully shielded transformer, prov-en layout techniques, and filtering. The use of a proprietary high-performance encapsulation formula and process result in very low input-to-output leak-age current of <100 nA and a very low coupling capacitance of <250 pF. EMCO High Voltage: www.emcohighvoltage.com

applications currently use multiple A/Ds to get the combination of speed and accuracy they need. This IC is so fast they can go to a single A/D — and it is so very accurate that they probably don’t have to do any time-consuming calibra-tion on the assembly line anymore. Think about that. At $29.50 each, the A/D is not a low-cost item, but it certainly may be well worth it.Linear Technology: www.linear.com

ElEctRoNic PRodUcts • electronicproducts.com • JANUARY 2014

POY Special 29

Low-power sensor- fusion coprocessor makes design easierThe SENtral sensor-fusion coprocessor from PNI Sensor presents a highly ef-fective way to pull in data from complex motion sensor systems with gyroscope, accelerometer, and magnetometer sen-sors that are often found in mobile and

wearable devices. The device offloads complex sensor algorithm processing from a main CPU and takes only a few hundred microamps while doing so. It will consume only about 1% of the power a standard CPUs needs to perform the task.

The IC can handle the job of manag-ing and “fusing” data from these multiple sensors with a nine-axis sensor fusion algorithm, further unburdening the CPU. And, the chip improves accuracy and eases the design task with “constant calibration.” The chip is only 1.6 x 1.6 x 0.5 mm, and it works over –40° to 85°C. What’s not to like about this chip?PNI Sensor Corporation: www.pnicorp.com/

Bluetooth Low Energy chip is in top formThe BlueNRG low-power Bluetooth Low Energy network processor IC from StMicroelectronics is compliant with the v4.0 specification. Bluetooth seems to be coming into great favor now, partly due to the Low Energy specification along with the fact that several suppliers are now making single-chip devices that can replace modules and be much more


30 POY Special

Power analyzer eases precision test of real-world signalsFor today’s designs, power is a ma-jor issue. Energy efficiency and new power sources are taking center stage in designs, so engineers are looking for advanced power analysis tools that can keep up with consumer demand, changing technologies, government reg-ulations…and the added workload they present. To meet the demands, the tools must provide a stable, linear response over a wide range of input current levels, ambient temperatures, crest factors, and other variables.

Last year Tektronix enter this realm for the first time, and did so with an instrument that sets new measurement standards. The PA4000 multi-phase power analyzer lets designers perform precise current measurements from input to output, even on the highly distorted power waveforms common in many of today’s applications. It is able to check conformance not only to cur-rent regulatory standards but is geared for future ones as well, even those with highly modulated waveforms and crest factors as high as 10. The instruments unique, built-in Spiral Shunt design

provides two shunts on each module: one for precise low-current measure-ments up to 1 A, and another for high-er-current measurements up to 30A. Combined with unique, high-speed DSP algorithms, this allows the PA4000 to track power cycles accurately, even in the presence of transients and noise, with measurements up to the 100th harmonic.Tektronix: www.tek.com

cost effective.This STMi-

croelectronics implementation looks to be the best around, with the lowest power draw (just 7.3 mA active receive peak current) and

excellent transmit/re-ceive specs. It can act as master or slave and the Bluetooth LE stack runs

on its Cortex M0 core while flash memory allows

in-field upgrading.STMicroelectronics:www.st.com

ElEctRoNic PRodUcts • electronicproducts.com • JANUARY 2014

POY Special 31

circuit. But a bolt of lightning struck the minds of Texas Instruments’ designers and product managers recently, causing them to invent the LDC1000 -- the industry’s fi rst inductance-to-digital converter (LDC).

Th e converter can use the inductive properties of coils, springs, and other de-vices to form sensors that deliver higher resolution, better reliability, and greater fl exibility than other sensing solutions that might fi t the application, at do so at a lower system cost and with less power consumption. Th e number of potential applications for this device seems to be growing by leaps and bounds.Texas Instruments: www.ti.com

Fast and Efficient Processing, Flash Memory, a Wide Range of Integrated Peripherals,and Efficient Register-Oriented Architectures

APPLICATIONS:• Induction Heating Cookers• Small Kitchen/Home Appliances • Boilers • Rice Cookers • Pressure Cookers • Induction Heaters • Air Conditioners • Washing Machines • Dryer Controller • Oven Controller• Vending Machines• IR Remote Controls with LCD• Fan Control• Smoke Detectors• Cordless Tools & Battery Chargers• PIR Motion Detectors• Ambient Light Sensors• Humidity Detectors• LED Lighting Control• System Board Management

For more information about our S3 Product Family, please visit www.zilog.com/S3

FEATURES:• SAM8 & SAM88 Z8-Compatible CPU Cores• Flash Memory: 4, 8, 16, and 32 KB• RAM: 208, 272, 1040, 2086 bytes

• CISC Instructions: 41, 78• Interrupts: 4, 17, 26• And many more!

Design With Freedom S3F84B8 Block Diagram

S3F80P5

S3F80P9

S3F80PB

S3F82NB

S3F84B8

S3F8S15

S3F8S19

S3F8S24

S3F8S28

S3F8S35

S3F8S39

S3F94C4

S3 8-BITMICROCONTROLLER

FAMILY

S3F94C8

First qualified GaN HEMT features very low energy lossesTransphorm off ers the industry’s fi rst qualifi ed 600-V gallium nitride (GaN) device platform with its TPH3006PS GaN high-electron mobility transistor

(HEMT). Th e GaN transistor combines low switching and conduction losses, off ering reduced energy loss of 50% compared to conventional silicon-based

A novel converter uses inductance for sensingFor years, engineers have measured the voltage across an inductor to sense changes in a circuit or the surrounding fi eld. Until last year, however, no one had apparently thought of using the phenomenon as the basis for creating a dedicated, mass-produced sensing

power conversion designs. Th e TO-220-packaged device features an RDS(on) of 150 mΩ, a Qrr of 56 nC, and high-fre-quency switching capability that enables compact, lower-cost systems. Th e devices simplify the design and manufacturing of a wide variety of electrical systems and devices, including power supplies and adapters, PV inverters for solar panels, motor drives and power conversion for electric vehicles.Transphorm:www.transphorm.com

The information in this feature represents a small sample of the data available from the IHS iSuppli Teardown Analysis Service. This service provides complete, detailed analyses of electronic equipment by disassembling products and studying their contents. The service has performed teardown analyses on products including wireless handsets, digital still cameras, PDAs, and laptop computers. IHS delivers complete assessments of all electronic, electro- mechanical, and mechanical components in such products, from semiconductors to passives to displays. Component data includes parts and estimated pricing and is broken down by assembly, function, component family, and type.

For more information on the IHS iSuppli Teardown Analysis Service, e-mail IHS at [email protected]

% of Total Cost by Component Type

% of Total Cost by Function % of Total Cost by Assembly

Camera 7.91%

Baseband 7.37%

RF/PA 7.12%

Power Managment 3.13%

BT/WLAN 2.35%

Accessories 2.25%

Battery 1.87%

Literature Packaging 0.57%

Display21.92%

AppsProcessing

9%

Main PCB45.11%

UserInterface10.94%


Product teardown

Apple iPhone 5S A1533

To get the complete teardown analysis and parts list of the Apple iPhone 5S A1533, including datasheets, go to...www2.electronicproducts.com/whatsinside.aspx

The iPhone 5S A1533 is the latest handset available from Apple in North America. This high-end smartphone comes with a large diagonal 4-in. display with 1,136 x 640 resolution and in-cell touch technology. Apple also included an A7 processor with a 64-bit dual-core CPU with quad-core GPU in 28 nm. Also featured is the 8-Mpixel rear-camera module with auto-focus lens and LED flash that can record HD video in 1080p, and a 1.2-Mpixel front-facing camera capable of recording full HD video in 720p.

What really makes the iPhone 5S stand out is its 500-ppi fingerprint sensor module. The sensor is only 170 µm thin and can easily read the fine details of a fingerprint by using advanced capacitive touch to take a high-resolution image from small sections of a fingerprint from the subepidermal layers of the skin. Other major components of this design include the multimode, multiband Qualcomm baseband processor, the main chassis enclosure with injected molded plastic, and the Toshiba Semiconductor 16-Gbyte NAND flash. The iPhone 5S A1533 is priced at $649.

32 What’s Inside

Memory9.78%

Mech/Electro 15.77%

Home Button/ Fingerprint Sensor PCB 7.01%

Primary Camera Mod 6.84%

Box Contents 2.86%

Connector PCB 1.39%

SecondaryCamera Mod 1.07%

Control Button PCB 0.93%

Light SensorPBC 0.89%

Display/Touchscreen

21.92%

OtherEnclosures11.97%

Generate tthheee eexxaacct waveforms you want. Introducing AAgiileennt Trueform technology.m

33500B Series Waveform Generators

Sine waves with 5x lower harmonic distortionPulses up to 30 MHz with 10x less jitterPoint-by-point arbitrary waveforms with sequencing16 -bit resolution with 1 mVpp to 10 Vpp amplitude8 upgradable models in 20 & 30 MHz

Agilent 33500B Series waveform generators with exclusive Trueform signal generation technology offer more capability, fi delity and choice than traditional DDS generators. Get the precision and fl exibility you need to characterize new components and designs with superior confi dence. And accelerate development from start to fi nish.

Learn more about the advantages

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© Agilent Technologies, Inc. 2013

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Distributor NetworkRight Instrument. Right Expertise. Delivered Right Now.

866-436-0887 www.microlease.com/agilent

34 Product Trends


insight into current product developments

Applications in

Military-aerospace products

Military-aerospace companies look to be competitive in similar ways to commercial companies, by making products smaller, cheaper, and faster. However, the

military companies then must make them more rugged and secure than their nonmilitary counterparts. Read what our ex-perts from API Technologies and VPT have to say about trends for military/aerospace products.

Tara Flynn Condon, Vice President, Corporate Develop-ment & Marketing for API Technologies, says that in 2014 we will see advancements in miniaturization continue. Just as in the commercial sector, the military and aerospace sectors strive to do more in a smaller footprint for greatly improved flexibility and portability. Reducing size, weight, and power consumption are even more important today, since the military continues to look to extend operational life.

Spectrum management is also becoming increasingly important, as we are seeing exponential growth in the amount of data travelling across the same finite spectrum. With this, signal interference has become a major challenge, and will only continue to worsen. More sophisticated electronic systems will need to minimize cross-channel interference.

The COTS TPS75 DC Tactical Power Supply from API Technologies is for RF and mobile networks, C4ISR applications, and unmanned systems. It accepts power from single or three phase generators or shore/community power. It converts ac to 28-Vdc power at 75 A.API Technologies: www.apitech.com

Military & SpaceDesign & Manufacturing for Custom Modules & Subsystems

Delivering Complete, Qualified Solutions to Meet Your Specific Requirements

Analog, Digital & Mixed-Signal ICs, Modules, Subsystems & Instrumentation

2 Elizabeth Drive • Chelmsford, MA 01824978-250-3343 tel • 978-250-3373 fax www.hittite.com • [email protected]

Receive the latest product releases - click on “My Subscription”

Download Hittite at the App Store

Core Competenciesn Frequency Synthesizers

n Dielectric Resonator Oscillators

n Narrow & Broadband Frequency Converters

n Power Amplifiers

n Multi-Channel Receivers

n Multi-Function Assemblies

Facilities, Manufacturing & Testn ISO 9001:2008 & AS9100:2009

n Class 100 Environment for S-Level Products

n Automatic Hybrid Assembly Equipment: Die Inspect / Pick, Die / Substrate Attach & Wire Bond

n IR Reflow Equipment for PCB Based Assemblies

n Automated Digital Product Test to 40 Gbps

n Automated RF, Microwave & Millimeterwave Product Test to 110 GHz

High Reliability Screening & Qualificationn VI to Methods 2010A & 2017K

n Temp Cycle Stress Test

n High Temp Burn-In & Life Test

n Wafer Lot Acceptance Test Bond Pull & Die Shear Test SEM Inspection Metal & Glass Thicknesses

n Serialized Test Data

n Qualification Report

36 Product Trends


insight into current product developments

VPT provides a full range of proven dc/dc converters, EMI Filters, and accessory products to Mil/Aero, High-Rel COTS, and space customers.VPT: www.vptpower.com

With SIGINT becoming an even bigger deal in electron-ic warfare, we expect to see continued growth in this arena. Military relies on GPS; and our enemies know that. Jamming/antijamming technology is the key to protection, as well as the way to defeat emerging adversaries.

There also seems to be a shifting mindset of mil and aero electronics buyers as they take on commercial buying habits. Buyers are holding suppliers to tighter turnaround times and more competitive pricing. Defense electronics firms with a strong commercial backbone that combines strong engineering with the ability to turn products quickly can do well here.

Monty Pyle, Vice President of Sales and Marketing for VPT, peered into the future and saw that even though development, qualification, and program cycles are lengthy in the mil-aero industry compared to most other industries, short- and long-term trends tend to be one and the same. With that clarified, we see the trend of cost sensitivity steering requirements to those product offerings that meet the application requirement, but do not exceed them. For example, in past years, a MIL-PRF-38534 Class H qualified dc/dc converter may have been selected for a given application because it was better than the requirement, and the customer then moved on to their next material deci-sion. Today that same customer will scrutinize their application requirements, compare that to the offerings available, and then select either the same product as before, the same but less-er-screened device or even an entirely different device from a commercial offering.

Paul O’Shea

The demand for unmanned aerial vehicles (UAVs) is increasing because of the rise in the adoption by government defense programs and civil use applications. Analog Devices provides best-in-class technology

solutions in the areas of gimbal control, imaging, radar, avionics, data link communications, and MEMS based sensor technology for UAV navigation.Analog Devices: www.analog.com

Custom fabricated sapphire domes feature a combination of optical and mechanical proper-ties for protecting guid-ance systems, sensors, and other devices in harsh airborne and sub-sea environments. The domes are unaffected by fast moving dirt, sand, saltwater, and chemi-cals. They feature Moh 9 hardness and provide up to 85% transmission

uncoated in the UV and IR range, and up to 99% when anti-reflective coated on two sides. Meller Optics: www.melleroptics.com

The LGDS-100-P-K module transient/spike suppressor is rated to sustain transients up

to 100 and 202 V to comply with MIL-STD-1275 and DEF-STAN 61-5 part

6 standards. The transient sup-pressor handles up to 100 W with no heatsink. The device provides input undervoltage lockout, output

overcurrent protection, and overtem-perature protection.

GAIA: www.gaia-converter.com

Buckeye Shapeform provides products and enclosures that use the company’s deep-draw technology and refined en-closure creation process. The technology ensures product precision, performance, and efficiency even when employed in harsh and often hostile environments.Buckeye Shapeform: www.buckeyeshapeform.com

Welcome to our Satellite Office

Space is no place for commercial-grade components.That’s why leading aerospace companies rely on Coilcraft CPS for proven RF and power magnetics that feature:

• Custom termination plating including Sn/Pb and Gold• Extended temperature ranges (-55°C to +300°C) • Vibration testing to 80 G / shock testing to 1000 G• Low outgassing to NASA specifications

With hundreds of space missions under our belt, Coilcraft CPS is well positioned for all your aerospace applications

800.981.0363 847.639.6400 www.coilcraft-cps.com

We also offer comprehensive product testing and validation services in accordance with established industry standards, as well as custom screening to your electrical and physical specifications.

Learn more about how our deep space experience can help your design take flight. Call or visit coilcraft-cps.com today!

* Coilcraft CPS parts are available with or without ITAR compliance.

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Product Update 39


connectors & sockets

Low-profile connectors take high current loadsFor board-to-board and board-to-wire interfaces, the DF64 Series horizontally mated two-piece connector system uses 18-24 AWG wire and can carry a 5-A current. The two-position connector measures 20.4 x 14.4 mm and has a mated height of just 4.7 mm.

Unlike conventional horizontally mated connectors that require a different series of connectors between board-to-board and board-to-wire interfaces, the DF64 Series features a common receptacle that mates with the header and the cable plug. As a result, manufacturers can simplify their assembly and eliminate the time and cost needed to maintain inventory of any additional components.Hirose Electric: www.hirose.com

800 .424 .9850401 .823 .5200www.advanced.com i n f o @ a d v a n c e d . c o m

Made in USA

Solving Your Board to Board Connector Design ChallengesDesign Challenges

• Screw-machined Terminals• Thru-hole or SMT• Low Profi le• High Density• Customized Designs• Proven Performance

1.0mm PitchSMT Connector

Coin-cell-battery holder isn’t much bigger than a coin cellAdding just 1.5 mm to the total height/profile of a CR2016 coin-battery system, the ultra-low-profile (3.1-mm) BLP2016SM-GTR holder from Memory Protection Devices also minimizes the total footprint to 23.09 x 15.09 mm in surface-mount applications. The top-loading coin cell holder uses corrosion-resistant, gold-flashed, nickel-plated phosphor bronze for its pressure contacts to provide a highly reliable electrical connection with low electrical resistance. For increased reliability, the holder also features specially curved positive contacts that provide added pressure for greater battery-cell retention, resisting shock, vibra-tion, and drops (1-meter-drop certified).

The holder's body is made of putty-colored LCP plastic designed to withstand SMT reflow temperatures up to 260ºC, as well as high-temperature sterilization cycles (gamma, electron beam, ethylene oxide, steam/autoclave, and hot air) commonly associated with medical-device manufacturing. The holder has a dielectric strength of 1,100 V/mil; is halogen-, PFOS-, and PFOA-free; and complies with such internation-al regulations as RoHS 2, WEEE, REACH, and SVHC. Available on tape and reel for automated assembly, holders are priced at $0.50 each in 5,000-piece lots and are available from stock to 4 weeks ARO.Memory Protection Devices: www.memoryprotectiondevices.com

Connector now available in small sizeThe UltiMate Series size 07 connector is smaller, more compact, and lighter than previous versions, but has the same performance, suiting it for use in harsh and extreme environments. Available in 2 to 9 contact configurations, the connector is sealed to IP68/69 mated and unmated, and has a high corrosion resistance of 1,000 hours.

The 14-mm-diameter connector has 360° EMC shielding, guarantees 10,000 mating cycles, and operates from -55°C to 135°C. Cable assembly solutions are available in both straight and right-angle overmolding.Fischer Connectors: www.fischerconnectors.com/htm/Contact-us-Maps.asp

• Highest efficiency across full load range• Fully regulated output voltages

• 1500 VDC I/O-isolation• Remote On/Off control

New design technology with increased efficiency and optimized thermal management and the use of best grade components afford the design of highest power density DC/DC-converters.

www.tracopower.comPOWERGATE LLC 866-588-1750 www.powergatellc.comPower Sources Unlimited 800-966-7784 www.psui.com/traco

TRACOPOWER introduces six new series of ultra compact isolated DC/DC-converters for high performance applications

60 Watt in 6-side shielded 1" x 2" metal package

TEN-60WIN Series4:1 input voltage rangeTEN-60N Series

2:1 input voltage range

30 Watt in 6-side shielded 1" x 1" metal package

THN-30 Series2:1 input voltage range

THN-30WI Series4:1 input voltage range

6 Watt in SIP-8 package

TMR-6 Series2:1 input voltage range

TMR-6 WI Series4:1 input voltage range


New Products 41

6-W dc/dc converter targets space-critical applicationsThe ML600xRU series surface-mount dc/dc converters provide 6 W of output power in a 0.87 x 0.80 x 0.40-in. SMT package. They provide the performance, size, and economy required by a wide range of space-crit-ical board-level applications. Available on tape-and-reel, they can be used with most automated assembly systems.

Sixteen models operate from 9 to 36-Vdc or 18 to 75-Vdc inputs, providing single and dual outputs of 3.3, 5, 12, 15, 24, ±5, ±12, or ±15 Vdc. Standard features include continuous short-circuit protection, high efficiency, an input/output isolation of 1,500 Vdc, and low-noise operation. All models include a remote on/off input. The MTBF (per MIL HDBK 217F) is greater than 350 kh. The operating tem-perature range extends from –40° to +80°C with no derating required.MicroPower Direct: www.micropowerdirect.com

www.globtek.com

Need Power?ThinkGlobTek

Green Power Supplies Meet Efficiency Level V Requirements 0-150WDesktop style Power Supplies with IEC 60320/ C6, C8 or C14 inlets have Double-Enforced In-sulation Mechanical Configurations, Reg-ulated Outputs voltage from: 12 to 48Vdc in 0.1V increments, up to 0-150W of con-tinuous output power. GlobTek’s GT-41133 series of enclosed power suppliesare housed in Impact Resistant non-vented Polycarbonate Case, Thermal con-duction Cooling, Case Dimensions: 62 x150 x 34 (mm). This Family features:Regulated output with very low ripple,...for more click www.globtek.com

Lithium Ion (Li-Ion) BatteryChargerIn response to in-creased concernand requirementsof portable equip-

ment and device manufacturers for safetyrelated to Lithium Ion (Li-Ion) batteries,GlobTek’s latest generation batterycharger designs include numerous redun-dant safety features which when commu-nicating with electronics in Lithium(Li-Ion) batteries prevents failure ordamage of the battery pack during charg-ing. Aside from safety, the charger in-cludes many features to maintain andlengthen battery life. The GlobTek GT-93023-12012(R) is a customized bespokemultiple-bay battery charger designed tocharge 5 battery packs in unison. The...for more click www.globtek.com

International Power CordsetsThis wide range ofinternational powercordsets are ap-proved to interna-tional safety agencyrequirements. De-signs are availablein various lengths,cable types, conductor gauge, termination,and jacket color. Cordsets are ideal forportable equipment, communication,video, power tools, consumer electronicsor industrial and medical equipment.Many designs are available ...for more click www.globtek.com

ISO9001:2008/13485/14001Certified

GlobTek Ad B rev 8.15.13_Electronic Products 8/28/2013 7:35 AM Page 1

Dc/dc converters target wireless and telecom networksThe JRCK017A0S32R0 isolated dc/dc power module offers 544-W

output power with 95% efficiency. This addition to the ORCA series provides up to 17 A of dc-output current at a nominal output voltage of 32 Vdc.

The dc/dc converter module in a DOSA-compli-ant half-brick form factor, optimized for high-voltage,

high-power applications such as wireless and switch networks. The new module

also offers Tunable Loop, an optional feature that enables a user to optimize the dynamic response of the converter to match the load with reduced output capacitance and reduce board space.XP Power: www.xppower.com

30-kW dc/dc and ac/dc module targets telecom, military needsThe C/B 6600 series is a 30-kW dc/dc and ac/dc converter module and battery charger. It provides a high density solution for high-power applications in industries such as utility, oil/gas, automa-tion, heavy industrial, military, telecom/datacom, alternative energy, transit/rail-way, process control, and power stations.

The converter module and battery charger offers two standard dc-input voltage ranges of 320 to 640 Vdc or 450 to 800 Vdc, as well as three-phase ac-input voltages of either 3 x 400 Vac or 3 x 480 Vac. These modules are single output and are available in ten standard ranges from 23 to 800 Vdc. All outputs

Power Sources

42 New Products


See PICO’s full line catalog at

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DC-DC CONVERTERSDC-DC CONVERTERS2V to 10,000 VDC Outputs

1-300 Watt ModulesRegulated/Proportional/Programmable

Isolated/Single/Dual Outputs

High ReliabilityGreater than 1,000,000 hrs.

Mil Hbk 217F •

Military UpgradesExpanded operating temperature

-55º to +85º C, no derating required•

Environmental ScreeningSelected Screening, Mil Std 883

•

ULTRA MiniatureFrom 0.5" x 0.5" x 0.2"

•Surface Mount/Thru-Hole

2V to 10,000 VDC Outputs1-300 Watt Modules

Regulated/Proportional/Programmable

Isolated/Single/Dual Outputs

High ReliabilityGreater than 1,000,000 hrs.

Mil Hbk 217F •

Military UpgradesExpanded operating temperature

-55º to +85º C, no derating required•

Environmental ScreeningSelected Screening, Mil Std 883

•

ULTRA MiniatureFrom 0.5" x 0.5" x 0.2"

•Surface Mount/Thru-Hole

A44_ElecProd_1-3V_2-0625x9-5_A44.qxd 12/10/13 11:34 AM Page 1

Thermoelectric air conditioners provide cooling to 170°FThe expanded line of ThermoTEC thermoelectric coolers are capable of sustained performance in environments with temperatures as high as 170°F. Select models can be configured to operate in ambient temperatures up to 190°F. The coolers target hot settings including deserts, or industrial applications such as those near blast furnaces.

Thermoelectric coolers offer significant advantages over traditional cooling methods such as compressor-based air conditioners. The units are NEMA 4X rated for indoor or outdoor use to provide protection against rain, sleet, snow, windblown dust, and corrosion. In addition, solid-state electronics and a lack of moving parts (except for fans) means thermoelectric cooling systems are low maintenance. The units are offered in sizes from 200 to 2,500 BTUs.EIC Solutions, Inc.: www.eicsolutions.com

3,000-W 1U hot-swap power supply delivers platinum efficiencyThe TFE300-54 3,000-W 1U hot-swap power supply delivering 80-plus platinum efficiencies with leading power density of 33.48 W/in3. The TFE3000-54 offers a floating dc output of 54 V which is adjustable from 42 to 55 Vdc, making it ideal for Power-Over-Ethernet, Telecom and Networking applications. Measuring only

1.6 x 4 x 14-in, the supply features: a standby output of either 3.3- or 5-V rated for 2 A; digital I2C/PMBus status & control; and a single rear blind-mate connector for ac input, dc output and status / control connections.

An optional 1U 19-in. Power Shelf is available to mount up to 4 power supplies for N+1 or 2N dual feed redundancy operations. Units are safety approved to cTUVus 60950-1 and bear the CE Mark for world wide applications.Tectrol: www.tectrol.com/feature

are adjustable and regulated to 0.2% (load) and 0.1% (line). They feature front to back fan cooling with a standard operating temperature of –20° to +75°C (with derating above +55°C), with an option for -40° to +75°C.Schaefer: www.schaeferpower.com

200-1,200-Vdc photovoltaic power supplies are economicalThe PV05/10(R) series economical photovoltaic power products are an upgrade of the

company’s PV05/10 series. Compared to the PV05/10 series, it has 200 to 1,200-Vdc ultrawide input range (6:1) and its efficiency in high-voltage input improves by 5% to 12%, making it widely applicable for fields like photovoltaic power generation and high voltage inverters. It has high efficiency and reliability, and various protection functions

lsuch as input undervoltage protection, output overvoltage protection, short-cir-cuit protection, and reverse input protection. The built-in isolation voltage ensures the safety performance of the module power supply and relevant loading under abnormal situations.Mornsun America: www.mornsunamerica.com

Power Sources


New Products 43

0603 RF inductors specified at -55° to 125°CThe ST312RAG0603 chip inductors offer extended temperature ratings of -55° to 125°C along with a higher Q and lower DCR than similar devices. For a 10-nH unit, Q is 38 minimum at 250 MHz and 142 at 1.7 GHz.

DCR is 0.054 Ω maximum and Imax is

800 mA. The series has inductance values of 1.8 to 150 nH with 2% or 5% tol-erance. Pricing starts at $0.99.Coilcraft: www.coilcraft-cps.com

IXYS Integrated Circuits Division(Formerly Clare, Inc.)78 Cherry Hill DriveBeverly, MA 01915 978-524-6768

Optically Isolated Power Relays! ▪ MOSFET-Based AC/DC Power Relays ▪ MOSFET-Based DC-Only Power Relays ▪ SCR-Based AC Power Switches

http://www.ixysic.com

IXYS IC DivisionPart Number

BlockingVoltage

LoadCurrent

OnResistance

SwitchingTimes

5ºC/WHeat Sink

Free Air

ton / toff

Examples of MOSFET-Based AC/DC Power Relays

CPC1988J 1000 VP 2.25 A 0.9 A 2.5 20ms / 5ms

CPC1909J 60 VP 15 A 6.5 A 0.1 25ms / 10ms

Examples of MOSFET-Based DC-Only Power Relays

CPC1788J 1000 VP 2.45 A 1 A 1.25 20ms / 5ms

CPC1709J 60 VP 22.8 A 9 A 0.05 20ms / 5ms

Examples of SCR-Based AC Power Switches (Zero-Cross Turn-On)

CPC1945G 400 VP - 1 A - 0.5 cycle / 0.5 cycle

CPC40055ST 800 VP 20 A 5 A - 0.5 cycle / 0.5 cycle

Examples of SCR-Based AC Power Switches (Rapid Turn-On)

CPC1964BX6 600 VP - 1.5 A - 500s / 0.5 cycle

CPC1976YX6 600 VP - 2 A - 500s / 0.5 cycle

Note: All devices in this table have input-to-output isolation between 2500Vrms and 5000Vrmsisolation betw

are, Inc.)ll Drive

All devices in this table have input-to-output iput to output i

ircuits DivisionionIXYS Integratted Ciircu

Ceramic capacitors are automotive gradeThe CGA3EA series automotive-grade multilayer SMT ceramic capacitors meet ESD immunity requirements according to the IEC 61000-4-2 standard. They come in 1.6 × 0.8-mm packages and offer capacitances from 1 to 10 nF at a rated voltage of 100 V.

The MLCCs come with C0G rating with a temperature range of -55° to +125°C and a temperature coefficient of 0 ±30 ppm/°C max, or NP0 rating over -55° to +150°C and the same tempera-ture coefficient. Contact sales office.TDK-EPC: www.epcos.com

Precision foil resistors target high-end audioThe conformally coated low-profile AUR precision resistors (Y4700xxKxxxxD) feature TCR down to 0.05 ppm/°C from 0°C to +60°C, tolerances down to ±0.01%, and load-life stability to ±0.01%. The resistors target high-end audio applications that require low distortion and noise.

The cold-rolled metal alloy foil devic-es eliminate any current noise in the ele-ment itself and provide the linearity that preserves signal integrity. They offer a resistance range from 5 Ω to 120 kΩ and are rated for 300 mW at +70°C with a maximum working voltage of 300 V and with a rise time of 1 ns with effectively no ringing.Vishay Precision Group: www.vishaypg.com/foil-resistors/

Components & Subassemblies

44 New Products


New-gen IR emitters are based on metal alloys and MEMSThe DLS200X2224 IR/thermal emitters are diamond-like sources (DLS) that are MEMS (microelectromechanical systems) structures that are micromechanically-structured hot plates. The device is a carbon-based nanocomposite (amorphous diamond) that is deposited as a resistance material on a silicon membrane. The material has a tem-perature coefficient of resistance of 40 A/W typical and a material emissivity of 0.80.

The thermal time constant rise time of 28 ms and fall time of 6.8 ms enable modulation depths of approximately 25% and 10% at modulation frequencies of 100 Hz and 1,000 Hz, respectively. The life expectancy at 750°C (10 Hz, duty cycle, 50%) is 30,000 h and at 600°C it is 250,000 h. The active material of the thermal emitter is a nano-amorphous carbon (NAC) has two structural networks; a hydrogen-containing carbon and a network that consists of silicon oxides.Laser Components: www.lasercomponents.com

LED module delivers industry’s first sunset dimming experienceThe LMH2 LED module features sunset dimming, a game-changing dimming technology that provides a dim-ming experience similar to incandescent lighting. The module

enables a natural dimming from 2700K to 1800K, that was previously un-achievable with any other energy-saving technology. It suits applications requiring a traditional style of dimming such as hospitality and res-

idential settings, while still achieving over 80 percent energy reduction compared to incandescent bulbs.

The LED module family lets lighting manufacturers address a wide range of lighting technologies with a one module form factor. The module is available from 850 to 3,000 lm at 2,700K and multiple driver options, They can be retrofitted in any room with traditional dimming technologies or used in new installations with 0 to 10 V or digital addressable lighting inter-face (DALI) dimming technologies.Cree: www.cree.com/modules

LED offers 50-kh life even at 135°CThe newest version of the Oslon Square LED withstands high ambient temperatures. The heat dissipation of the LED

allows an increase in the junction tem-perature enabling them to reach

a lifetime of 50,000 hours at 135°C. They are measured

and binned at 85°C to ensure that the color point of each LED in a

luminaire remains uniform even at high temperatures.

The LED suits use in various build-ing applications. It features a color temperature ranging between 2400 and 5000 Kelvin, and has a color rendering index over 80 and a luminous flux of 202 lm. The LED is undergoing extensive quality testing and the certifica-tion process under the LM-80 long lifetime standard is in progress. The results of the 3,000 hour test are expected at the end of 2013, and the results of the 6,000 hour test are expected in spring 2014.Osram Opto Semiconductors: www.osram-os.com

Optoelectronics


New Products 45

Plastic enclosures house popular SBCsBased on the company's 1593 series plastic enclosures, the 1593HAM series enclo-sures are designed to house such credit-card-sized, single-board computers (SBCs) as the Arduino Uno, Due, and Mega 2560; the Beaglebone and Beaglebone Black; and the Freescale Freedom KL-02Z, KL-05Z, and KL-25Z.

Machined for the particular SBC type's connectors, controls, and/or LEDs, the cases are molded in black, gray, or translucent blue ABS plastic and come in three different sizes: 4.3 x 2.9 x 1.0 in. (Arduino), 3.75 x 3.04 x1.18 in. (Beaglebone), and 3.6 x 2.6 x 1.1 in. (Freescale Freedom). The enclosure's top, bottom, and front/rear panels are assembled with self-tapping screws.Hammond Manufacturing: www.hammondmfg.com

I/O connectors operate at 5 to 10 Gbits/sFor high-performance in cloud computing, data centers, enterprise servers, and con-sumer electronics, these SATA III, PCI Express (PCIe) 3.0, USB 3.0, and Thunderbolt connectors operate at frequencies ranging from 5 to 10 Gbits/s.

The SATA III connector, in SMT (E9122-001-01) or DIP (E9113-001-01) versions, is popular as a storage interface while the PCIe3.0 connector (E9001-001-01) can sup-

port up to 8 Gbits/s and is used in expansion cards. The USB 3.0 connectors type A (E8199-001-01) and micro type AB (E8110-001-01) are used to provide desktop/mobile connectivity, while Thunderbolt (E9320-001-

01) supports high-resolution displays and high-performance data devices through a single, compact port. Samples are available upon request and lead time is 4 to 6 weeks.Pulse Electronics: www.pulseelectronics.com

HigHligHt of tHe MontH

Battery connector can cut onboard footprint over 100%Offering connection pitches as low as 2 mm, the XD2B miniature battery connector is only 2.6-mm deep, which is >50% to >100% less than competing products. Further, the connector is designed to be re-cessed into the edge of a board to reduce above-board height. The connector is targeted at mobile devices that use Li-Ion flat-pack batteries, such as smartphones, tablets, dataloggers, and hand-held POS terminals.

Electroforming technology produces contacts that are substantially stronger than contacts produced by conventional pressed materials, and an improved spring-contact configuration provides higher contact forces, making the gold-plated contacts more impervious to impact and shock. The connectors are available now in three versions: with 6, 7, or 8 PCB connection terminals (parts XD2B-0406-26A, XD2B-0507-20A, and XD2B-0408-23A, respectively) for mating with 4, 5, or 4 battery connection pads, respectively.Omron Electronic Components: www.components.omron.com

Packaging & Interconnections

46 New Products


www.masterbond.com

Hackensack, NJ 07601 USA+1.201.343.8983 • [email protected]

• Superior toughness• Low volume resistivity• Non-drip compound

EP79FL Adhesive

Silver Coated Nickel Filled Epoxy

stayconnected

Compact vent suits automotive electronics & housingsTo provide high-performance venting of automotive electron-ics' housings in a smaller footprint, the AMF200200 PolyVent

Compact Series measures just 14.33 mm in di-ameter by 8.9 mm in total height — 30% smaller than previous PolyVent Snap-Fit products. It aims to provide a higher level of protection for sensitive compo-nents like sensors,

motors, and control units, while providing reliable and rapid pressure equalization through the use of an enhanced micropo-rous oleophobic membrane that allows airflow but blocks water and contaminants.

The smaller total height provides more flexibility in com-ponent layout, and facilitates heat transfer from printed circuit boards to the housing exterior. A low installed height (only 3.45 mm) results in less protrusion above the housing and thus less

Fine-pitch board-to-board connector is hermaphroditicFor parallel stacking of printed circuit boards, the 0.5-mm fine-pitch hermaphroditic (FPH) board-to-board connector is robust, yet economical compared to conventional stacking connectors that require separate plugs and receptacles. It helps consolidate connector selection, reduce component en-gineering and part maintenance costs, and eliminate material scrap on the factory floor.

The connec-tor is designed to withstand 50 mating cycles in its working environment, with a maximum mating force of 42 g per contact pair. It handles a maximum of 0.5 A per contact, has a maximum

contact resistance of 30 mΩ, is rated for 50 V, and has a dielec-tric withstanding voltage 500 V. The connector is available with or without locating posts and the ability to withstand reflow soldering of 245°C or 260°C.TE Connectivity: www.tycoelectronics.com



New Products 47

Shock-safe fuseholder has UL/CSA ratings of 16 A/400 VacDesigned for 5 x 20-mm fuses, the FPG fuseholder series is now available in models that are UL4248-1/UL 512 and CSA C22.2 rated for up to 16A at 400 Vac. VDE approval is in accordance with IEC 60127-6 for 10 A at 250 Vac, and the series meets shock-safe requirements according to IEC 529. The fuseholders have a rated power acceptance of 2.5 W at 10 A and operate over a -40° to 85°C range.

Priced at $2.11 ea / 100, the series includes thermoplastic versions that meet IEC 60335-1 edition 4.0 requirements for appliances in unattended use. The units come in seven different mounting options: front or rear panel, threaded neck panel, snap-in or press-in panel, through-hole, or SMD PCB mount. Fuseholders come with fuse carriers and slotted or finger grip caps, and are available with IP40 or IP67 seal protection for front or rear panel mounting and vertical or horizontal PCB mounting.Schurter: www.schurter.com

MORE PERFORMANCEHigh frequency (>40 GHz) socketscome in various materials to meetyour diverse testing requirements.From Bench Characterization to fullyAutomatic Handlers (>500k cycles).

MORE CHOICESThe industry’s widest available DUT interfaces – Spring Probes, Microstrip™ Contacts, and two types of Conductive Elastomers.

LESS COSTAll of these DUT interface materials areavailable in off-the-shelf molded plasticfor a fraction of the cost of others’machined housings.

LESS WAITWe can deliver the sockets you need infour weeks or less! Why settle for less?

Bristol, PA 19007-6810Tel 215-781-9956Fax 215-781-9845Email: [email protected]

A lot more of what you need...

A lot lessof what you don’t!

The Evolution ofInterconnect Innovation

A lot more

vulnerability to mechanical impacts or steam-jets; often, a protective wall does not need to be added.W.L. Gore & Associates: www.gore.com


ELECTRONIC PRODUCTS 50 Charles Lindbergh Blvd., Ste. 100, Uniondale, NY 11553 • www.hearstadvantage.com • (516) 227-1300 ADVERTISING OFFICES Publisher: Steve Cholas Sales Administrator: Michelle Smith

CHINADaphne Liu 86-10-51727138, FAX: 86-10-51727142 Electronic Products China, 21IC.com, Beijing, China [email protected]

EUROPESteve Regnier Tel: +44 1732 366 555, Fax: +44 1732 366 052 Star Media Services [email protected]

KOREAKeon Chang, Sls. Mgr., Young J. Baek, Mng. Director Tel: 82-2-2273-4818 Young Media, Seoul, Korea [email protected]

JAPANAkiyoshi Ojima Tel: 81-(0)45-624-3502, Mediaship Japan Ltd., Yokohama Fax: 81-(0)45-624-3503

TAIWANHelen Lai Tel: 886-2-2727-7799 Two-Way Communications Co., Ltd. [email protected]

REPRINTSWright’s Media 877-652-5295

AL/DE/NC/SC/CT/FL/MA/MD/ME/NH/NJ/NY/EASTERN PA/RI/VA/VT/EASTERN CAJoe Williams 508-541-4449, FAX: 508-541-0042 Hearst Electronics Group, Franklin, MA [email protected]

TN/KY/WV/OH/MI/IN/IL/CO/IA/MN/ND/WESTERN PA/SD/WI/TORONTODirk E. Barenbrugge 847-803-4662, FAX: 847-803-8795 Hearst Electronics Group, Naperville, IL [email protected]

CA/NVJohn Spreer 408-293-2650, FAX: 408-521-9955 Hearst Electronics Group, San Jose, CA [email protected]

AR/AZ/GA/ID/KS/LA/MO/MS/MT/NE/OK/OR/TX/WA/NM/UT/WY/WESTERN CANADAJim DeAndrea 281-557-9133, FAX: 832-201-0787 Hearst Electronics Group [email protected]

DISTRIBUTOR INVENTORYPat Cragin 303-815-6853, FAX: 972-767-4659 Operations Manager/Distributor Services [email protected]


Absopulse Electronics Ltd. ……………………………………… 41Advanced Interconnections Corp. ……………………………… 39Agilent Technologies, Inc. …………………………… Cover 2, 33APEC - Applied Power Electronic Conference ………………… 38Aries Electronics, Inc …………………………………………… 47Coilcraft CPS …………………………………………………… 37Coilcraft, Inc. …………………………………………………… 10Cornell Dubilier Electronics …………………………………… 27CUI Inc. ………………………………………………………… 22DataImage, Inc. ………………………………………………… 44Digi-Key Corporation ………………………………… Cover 1, 1Floyd Bell Inc. …………………………………………………… 48Global Lighting Technologies, Inc. …………………………… 19GlobTek, Inc. ………………………………………… Cover 1, 41Hammond Manufacturing Company Inc. ……………………… 47Hittite Microwave Corporation ………………………………… 35Integrated Power Designs, Inc. ………………………………… 23International Rectifier …………………………………………… 21Ironwood Electronics, Inc. ……………………………………… 48IXYS Corporation ……………………………………………… 34

IXYS Integrated Circuits Division ……………………………… 43KOA Speer Electronics, Inc. …………………………………… 29Linear Technology Corporation ……………………………… 13Master Bond Inc. ……………………………………………… 46Maxim Integrated ………………………………………… Cover 4Mill-Max Manufacturing Corp. ………………………………… 7Mouser Electronics …………………………………………… 16, 17National Instruments ……………………………………… Cover 3Newark/element 14 …………………………………………… 9Okaya Electric America, Inc. …………………………………… 18OKW Enclosures, Inc. ………………………………………… 45Pico Electronics, Inc. …………………………………………… 42Precision Paper Tube Company ………………………………… 46Renco Electronics, Inc. ………………………………………… 25SanDisk Corporation …………………………………………… 5TDK-Lambda Americas, Inc. …………………………………… 30TE Connectivity ………………………………………………… 2, 3Toshiba America Electronic Components, Inc. ……………… 14, 15TRACOPOWER ……………………………………………… 40Zilog Inc. ………………………………………………………… 31

48 Product MartElectronic Products Presented by the Manufacturer

Voice-Capable Alarms Replace Ambiguous “Beep” Sometimes a “beep” or “whoop” doesn’t convey enough information. • Announcer™ Series alarms from Floyd Bell play a pre-recorded

audio message or voice instructions up to ten seconds (up to 90dB).

• Choose from standard messages (“Warning!”), or custom message production. Announcer™ Series alarms come standard with quick connect terminals and voltage range to fit your application.

Floyd Bell [email protected]

Burn-In & Test Sockets 0.4mm to 1.27mmIndustry’s Smallest Footprint•Upto500,000insertions•Bandwidth23GHz•2.5mmpersidelargerthanIC•BallCountover3500,BodySize2-100mm•Lessthan25milliohmContactResistance•-55Cto+180C•4Ato8A@80Crise•BGA,LGA,QFN,QFP,&SOIC•Optionalheatsinkingto100W•SixdifferentLidoptions•QuickTurnCustoms

Ironwood ElectronicsTel:(800)404-0204Fax:(952)229-8201www.ironwoodelectronics.com

advertiser indexthis index is provided as an additional service. the publisher does not assume any liability for errors or omissions.

800 453 6202

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