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The top documents tagged [bump pads]
LOW COST AND LOW MASS BUMP BONDING SAMI VAEHAENEN – CERN PH-ESE 1
223 views
ILP-Based Inter-Die Routing for 3D ICs Chia-Jen Chang, Pao-Jen Huang, Tai-Chen Chen, and Chien-Nan Jimmy Liu Department of Electrical Engineering, National
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Low cost and low mass bump bonding
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System in Package and Chip-Package-Board Co-Design
36 views